CN113416930A - Evaporation source and film forming apparatus - Google Patents
Evaporation source and film forming apparatus Download PDFInfo
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- CN113416930A CN113416930A CN202110723236.8A CN202110723236A CN113416930A CN 113416930 A CN113416930 A CN 113416930A CN 202110723236 A CN202110723236 A CN 202110723236A CN 113416930 A CN113416930 A CN 113416930A
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- evaporation source
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- 238000001704 evaporation Methods 0.000 title claims abstract description 140
- 230000008020 evaporation Effects 0.000 title claims abstract description 137
- 239000000463 material Substances 0.000 claims abstract description 47
- 238000009792 diffusion process Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 abstract description 19
- 238000009825 accumulation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 29
- 238000007740 vapor deposition Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an evaporation source and a film forming apparatus, which can prevent the reflection or re-evaporation of a film forming material to the evaporation source and the accumulation of the film forming material to the peripheral members of the evaporation source even if the opening end surface of an evaporation opening part positioned at the outermost side is inclined towards the outer side of the long side direction of the evaporation source. The evaporation source includes a container for containing a film forming material, and a plurality of cylindrical portions arranged along a longitudinal direction of the container and protruding from the container, respectively, wherein a first cylindrical portion and a second cylindrical portion of the plurality of cylindrical portions are inclined so that distal ends thereof are oriented in the same direction in the longitudinal direction, and an inclination angle of the first cylindrical portion and an inclination angle of the second cylindrical portion are different from each other.
Description
The present invention is a divisional application of an invention patent application having an application date of 2017, 7 and 5, and an application number of 201710539978.9, entitled "vapor deposition device and evaporation source".
Technical Field
The present invention relates to an evaporation source and a film forming apparatus.
Background
Japanese patent application No. 2014-265981, which was previously filed by the present applicant, proposes a vacuum deposition apparatus in which an opening end surface of an evaporation port located on the outer side among a plurality of evaporation ports provided in an evaporation source is inclined so as to face the outer side in the longitudinal direction of the evaporation source, whereby a deposited film having a uniform film thickness distribution and suppressed film blurring in a pattern after film formation can be obtained without arranging the evaporation ports so as to expand outward in the longitudinal direction.
However, when the opening end surface of the evaporation port portion B of the evaporation source a is inclined so as to face the outer side in the longitudinal direction of the evaporation source as described above, the scattering range of the evaporated film-forming material discharged from the inclined opening end surface is inclined toward the evaporation source side, and as illustrated in fig. 1, the scattering range spreads to both end portions (the range indicated by C in fig. 1) of the evaporation source a (normally, the distribution of the discharge angle of the film-forming material discharged from the evaporation port portion scatters forward from an imaginary plane including the opening end surface according to the cosine law that the normal direction of the opening is 0 °).
In the case where the scattering range of the film forming material directly reaches the evaporation source, the evaporation source is heated, and therefore the scattered film forming material is reflected or re-evaporated by the evaporation source and reaches the substrate, and the film thickness distribution may be affected.
In addition, when the evaporation source is covered with the cooling member, the film forming material is deposited on the cooling member in the range where the film forming material is scattered. The deposit on the cooling member is difficult to evaporate again, grows gradually, and may block the opening of the evaporation port sooner or later.
Disclosure of Invention
[ problem to be solved by the invention ]
The present invention has been made in view of the above-described situation, and provides a vapor deposition apparatus and an evaporation source capable of preventing reflection or re-evaporation of a film forming material to the evaporation source and deposition to members around the evaporation source even in a structure in which an opening end surface of an evaporation port portion located on the outermost side is inclined so as to face the outer side in the longitudinal direction of the evaporation source.
[ MEANS FOR solving PROBLEMS ] A method for solving the problems
A vapor deposition device including an evaporation source having a container for containing a film forming material, a plurality of evaporation port portions provided along a longitudinal direction of the container, and evaporation source peripheral members provided around the container, the vapor deposition device being configured to form a vapor deposition film on a substrate by discharging the film forming material from the evaporation port portions, wherein each of a pair of outer evaporation port portions provided on an outermost side among the plurality of evaporation port portions has an opening end surface inclined so as to face an outer side in the longitudinal direction of the container, and the container and the evaporation source peripheral members are accommodated inside a virtual plane including the opening end surface without protruding outward.
[ Effect of the invention ]
The present invention is configured as described above, and therefore provides a vapor deposition apparatus and an evaporation source as follows: even if the open end surface of the evaporation port located at the outermost side is inclined so as to face the outer side in the longitudinal direction of the evaporation source, the film forming material can be prevented from being reflected or re-evaporated in the evaporation source and deposited on the member around the evaporation source.
Drawings
Fig. 1 is a schematic explanatory view of the background art.
Fig. 2 is an enlarged schematic explanatory cross-sectional view of the present embodiment.
Fig. 3 is a schematic explanatory cross-sectional view of the present embodiment.
Fig. 4 is a schematic diagram of main parts of the present embodiment.
Fig. 5 is an enlarged schematic explanatory cross-sectional view of another example 1.
Fig. 6 is a schematic explanatory cross-sectional view of another example 2.
Fig. 7 is an enlarged schematic explanatory cross-sectional view of another example 3.
Fig. 8 is a schematic explanatory front view of another example 4.
FIG. 9 is a schematic explanatory side view of another example 4.
Fig. 10 is a schematic explanatory front view of the vapor deposition device.
Fig. 11 is a schematic explanatory side view of the vapor deposition device.
[ notation ] to show
1 Container
2a, 2b evaporation port
3 peripheral member of evaporation source
4 diffusion part
5 Material housing part
6 Heater
7 reflector
8 water-cooling plate
9 anti-adhesion plate
Detailed Description
The operation of the present invention is illustrated based on the drawings, and embodiments of the present invention considered to be preferable are briefly described.
The evaporated film forming material is discharged from the evaporation port parts 2a and 2b of the container 1 to form a deposited film on the substrate.
At this time, the evaporation source peripheral member 3 such as the container 1, the heating member, and the cooling member does not protrude outward beyond the imaginary plane including the opening end face of the outer evaporation port portion 2a, that is, the container 1 and the evaporation source peripheral member 3 are not present in the region where the film-forming material discharged from the opening end face of the outer evaporation port portion 2a reaches, and therefore, reflection or re-evaporation of the film-forming material discharged from the opening end face of the outer evaporation port portion 2a to the container 1 and deposition to the evaporation source peripheral member 3 can be prevented.
[ examples ] A method for producing a compound
Specific embodiments of the present invention are explained based on the drawings.
In this embodiment, the present invention is applied to a vapor deposition device as shown in fig. 10 and 11. In order to form a thin film on a substrate 21 in a vacuum chamber 20 that maintains a reduced pressure atmosphere, the vapor deposition apparatus includes: a film thickness monitor 22 for monitoring the evaporation rate of the evaporated particles emitted from the evaporation source 25; a film thickness meter 23 which is provided outside the vacuum chamber 20 and converts the amount of the evaporation particles to be monitored into a film thickness; and a heater power supply 24 for heating the evaporation source 25 in order to control the evaporation rate of the film forming material so that the converted film thickness becomes a desired film thickness. Further, a relative movement mechanism for relatively moving the substrate 21 and the evaporation source 25 is provided, and by performing film formation while performing relative movement, a vapor deposition film having a uniform film thickness can be formed over the entire surface of the substrate.
The container 1 and the substrate disposed at a position facing the container 1 are relatively moved in a direction orthogonal to the longitudinal direction of the container 1, and the deposition material is discharged from the evaporation port portion 2, thereby forming a deposition film on the substrate.
In the present embodiment, an evaporation source 25 is used which is composed of a container 1 and evaporation port sections 2a and 2b, the container 1 accommodating a film-forming material, and a plurality of the evaporation port sections 2a and 2b are provided in the container 1 along the longitudinal direction of the container 1.
The container 1 and the evaporation source peripheral member 3 provided around the container 1 according to the present embodiment are configured not to protrude outward from a virtual plane including the opening end face, and are configured to be accommodated inside the virtual plane.
The container 1 is provided with a diffuser 4 for diffusing the vaporized film-forming material, and the width W1 of the diffuser 4 in the longitudinal direction of the container 1 is set to be narrower than the arrangement width W2 of the evaporation port portions 2a and 2 b. In the present embodiment, an integrated container 1 is used in which the lower portion of the container 1 is a material storage portion 5 and the upper portion is a diffusion portion 4.
A pair of outer evaporation port portions 2a provided on the outermost side among the plurality of evaporation port portions 2 have opening end surfaces inclined so as to face the outer side in the longitudinal direction of the container 1.
Further, the evaporation port portion 2b other than the outer evaporation port portion 2a may have an opening end surface inclined outward in the longitudinal direction of the container 1, may have an opening end surface inclined inward in the longitudinal direction, or may be provided upright on the container 1, similarly to the outer evaporation port portion 2 a.
In the present embodiment, the evaporation port section 2b other than the innermost one of the evaporation port sections is configured in the same manner as the outer evaporation port section 2a, and the innermost one of the evaporation port sections 2b is configured to be vertically erected on the container 1.
The evaporation source peripheral member 3 of the present embodiment is a square ring-shaped member provided so as to surround the periphery of the rectangular container 1 in a plan view, and specifically, is a heating member and a cooling member of the container 1.
In the present embodiment, as shown in fig. 2 and 3, a heater 6 for heating the container 1, a reflector 7 for reflecting heat from the container 1 and the heater 6, a water-cooling plate 8 for preventing heat from the container 1, the heater 6, and the reflector 7 from being diffused to the surroundings, and an adhesion preventing plate 9 surrounding the container 1, the heater 6, the reflector 7, and the water-cooling plate 8 are provided as the evaporation source peripheral member 3 in this order from the inside. In the present embodiment, the adhesion preventing plate 9 is also shaped to cover the upper surfaces of the heater 6, the reflector 7, and the water cooling plate 8. The adhesion preventing plate 9 is formed to cover the entire upper surface of the container 1 except for the arrangement region of the evaporation port portions 2a and 2 b.
The container 1 is configured such that the distance from the longitudinal end surface of the container 1 to the outer evaporation port portion 2a is a length such that both end portions of the container 1 and the evaporation source peripheral member 3 are not positioned outside the virtual plane.
Specifically, the length from the longitudinal end surface of the container 1 to the outer evaporation port portion 2a, the inclination angle of the opening end surface of the outer evaporation port portion 2a, and the thickness of the evaporation source peripheral member 3 are appropriately set so that the container 1 and the evaporation source peripheral member 3 are accommodated inside the virtual plane. Here, the inclination angle of the opening end face of the outer evaporation port portion 2a is preferably set to 30 ° to 45 °.
For example, as shown in fig. 4, a length M1 from the end surface of the container 1 in the longitudinal direction to the outer evaporation port 2a, a length M2 from the end surface of the evaporation source peripheral member 3 to the outer evaporation port 2a, and a thickness M3 of the evaporation source peripheral member 3 can be determined as follows using the inclination angle θ of the opening end surface of the outer evaporation port 2a and the tip length L2 (protruding from the upper surface of the container 1) of the outer evaporation port 2 a. In the figure, L1 represents the entire length of the outer evaporation port 2 a.
M1＝L2×sinθ
M2＝L2÷sinθ
M3＝M2-M1
For example, when L2 is 40mm and θ is 40 °, M1 is 25.7mm, M2 is 62.2mm, and M3 is 36.5 mm.
The evaporation source peripheral member 3 surrounds the side surface and the end surface of the end portion of the container 1 in fig. 2, but may surround the end portion of the container 1 to the upper surface. For example, as in another example 1 shown in fig. 5, the heater 6, the reflector 7, and the adhesion preventing plate 9 may be configured to cover the upper surface of the end portion of the container 1.
The configuration of the container 1 is not limited to the integrated type as described above, and may be a separated type in which, for example, as in the evaporation source 25 of another example 2 shown in fig. 6, the material storage portion 5 and the diffusion portion 4 are provided via the communication portion 12, and both the material storage portion 5 and the diffusion portion 4 are combined to form the container 1. In this case, if the width W1 of the diffusion portion 4 is narrowed in order to avoid the container 1 and the like from protruding outward from the virtual plane, the width W3 of the material containing portion 5 does not need to be shortened in order to be contained inside the virtual plane, and therefore, a configuration that is wider than the width W1 of the diffusion portion 4 and can contain a larger amount of material can be realized, and moreover, the influence of the material containing portion 5 on the substrate temperature and the like can be suppressed, and the film formation can be performed more favorably.
In the present embodiment, the inclination angles of the opening end surfaces of the evaporation port portions 2a and 2b inclined outward in the longitudinal direction of the container 1 are the same, but the inclination angles of the opening end surfaces of the outer evaporation port portion 2a may be set to different angles so as to maximize the inclination angle. In this case, the inclination angle of the opening end face of the evaporation port portion 2a or 2b may be set to an angle equal to or larger than the inclination angle of the opening end face of the evaporation port portion 2b located inside.
In this case, the following configuration can be adopted: the evaporated particles discharged from the inner evaporation port 2b are prevented from adhering to the outer evaporation ports 2a and 2b and being evaporated again. Further, the distance from the outer evaporation port portions 2a and 2b to the substrate end is long, and it is necessary to make the evaporation particles reach further away, but the evaporation particles released from the outer evaporation port portions 2a and 2b can be made to reach further away by increasing the inclination angle as they get closer to the outer side.
As in another example 3 shown in fig. 7, if the container 1 and the evaporation source peripheral member 3 provided around the container 1 are accommodated inside a virtual plane including the opening end surfaces of the evaporation port portions 2a and 2b, respectively, without protruding outward from the virtual plane, not only the outer evaporation port portion 2a but also the other evaporation port portion 2b having an opening end surface inclined outward in the longitudinal direction of the container 1, as well, the effect is greater.
Further, the following configuration may be adopted: as shown in another example 4 shown in fig. 8 and 9, the upper portion of the integrated container 1 or the upper portion of the separate container 1 may be chamfered at a predetermined angle at the upper portions of the left and right ends, the upper portions of the front and rear ends, or the upper portions of the left and right ends and the upper portions of the front and rear ends. In the case of fig. 8, the deposition of material to the evaporation source peripheral members 3 in the longitudinal direction of the container 1 can be further prevented, and in the case of fig. 9, the deposition of material to the evaporation source peripheral members 3 in the front and rear of the evaporation source in the short-side direction can be further prevented.
The present invention is not limited to the embodiment, and the specific configurations of the respective constituent elements may be appropriately designed.
Claims (21)
1. An evaporation source having a container for containing a film forming material and a plurality of cylindrical portions arranged along a longitudinal direction of the container and projecting from the container, respectively,
it is characterized in that the preparation method is characterized in that,
the first cylindrical portion and the second cylindrical portion of the plurality of cylindrical portions are inclined such that the tip ends thereof are directed in the same direction in the longitudinal direction,
the inclination angle of the first cylindrical portion is different from the inclination angle of the second cylindrical portion.
2. The evaporation source according to claim 1,
the container has a material storage portion and a diffusing portion.
3. The evaporation source according to claim 2,
the length of the material housing portion in the longitudinal direction is longer than the length of the diffusion portion in the longitudinal direction.
4. The evaporation source according to claim 2,
the container is provided with an opening that communicates the material storage portion and the diffusion portion, and the container further has an intermediate portion that partially divides the material storage portion and the diffusion portion.
5. The evaporation source according to claim 4,
the plurality of cylindrical portions are not disposed directly above the center of the opening.
6. The evaporation source according to claim 2,
a third cylindrical portion and a fourth cylindrical portion of the plurality of cylindrical portions are inclined such that tips thereof are directed in the longitudinal direction in a direction opposite to the first cylindrical portion and the second cylindrical portion,
the inclination angle of the third cylindrical portion and the inclination angle of the fourth cylindrical portion are different.
7. The evaporation source according to claim 6,
the length of the material housing portion in the longitudinal direction is longer than the length of the diffusion portion in the longitudinal direction.
8. The evaporation source according to claim 6,
the container is provided with an opening that communicates the material storage portion and the diffusion portion, and the container further has an intermediate portion that partially divides the material storage portion and the diffusion portion.
9. The evaporation source according to claim 8,
the plurality of cylindrical portions are not disposed directly above the center of the opening.
10. The evaporation source according to claim 8,
the first and second cylindrical portions and the third and fourth cylindrical portions are arranged on both sides across the opening in the longitudinal direction.
11. The evaporation source according to claim 10,
the first and second cylindrical portions and the third and fourth cylindrical portions are arranged symmetrically with respect to the opening in the longitudinal direction.
12. The evaporation source according to claim 1,
the inclination angle of the first cylindrical portion and the second cylindrical portion is set to 30 ° to 45 °.
13. A film forming apparatus is characterized in that,
the film forming apparatus includes:
the evaporation source of any of claims 1 to 12; and
a moving mechanism for moving the evaporation source,
the evaporation source is moved to discharge the material from the evaporation source, thereby forming a film on the substrate.
14. An evaporation source having a container for containing a film forming material and a plurality of cylindrical portions arranged along a longitudinal direction of the container and projecting from the container, respectively,
it is characterized in that the preparation method is characterized in that,
the container includes a material storage portion for storing a film forming material, a diffusion portion for diffusing the film forming material evaporated in the material storage portion, and a communication portion for communicating the material storage portion and the diffusion portion,
the communication portion has a length shorter than a length of the material containing portion and a length of the diffusion portion in the longitudinal direction,
the plurality of cylindrical portions are provided to the diffusion portion,
a first cylindrical portion located at an end in the longitudinal direction among the plurality of cylindrical portions is inclined.
15. The evaporation source according to claim 14,
the container is provided with a diffusion portion for diffusing the evaporated film-forming material, and the diffusion portion has a width in the longitudinal direction of the container set to a width smaller than the arrangement width of the cylindrical portion.
16. The evaporation source according to claim 14,
a second cylindrical portion different from the first cylindrical portion among the plurality of cylindrical portions is inclined so that a tip end thereof is oriented in the same direction as the first cylindrical portion in the longitudinal direction,
the inclination angle of the first cylindrical portion is different from the inclination angle of the second cylindrical portion.
17. The evaporation source according to claim 16,
the inclination angle of the first cylindrical portion is larger than the inclination angle of the second cylindrical portion.
18. The evaporation source according to claim 14,
the inclination angle of each of the plurality of cylindrical portions is equal to or greater than the inclination angle of a cylindrical portion located between itself and the center in the longitudinal direction of the region in which the plurality of cylindrical portions are arranged.
19. The evaporation source according to claim 14,
the inclination angle of the first cylindrical portion is set to 30-45 °.
20. The evaporation source according to claim 16,
the evaporation source includes a heater provided around the container and heating the container,
the first cylindrical portion is inclined in a direction away from the second cylindrical portion,
an opening surface formed by an opening provided at a distal end of the first cylindrical portion is inclined so that the opening faces a side opposite to a side where the second cylindrical portion is provided,
the heater is provided on one side of the container with respect to an imaginary plane including the opening surface.
21. A film forming apparatus is characterized in that,
the film forming apparatus includes:
the evaporation source of any of claims 14 to 20; and
a moving mechanism for moving the evaporation source,
the evaporation source is moved to discharge the material from the evaporation source, thereby forming a film on the substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-133685 | 2016-07-05 | ||
| JP2016133685A JP6641242B2 (en) | 2016-07-05 | 2016-07-05 | Evaporator and evaporation source |
| CN201710539978.9A CN107574411B (en) | 2016-07-05 | 2017-07-05 | Evaporation device and evaporation source |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710539978.9A Division CN107574411B (en) | 2016-07-05 | 2017-07-05 | Evaporation device and evaporation source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113416930A true CN113416930A (en) | 2021-09-21 |
Family
ID=60948366
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110723236.8A Pending CN113416930A (en) | 2016-07-05 | 2017-07-05 | Evaporation source and film forming apparatus |
| CN201710539978.9A Active CN107574411B (en) | 2016-07-05 | 2017-07-05 | Evaporation device and evaporation source |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710539978.9A Active CN107574411B (en) | 2016-07-05 | 2017-07-05 | Evaporation device and evaporation source |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6641242B2 (en) |
| KR (3) | KR102182869B1 (en) |
| CN (2) | CN113416930A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6686069B2 (en) * | 2018-05-29 | 2020-04-22 | キヤノントッキ株式会社 | Evaporation source device, vapor deposition device, and vapor deposition system |
| JP7179635B2 (en) * | 2019-02-12 | 2022-11-29 | 株式会社アルバック | Evaporation source, vacuum processing apparatus, and deposition method |
| KR102696209B1 (en) * | 2019-03-20 | 2024-08-20 | 가부시키가이샤 코쿠사이 엘렉트릭 | Substrate processing apparatus, process vessel, reflector and method of manufacturing semiconductor device |
| KR20210061639A (en) * | 2019-11-20 | 2021-05-28 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method and electronic device manufacturing method using the same |
| CN111378933B (en) * | 2020-04-27 | 2022-04-26 | 京东方科技集团股份有限公司 | Evaporation source, evaporation source system |
| JP7242626B2 (en) * | 2020-12-10 | 2023-03-20 | キヤノントッキ株式会社 | Deposition equipment |
| JP7291197B2 (en) * | 2021-07-15 | 2023-06-14 | キヤノントッキ株式会社 | Film forming apparatus, film forming method, and evaporation source unit |
| KR20230012415A (en) * | 2021-07-15 | 2023-01-26 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method and evaporation source unit |
| JP7372288B2 (en) * | 2021-07-15 | 2023-10-31 | キヤノントッキ株式会社 | Film deposition equipment, film deposition method, and evaporation source |
| JP7509809B2 (en) | 2022-01-28 | 2024-07-02 | キヤノントッキ株式会社 | Evaporation source unit, film forming apparatus and film forming method |
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| Publication number | Publication date |
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| JP6641242B2 (en) | 2020-02-05 |
| KR20200132814A (en) | 2020-11-25 |
| KR102458193B1 (en) | 2022-10-25 |
| CN107574411A (en) | 2018-01-12 |
| KR102182869B1 (en) | 2020-11-25 |
| KR20180005129A (en) | 2018-01-15 |
| CN107574411B (en) | 2021-06-29 |
| KR20210090600A (en) | 2021-07-20 |
| KR102279411B1 (en) | 2021-07-19 |
| JP2018003122A (en) | 2018-01-11 |
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