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KR101687639B1 - 절단 장치와 절단 방법, 흡착 기구와 이를 이용하는 흡착 장치 및 절단 시스템 - Google Patents

절단 장치와 절단 방법, 흡착 기구와 이를 이용하는 흡착 장치 및 절단 시스템 Download PDF

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Publication number
KR101687639B1
KR101687639B1 KR1020150089946A KR20150089946A KR101687639B1 KR 101687639 B1 KR101687639 B1 KR 101687639B1 KR 1020150089946 A KR1020150089946 A KR 1020150089946A KR 20150089946 A KR20150089946 A KR 20150089946A KR 101687639 B1 KR101687639 B1 KR 101687639B1
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KR
South Korea
Prior art keywords
holes
suction
base
support portion
jig
Prior art date
Application number
KR1020150089946A
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English (en)
Korean (ko)
Other versions
KR20160019852A (ko
Inventor
칸지 이시바시
히데카즈 아즈마
카쯔노리 쯔타후지
Original Assignee
토와 가부시기가이샤
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160019852A publication Critical patent/KR20160019852A/ko
Application granted granted Critical
Publication of KR101687639B1 publication Critical patent/KR101687639B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
KR1020150089946A 2014-08-12 2015-06-24 절단 장치와 절단 방법, 흡착 기구와 이를 이용하는 흡착 장치 및 절단 시스템 KR101687639B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014164468A JP6430170B2 (ja) 2014-08-12 2014-08-12 切断装置及び切断方法並びに吸着機構及びこれを用いる装置
JPJP-P-2014-164468 2014-08-12

Publications (2)

Publication Number Publication Date
KR20160019852A KR20160019852A (ko) 2016-02-22
KR101687639B1 true KR101687639B1 (ko) 2016-12-19

Family

ID=55367852

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150089946A KR101687639B1 (ko) 2014-08-12 2015-06-24 절단 장치와 절단 방법, 흡착 기구와 이를 이용하는 흡착 장치 및 절단 시스템

Country Status (4)

Country Link
JP (1) JP6430170B2 (ja)
KR (1) KR101687639B1 (ja)
CN (1) CN105364972B (ja)
TW (1) TWI597797B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183484A (ja) * 2016-03-30 2017-10-05 株式会社ディスコ チャックテーブル
FR3051718A1 (fr) * 2016-05-27 2017-12-01 Mgi Digital Tech Dispositif et procede de maintien/transport de substrats dans une machine d'impression
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP6916718B2 (ja) * 2017-11-15 2021-08-11 東レエンジニアリング株式会社 レーザ加工装置
CN108249746B (zh) * 2018-02-09 2020-12-11 京东方科技集团股份有限公司 移载基台及采用该移载基台切割基板的切割方法
CN108466086B (zh) * 2018-03-16 2020-11-10 武汉华星光电半导体显示技术有限公司 一种真空吸附装置和切割设备
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
CN110270905A (zh) * 2019-07-23 2019-09-24 珠海晨新科技有限公司 一种液晶模组磨边的cnc载台装置
CN112404752A (zh) * 2020-11-26 2021-02-26 广东省科学院智能制造研究所 一种工作台、激光切割机工作台和激光切割机
KR20230135661A (ko) 2021-03-18 2023-09-25 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP2023050926A (ja) 2021-09-30 2023-04-11 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
CN114178718A (zh) * 2021-12-31 2022-03-15 南京萃智激光应用技术研究院有限公司 一种光掩膜版无粉尘激光加工装置及加工方法
CN114560626A (zh) * 2022-04-01 2022-05-31 吉安市惠安建材有限公司 一种玻璃切割台

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151441A (ja) 2000-11-07 2002-05-24 Nec Machinery Corp 基板のチャック装置
JP2002337034A (ja) * 2001-05-11 2002-11-26 Tokyo Seimitsu Co Ltd 面発光式吸着テーブル
JP2003340666A (ja) 2002-05-27 2003-12-02 Dainippon Screen Mfg Co Ltd 吸着テーブルとこれを用いた処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE352558B (ja) * 1967-10-11 1973-01-08 American Screen Process Equip
JPS57170996U (ja) * 1981-04-22 1982-10-27
DE4406739C2 (de) * 1994-03-02 1997-06-19 Heidelberger Druckmasch Ag Vorrichtung zum gleichmäßigen Ansaugen eines flächigen Körpers auf einer Unterlage, insbesondere für Druckmaschinen und deren Zusatzgeräte
KR0147403B1 (ko) * 1994-06-24 1998-11-02 문정환 칩자동 로딩장치
JP3414017B2 (ja) * 1994-12-09 2003-06-09 ソニー株式会社 半導体装置
JPH11267986A (ja) * 1998-03-23 1999-10-05 Murata Mfg Co Ltd シート吸着板
JP3883784B2 (ja) * 2000-05-24 2007-02-21 三洋電機株式会社 板状体および半導体装置の製造方法
US20030062734A1 (en) * 2001-10-02 2003-04-03 Faris Sadeg M. Device and method for handling fragile objects, and manufacturing method thereof
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP4733929B2 (ja) 2004-04-20 2011-07-27 株式会社ディスコ 半導体ウエーハの切断方法
JP5448334B2 (ja) * 2007-12-11 2014-03-19 株式会社ディスコ パッケージ基板の保持治具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151441A (ja) 2000-11-07 2002-05-24 Nec Machinery Corp 基板のチャック装置
JP2002337034A (ja) * 2001-05-11 2002-11-26 Tokyo Seimitsu Co Ltd 面発光式吸着テーブル
JP2003340666A (ja) 2002-05-27 2003-12-02 Dainippon Screen Mfg Co Ltd 吸着テーブルとこれを用いた処理装置

Also Published As

Publication number Publication date
CN105364972A (zh) 2016-03-02
KR20160019852A (ko) 2016-02-22
TW201611167A (zh) 2016-03-16
JP6430170B2 (ja) 2018-11-28
JP2016040060A (ja) 2016-03-24
CN105364972B (zh) 2017-11-14
TWI597797B (zh) 2017-09-01

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