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KR102104141B1 - 플럭스 분수 - Google Patents

플럭스 분수 Download PDF

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Publication number
KR102104141B1
KR102104141B1 KR1020147024487A KR20147024487A KR102104141B1 KR 102104141 B1 KR102104141 B1 KR 102104141B1 KR 1020147024487 A KR1020147024487 A KR 1020147024487A KR 20147024487 A KR20147024487 A KR 20147024487A KR 102104141 B1 KR102104141 B1 KR 102104141B1
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KR
South Korea
Prior art keywords
magnet
magnetic field
magnetic
computing device
coupling device
Prior art date
Application number
KR1020147024487A
Other languages
English (en)
Other versions
KR20140136440A (ko
Inventor
3세 데이비드 오토 위트
로빈 레베카 리드 맥러플린
서머 엘 슈나이더
에릭 요셉 왈
제임스 에이치 와이즈
카밀로 레온
카르스텐 아가르드
토마스 찰스 올리버
Original Assignee
마이크로소프트 테크놀로지 라이센싱, 엘엘씨
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Publication of KR20140136440A publication Critical patent/KR20140136440A/ko
Application granted granted Critical
Publication of KR102104141B1 publication Critical patent/KR102104141B1/ko

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Abstract

플럭스 분수 기법이 설명된다. 하나 이상의 구현예에서, 장치는 태블릿으로 구성된 컴퓨팅 장치의 디스플레이 장치의 적어도 일부분에 배치되도록 구성된 커버, 및 유연한 경첩을 사용하여 커버에 부착된 연결부를 포함한다. 연결부는 자기 결합 장치를 사용하여 컴퓨팅 장치에 물리적으로 결합되도록 구성된다. 자기 결합 장치는 자기장이 축을 따라 정렬되도록 연결부에 배치된 제 1 자석을 포함하고, 제 2 자석 및 제 3 자석은 연결부에서 제 1 자석의 양쪽에 배치된다. 제 2 및 제 3 자석은 제 1 자석의 자기장의 축에 실질적으로 수직인 각각의 축을 따라 정렬되는 각각의 자기장을 갖고 있다.

Description

플럭스 분수{FLUX FOUNTAIN}
모바일 장치들은 모바일 세팅에서 사용자들이 이용할 수 있는 기능이 증가하도록 개발되어 왔다. 예를 들어, 사용자는 이메일 확인, 웹 서핑, 문자 작성, 애플리케이션과의 인터랙션 등을 위해 모바일 폰, 태블릿 컴퓨터, 또는 그 밖의 모바일 컴퓨팅 장치와 인터랙션할 수 있다.
모바일 컴퓨팅 장치들은 이동하도록 구성되어 있기 때문에, 이 장치들은 컴퓨팅 장치에 대해 다양한 안전도를 갖고 있는 매우 다양한 환경에 노출될 수 있다. 따라서, 이런 환경으로부터 모바일 컴퓨팅 장치들을 보호해주도록 장치들이 개발되었다. 그러나, 컴퓨팅 장치에서 그런 장치들을 설치하고 제거하는 종래의 기법은, 제거하기는 어렵지만 좋은 수준의 보호를 제공하는 것과 상대적으로 제거하기는 쉽지만 제한된 수준의 보호를 제공하는 것 사이를 오갔다.
플럭스 분수 기법이 설명된다. 하나 이상의 구현예에서, 장치는 태블릿으로 구성된 컴퓨팅 장치의 디스플레이 장치의 적어도 일부분에 배치되도록 구성된 커버, 및 유연한 경첩을 사용하여 커버에 부착된 연결부를 포함한다. 연결부는 자기 결합 장치를 사용하여 컴퓨팅 장치에 물리적으로 결합되도록 구성된다. 자기 결합 장치는 자기장이 축을 따라 정렬되도록 연결부에 배치된 제 1 자석을 포함하고, 제 2 자석 및 제 3 자석은 연결부에서 제 1 자석의 양쪽에 배치된다. 제 2 및 제 3 자석은 제 1 자석의 자기장의 축에 실질적으로 수직인 각각의 축을 따라 정렬되는 각각의 자기장을 갖고 있다.
하나 이상의 구현예에서, 입력 장치는 컴퓨팅 장치에 의한 처리를 위한 신호를 생성하도록 구성된 입력부를 포함하고, 입력부는 적어도 하나의 키를 포함하며, 유연한 경첩을 사용하여 연결부가 입력부에 부착되어 있다. 연결부는 컴퓨팅 장치에 의한 처리를 위한 신호를 전달하기 위해 컴퓨팅 장치에 통신가능하게 결합하고, 플럭스 분수를 구현하도록 구성된 복수의 자석을 갖는 자기 결합 장치를 사용하여 컴퓨팅 장치에 물리적으로 결합하도록 구성되어 있다.
하나 이상의 구현예에서, 컴퓨팅 장치는 하우징, 하우징 내에 배치되고 하나 이상의 동작을 수행하기 위해 적어도 부분적으로는 하드웨어로 구현되는 하나 이상의 모듈, 및 하우징에 의해 지지되고 장치에 대한 자기 및 물리적 결합을 형성하도록 구성된 자기 결합 장치를 포함한다. 자기 결합 장치는, 자기장이 축을 따라 정렬되도록 연결부에 배치된 제 1 자석, 및 연결부에서 제 1 자석의 양쪽에 배치된 제 2 및 제 3 자석을 포함하고, 각각의 자석은 제 1 자석의 자기장의 축에 실질적으로 수직인 축을 따라 정렬되는 각각의 자기장을 갖고 있다.
본 요약은 아래의 상세한 설명에서 추가로 기술되는 개념들의 선택을 단순화된 형식으로 소개하기 위해 제공되었다. 본 요약은 특허청구된 대상의 핵심 특징 또는 중요 특징을 식별하기 위한 것이 아니며, 특허청구된 대상의 범위를 결정하기 위해 따로 사용되기 위한 것도 아니다.
상세한 설명은 첨부 도면을 참조하여 기술된다. 도면에서, 도면 부호의 가장 왼쪽 숫자(들)는 상기 도면 부호가 처음 등장한 도면을 식별한다. 명세서와 도면의 서로 다른 사례에서의 동일한 도면 부호의 사용은 유사하거나 동일한 아이템을 나타낼 수 있다. 도면에서 표현된 엔티티들은 하나 이상의 엔티티를 나타낼 수 있으며, 따라서 본 논의에서는 단수 또는 복수 형태의 엔티티를 서로 같은 의미로 참조할 수 있다.
도 1은 본원에 기술된 기법을 이용하여 동작할 수 있는 구현예의 환경을 도시한다.
도 2는 도 1의 입력 장치의 구현예에서 유연한 경첩(flexible hinge)을 더욱 상세하게 도시한다.
도 3은 컴퓨팅 장치의 디스플레이 장치를 커버하였을 때 컴퓨팅 장치에 대한 입력 장치의 예시적인 방향(orientation)을 도시한다.
도 4는 타이핑 방향을 가정했을 때 컴퓨팅 장치에 대한 입력 장치의 예시적인 방향을 도시한다.
도 5는 컴퓨팅 장치(102)의 후면 하우징(rear housing)을 커버하고 컴퓨팅 장치의 디스플레이 장치를 노출하였을 때 컴퓨팅 장치에 대한 입력 장치의 예시적인 방향을 도시한다.
도 6은 본 예시에서 컴퓨팅 장치의 받침대(kickstand)를 지지하기 위해 사용되는, 컴퓨팅 장치의 뒤쪽을 커버하도록 구성된 부분을 포함하였을 때 입력 장치의 예시적인 방향을 도시한다.
도 7은 도 6의 부분을 포함하는 입력 장치가 컴퓨팅 장치의 앞뒤 모두를 커버하는 데 사용되는 예시적인 방향을 도시한다.
도 8은 기계적인 결합 돌출부(mechanical coupling protrusion)와 복수의 통신 접점 (communication contact)을 포함하는 도 2의 연결부(connection portion)의 사시도를 나타내는 예시적인 구현예를 도시한다.
도 9는 통신 접점을 나타내는 축에 따른 단면도와 컴퓨팅 장치의 공동의 단면도를 더욱 상세하게 도시한다.
도 10은 기계적인 결합 돌출부를 나타내는 축에 따른 단면도와 컴퓨팅 장치의 공동의 단면도를 더욱 상세하게 도시한다.
도 11은 자기 결합 장치(magnetic coupling device)를 나타내는 축에 따른 단면도와 컴퓨팅 장치의 공동의 단면도를 더욱 상세하게 도시한다.
도 12는 플럭스 분수(flux fountain)를 구현하기 위해 입력 장치 혹은 컴퓨팅 장치에서 이용할 수 있는 자기 결합부(magnetic coupling portion)의 일례를 도시한다.
도 13은 플럭스 분수를 구현하기 위해 입력 장치 혹은 컴퓨팅 장치에서 이용할 수 있는 자기 결합부의 일례를 도시한다.
도 14는 컴퓨팅 장치의 하나 이상의 자기 결합 장치에 끌어당겨지도록 구성된 커버의 일례를 도시한다.
도 15는 본원에 기술된 기법의 실시예를 구현하기 위해 도 1-14와 관련하여 설명된 바와 같은 임의의 유형의 컴퓨팅 장치로 구현될 수 있는 예시적인 장치의 다양한 컴포넌트들을 포함하는 예시적인 시스템을 도시한다.
개관
다양한 기능을 제공하기 위해 여러 다른 장치들이 모바일 컴퓨팅 장치에 물리적으로 부착되어 있을 수 있다. 예를 들어, 손상을 방지하기 위해 적어도 컴퓨팅 장치의 디스플레이 장치에 대한 커버를 제공하도록 장치가 구성될 수 있다. 컴퓨팅 장치에 입력을 제공하기 위한 입력 장치(예컨대, 트랙 패드(track pad)가 있는 키보드)와 같은 그 밖의 다른 장치들도 모바일 컴퓨팅 장치에 물리적으로 부착될 수 있다. 또한, 예를 들어, 조합 커버 및 입력 장치를 제공하기 위해, 이런 장치들의 기능이 조합될 수 있다. 그러나, 장치들을 컴퓨팅 장치에 부착하기 위해 이용했던 종래의 기법은, 상당한 수준의 보호와 그에 상응하는 장치의 설치 및 제거 시의 복잡도와 제한된 수준의 보호이지만 상대적으로 쉬운 설치 및 제거 사이를 오갈 수 있다.
플럭스 분수 기법이 설명된다. 하나 이상의 실시예에서, 장치는 자기 결합 장치를 사용하여 컴퓨팅 장치에 부착되도록 구성될 수 있다. 자기 결합 장치는 자기장의 영향력을 확장하기 위해 복수의 축에 배열된 각각의 자기장을 갖는 복수의 자석을 포함할 수 있다. 이는 정렬(alignment)을 증진할 뿐만 아니라, 예를 들어, 장치들이 함께 "스내핑(snap)"되도록 자석이 물리적인 결합을 시작하기에 충분한 범위를 증가시키기 위해 사용될 수 있다. 그 일례가 플럭스 분수이며, 그 예시들이 도 12 및 13과 관련하여 논의된다. 컴퓨팅 장치는 이런 기능을 이용하기 위해 플럭스 분수 또한 포함할 수 있다. 일례로, 자석의 범위가 몇 밀리미터에서 몇 센티미터로 확장되어, 자석에 의해 지지되는 물리적 결합력을 증가시킬 수 있다. 이런 기법 및 그 밖의 기법이 다음 도면들과 관련해 추가로 논의된다.
다음 논의에서, 본원에 기술된 기법을 이용할 수 있는 예시적인 환경이 먼저 설명된다. 그 다음으로 예시적인 환경은 물론 그 외 다른 환경에서 실행될 수 있는 예시적인 절차가 설명된다. 따라서, 예시적인 절차의 수행은 예시적인 환경에 국한되지 않고, 예시적인 환경은 예시적인 절차의 수행에 국한되지 않는다. 또한, 입력 장치가 설명되었지만, 커버와 같이 입력 기능을 포함하지 않는 그 밖의 다른 장치들도 고려된다. 예를 들어, 이와 같은 기법은 수동 장치, 예컨대, 컴퓨팅 장치의 자기 결합 장치들에 끌어당겨지도록 구성되고 커버 내에 위치하는 하나 이상의 재료(예컨대, 자석, 철계 재료(ferrous material) 등)를 갖는 커버, 돌출부와 연결부의 사용 등에 동일하게 적용될 수 있으며, 이는 아래에서 추가적으로 설명된다.
예시적인 환경
도 1은 본원에 기술된 기법을 이용하여 동작할 수 있는 구현예의 환경(100)을 도시한다. 도시된 환경(100)은 유연한 경첩(106)을 통해 입력 장치(104)에 물리적으로 또한 통신가능하게 결합된 컴퓨팅 장치(102)의 일례를 포함한다. 컴퓨팅 장치(102)는 다양한 방식으로 구성될 수 있다. 예를 들어, 컴퓨팅 장치(102)는 모바일 폰, 도시된 바와 같은 태블릿 컴퓨터 등을 비롯한 모바일 사용을 위해 구성될 수 있다. 따라서, 컴퓨팅 장치(102)는 상당한 메모리 및 프로세서 자원을 갖는 풍부한 자원 장치(full resource device)에서 제한된 메모리 및/또는 프로세싱 자원을 갖는 저-자원 장치에 이를 수 있다. 또한, 컴퓨팅 장치(102)는 컴퓨팅 장치(102)가 하나 이상의 동작을 실행하게 하는 소프트웨어와 관련이 있을 수 있다.
컴퓨팅 장치(102)는, 예를 들어, 입/출력 모듈(108)을 포함하도록 도시되어 있다. 입/출력 모듈(108)은 컴퓨팅 장치(102)의 입력 처리 및 출력 렌더링에 관련된 기능을 나타낸다. 입/출력 모듈(108)은 입력 장치(104)의 키들, 그리고 제스처를 식별하고 또한 입력 장치(104) 및/또는 디스플레이 장치(110)의 터치스크린 기능을 통해 인식될 수 있는 이 제스처에 대응하는 동작들을 실행시키기 위해 디스플레이 장치(110)에 의해 디스플레이되는 가상 키보드의 키들 등에 대응하는 기능에 관련된 입력들과 같은 다양한 다른 입력을 처리할 수 있다. 따라서, 입/출력 모듈(108)은 키 누르기, 제스처 등을 포함하는 입력 유형들 간의 구분(division)을 인식하고 이용함으로써 여러 다른 입력 기법을 지원할 수 있다.
다른 키 배열도 고려할 수 있지만, 도시된 예시에서는, 입력 장치(104)가 QWERTY 키 배열을 갖는 키보드 및 트랙패드를 포함하는 입력부를 갖는 것으로 구성된다. 또한, 게임 컨트롤러, 악기를 모방하는 구성을 비롯한 종래와는 다른 구성도 고려할 수 있다. 따라서, 입력 장치(104) 및 입력 장치(104)에 포함된 키들은 여러 다양한 기능을 지원하기 위해 여러 다른 구성을 가정할 수 있다.
전술한 바와 같이, 입력 장치(104)는 본 예시에서 유연한 경첩(106)을 사용하여 컴퓨팅 장치(102)에 물리적으로 또한 통신가능하게 결합되어 있다. 핀에 의해 지지되는 기계적인 회전과 같은 실시예를 고려해볼 수도 있지만 이와는 달리, 경첩에 의해 지지되는 회전 운동(rotational movement)은 경첩을 형성하는 재료의 휘어짐(flexing)(예컨대, 구부림(bending))을 통해 얻어진다는 점에서 유연한 경첩(106)은 유연하다. 또한, 이런 유연한 회전은 하나 이상의 방향으로(예컨대, 도면에서는 수직으로) 움직임을 지원하지만, 컴퓨팅 장치(102)에 대해 입력 장치(104)의 측면 운동과 같은 다른 방향으로의 움직임을 제한하도록 구성될 수 있다. 이는, 컴퓨팅 장치(102)에 대한 입력 장치(104)의 일관된 정렬을 지원하기 위해, 예를 들어, 전력 상태, 애플리케이션 상태 등을 변경하기 위해 사용되는 센서들을 정렬하기 위해서 사용될 수 있다.
예를 들어, 유연한 경첩(106)은 한 개 이상의 패브릭 층을 사용하여 형성될 수 있고, 입력 장치(104)를 컴퓨팅 장치(102)에 또는 컴퓨팅 장치(102)를 입력 장치(104)에 통신가능하게 결합시키기 위해 유연한 선(flexible trace)으로 형성된 도체를 포함할 수 있다. 이러한 통신은, 예를 들어, 키 누르기의 결과를 컴퓨팅 장치(102)로 전달하고, 컴퓨팅 장치로부터 전력을 수신하고, 인증을 실행하며, 컴퓨팅 장치(102)로 보조 전력을 제공하는 등을 하기 위해 사용될 수 있다. 유연한 경첩(106)은 다양한 방식으로 구성될 수 있으며, 이는 다음 도면과 관련하여 추가로 논의될 것이다.
도 2는 도 1의 입력 장치(104)의 구현예(200)에서 유연한 경첩(106)을 더욱 상세하게 도시한다. 본 예시에서, 입력 장치(104)와 컴퓨팅 장치(102) 간의 통신적 및 물리적 연결을 제공하도록 구성된 입력 장치의 연결부(202)가 도시되어 있다. 도시된 바와 같이 연결부(202)는 컴퓨팅 장치(102)의 하우징 내의 하나의 채널로 수신되도록 구성된 높이 및 단면을 갖고 있지만, 이런 배열은 본 발명의 사상과 범위를 벗어나지 않고 뒤바뀔 수 있다.
연결부(202)는 유연한 경첩(106)을 사용하여 키들을 포함하는 입력 장치(104)의 일부분에 유연하게 연결된다. 따라서, 연결부(202)가 컴퓨팅 장치에 물리적으로 연결되었을 때, 연결부(202)와 유연한 경첩(106)의 조합은 책의 경첩과 유사한 컴퓨팅 장치(102)에 대한 입력 장치(104)의 움직임을 지원하게 된다.
이런 회전 운동을 통해, 컴퓨팅 장치(102)에 대한 입력 장치(104)의 다양한 방향(orientation)이 지원될 수 있다. 예를 들어, 입력 장치(104)가 컴퓨팅 장치(102)의 디스플레이 장치(110)에 놓여져 도 3의 예시적인 방향(300)으로 도시된 바와 같이 커버로서 기능하도록, 유연한 경첩(106)에 의해 회전 운동이 지원될 수 있다. 따라서, 입력 장치(104)는 컴퓨팅 장치(102)의 디스플레이 장치(110)가 손상되지 않도록 보호할 수 있다.
도 4의 예시적인 방향(400)으로 도시된 바와 같이, 타이핑 배열을 지원할 수 있다. 이 방향에서, 입력 장치(104)가 표면에 반듯이 놓여 있고, 컴퓨팅 장치(102)는 예를 들어, 컴퓨팅 장치(102)의 뒷면에 배치된 받침대(402)를 사용하여, 디스플레이 장치(110)를 볼 수 있는 각도로 배치된다.
도 5의 예시적인 방향(500)에서, 입력 장치(104)는 컴퓨팅 장치(102)의 뒤에, 예를 들어, 컴퓨팅 장치(102) 상의 디스플레이 장치(110)의 반대편에 배치된 컴퓨팅 장치(102)의 후면 하우징에 배치되도록 회전할 수 있다. 본 예시에서, 컴퓨팅 장치(102)에 대한 연결부(202)의 방향을 통해, 유연한 경첩(106)은 입력 장치(104)를 컴퓨팅 장치(102)의 뒤쪽에 위치시키기 위해 연결부(202)를 "감싸게(wrap around)" 된다.
이렇게 감쌀 경우 컴퓨팅 장치(102)의 뒤쪽의 일부분이 노출된다. 이는, 본 예시적인 방향(500)에서 컴퓨팅 장치(102)의 뒤쪽의 대부분이 입력 장치(104)에 의해 커버된다 해도, 컴퓨팅 장치(102)의 뒤쪽에 카메라(502)를 배치하는 등의 다양한 기능으로 이용될 수 있다. 어느 임의의 시간에 컴퓨팅 장치(102)의 한쪽 면을 커버하기 위한 입력 장치(104)의 구성이 앞서 설명되었지만, 그 밖의 구성도 고려될 수 있다.
도 6의 예시적인 방향(600)에서, 입력 장치(104)는 컴퓨팅 장치의 뒤쪽을 커버하도록 구성된 부분(602)을 포함하는 것으로 도시되어 있다. 또한 이 부분(602)은 유연한 경첩(604)을 사용하여 연결부(202)에 연결되어 있다.
또한 도 6의 예시적인 방향(600)은 입력 장치(104)가 표면에 반듯이 놓여 있고 컴퓨팅 장치(102)는 디스플레이 장치(110)를 볼 수 있는 각도로 배치되는 타이핑 배열을 도시하고 있다. 이는 본 예시에서 부분(602)에 접촉하기 위해 컴퓨팅 장치(102)의 뒷면에 배치된 받침대(402)를 사용하여 지원된다.
도 7은 부분(602)을 포함하는 입력 장치(104)가 컴퓨팅 장치(102)의 앞(예컨대, 디스플레이(110))과 뒤(예컨대, 디스플레이 장치로부터 하우징의 반대편) 모두를 커버하는 데 사용되는 예시적인 방향(700)을 도시한다. 하나 이상의 구현예에서, 전기 및 기타 연결 단자가, 예를 들어, 닫혔을 때 보조 전력을 제공하기 위해, 컴퓨팅 장치(102) 및/또는 입력 장치(104)의 옆을 따라 배치될 수 있다.
물론, 기타 다양한 방향들도 지원된다. 예를 들어, 컴퓨팅 장치(102) 및 입력 장치(104) 모두가 도 1에 도시된 바와 같이 표면이 반듯이 놓여지는 배열을 가정할 수 있다. 삼각대 배열(tripod arrangement), 회의 배열, 프레젠테이션 배열 등을 비롯한 기타 예시들도 고려할 수 있다.
다시 도 2로 되돌아가서, 연결부(202)는 자기 결합 장치(204, 206), 기계적인 결합 돌출부(208, 210), 및 복수의 통신 접점(212)을 포함하는 것으로 본 예시에서 도시되어 있다. 자기 결합 장치(204, 206)는 한 개 이상의 자석을 사용하여 컴퓨팅 장치(102)의 보조 자기 결합 장치들에 자기적으로 결합하도록 구성된다. 이런 방식으로, 입력 장치(104)는 자기 인력(magnetic attraction)을 사용하여 컴퓨팅 장치(102)에 물리적으로 고정될 수 있다.
또한 연결부(202)는 입력 장치(104)와 컴퓨팅 장치(102) 간의 기계적인 물리적 연결을 형성하기 위해 기계적인 결합 돌출부(208, 210)를 포함한다. 기계적인 결합 돌출부(208, 210)는 도 8에서 더욱 상세하게 도시되며, 이는 아래에서 논의된다.
도 8은 기계적인 결합 돌출부(208, 210)와 복수의 통신 접점(212)을 포함하는 도 2의 연결부(202)의 사시도를 나타내는 예시적인 구현예(800)를 도시한다. 도시된 바와 같이, 기계적인 결합 돌출부(208, 210)는 연결부(202)의 표면으로부터 확장되도록 구성되며, 다른 각도들도 고려될 수 있지만 이 경우에는 수직이 된다.
기계적인 결합 돌출부(208, 210)는 컴퓨팅 장치(102)의 채널 내에 있는 보조 공동 내에서 수신되도록 구성된다. 이렇게 수신될 때, 기계적인 결합 돌출부(208, 210)는 돌출 높이 및 공동의 깊이에 대응하는 것으로 정의된 축에 나란하지 않은 힘이 적용될 때 장치들 간의 기계적 바인딩을 증진하게 되고, 이는 도 10과 관련하여 추가로 논의될 것이다.
또한 연결부(202)는 복수의 통신 접점들(212)을 포함하는 것으로 도시되어 있다. 복수의 통신 접점들(212)은 다음 도면에 도시되어 있고 더욱 상세하게 논의되는 바와 같이 장치들 간의 통신적 결합을 형성하기 위해 컴퓨팅 장치(102)의 대응 통신 접점들에 접촉하도록 구성된다.
도 9는 통신 접점들(212) 중 하나를 나타내는 도 2 및 8의 축(900)에 따른 단면도와 컴퓨팅 장치(102)의 공동의 단면도를 더욱 상세하게 도시한다. 연결부(202)는 예를 들어, 보조적인 형태를 갖는, 컴퓨팅 장치(102)의 채널(904)에 대해 보조적으로 구성된 돌기(projection, 902)를 포함하는 것으로 도시되어 있고, 따라서 공동(904) 안에서의 돌기(902)의 움직임이 제한된다.
통신 접점들(212)은 다양한 방식으로 구성될 수 있다. 도시된 예시에서, 연결부(202)의 접점들(212)은 연결부의 배럴(barrel, 908) 안에 갇힌 스프링 작동식 핀(spring loaded pin, 906)으로 형성된다. 스프링 작동식 핀(906)은 입력 장치(104)와 컴퓨팅 장치(102) 간의 일정한 통신 접점을 제공하기 위해 배럴(908)의 바깥으로, 예를 들어, 컴퓨팅 장치(102)의 접점(910)에 치우치게 된다. 따라서, 장치의 움직임이나 떠밀림(jostling) 중에도 접점 및 그 통신이 유지될 수 있다. 컴퓨팅 장치(102)에 핀들의 배치 및 입력 장치(104)에 접점들 배치를 포함하여 다양한 다른 예시들도 고려할 수 있다.
도 10은 기계적인 결합 돌출부(208)를 나타내는 도 2 및 도 8의 축(1000)에 따른 단면도와 컴퓨팅 장치(102)의 공동(904)의 단면도를 더욱 상세하게 도시한다. 상기와 같이, 돌기(902)와 채널(904)는 컴퓨팅 장치(102)에 대한 연결부(202)의 움직임을 제한하기 위해 보조적인 크기 및 형태를 갖도록 구성된다.
본 예시에서, 연결부(202)의 돌기(902)는 그 위에 배치된, 채널(904) 내에 배치된 보조 공동(1002)에서 수신되도록 구성된 기계적인 결합 돌출부(208)를 포함한다. 공동(1002)은, 예를 들어, 도 8에 도시된 바와 같이 실질적으로 타원형 기둥(oval post)으로 구성된 돌출부(208)를 수신하도록 구성될 수 있으며, 물론 다른 예시들도 고려될 수 있다.
기계적인 결합 돌출부(208)의 높이와 공동(1002)의 깊이를 따르는 세로축(longitudinal axis)에 일치하는 힘이 적용될 때, 사용자는 오로지 컴퓨팅 장치(102)에서 입력 장치(104)를 분리하려는 자석에 의해 적용되는 자기 결합력을 이기게 된다. 그러나, 다른 각도에서 기계적인 결합 돌출부(208)는 공동(1002) 내에서 기계적으로 바인딩하도록 구성된다. 이는 자기 결합 장치들(204, 206)의 자력(magnetic force)에 더해서 컴퓨팅 장치(102)로부터의 입력 장치(104)의 제거에 저항하는 힘을 생성한다. 이와 같은 방식으로, 기계적인 결합 돌출부(208)는 책에서 책장을 찢는 것을 모방하기 위해 컴퓨팅 장치(102)로부터 입력 장치(104)의 제거를 편향시키고, 장치들을 분리하려는 다른 시도를 제한할 수 있다.
도 11은 기계적인 결합 돌출부(204)를 나타내는 도 2 및 도 8의 축(1100)에 따른 단면도와 컴퓨팅 장치(102)의 공동(904)의 단면도를 더욱 상세하게 도시한다. 본 예시에서, 자기 결합 장치(204)의 자석은 연결부(202) 내에 배치된 것으로 도시된다.
연결부(202)와 채널(904)의 움직임은 자석(1102)이 컴퓨팅 장치(102)의 자기 결합 장치(1106)의 자석(1104)에 끌어당겨지게 할 수 있고, 본 예시에서 이 자석은 컴퓨팅 장치(102)의 하우징의 채널(904) 내에 배치된다. 하나 이상의 실시예에서, 유연한 경첩(106)의 유연성에 의해 연결부(202)가 채널(904)에 "스내핑"될 수 있다. 또한, 이를 통해 기계적인 결합 돌출부(208)가 공동(1002)에 삽입되도록 정렬되고 통신 접점들(212)이 채널의 각각의 접점(910)에 맞춰 정렬되도록 연결부(202)가 채널(904)과 "일렬로 배열될" 수 있다.
자기 결합 장치들(204, 1106)은 다양한 방식으로 구성될 수 있다. 예를 들어, 자기 결합 장치(204)는 (예컨대, 강철과 같은) 뒤판(backing, 1108)을 이용하여 자석(1102)에 의해 생성되는 자기장이 뒤판(1108)으로부터 바깥쪽으로 확장되게 할 수 있다. 따라서, 자석(1102)에 의해 생성되는 자기장의 범위가 확장될 수 있다. 자기 결합 장치(204, 1106)는 다양한 다른 구성을 이용할 수 있고, 그 예시들이 다음의 참조 도면과 관련하여 설명되고 도시되어 있다.
도 12는 플럭스 분수를 구현하기 위해 입력 장치(104) 혹은 컴퓨팅 장치(102)에서 이용할 수 있는 자기 결합부의 일례(1200)를 도시한다. 본 예시에서, 자기장의 정렬은 화살표를 사용하여 복수의 자석 각각에 대해 표시되어 있다.
축을 따라 정렬된 자기장을 갖는 자기 결합 장치에 제 1 자석(1202)이 배치된다. 제 2 및 제 3 자석(1204, 1206)이 제 1 자석(1202)의 양쪽에 배치된다. 제 2 및 제 3 자석(1204, 1206)의 자기장의 정렬은 제 1 자석(1202)의 축에 실질적으로 수직이며 또한 일반적으로 서로 반대이다.
이 경우에, 제 2 및 제 3 자석의 자기장은 제 1 자석(1202)을 향한다. 이에 의해 제 1 자석(1202)의 자기장이 표시된 축을 따라 더 확장됨으로써, 제 1 자석(1202)의 자기장의 범위가 증가하게 된다.
이런 영향력은 제 4 및 제 5 자석(1208, 1210)을 사용하여 더욱 확장될 수 있다. 본 예시에서, 제 4 및 제 5 자석(1208, 1210)은 제 1 자석(1202)의 자기장과 실질적으로 반대로 정렬된 자기장을 갖는다. 또한, 제 2 자기장(1204)은 제 4 자석(1208)과 제 1 자석(1202) 사이에 배치된다. 제 3 자기장(1206)은 제 1 자석(1202)과 제 5 자석(1210) 사이에 배치된다. 따라서, 제 4 및 제 5 자석(1208, 1210)의 자기장은 그 각각의 축에 따라 더 확장되어 그 컬렉션에서 이들 자석의 강도는 물론 다른 자석의 강도까지 증가시킬 수 있다. 5 개의 자석의 이와 같은 배열은 플럭스 분수를 형성하기에 적합하다. 5 개의 자석으로 설명되었지만, 더 큰 강도의 플럭스 분수를 형성하기 위해 5 개 이상의 홀수 개의 자석으로 이런 관계를 반복할 수 있다.
다른 자기 결합 장치에 자기적으로 부착하기 위해서, 유사한 배열의 자석들이 도시된 배열의 "위에" 또는 "아래에" 배치될 수 있고, 예를 들어, 제 1, 제 4 및 제 5 자석(1202, 1208, 1210)의 자기장이 그 자석들 위 또는 아래의 대응 자석들에 맞춰 정렬된다. 또한, 다른 구현예들이 고려될 수도 있지만, 도시된 예시에서는, 제 1, 제 4 및 제 5 자석(1202, 1208, 1210)의 강도가 제 2 및 3 자석(1204, 1206)보다 강하다. 플럭스 분수의 다른 예시가 다음의 도면 논의에서 설명된다.
도 13은 플럭스 분수를 구현하기 위해 입력 장치(104) 혹은 컴퓨팅 장치(102)에서 이용할 수 있는 자기 결합부의 일례(1300)를 도시한다. 본 예시에서, 자기장의 정렬은 역시 화살표를 사용하여 복수의 자석 각각에 대해 표시되어 있다.
도 12의 예시(1200)와 같이, 축을 따라 정렬된 자기장을 갖는 자기 결합 장치에 제 1 자석(1302)이 배치된다. 제 2 및 제 3 자석(1304, 1306)이 제 1 자석(1302)의 양쪽에 배치된다. 제 2 및 제 3 자석(1304, 1306)의 자기장의 정렬은 제 1 자석(1302)의 축에 실질적으로 수직이며 또한 일반적으로 서로 반대이다.
이 경우에, 제 2 및 제 3 자석의 자기장은 제 1 자석(1302)을 향한다. 이에 의해 제 1 자석(1302)의 자기장이 표시된 축을 따라 더 확장됨으로써, 제 1 자석(1302)의 자기장의 범위가 증가하게 된다.
이런 영향력은 제 4 및 제 5 자석(1308, 1310)을 사용하여 더욱 확장될 수 있다. 본 예시에서, 제 4 자석(1308)은 제 1 자석(1302)의 자기장과 실질적으로 반대로 정렬된 자기장을 갖는다. 제 5 자석(1310)은 제 2 자석(1304)의 자기장에 실질적으로 대응하도록 정렬된 자기장을 갖고 있고 또한 제 3 자석(1306)의 자기장과 실질적으로 반대이다. 제 4 자기장(1308)은 자기 커플링 장치의 제 3 자석과 제 5 자석(1306, 1310) 사이에 배치된다.
5 개의 자석의 이와 같은 배열은 플럭스 분수를 형성하기에 적합하다. 5 개의 자석으로 설명되었지만, 더 큰 강도의 플럭스 분수를 형성하기 위해 5 개 이상의 홀수 개의 자석으로 이런 관계를 반복할 수 있다. 따라서, 제 1 및 제 4 자석(1302, 1308)의 자기장은 그 각각의 축에 따라 더 확장되어 이 자석의 강도를 증가시킬 수 있다.
다른 자기 결합 장치에 자기적으로 부착하기 위해서, 유사한 배열의 자석들이 도시된 배열의 "위에" 또는 "아래에" 배치될 수 있고, 예를 들어, 제 1 및 제 4 자석(1302, 1308)의 자기장이 그 자석들 위 또는 아래의 대응 자석들에 맞춰 정렬된다. 또한, 다른 구현예들이 고려될 수도 있지만, 도시된 예시에서는, (개개의) 제 1 및 제 4 자석(1302, 1308)의 강도가 제 2, 3 및 5 자석(1304, 1306, 1310)의 강도보다 강하다.
또한, 도 12의 예시(1200)에서는, 유사한 크기의 자석들을 사용하여, 도 13의 예시(1300)에 비해 증가된 자기 결합을 갖고 있을 수 있다. 예를 들어, 도 12의 예시(1200)는 3 개의 자석(예컨대, 제 1, 제 4 및 제 5 자석(1202, 1208, 1210))을 사용하여 자기 결합을 기본적으로 제공하고, 이 자석들의 자기장을 "조종하기" 위해 2 개의 자석, 예를 들어, 제 2 및 3 자석(1204, 1206)이 사용되었다. 반면, 도 13의 예시(1300)는 2 개의 자석(예컨대, 제 1 및 제 4 자석(1302, 1308))을 사용하여 자기 결합을 기본적으로 제공하고, 이 자석들의 자기장을 "조종하기" 위해 3 개의 자석, 예를 들어, 제 2, 3 및 5 자석(1304, 1306, 1310)이 사용되었다.
따라서, 도 13의 예시(1300)에서는, 유사한 크기의 자석들을 사용하여, 도 12의 예시(1200)에 비해 증가된 자기 결합 능력을 갖고 있을 수 있다. 예를 들어, 도 13의 예시(1300)에서는 3 개의 자석(예컨대, 제 2, 3 및 5 자석(1304, 1306, 1310))을 사용하여, 기본적인 자기 결합을 제공하기 위해 사용된 제 1 및 제 4 자석(1302, 1308)의 자기장을 "조종한다". 따라서, 도 13의 예시(1300)에서 자석들의 자기장 배열이 도 12의 예시(1200)의 배열보다 더 가까울 수 있다.
이용한 기법에 상관 없이, 예를 들어, 종래의 정렬 상태로 자석 자체가 유사한 강도를 갖는 자석들의 사용에 비해, 자석의 유효 범위를 증가시키기 위해, 설명된 자기장의 "조종" 또는 "조준(aiming)"을 사용할 수 있음이 자명하다. 하나 이상의 구현예에서, 이는 특정량의 자성체를 사용하는 몇 밀리미터에서 동량의 자성체를 사용하는 몇 센티미터까지 증가시키게 된다.
도 14는 본원에 기술된 기법을 이용하도록 구성된 커버(1402)의 예시적인 구현(1400)을 도시한다. 본 예시에서, 커버(1402)는 컴퓨팅 장치(102)의 하나 이상의 자석에 끌어당겨지도록 구성된 커버의 연결부에 따라 배치된 재료(1404, 1406)를 포함한다.
예를 들어, 커버(1402)는 컴퓨팅 장치(102)의 하나 이상의 자석, 예를 들어, 전술한 플럭스 분수에 끌어당겨지도록 구성된 하나의 자석, 하나 이상의 철계 재료의 스트립(strip) 등을 포함할 수 있다. 예를 들어, 하나 이상의 자석(및 그들의 다양한 조합)이 컴퓨팅 장치(102)에 의해 구현된 플럭스 분수의 하나 이상의 대응 자석에 끌어당겨지도록 배치될 수 있다. 이와 같은 방식으로, 연결의 "양쪽에" 자석들의 배열을 포함하지 않고도 전술한 바와 같이 강력한 물리적 연결이 지원될 수 있다. 다양한 다른 예시들도 고려할 수 있다.
예시적인 시스템 및 장치
도 15는 하나 이상의 컴퓨팅 시스템 및/또는 전술한 다양한 기법을 구현할 수 있는 장치를 나타내는 예시적인 컴퓨팅 장치(1502)를 포함하는 예시적인 시스템(1500)을 도시한다. 컴퓨팅 장치(1502)는, 예를 들어, 사용자의 한쪽 손 또는 양손으로 잡거나 들고 있도록 형성된 하우징과 크기를 통한 모바일 구성을 가정하도록 구성될 수 있으며, 다른 예들도 고려할 수 있지만, 도시된 예시로서 모바일 폰, 모바일 게임 및 음악 기기, 및 태블릿 컴퓨터를 들 수 있다.
도시된 바와 같이 예시적인 컴퓨팅 장치(1502)는 프로세싱 시스템(1504), 하나 이상의 컴퓨터 판독가능 저장 매체(1506), 및 서로 통신가능하게 연결된 하나 이상의 I/O 인터페이스(1508)를 포함한다. 도시되지는 않았지만, 컴퓨팅 장치(1502)는 다양한 컴포넌트들을 서로 결합시키는 시스템 버스 또는 기타 데이터 및 명령어 전송 시스템을 더 포함할 수 있다. 시스템 버스는 메모리 버스 또는 메모리 컨트롤러, 주변 버스, USB, 및/또는 임의의 다양한 버스 아키텍처를 사용하는 프로세서 또는 로컬 버스를 비롯한 임의의 하나 또는 상이한 버스 구조들의 조합을 포함할 수 있다. 컨트롤 및 데이터 라인과 같이 여러 다른 예시들도 고려된다.
프로세싱 시스템(1504)은 하드웨어를 사용하여 하나 이상의 동작을 수행하는 기능을 나타낸다. 따라서, 프로세싱 시스템(1504)은 프로세서, 기능 블록 등으로 구성될 수 있는 하드웨어 구성요소(1510)를 포함하는 것으로 도시된다. 이는 하나 이상의 반도체를 사용하여 형성된 ASIC(application specific integrated circuit) 또는 기타 로직 장치로서의 하드웨어로의 구현을 포함할 수 있다. 하드웨어 구성요소(1510)는 하드웨어 구성요소를 형성하는 물질이나 또는 이용된 처리 메커니즘에 제한되지 않는다. 예를 들어, 프로세서는 반도체(들) 및/또는 트랜지스터(전자 집적 회로(IC))를 포함할 수 있다. 이런 맥락에서, 프로세서 실행 가능 명령어는 전자적으로 실행 가능한 명령어일 수 있다.
컴퓨터 판독가능 저장 매체(1506)는 메모리/저장 컴포넌트(1512)를 포함하는 것으로 도시된다. 메모리/저장 컴포넌트(1512)는 하나 이상의 컴퓨터 판독가능 저장 매체와 관련된 메모리/저장 기능을 나타낸다. 메모리/저장 컴포넌트(1512)는 (랜덤 액세스 메모리(RAM)와 같은) 휘발성 매체 및/또는 (판독 전용 메모리(ROM), 플래시 메모리, 광 디스크, 자기 디스크 등의) 비휘발성 매체를 포함할 수 있다. 메모리/저장 컴포넌트(1512)는 고정식 매체(예컨대, RAM, ROM, 고정 하드 드라이브 등)뿐만 아니라 이동식 매체(예컨대, 플래시 메모리, 이동식 하드 드라이브, 광 디스크 등)를 포함할 수 있다. 컴퓨터 판독가능 저장 매체(1506)는 후술하는 바와 같이 다양한 다른 방식으로 구성될 수 있다.
입/출력 인터페이스(들)(1508)는 사용자가 컴퓨팅 장치(1502)로 명령어 및 정보를 입력할 수 있고, 또한 다양한 입/출력 장치를 이용해 정보가 사용자 및/또는 그 밖의 다른 컴포넌트 또는 장치로 제공되게 하는 기능을 나타낸다. 입력 장치의 예로는 키보드, 커서 제어 장치(예컨대, 마우스), 마이크로폰, 스캐너, 터치 기능(예컨대, 물리적 터치를 탐지하도록 구성된 정전 용량형 또는 기타 센서), 카메라(예컨대, 터치를 포함하지 않는 움직임을 제스처로서 인식하기 위해 적외선 주파수와 같은 가시 또는 비가시 파장을 이용할 수 있음) 등을 포함한다. 출력 장치의 예로는 디스플레이 장치(예컨대, 모니터 또는 프로젝터), 스피커, 프린터, 네트워크 카드, 촉각 반응 장치 등을 포함한다. 따라서, 컴퓨팅 장치(1502)는 사용자 인터랙션을 지원하기 위해 다양한 방식으로 구성될 수 있다.
또한 컴퓨팅 장치(1502)는 컴퓨팅 장치(1502)에서 물리적으로 또한 통신가능하게 제거 가능한 입력 장치(1514)에 통신가능하게 또한 물리적으로 결합된 것으로 도시되어 있다. 이와 같은 방식으로, 여러 다른 입력 장치들이 매우 다양한 기능을 지원하기 위한 매우 다양한 구성을 갖고 있는 컴퓨팅 장치(1502)에 결합될 수 있다. 본 예시에서, 입력 장치(1514)는 압력 감지 키, 기계적으로 스위칭되는 키 등으로 구성될 수 있는 하나 이상의 키(1516)를 포함한다.
또한 입력 장치(1514)는 다양한 기능을 지원하도록 구성되는 하나 이상의 모듈(1518)을 포함하는 것으로 도시되어 있다. 하나 이상의 모듈(1518)은, 예를 들어, 키 누르기(keystroke)가 의도되었는지 여부 결정, 입력이 정지압(resting pressure)을 나타내는지 여부 결정, 컴퓨팅 장치(1502)와의 동작을 위해 입력 장치(1514)의 인증 지원을 위해 키(1516)로부터 수신된 아날로그 및/또는 디지털 신호들을 처리하도록 구성될 수 있다.
본원에서는 다양한 기법이 소프트웨어, 하드웨어 구성요소, 또는 프로그램 모듈로서 일반적으로 설명된다. 일반적으로, 이런 모듈은 특정 작업을 실행하거나 특정 추상화 데이터 유형을 구현하는 루틴, 프로그램, 객체, 구성요소, 컴포넌트, 데이터 구조 등을 포함한다. 본원에서 사용된 용어 "모듈" 및 "기능" 및 "컴포넌트"는 일반적으로 소프트웨어, 펌웨어, 하드웨어, 또는 이들의 조합을 나타낸다. 본원에 기술된 기법의 특징은 플랫폼 독립적(platform-independent)이며, 이는 기법이 다양한 프로세서를 갖는 다양한 상업용 컴퓨팅 플랫폼 상에서 구현될 수 있음을 의미한다.
설명된 모듈 및 기법의 구현예는 컴퓨터 판독가능 매체에 저장되거나 또는 컴퓨터 판독 가능 매체로 전송될 수 있다. 컴퓨터 판독가능 매체는 컴퓨팅 장치(1502)가 액세스할 수 있는 다양한 매체를 포함할 수 있다. 예를 들어, 그러나 제한 없이, 컴퓨터 판독가능 매체는 "컴퓨터 판독가능 저장 매체" 및 "컴퓨터 판독가능 통신 매체"를 포함할 수 있다.
"컴퓨터 판독가능 저장 매체"는 단순 신호 전송, 반송파, 또는 신호 그 자체와 달리 정보의 영속적(persistent) 및/또는 비-일시적(non-transitory) 저장을 가능하게 하는 매체 및/또는 장치를 지칭할 수 있다. 따라서, 컴퓨터 판독가능 저장 매체는 비-신호 운반(bearing) 매체를 지칭한다. 컴퓨터 판독가능 저장 매체는 컴퓨터 판독가능 명령어, 데이터 구조, 프로그램 모듈, 로직 요소/회로, 또는 그 밖의 다른 데이터와 같은 정보의 저장에 적합한 방법 또는 기법으로 구현되는 휘발성 및 비-휘발성, 이동식 및 비-이동식 매체 및/또는 저장 장치 등의 하드웨어를 포함한다. 컴퓨터 판독가능 저장 매체의 예로는, RAM, ROM, EEPROM, 플래시 메모리 또는 그 밖의 다른 메모리 기법, CD-ROM, DVD(digital versatile disk), 또는 기타 광 저장장치, 하드 디스크, 자기 카세트, 자기 테이프, 자기 디스크 저장장치 또는 기타 자기 저장 장치, 또는 그 밖의 다른 저장 장치, 유형 매체(tangible media) 또는 컴퓨터에 의해 액세스될 수 있는 바람직한 정보를 저장하기에 적합한 제조 물품이 있으며, 그러나 이에 제한되지는 않는다.
"컴퓨터 판독가능 통신 매체"는 가령 네트워크를 통해 컴퓨팅 장치(1502)의 하드웨어로 명령어를 송신하도록 구성된 신호 운반 매체를 지칭할 수 있다. 일반적으로 통신 매체는 컴퓨터 판독가능 명령어, 데이터 구조, 프로그램 모듈, 또는 기타 데이터를 반송파, 데이터 신호 또는 그 밖의 다른 전송 메커니즘을 비롯한 변조 데이터 신호로 구현할 수 있다. 통신 매체는 임의의 정보 전달 매체를 더 포함한다. "변조된 데이터 신호"라는 용어는 신호 내 정보를 인코딩하도록 특징들 중 하나 이상 설정 또는 변경된 신호를 의미한다. 예를 들어, 그러나 제한 없이, 통신 매체는 유선 네트워크 또는 직접 배선된 연결과 같은 유선 매체, 및 음향, RF, 적외선 및 그 밖의 다른 무선 매체와 같은 무선 매체를 포함한다.
전술한 바와 같이, 하드웨어 구성요소(1510) 및 컴퓨터 판독가능 저장 매체(1506)는, 하나 이상의 명령어를 실행하기 위한 것을 비롯해, 본원에 기술된 기법의 적어도 일부 양태를 구현하기 위해 몇몇 실시예에서 이용할 수 있는 하드웨어로 구성된 모듈, 프로그램 가능한 장치 로직 및/또는 고정 장치 로직을 나타낸다. 하드웨어는 집적 회로 또는 온-칩 시스템, ASIC(application-specific integrated circuit), FPGA(field-programmable gate array), CPLD(complex programmable logic device), 및 실리콘 또는 기타 하드웨어에서의 기타 구현예의 컴포넌트들을 포함할 수 있다. 이런 맥락에서, 하드웨어는 명령어에 의해 정의되는 프로그램 태스크를 실행하는 프로세싱 장치, 및/또는 하드웨어에 의해 구현되는 로직은 물론, 실행을 위한 명령어를 저장하는 데 이용되는 하드웨어, 예컨대, 전술한 컴퓨터 판독가능 저장 매체로서 동작할 수 있다.
본원에 설명된 다양한 기법을 구현하기 위해 전술한 것들의 조합을 이용할 수 있다. 따라서, 소프트웨어, 하드웨어, 또는 실행 가능 모듈은 임의의 형태의 컴퓨터 판독가능 저장 매체에 구현된 하나 이상의 명령어 및/또는 로직으로서 및/또는 하나 이상의 하드웨어 요소(1510)에 의해 구현될 수 있다. 컴퓨팅 장치(1502)는 소프트웨어 및/또는 하드웨어 모듈에 대응하는 특정 명령어 및/또는 기능을 구현하도록 구성될 수 있다. 따라서, 소프트웨어로서 컴퓨팅 장치(1502)에 의해 실행될 수 있는 모듈들은 예컨대, 컴퓨터 판독가능 저장 매체 및/또는 프로세싱 시스템(1504)의 하드웨어 요소(1510)를 사용하여 적어도 부분적으로는 하드웨어로 구현될 수 있다. 명령어 및/또는 기능은 본원에 설명된 기법, 모듈, 및 예시를 구현하기 위해 하나 이상의 제조물품(예컨대, 하나 이상의 컴퓨팅 장치(1502) 및/또는 프로세싱 시스템(1504))으로 실행/동작될 수 있다.
결론
구현예가 구조적 특징부 및/또는 방법적 동작에 특정적인 언어로 기술되었지만, 이하의 특허청구범위에서 정의되는 본 구현은 반드시 기술된 특정 특징부 또는 동작에 한정되는 것은 아님을 알아야 한다. 오히려, 특정 특징부 및 동작은 특허청구된 특징부를 구현하는 예시적인 형태로서 개시된 것이다.

Claims (20)

  1. 컴퓨팅 디바이스의 디스플레이 디바이스의 적어도 일부분에 선택적으로 배치되도록 구성된 커버와,
    상기 커버에 부착된 연결부를 포함하되,
    상기 연결부는 자기 결합 디바이스를 사용하여 상기 컴퓨팅 디바이스에 물리적으로 결합되도록 구성되며,
    상기 자기 결합 디바이스는
    자기장이 축을 따라 정렬되도록 상기 연결부에 배치된 제 1 자석과,
    상기 연결부에서 상기 제 1 자석의 양쪽에 배치된 제 2 및 제 3 자석 - 상기 제 2 자석과 상기 제 3 자석의 각각은 상기 제 1 자석의 자기장의 축에 수직인 축을 따라 정렬되는 각각의 자기장을 가짐 - 을 포함하고,
    상기 제 1 자석의 자기장의 강도는 상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장의 강도보다 더 큰
    장치.
  2. 제 1 항에 있어서,
    상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장이 상기 제 1 자석의 자기장을 상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장의 영향이 없는 상기 제 1 자석의 자기장보다 상기 연결부로부터 더 멀리 확장되게 하도록, 상기 제 2 자석 및 상기 제 3 자석이 상기 연결부에서 상기 제 1 자석의 양쪽에 배치되는
    장치.
  3. 제 1 항에 있어서,
    상기 제 2 자석 및 상기 제 3 자석은 반대 방향으로 배열된 각각의 자기장을 갖도록 상기 자기 결합 디바이스에 배치되는
    장치.
  4. 삭제
  5. 제 1 항에 있어서,
    상기 자기 결합 디바이스는 상기 제 1, 제 2, 및 제 3 자석과 함께 플럭스 분수를 형성하는 제 4 자석 및 제 5 자석을 포함하는
    장치.
  6. 제 5 항에 있어서,
    상기 제 4 자석은 상기 제 1 자석의 자기장과 반대로 정렬되는 자기장을 가지며,
    상기 제 5 자석은 상기 제 2 자석의 자기장에 일치하고 상기 제 3 자석의 자기장과 반대인 자기장을 가지며,
    상기 제 4 자석은 상기 자기 결합 디바이스에서 상기 제 3 자석 및 상기 제 5 자석 사이에 배치된
    장치.
  7. 제 1 항에 있어서,
    상기 커버는 상기 연결부의 복수의 통신 접점에 통신가능하게 결합된 입력부를 더 포함하고, 상기 입력부는 상기 컴퓨팅 디바이스에 하나 이상의 입력을 제공하도록 구성된
    장치.
  8. 제 7 항에 있어서,
    상기 입력부는 키보드를 구현하도록 구성되는
    장치.
  9. 하우징과,
    상기 하우징 내에 배치되고 하나 이상의 동작을 수행하기 위해 적어도 부분적으로는 하드웨어로 구현되는 하나 이상의 모듈과,
    상기 하우징 상에 배치되고 입력 디바이스와 통신가능한 결합을 형성하도록 구성된 하나 이상의 통신 접점과,
    상기 하나 이상의 통신 접점의 반대쪽에서 상기 하우징에 의해 지지되는 제 1 자기 결합 디바이스 및 제 2 자기 결합 디바이스를 포함하되,
    상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각은 디바이스에 대한 자성의 물리적인 결합을 형성하도록 구성되며,
    상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각은
    자기장이 축을 따라 정렬되도록 연결부에 배치된 제 1 자석과,
    상기 연결부에서 상기 제 1 자석의 양쪽에 배치된 제 2 자석 및 제 3 자석 - 상기 제 2 자석 및 상기 제 3 자석의 각각은 상기 제 1 자석의 자기장의 축에 수직인 축을 따라 정렬되는 각각의 자기장을 가짐 - 을 포함하고,
    상기 제 1 자석의 자기장의 강도는 상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장의 강도보다 더 큰
    컴퓨팅 디바이스.
  10. 제 9 항에 있어서,
    상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각은 플럭스 분수를 구현하도록 구성되는
    컴퓨팅 디바이스.
  11. 제 9 항에 있어서,
    상기 하우징은 태블릿 구성(tablet configuration)을 형성하도록 구성되는
    컴퓨팅 디바이스.
  12. 제 9 항에 있어서,
    상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각은 상기 제 1, 제 2, 및 제 3 자석의 각각과 함께 플럭스 분수를 형성하는 제 4 자석 및 제 5 자석을 포함하는
    컴퓨팅 디바이스.
  13. 제 12 항에 있어서,
    상기 제 4 자석은 상기 제 1 자석의 자기장과 반대로 정렬되는 자기장을 가지며,
    상기 제 5 자석은 상기 제 2 자석의 자기장에 일치하고 상기 제 3 자석의 자기장과 반대인 자기장을 가지며,
    상기 제 4 자석은 상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각에서 상기 제 3 자석 및 상기 제 5 자석 사이에 배치되는
    컴퓨팅 디바이스.
  14. 제 12 항에 있어서,
    상기 제 4 자석 및 상기 제 5 자석은 상기 제 1 자석의 자기장과 반대로 정렬되는 자기장을 가지며,
    상기 제 2 자석은 상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각에서 상기 제 1 자석과 상기 제 4 자석 사이에 배치되고,
    상기 제 3 자석은 상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각에서 상기 제 1 자석과 상기 제 5 자석 사이에 배치되는
    컴퓨팅 디바이스.
  15. 제 9 항에 있어서,
    상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장이 상기 제 1 자석의 자기장을 상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장의 영향이 없는 상기 제 1 자석의 자기장보다 상기 하우징으로부터 더 멀리 확장되게 하도록, 상기 제 2 자석 및 상기 제 3 자석이 상기 제 1 자석의 양쪽에 배치되는
    컴퓨팅 디바이스.
  16. 제 9 항에 있어서,
    상기 제 2 자석 및 상기 제 3 자석은 반대 방향으로 배열된 각각의 자기장을 갖도록 상기 제 1 자기 결합 디바이스 및 상기 제 2 자기 결합 디바이스의 각각에 배치되는
    컴퓨팅 디바이스.
  17. 삭제
  18. 컴퓨팅 디바이스로서,
    하우징과,
    상기 하우징 내에 배치되고 하나 이상의 동작을 수행하기 위해 적어도 부분적으로는 하드웨어로 구현되는 하나 이상의 모듈과,
    상기 하우징 상에 배치되고 입력 디바이스와 통신가능한 결합을 형성하도록 구성된 하나 이상의 통신 접점과,
    상기 하우징에 의해 지지되고, 디바이스에 대한 자성의 제거 가능한 물리적인 결합을 형성하여 상기 디바이스가 상기 컴퓨팅 디바이스로부터 물리적으로 분리되도록 구성되는 자기 결합 디바이스를 포함하되,
    상기 자기 결합 디바이스는,
    자기장이 축을 따라 정렬되도록 연결부에 배치된 제 1 자석과,
    상기 연결부에서 상기 제 1 자석의 양쪽에 배치된 제 2 자석 및 제 3 자석 - 상기 제 2 자석 및 상기 제 3 자석의 각각은 상기 제 1 자석의 자기장의 축에 수직인 축을 따라 정렬되는 각각의 자기장을 가짐 - 을 포함하고,
    상기 제 1 자석의 자기장의 강도는 상기 제 2 자석 및 상기 제 3 자석의 각각의 자기장의 강도보다 더 큰
    컴퓨팅 디바이스.
  19. 제 18 항에 있어서,
    상기 자기 결합 디바이스는 상기 제 1, 제 2, 및 제 3 자석과 함께 플럭스 분수를 형성하는 제 4 자석 및 제 5 자석을 포함하는
    컴퓨팅 디바이스.
  20. 제 18 항에 있어서,
    상기 디바이스는 커버인
    컴퓨팅 디바이스.
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