JP6686069B2 - Evaporation source device, vapor deposition device, and vapor deposition system - Google Patents

Description

  The present invention relates to an evaporation source device, a vapor deposition device, and a vapor deposition system.

  In recent years, as one kind of display, an organic EL device including an organic EL element using electroluminescence of an organic material has been attracting attention. In manufacturing an organic electronic device such as an organic EL display, there is a step of depositing a vapor deposition material such as an organic material or a metal electrode material on a substrate using an evaporation source device to form a film.

  In the vapor deposition device of Patent Document 1, when the vapor of the organic material generated inside the container constituting the evaporation source device is discharged from the opening of the container, it passes through the discharge port defined by the steam adjusting member to form a vacuum chamber. Is released inside. Further, on the vapor adjusting member, a tubular deposition preventing plate is arranged with one end of the cylinder facing the substrate holder side and the other end facing the discharge port. The vapor of the organic material discharged from the discharge port passes through the inside of the cylindrical deposition preventive plate and is discharged from the opening at the end portion on the substrate holder side.

JP, 2005-325391, A

  The deposition preventive plate described in Patent Document 1 functions as a limiting member that limits the radiation angle of the vapor deposition material. Heat from a container or a heater that heats the container is applied to the deposition preventive plate directly by radiation or indirectly through the vapor of the organic material. When heat is applied to the deposition preventive plate, the heat may heat the substrate to be film-formed. If the substrate to be film-formed is excessively heated, circuits and pixels formed on the substrate may be damaged, which is not preferable.

  Therefore, in view of the above-mentioned problems, the present invention aims to suppress the temperature rise of the limiting member.

An evaporation source device according to one aspect of the present invention includes a container that contains a vapor deposition material, a cooling member, and a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less. An evaporation source device comprising, wherein the limiting member has a facing surface facing the cooling member,
The container is disposed between the container for accommodating the vapor deposition material in a solid state or a liquid state, the opening and the container, communicates with the container, and evaporates to accommodate the vapor deposition material in a gas state. A portion, an intermediate portion that is disposed between the accommodation portion and the evaporation portion, and communicates with each of the accommodation portion and the evaporation portion, and includes a normal direction of an opening surface of the opening, In a cross section perpendicular to the facing surface, the cooling member is arranged so as to sandwich at least a part of the container, the limiting member is arranged so as to sandwich at least a part of the cooling member, and the width of the intermediate portion. Is smaller than the width of the evaporating portion and the width of the accommodating portion .
An evaporation source device as another aspect of the present invention has a plurality of containers each containing a vapor deposition material, a plurality of cooling members, and a constant radiation angle of the vapor deposition material emitted from each opening of the plurality of containers. A plurality of limiting members each of which is limited to an angle of less than or equal to, and each of the plurality of limiting members has a facing surface that faces each of the cooling members, For each, including the normal direction of the opening surface of the opening, in a cross section perpendicular to the facing surface, each of the plurality of cooling members are arranged to sandwich at least a part of each of the plurality of containers, each of the plurality of limiting members, arranged so as to sandwich each of the at least a portion of said plurality of cooling members, wherein the plurality of containers are arranged side by side, two adjacent said Two of the restriction member corresponding to each of the vessel is characterized in that it is arranged to face.
An evaporation source device as another aspect of the present invention is a container that contains a vapor deposition material, a cooling member, and a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less. And a first cooling unit surrounding at least a part of the evaporation unit, wherein the limiting member has a facing surface facing the cooling member. A second cooling portion surrounding at least a part of the portion, and the container is disposed between the storage portion that stores the vapor deposition material in a solid state or a liquid state, and the opening and the storage portion. A section including a vaporization section that communicates with the accommodation section and accommodates the vapor deposition material in a gas state, includes a normal direction of an opening surface of the opening, and is perpendicular to the facing surface, the cooling member is Arrange so that at least a part of the container is sandwiched The limiting member is arranged so as to sandwich at least a part of the cooling member, and a width of the evaporation portion in a direction perpendicular to the facing surface is smaller than a width of the evaporator in a direction perpendicular to the facing surface. The width in the direction perpendicular to the facing surface of the first cooling unit is smaller than the width in the direction perpendicular to the facing surface of the second cooling unit.
An evaporation source device as another aspect of the present invention is a container that contains a vapor deposition material, a cooling member, and a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less. In the evaporation source device, the limiting member has a facing surface facing the cooling member, includes a direction normal to the opening surface of the opening, and includes the cooling in a cross section perpendicular to the facing surface. The member is arranged so as to sandwich at least a part of the container, the limiting member is arranged so as to sandwich at least a part of the cooling member, and the container includes a nozzle portion that forms the opening, The nozzle portion is provided so as to project from the first surface of the container, the cooling member includes a facing portion that is arranged to face the first surface of the container, and the limiting member is the The extension that extends to face the facing portion Characterized in that it comprises a part.
An evaporation source device as another aspect of the present invention is a container that contains a vapor deposition material, a cooling member, and a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less. In the evaporation source device, the limiting member has a facing surface facing the cooling member, includes a normal direction of the opening surface of the opening, and includes the cooling member in a cross section perpendicular to the facing surface. The member is arranged so as to sandwich at least a part of the container, the limiting member is arranged so as to sandwich at least a part of the cooling member, and the container contains the vapor deposition material in a solid state or a liquid state. A containing part, which is disposed between the opening and the containing part, communicates with the containing part, and includes an evaporating part that contains the vapor deposition material in a gaseous state, and the containing part of the container includes: For containing the vapor deposition material And堝部material, the upper part arranged partition member of the crucible member is being arranged.

  According to the present invention, the temperature rise of the restriction member can be suppressed.

Schematic cross-sectional view of vapor deposition device Schematic diagram of the evaporation source device of Example 1 Schematic diagram of the evaporation source device of Example 2 Schematic diagram of the evaporation source device of Example 3 Schematic diagram of the evaporation source device of Example 4 Schematic diagram of the evaporation source device of Example 5 Illustration of organic EL display device

  MODES FOR CARRYING OUT THE INVENTION Modes for carrying out the present invention will be exemplarily described in detail below based on embodiments with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in this embodiment should be appropriately changed depending on the configuration of the apparatus to which the invention is applied and various conditions. That is, the scope of the present invention is not intended to be limited to the following embodiments. Needless to say, a combination of the respective embodiments described below is appropriately included in the scope of the present invention.

[Example 1]
<Schematic configuration of vacuum device>
FIG. 1 is a schematic diagram showing a configuration of a vapor deposition device (film forming device) 100. The vapor deposition device 100 has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a reduced pressure atmosphere. Inside the vacuum chamber 200, the substrate 10, which is the object to be processed held by the object installation base (substrate holder) 210, the mask 220, and the evaporation source device 240 are provided. The processing object installation base 210 includes a support tool such as a receiving claw for mounting the substrate 10 and a pressing tool such as a clamp for pressing and holding the substrate, and holds the substrate.

  The substrate 10 is transferred into the vacuum chamber 200 by a transfer robot (not shown) arranged in the substrate transfer device, and then is held by the object-to-be-processed table 210, and is parallel to the horizontal plane (XY plane) during film formation. So that it is fixed. A plurality of vapor deposition apparatuses including the vapor deposition apparatus 100 are connected to the substrate transfer apparatus to construct a vapor deposition system. The mask 220 is a mask having an opening pattern corresponding to a predetermined thin film pattern formed on the substrate 10, and is, for example, a metal mask. The substrate 10 is placed on the mask 220 during film formation.

  In the vacuum chamber 200, in addition, a cooling plate (not shown) that suppresses the temperature rise of the substrate 10 may be provided. An alignment mechanism (not shown) for aligning at least one of the substrate 10 and the mask 220 may be provided on the vacuum chamber 200. The alignment mechanism includes driving means such as an actuator that moves at least one of the substrate 10 and the mask 220 in the X direction or the Y direction, and a clamp mechanism actuator that holds at least one of the substrate 10 and the mask 220. May be. Further, the alignment mechanism may include a camera that images at least one of the substrate 10 and the mask 220.

The evaporation source device 240 includes a container 400 for accommodating and holding the vapor deposition material 242, a container 40 for heating the vapor deposition material 242, and discharging vapor of the vapor deposition material 242 from an opening of the container 400.
A heating unit 430 for heating 0 is provided. Each of the other components will be described later in detail. In addition to the evaporation source device 240, the vapor deposition device 100 may include a shutter that suppresses the release of the vapor deposition material 242, a film thickness monitor for measuring the film thickness of the film formed on the substrate 10 (both of which are provided). (Not shown). Further, the vapor deposition device 100 may include a moving mechanism 250 that moves the evaporation source device 240 to uniformly form a film. The moving mechanism 250 is preferably a mechanism that moves the evaporation source device 240 in the XY directions, that is, in the direction parallel to the substrate surface of the substrate 10, but is not limited thereto, and the Z direction, that is, the substrate of the substrate 10. A mechanism for moving in a direction perpendicular to the plane may be used. The moving mechanism 250 is preferably configured so that the evaporation source device 240 can be mounted. The shape, positional relationship, and size ratio of each constituent element of the evaporation source device 240 in FIG. 1 are merely examples.

  As a material of the container 400, for example, a ceramic, a metal, a carbon material, or the like can be used, but the material is not limited thereto, and a preferable material is used in consideration of the physical properties of the vapor deposition material 242 and the heating temperature of the heating unit 430. Above all, as a material of the container 400, a refractory metal such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, or titanium, or an alloy containing the above metal is preferable. Here, the refractory metal refers to a metal having a melting point higher than that of iron.

  Examples of the heating unit 430 include a sheath heating unit and a resistance heating type heating unit such as a metal wire wire. However, the heating unit 430 is not limited to this and may have a heating performance for evaporating the vapor deposition material 242. As for the shape of the heating portion, any shape such as a wire shape or a mesh shape can be adopted in addition to the plate shape as shown in FIG. During vapor deposition, the temperature of the heating unit 430 is preferably controlled to a temperature at which the vapor deposition material 242 is in a gas state, and is preferably controlled to 250 ° C. or higher and 1400 ° C. or lower. During vapor deposition, the temperature of the heating unit 430 is preferably controlled to be 250 ° C. or higher and 450 ° C. or lower when the vapor deposition material 242 is an organic material, and 650 ° C. or higher when the vapor deposition material 242 is a metal material. It is preferable that the temperature is controlled to 1400 ° C. or lower.

  The vapor deposition device 100 has a control unit 270. The control unit 270 controls the evaporation source device 240, for example, timing control of start and end of heating, temperature control, opening / closing timing control when a shutter is provided, and movement control when a moving mechanism 250 is provided. The control unit 270 may be configured by combining a plurality of control means. The plurality of control means are, for example, heating control means, shutter control means, movement control means of the evaporation source movement mechanism, and the like. The control unit 270 may also serve as a control unit for a mechanism other than the evaporation source device 240, such as a conveyance and alignment control unit for the substrate 10.

  The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I / O, UI, and the like. In this case, the function of the control unit 270 is realized by the processor executing the program stored in the memory or the storage. As the computer, a general-purpose computer may be used, or an embedded computer or a programmable programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that the control unit 270 may be provided for each vapor deposition device, or one control unit 270 may control a plurality of vapor deposition devices.

When the vapor deposition material 242 is housed inside the container 400 and preparations such as placement of the substrate 10 on the mask 220 (or placement of the mask 220 on the substrate 10) and alignment are completed, the heating unit 430 is controlled by the control unit 270. Starts to heat the vapor deposition material 242. When the temperature rises sufficiently, the vapor deposition material 242 evaporates, the vaporized vapor deposition material 242 is released from the opening 401 of the container 400, and adheres to the surface of the substrate 10 to form a film. The vapor deposition material 242 released from the container 400 is a gas (vapor) of the vapor deposition material 242, and this vapor is heated by the heating unit 430. Co-deposition can be performed by accommodating different types of vapor deposition materials in a plurality of containers.

  A film having a desired thickness is formed on the substrate by controlling the film thickness of the formed film while measuring the film thickness with a film thickness monitor (not shown) or the like. In order to form a film with a uniform thickness, for example, vapor deposition may be performed while rotating the substrate 10 or moving the evaporation source device 240 by the moving mechanism 250. Further, depending on the size of the substrate 10, it is also preferable to heat the plurality of containers 400 in parallel.

  The shape of the container 400 is arbitrary. The evaporation source device 240 may be a dot-shaped evaporation source device having one opening for discharging the vapor deposition material 242, or may have a plurality of openings for discharging the vapor deposition material 242, and the plurality of openings are arranged in a row. It may be a linear evaporation source device arranged in a line. Alternatively, it may be a planar evaporation source device having a plurality of openings for discharging the vapor deposition material 242, and the plurality of openings are arranged two-dimensionally in a planar manner, or a plurality of point-like evaporation source devices may be prepared. However, it may be a revolver type evaporation source device that replaces the evaporation source device used when the material runs out.

  As described later, a multilayer structure can be formed by depositing another type of vapor deposition material on a substrate on which a certain type of vapor deposition material is deposited. In that case, the vapor deposition material in the container may be exchanged, or the vessel itself may be exchanged for one in which another type of vapor deposition material is stored. Further, a plurality of evaporation source devices may be provided in the vacuum chamber and used while being exchanged, or the substrate 10 is carried out from the current evaporation device and another evaporation device having an evaporation source device in which another kind of evaporation material is stored. It may be loaded into the device.

<Detailed configuration of evaporation source device>
FIG. 2A is a schematic cross-sectional view for explaining the configuration of the evaporation source device 240 of this embodiment. FIG. 2B is a schematic top view of the linear evaporation source device 240, and FIG. 2C is a schematic top view of the point evaporation source device 240. The AA cross section of FIGS. 2B and 2C is shown in FIG. Note that the AA cross section is a cross section that includes the normal direction of the opening surface of the opening 401 of the container 400 described below and is perpendicular to the facing surface of the limiting member 410 that faces the cooling member 420. 2 (a) to 2 (c) that are common to FIG. 1 are assigned the same reference numerals to simplify the description.

  The evaporation source device 240 includes a container 400, a limiting member 410, a cooling member 420, a heating unit 430, and a reflecting member 440. The container 400 holds a vapor deposition material. In this embodiment, the container 400 is made of tantalum. By configuring the container 400 with tantalum, the deformation of the container 400 can be suppressed even when the heating temperature by the heating unit 430 is raised to 1400 ° C. A heating unit 430 is provided on the side surface of the container 400 to heat the vapor deposition material held in the container 400 and release the vapor deposition material from the opening 401 provided in the container 400. Although the heating unit 430 of the present embodiment is arranged only on the side surface of the container 400, it may be provided on the upper surface or the bottom surface of the container 400.

  The cooling member 420 is arranged so as to cover at least a part of the container 400 in which the vapor deposition material is held in order to prevent the temperature of the entire vacuum chamber from rising due to the heat of heating the vapor deposition material. In this embodiment, the cooling member 420 is provided so as to surround the container 400 and the heating unit 430. Inside the cooling member 420, a flow path (not shown) for flowing the cooling liquid is provided to cool the cooling member 420. In this embodiment, the cooling member 420 is made of stainless steel.

The reflection member 440 is arranged between the heating unit 430 and the cooling member 420. The reflecting member 440 is cooled by the cooling member 420, and prevents the temperature of the entire vacuum chamber from rising due to the heat of heating the vapor deposition material as with the cooling member 420. In this embodiment, the reflection member 440
Is composed of molybdenum, but may be composed of a material such as tungsten, iridium, or ruthenium. The reflecting member 440 may be composed of a plurality of sheets, and a space may be provided between the reflecting members.

  The limiting member 410 has a function of limiting the radiation angle of the vapor deposition material in the form of gas discharged from the opening 401 of the container 400 to a certain angle or less. The limiting member 410 is arranged so as to sandwich the container 400 in the AA cross section of FIG. 2, and is configured to extend from the opening end of the container 400 in the direction in which the vapor deposition material is discharged. The emission angle of the vapor deposition material released from the container 400 is limited to a certain angle or less by the limiting member 410. This makes it possible to limit the incident angle of the vapor deposition material to the substrate 10 to a certain angle or less when performing vapor deposition in the vapor deposition apparatus, and improve the patterning accuracy in film formation via the mask 220. Further, it is possible to prevent the vapor deposition material from adhering to a portion other than the substrate 10 and the mask 220, such as the wall surface of the vacuum chamber 200. In this specification, the radiation angle means an angle formed by the radiation direction of the vapor deposition material emitted from the opening of the container and the normal line of the opening of the container. In this specification, the incident angle means an angle formed by the incident direction of the vapor deposition material which is incident on the substrate and the normal line of the substrate surface of the substrate.

  In the present embodiment, the restriction member 410 is arranged so as to sandwich the cooling member 420 in the AA cross section of FIG. The limiting member 410 is arranged so as to cover at least a part of the cooling member 420, and has a facing surface facing the cooling member 420. With this configuration, the cooling member 420 that cools the container 400 can cool not only the container 400 but also the limiting member 410. The restriction member 410 restricts the radiation angle of the vapor deposition material by physically shielding a part of the vapor deposition material discharged from the opening 401 of the container 400, and therefore the restriction member 410 is heated by the heat of the vapor deposition material. Is easy to rise. Since the limiting member 410 is arranged so as to sandwich at least a part of the cooling member 420 as in the present embodiment, the limiting member 410 is cooled by the cooling member 420, so that the temperature of the limiting member 410 is reduced even during vapor deposition. The rise can be suppressed.

  In the present embodiment, the limiting member 410 is fixed to the cooling member 420 by a fixing member (not shown). The fixing member is not particularly limited, but a bolt or the like can be used. The limiting member 410 and the cooling member 420 can be thermally connected by fixing the limiting member 410 to the cooling member 420 with a fixing member made of a material having a high thermal conductivity such as metal. As a result, the cooling efficiency of the restriction member 410 by the cooling member 420 can be improved. On the other hand, it is preferable that a space be provided between the limiting member 410 and the cooling member 420. As a result, it is possible to prevent the restriction member 410 from being excessively cooled by the cooling member 420.

  The method of fixing the limiting member 410 to the cooling member 420 or the container 400 is not particularly limited. For example, even if the cooling member 420 is extended below the restriction member 410 to form an abutting portion (not shown) for abutting and supporting the restriction member 410, the restriction member 410 may be abutted and supported. Good. According to this, the positioning of the limiting member 410 can be facilitated, and as a result, the radiation angle of the vapor deposition material can be easily set. The abutting support by the abutting portion and the fixing by the above-mentioned fixing member may be combined.

In the present embodiment, since the limiting member 410, the cooling member 420, and the reflecting member 440 are plate-shaped members, the limiting member 410 is called a limiting plate, the cooling member 420 is called a cooling plate, and the reflecting member 440 is called a reflecting plate. You can also The limiting member 410 is formed of a material such as stainless steel, aluminum, titanium, or carbon, but is not limited to this. Further, the limiting member 410 is not limited to the form made of a single material, but may be made of a plurality of materials. Further, the limiting member 410 is not limited to the form configured by a single component, and may be configured by combining a plurality of components by welding, screwing, or the like. The plurality of components forming the limiting member 410 include a component forming a portion of the limiting member 410 that limits steam (a limiting portion) and a portion of the limiting member 410 that is cooled by the cooling member 420 (a base portion, And a component forming a cooling unit). A plurality of these components may be thermally connected so that the limiting portion is cooled by the cooling member 420 via the base portion.

  Since vapor deposition material adheres to the limiting member 410 when vapor deposition is performed, maintenance such as replacement or cleaning of the limiting member 410 is required after the vapor deposition process is performed for a certain period. In the present embodiment, the restriction member 410 can be removed by releasing the fixing by removing the fixing member for fixing the restriction member 410 to the cooling member 420. That is, the limiting member 410 is provided so as to be removable from the cooling member 420. Thereby, the above-mentioned maintenance work can be easily performed.

  More specifically, when the limiting member 410 is a tubular member that is slightly larger than the cooling member 420, the cooling member 420 can be inserted into and removed from the tubular limiting member 410. According to this, by pulling out the limiting member 410 in a state where the fixing of the limiting member 410 to the cooling member 420 is released, the limiting member 410 can be moved and removed along the surface of the cooling member 420. As a result, the maintenance work can be performed more easily. Alternatively, even if the limiting member 410 is not a tubular member, at least one of the limiting member 410 and the cooling member 420 may be provided with a guide portion that guides the relative movement of the cooling member 420 with respect to the limiting member 410. This also allows the restriction member 410 to be moved along the surface of the cooling member 420 and removed.

  Although the limiting member 410 is provided so as to surround the side surface of the cooling member 420 in the present embodiment, it may be configured not to be disposed on a part of the side surface of the cooling member 420.

[Example 2]
The evaporation source device 240 of the present embodiment shown in FIG. 3 shows an example in which the configuration of the limiting member is different from that of the first embodiment in the height direction of the container 400. The same components as those in the other embodiments are designated by the same reference numerals to simplify the description. As shown in FIG. 3, the container 400 will be described separately as follows. The nozzle part 400 (a) is a region that forms the opening 401 and is provided so as to project from the surface (first surface) of the container 400. The housing portion 400 (c) is a region for housing a vapor deposition material in a solid state or a liquid state. The evaporation unit 400 (b) is a region that is located between the nozzle unit 400 (a) and the containing unit 400 (c) and contains the vapor deposition material in a gaseous state. The evaporation unit 400 (b) communicates with the accommodation unit 400 (c), and the vapor deposition material in the gas state generated in the accommodation unit 400 (c) is movable. Note that, similarly to FIG. 2A, FIG. 3 includes a cross section (A-A cross section) including the normal direction of the opening surface of the opening 401 of the container 400 and perpendicular to the facing surface of the limiting member 412 facing the cooling member 420. ) Is shown.

  Further, in this embodiment, a crucible member 450 for accommodating the vapor deposition material is provided inside the container 400, and a partition member 460 arranged above the crucible member 450. The crucible member 450 and the partition member 460 are arranged at positions facing the housing portion 400 (c). By providing the crucible member 450, the vapor deposition material can be easily replaced. The partition member 460 has an opening through which the vapor deposition material in a gaseous state passes, and can prevent the vapor deposition material from scattering due to bumping. The shape and number of the openings of the partition member 460 are not particularly limited, but the openings of the partition member 460 are preferably provided at positions other than the positions facing the nozzle portion 400 (a). This can further prevent the vapor deposition material from scattering due to bumping.

The heating unit 430 is divided into a first heating unit 430 (a) facing the evaporation unit 400 (b) and a second heating unit 430 (b) facing the accommodation unit 400 (c). There is. With such a configuration, it is possible to individually adjust the heating temperature for the evaporation unit 400 (b) and the heating temperature for the storage unit 400 (c).

  In general, regarding the vapor deposition material in the solid state or the liquid state stored in the storage section 400 (c), deterioration of the material due to high temperature heat is concerned. Therefore, the second heating unit 430 (b) is preferably controlled at a temperature at which the vapor deposition material in the solid state or the liquid state can be changed to the gas state. Specifically, it is preferably controlled at the sublimation temperature of the vapor deposition material or at a temperature near the boiling point. On the other hand, the vapor deposition material stored in the evaporation unit 400 (b) needs to be maintained in the vapor state so that the vapor deposition material does not solidify in the nozzle unit 400 (a). Therefore, the first heating unit 430 (a) is controlled at a higher temperature than the second heating unit 430 (b).

  In the present embodiment, the cooling member 420 includes the evaporating portion 400 (b) in a cross section that includes the normal direction of the opening surface of the opening 401 of the container 400 and is perpendicular to the facing surface of the limiting member 412 that faces the cooling member 420. It is arranged so as to sandwich the housing portion 400 (c).

  The restricting member 412 includes the normal direction of the opening surface of the opening 401 of the container 400, and sandwiches the cooling member 420 and the evaporation unit 400 (b) in a cross section perpendicular to the facing surface of the restricting member 412 that faces the cooling member 420. Are arranged as follows. The method of fixing the limiting member 412 to the cooling member 420 is the same as in the first embodiment. The restriction member 412 is arranged so as to cover at least a part of the evaporation unit 400 (b) and at least a part of the cooling member 420. In this embodiment, the limiting member 412 is configured to face the first heating unit 430 (a) and not face the second heating unit 430 (b). However, the configuration is not limited to this, and the configuration may be such that the limiting member 412 faces a part of the second heating unit 430 (b).

[Example 3]
The evaporation source device 240 of this embodiment shown in FIG. 4 is different from the first and second embodiments in the configuration of the limiting member around the nozzle portion 400 (a) of the container 400. The same components as those in the other embodiments are designated by the same reference numerals to simplify the description. The cooling member 420 will be described separately below. The facing portion 420 (a) is a region arranged so as to face the surface (first surface) that is the upper surface of the container 400 in which the nozzle portion 400 (a) is arranged. The side surface portion 420 (b) is an area arranged to face the side surface of the container 400. The bottom surface portion 420 (c) is an area arranged to face the bottom surface of the container 400. Note that, similarly to FIG. 2A, FIG. 4 includes a cross section (A-A cross section) including the normal direction of the opening surface of the opening 401 of the container 400 and perpendicular to the facing surface of the limiting member 414 facing the cooling member 420. ) Is shown.

  The limiting member 414 faces the base portion 414 (c) facing the side surface of the container 400, the limiting portion 414 (b) positioned in the direction in which the vapor deposition material is discharged from the opening end of the nozzle portion 400 (a), and the cooling member 420. An extending portion 414 (a) extending opposite the portion 420 (a) is included. The method of fixing the limiting member 414 to the cooling member 420 is the same as in the first embodiment. With this configuration, the area where the restriction member 414 faces the cooling member 420 can be increased as compared with the first and second embodiments, and the cooling efficiency of the restriction member 414 can be improved.

[Example 4]
The evaporation source device 240 of this embodiment shown in FIG. 5 shows an example in which an intermediate portion 400 (d) that connects the evaporation portion 400 (b) and the housing portion 400 (c) is provided. The same components as those in the other embodiments are designated by the same reference numerals to simplify the description. Note that, like FIG. 2A, FIG. 5 includes a cross section (A-A cross section) including the normal direction of the opening surface of the opening 401 of the container 400 and perpendicular to the facing surface of the limiting member 416 facing the cooling member 420. ) Is shown.

  The middle part 400 (d) communicates with each of the evaporation part 400 (b) and the containing part 400 (c). The intermediate portion 400 (d) has a smaller volume of the region for containing the vapor deposition material than the evaporation portion 400 (b) and the containing portion 400 (c). In the AA cross section, the width 502 in the direction perpendicular to the facing surface of the limiting member 416 of the intermediate portion 400 (d) facing the cooling member 420 has a limiting member of the evaporation portion 400 (b) and the containing portion 400 (c). It is smaller than any of the widths (501, 503) in the direction perpendicular to the facing surface of 416 facing the cooling member 420. Further, the evaporation section 400 (b) has a smaller volume of the region for accommodating the vapor deposition material than the accommodating section 400 (c). In the AA cross section, the width 501 in the direction perpendicular to the facing surface of the limiting member 416 of the evaporation unit 400 (b) facing the cooling member 420 faces the cooling member 420 of the limiting member 416 of the accommodation unit 400 (c). Is smaller than the width 503 in the direction perpendicular to the facing surface. In addition, in the case of the present embodiment, each of the above-mentioned widths can be paraphrased as "a width in the direction sandwiched by the restriction members".

  The reflection member 440 is divided into a first reflection member 440 (a) facing the evaporation unit 400 (b) and a second reflection member 440 (b) facing the storage unit 400 (c). There is. Further, in this embodiment, the first reflecting member 440 (a) faces only the evaporating section 400 (b), but may face the intermediate section 400 (d) or the intermediate section 400 (d). ) May be provided separately.

  The cooling member 420 includes a first cooling unit that surrounds at least a part of the evaporation unit 400 (b) and a second cooling unit that surrounds at least a part of the housing unit 400 (c). In the present embodiment, the first cooling section also surrounds at least a part of the intermediate section 400 (d). In the AA cross section, the width 504 in the direction perpendicular to the facing surface of the limiting member 416 of the first cooling unit that faces the cooling member 420 faces the cooling member 420 of the limiting member 416 of the second cooling unit that faces the cooling member 420. It is smaller than the width 505 in the direction perpendicular to the plane. The limiting member 416 is arranged so as to sandwich the region of the cooling member 420 facing the evaporation part 400 (b) and the intermediate part 400 (d), and faces the region of the cooling member 420 facing the accommodation part 400 (c). It is not configured. The interval 506 in the direction sandwiching the evaporation member 400 (b) and the cooling member 420 of the restriction member 416 is smaller than the width 505 in the sandwiching direction of the housing part 400 (c) of the cooling member 420. This makes it possible to configure the evaporation source device 240 by utilizing the space.

[Example 5]
The evaporation source device 240 of the present embodiment shows an example in which a plurality of containers 400 are provided. As shown in FIG. 6, the evaporation source device 240 has a configuration in which two evaporation source devices according to the fourth embodiment are arranged. Note that, similarly to FIG. 2A, FIG. 6 includes a cross section (A-A cross section) including the normal direction of the opening surface of the opening 401 of the container 400 and perpendicular to the facing surface of the limiting member 416 facing the cooling member 420. ) Is shown.

  The limiting member 416 is fixed to the cooling member 420 by a bolt 600 that is a fixing member. A space is provided between the limiting member 416 and the cooling member 420. By thus providing a space between the restriction member 416 and the cooling member 420 and cooling the restriction member 416 by radiation, it is possible to prevent the restriction member 416 from being excessively cooled. When the fixing is released by removing the bolt 600, the limiting member 416 can be moved along the side surface of the cooling member 420, and the limiting member 416 can be removed from the cooling member 420. The container 400 is arranged on a bolt-shaped protrusion 610 provided on the cooling member 420. The heating unit 430 and the reflection member 440 are fixed to the cooling member 420 with a bolt (not shown) different from the bolt 600.

The evaporation source device 240 is provided on the moving mechanism 250. The inside of the moving mechanism 250 is an atmospheric space that is shielded from the vacuum chamber 200, and can accommodate wiring and the like (not shown) connected to the evaporation source device 240. By moving the moving mechanism 250, vapor deposition can be performed while moving the evaporation source device 240.

[Example 6]
<Specific Example of Method for Manufacturing Organic Electronic Device>
In the present embodiment, an example of a method for manufacturing an organic electronic device using a vapor deposition apparatus (vapor deposition apparatus) including an evaporation source device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be illustrated as an example of an organic electronic device. First, the organic EL display device to be manufactured will be described. 7A shows an overall view of the organic EL display device 60, and FIG. 7B shows a sectional structure of one pixel. As the evaporation source device 240 included in the vapor deposition device of the present embodiment, the device described in any of the above embodiments is used.

  As shown in FIG. 7A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. It should be noted that the pixel here refers to the minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device shown in the figure, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B which emit different lights. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

  FIG. 7B is a schematic partial sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode on a substrate 63 that is a vapor deposition target. And a (cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layers. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes described as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by water and oxygen, a protective layer 70 is provided to protect the organic EL element from water and oxygen.

Next, an example of the method for manufacturing the organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is loaded into the first vapor deposition apparatus, the substrate is held on the object-to-be-processed installation base 210, and the hole transport layer 65 is commonly used on the first electrode 64 in the display area. The layer is formed as a layer. The hole transport layer 65 is formed by vacuum vapor deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display region 61, a high-definition mask is unnecessary. Here, the vapor deposition apparatus used in the film formation in this step and in the film formation of each layer described below includes the evaporation source apparatus described in any of the above embodiments.

  Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second vapor deposition apparatus, and is held by the target object mounting base 210. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red light is formed on the portion of the substrate 63 where the element that emits red light is arranged. According to this example, the mask and the substrate can be satisfactorily overlapped with each other, and highly accurate film formation can be performed.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third vapor deposition device, and the light emitting layer 66B emitting blue is formed by the fourth vapor deposition device. After the film formation of the light emitting layers 66R, 66G, 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth vapor deposition device. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate on which the electron transport layer 67 has been formed is moved to the sputtering apparatus, the second electrode 68 is formed, and then the plasma CVD apparatus is formed to form the protective layer 70, and the organic EL display device 60 is completed. To do.

  If the substrate 63 on which the insulating layer 69 is patterned is carried into the vapor deposition apparatus and until the film formation of the protective layer 70 is completed, if the substrate 63 is exposed to an atmosphere containing water or oxygen, the light emitting layer made of the organic EL material will have water. It may be deteriorated by oxygen or oxygen. Therefore, in this example, loading and unloading of the substrate between the vapor deposition devices are performed in a vacuum atmosphere or an inert gas atmosphere.

  In the organic EL display device thus obtained, the light emitting layer is accurately formed for each light emitting element. By using the manufacturing method described above, it is possible to suppress the occurrence of defects in the organic EL display device due to damage to the substrate or a circuit for driving the organic EL display device. According to the vapor deposition device according to the present embodiment, it is possible to suppress the temperature rise of the restriction member of the evaporation source device, it is possible to suppress the heating of the substrate of the film formation target, it is possible to perform good vapor deposition .

  240: evaporation source device, 400: container, 420: cooling member, 410: restriction member

Claims (24)

A container containing the vapor deposition material,
A cooling member,
A vaporization source device comprising: a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less,
The limiting member has a facing surface facing the cooling member,
The container is disposed between the container for accommodating the vapor deposition material in a solid state or a liquid state, the opening and the container, communicates with the container, and evaporates to accommodate the vapor deposition material in a gas state. A portion, and an intermediate portion that is disposed between the accommodation portion and the evaporation portion and that communicates with each of the accommodation portion and the evaporation portion,
The cooling member includes a first cooling section that surrounds at least a part of the evaporation section, and a second cooling section that surrounds at least a part of the accommodation section,
In a cross section perpendicular to the facing surface, including the normal direction of the opening surface of the opening,
The cooling member is arranged so as to sandwich at least a part of the container,
The limiting member is arranged so as to sandwich at least a part of the cooling member,
The width of the intermediate portion, rather smaller than the width of the width and the housing portion of the evaporation section,
The width of the evaporation portion in the direction perpendicular to the facing surface is smaller than the width of the accommodation portion in the direction perpendicular to the facing surface,
The evaporation source device , wherein the width of the first cooling unit in a direction perpendicular to the facing surface is smaller than the width of the second cooling unit in a direction perpendicular to the facing surface . A plurality of containers each containing a vapor deposition material,
A plurality of cooling members,
A plurality of limiting members for limiting the radiation angle of the vapor deposition material emitted from the respective openings of the plurality of containers to a certain angle or less, and an evaporation source device comprising:
Each of the plurality of limiting members has a facing surface that faces each of the cooling members,
For each of the plurality of containers, including a normal direction of the opening surface of the opening, in a cross section perpendicular to the facing surface,
Each of the plurality of cooling members is arranged so as to sandwich at least a part of each of the plurality of containers,
Each of the plurality of limiting members is arranged so as to sandwich at least a part of each of the plurality of cooling members,
The plurality of containers are arranged side by side,
The evaporation source device, wherein the two limiting members corresponding to the two adjacent containers are arranged to face each other. A container containing the vapor deposition material,
A cooling member,
A vaporization source device comprising: a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less,
The limiting member has a facing surface facing the cooling member,
The container is disposed between the container for accommodating the vapor deposition material in a solid state or a liquid state, the opening and the container, communicates with the container, and evaporates to accommodate the vapor deposition material in a gas state. Part and including,
The cooling member includes a first cooling section that surrounds at least a part of the evaporation section, and a second cooling section that surrounds at least a part of the accommodation section ,
Includes normal direction of the opening surface of the front Symbol opening, in a cross section perpendicular to the facing surface,
The cooling member is arranged so as to sandwich at least a part of the container,
The limiting member is arranged so as to sandwich at least a part of the cooling member,
The width of the evaporation portion in the direction perpendicular to the facing surface is smaller than the width of the accommodation portion in the direction perpendicular to the facing surface,
The width of the first cooling unit in the direction perpendicular to the facing surface is smaller than the width of the second cooling unit in the direction perpendicular to the facing surface.
An evaporation source device characterized by the above. A container containing the vapor deposition material,
A cooling member,
A vaporization source device comprising: a limiting member that limits the radiation angle of the vapor deposition material emitted from the opening of the container to a certain angle or less,
The limiting member has a facing surface facing the cooling member,
In a cross section perpendicular to the facing surface, including the normal direction of the opening surface of the opening,
The cooling member is arranged so as to sandwich at least a part of the container,
The limiting member is arranged so as to sandwich at least a part of the cooling member,
The container includes a nozzle portion forming the opening,
The nozzle portion is provided so as to project with respect to the first surface of the container,
The cooling member includes a facing portion arranged facing the first surface of the container,
The limiting member includes an extending portion that extends so as to face the facing portion.
An evaporation source device characterized by the above. Wherein the restriction member, the evaporation source device according to claim 1, any one of 4, characterized in that it is cooled by the cooling member. The evaporation source device according to any one of claims 1 to 5, wherein the limiting member is thermally connected to the cooling member. 7. The limiting member is thermally connected to the cooling member via a fixing member that fixes the limiting member to the cooling member, according to any one of claims 1 to 6. The evaporation source device described. The said cooling member is arrange | positioned so that at least one part of the said container may be surrounded, The evaporation source apparatus as described in any one of Claim 1 to 7 characterized by the above-mentioned. In the cross section, the limiting member, the evaporation source device according to claim 1 or 3, characterized in that it is arranged so as to sandwich at least a portion of at least a portion and the cooling member of the evaporation section. In the cross section,
An interval between portions of the limiting member that sandwich at least a part of the evaporation portion in a direction perpendicular to the facing surface is smaller than a width of the second cooling portion in a direction perpendicular to the facing surface. The evaporation source device according to claim 9 . Further comprising a heating unit for heating the container,
The evaporation source device according to any one of claims 1 to 10 , wherein the heating unit is disposed between the container and the cooling member. Further comprising a heating unit for heating the container,
The heating unit includes a first heating unit and a second heating unit,
The first heating unit is arranged to face the evaporation unit,
The second heating unit is arranged to face the accommodation unit,
The said 1st heating part and the said 2nd heating part are arrange | positioned between the said container and the said cooling member, The any one of Claim 1, 3, 9 or 10 characterized by the above-mentioned. Evaporation source device. The evaporation source device according to claim 12 , wherein the first heating unit is controlled at a temperature higher than that of the second heating unit. The evaporation source device according to any one of claims 11 to 13 , wherein the temperature of the heating unit is controlled to be 250 ° C or higher and 1400 ° C or lower. Disposed between the heating unit and the cooling member, further comprising a reflecting member that reflects heat from the heating unit,
The evaporation source device according to any one of claims 11 to 14 , wherein the reflection member is cooled by the cooling member. The evaporation source device according to claim 15 , wherein the reflection member is made of molybdenum, the container is made of tantalum, and the limiting member is made of stainless steel. The evaporation source device according to any one of claims 1 to 16 , wherein the limiting member is detachably provided along a surface of the cooling member. The container includes a nozzle portion forming the opening,
The nozzle portion is provided so as to project with respect to the first surface of the container,
The cooling member includes a facing portion arranged facing the first surface of the container,
The evaporation source device according to any one of claims 1 to 17 , wherein the limiting member includes an extending portion that extends so as to face the facing portion. The evaporation source device according to any one of claims 1 to 18 , wherein the cooling member is provided with a flow path for flowing a cooling liquid inside the cooling member. The container, the evaporation source device according to any one of claims 1 to 19, characterized in that a plurality of said openings. In the cross section, the interval in the direction perpendicular to the facing surface of the portion that sandwiches at least a part of the evaporation portion of the limiting member is smaller than the width of the second cooling unit in the direction perpendicular to the facing surface. The evaporation source device according to claim 1 or 3 , characterized in that. An evaporation source device according to any one of claims 1 to 21 ,
A vacuum chamber in which the evaporation source device is disposed and in which vapor deposition is performed, the vapor deposition device. The vapor deposition device has a moving mechanism on which the evaporation source device is mounted,
The vapor deposition apparatus according to claim 22 , wherein vapor deposition is performed by moving the moving mechanism. A plurality of vapor deposition devices each comprising the evaporation source device according to any one of claims 1 to 21 ;
A substrate transport device to which the plurality of vapor deposition devices are connected.

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