JP5953514B2 - 発光装置と表示装置 - Google Patents
発光装置と表示装置 Download PDFInfo
- Publication number
- JP5953514B2 JP5953514B2 JP2015239461A JP2015239461A JP5953514B2 JP 5953514 B2 JP5953514 B2 JP 5953514B2 JP 2015239461 A JP2015239461 A JP 2015239461A JP 2015239461 A JP2015239461 A JP 2015239461A JP 5953514 B2 JP5953514 B2 JP 5953514B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- phosphor
- emitting diode
- cerium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 281
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- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 49
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 47
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- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- -1 gallium nitride compound Chemical class 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 238000000295 emission spectrum Methods 0.000 claims description 47
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 36
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical group [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 14
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- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 6
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
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- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
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- 241001391944 Commicarpus scandens Species 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
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- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
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- H01J29/20—Luminescent screens characterised by the luminescent material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/4501—Shape
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Description
またさらに、イオン性の有機染料を使用すると、チップ近傍では直流電界により電気泳動を起こし、色調が変化する場合がある。
(1)発光素子としては、高輝度の発光が可能で、かつその発光特性が長期間の使用に対して安定していること、
(2)蛍光体としては、上述の高輝度の発光素子に近接して設けられて、該発光素子からの強い光にさらされて長期間使用した場合においても、特性変化の少ない耐光性及び耐熱性等に優れていること(特に発光素子周辺に近接して配置される蛍光体は、我々の検討によると太陽光に比較して約30倍〜40倍に及ぶ強度を有する光にさらされるので、発光素子として高輝度のものを使用すれば使用する程、蛍光体に要求される耐光性は厳しくなる)、
(3)発光素子と蛍光体との関係としては、蛍光体が発光素子からのスペクトル幅をもった単色性ピーク波長の光を効率よく吸収すると共に効率よく異なる発光波長が発光可能であること、が必要であると考え、鋭意検討した結果、本発明を完成させた。
前記発光素子の発光層が窒化物系化合物半導体からなり、かつ前記フォトルミネセンス蛍光体が、Y、Lu、Sc、La、Gd及びSmからなる群から選ばれた少なくとも1つの元素と、Al、Ga及びInからなる群から選ばれる少なくとも1つの元素とを含み、かつセリウムで付活されたガーネット系蛍光体を含むことを特徴とする。
,0≦j,0≦k,i+j+k=1)としては、InGaNや各種不純物がドープされたGaNを始め、種々のものが含まれる。
この本願発明の発光装置は、高輝度の発光が可能な窒化物系化合物半導体からなる発光素子を用いているので、高輝度の発光をさせることができる。また、該発光装置において、使用している前記フォトルミネッセンス蛍光体は、長時間、強い光にさらされても蛍光特性の変化が少ない極めて耐光性に優れている。これによって、長時間の使用に対して特性劣化を少なくでき、発光素子からの強い光のみならず、野外使用時等における外来光(紫外線を含む太陽光等)による劣化も少なくでき、色ずれや輝度低下が極めて少ない発光装置を提供できる。また、この本願発明の発光装置は、使用している前記フォトルミネッセンス蛍光体が、短残光であるため、例えば、120nsecという比較的速い応答速度が要求される用途にも使用することができる。
但し、0≦s≦1、Reは、Y、Ga、Laから選択される少なくとも一種である。
また、本発明の発光装置においては、発光波長を調整するために、前記フォトルミネッセンス蛍光体は、それぞれイットリウム・アルミニウム・ガーネット系蛍光体において、イットリウムの一部がガドリニウムに置換され、互いに置換量が異なる第1の蛍光体と第2の蛍光体とを含むようにしてもよい。
その一主表面に前記フォトルミネセンス蛍光体が設けられかつ該一主表面を除く表面が実質的に反射部材で覆われた略矩形の導光板を備え、前記発光素子が発光した光を導光板と前記フォトルミネセンス蛍光体とを介して面状にして、前記導光板の前記一主表面から出力することを特徴とする。
該LEDチップの他方の電極に電気的に接続させたインナー・リードと、
前記LEDチップを覆うように前記カップ内に充填された透光性のコーティング部材と、
前記マウント・リードのカップ部と、前記インナーリードと該LEDチップの他方の電極との接続部分とを含み、前記コーティング部材で覆われたLEDチップを被覆するモールド部材とを有する発光ダイオードであって、
前記LEDチップが窒化物系化合物半導体であり、かつ前記コーティング部材が、Y、Lu、Sc、La、Gd及びSmからなる群から選ばれた少なくとも1つの元素と、Al、Ga及びInからなる群から選ばれる少なくとも1つの元素とを含み、セリウムで付活されたガーネット系蛍光体からなるフォトルミネッセンス蛍光体を含むことを特徴とする。
また、本発明の発光ダイオードでは、前記フォトルミネッセンス蛍光体として、一般式(Re1-rSmr)3(Al1-sGas)5O12:Ceで表される蛍光体(ただし、0≦r<1、0≦s≦1、Reは、Y、Gdから選択される少なくとも一種である。)を用いても良い。
また、本発明の発光ダイオードでは、前記フォトルミネッセンス蛍光体として、一般式(Y1-p-q-rGdpCeqSmr)3(Al1-sGas)5O12で表される(ただし、0≦p≦0.8、0.003≦q≦0.2、0.0003≦r≦0.08、0≦s≦1)蛍光体を用いることもできる。
図1の発光ダイオード100は、マウント・リード105とインナーリード106とを備えたリードタイプの発光ダイオードであって、マウント・リード105のカップ部105a上に発光素子102が設られ、カップ部105a内に、発光素子102を覆うように、所定のフォトルミネッセンス蛍光体を含むコーティング樹脂101が充填された後に、樹脂モールドされて構成される。ここで、発光素子102のn側電極及びp側電極はそれぞれ、マウント・リード105とインナーリード106とにワイヤー103を用いて接続される。
1.通常、発光素子(LED)から放出される光は、発光素子に電力を供給する電極を介して放出される。放出された光は、発光素子に形成された電極の陰となり、特定の発光パターンを有し、そのために全ての方向に均一に放出されない。しかしながら、蛍光体を備えた発光ダイオードは、蛍光体により発光素子からの光を散乱させて光を放出するので、不要な発光パターンを形成することなく、広い範囲に均一に光を放出することができる。
2.発光素子(LED)からの光は、単色性ピークを有するといっても、ある程度のスペクトル幅をもつので演色性が高い。このことは、比較的広い範囲の波長を必要とする光源として使用する場合には欠かせない長所になる。例えば、スキャナーの光源等に用いる場合は、スペクトル幅が広いほうが好ましい。
1.発光素子102,202に近接して設けられ、太陽光の約30倍から40倍にもおよぶ強い光にさらされることになるので、強い強度の光の照射に対して長時間耐え得るように、耐光性に優れていること。
4.発光素子102,202に近接して設けられ、該チップを発光させる際の発熱による温度変化の影響を受けるので、温度特性が良好であること。
6.発光ダイオードが使用される環境に応じた耐候性があること、
などの特性が要求される。
本願発明に係る実施の形態1の発光ダイオードは、発光層に高エネルギーバンドギャッブを有し、青色系の発光が可能な窒化ガリウム系化合物半導体素子と、黄色系の発光が可能なフォトルミネセンス蛍光体である、セリウムで付活されたガーネット系フォトルミネッセンス蛍光体とを組み合わせたものである。これによって、この実施形態1の発光ダイオードにおいて、発光素子102,202からの青色系の発光と、その発光によって励起されたフォトルミネセンス蛍光体からの黄色系の発光光との混色により白色系の発光が可能になる。
(フォトルミネセンス蛍光体)
本実施形態1の発光ダイオードに用いられるフォトルミネセンス蛍光体は、半導体発光層から発光された可視光や紫外線で励起されて、励起した光と異なる波長を有する光を発
光するフォトルミネセンス蛍光体である。具体的にはフォトルミネセンス蛍光体として、Y、Lu、Sc、La、Gd及びSmから選択された少なくとも1つの元素と、Al、Ga及びInから選択された少なくとも1つの元素とを含み、セリウムで付活されたガーネット系蛍光体である。本発明では、該蛍光体として、YとAlを含みセリウムで付活されたイットリウム・アルミニウム・ガーネット系蛍光体、又は、一般式(Re1-rSmr)3(Al1-sGas)5O12:Ce(但し、0≦r<1、0≦s≦1、Reは、Y、Gdから選択される少なくとも一種)であらわされる蛍光体を用いることが好ましい。窒化ガリウム系化合物半導体を用いた発光素子が発光するLED光と、ボディーカラーが黄色であるフォトルミネセンス蛍光体が発光する蛍光光が補色関係にある場合、LED光と、蛍光光とを混色して出力することにより、全体として白色系の光を出力することができる。
コーテイング樹脂101,コーテイング部201を形成する樹脂(詳細は後述する)に混合して使用されるので、窒化ガリウム系発光素子の発光波長に対応させて、樹脂などとの混合比率、若しくはカップ部105又は筺体204の凹部への充填量を種々調整することにより、発光ダイオードの色調を、白色を含め電球色など任意に設定できる。
例えば、フォトルミネセンス蛍光体が含有されたコーティング部やモールド部材の表面側から発光素子に向かってフォトルミネセンス蛍光体の分布濃度を高くした場合は、外部環境からの水分などの影響をより受けにくくでき、水分による劣化を防止することができる。他方、フォトルミネセンス蛍光体を、発光素子からモールド部材等の表面側に向かって分布濃度が高くなるように分布させると、外部環境からの水分の影響を受けやすいが発光素子からの発熱、照射強度などの影響をより少なくでき、フォトルミネセンス蛍光体の劣化を抑制することができる。このような、フォトルミネセンス蛍光体の分布は、フォトルミネセンス蛍光体を含有する部材、形成温度、粘度やフォトルミネセンス蛍光体の形状、粒度分布などを調整することによって種々の分布を実現することができ、発光ダイオードの使用条件などを考慮して分布状態が設定される。
一方、Gdが増加するするとともに、青色光によるフォトルミネッセンスの発光輝度は低下する傾向にある。
AlをGaによって置換する場合、発光効率と発光波長を考慮してGa:Al=1:1から4:6の間の比率に設定することが好ましい。同様に、Yの一部をGdで置換する場合は、Y:Gd=9:1〜1:9の範囲の比率に設定することが好ましく、4:1〜2:3の範囲に設定することがより好ましい。Gdの置換量が2割未満では、緑色成分が大きく赤色成分が少なくなるからであり、Gdの置換量が6割以上になると、赤み成分を増やすことができるが、輝度が急激に低下する。特に、発光素子の発光波長によるがYAG系蛍光体中のYとGdとの比率を、Y:Gd=4:1〜2:3の範囲に設定することにより、1種類のイットリウム・アルミニウム・ガーネット系蛍光体を用いて黒体放射軌跡にほぼ沿った白色光の発光が可能な発光ダイオードを構成することができる。また、YAG系蛍光体中のYとGdとの比率を、Y:Gd=2:3〜1:4の範囲に設定すると、輝度は低いが電球色の発光が可能な発光ダイオードを構成することができる。
尚、Ceの含有量(置換量)は、0.003〜0.2の範囲に設定することにより、発光ダイオードの相対発光光度を70%以上にできる。含有量が0.003未満では、Ceによるフォトルミネッセンスの励起発光中心の数が減少することにより光度が低下し、逆に0.2より大きくなると濃度消光が生じる。
発光素子は、図1及び図2に示すように、モールド部材に埋設されることが好ましい。本願発明の発光ダイオードに用いられる発光素子は、セリウムで付活されたガーネット系蛍光体を効率良く励起できる窒化ガリウム系化合物半導体である。窒化ガリウム系化合物半導体を用いた発光素子102,202は、MOCVD法等により基板上にInGaN等の窒化ガリウム系半導体を発光層として形成することにより作製される。発光素子の構造としては、MIS接合、PIN接合やPN接合などを有するホモ構造ヘテロ構造あるいはダブルヘテロ構成のものが挙げられる。半導体層の材料やその混晶度によって発光波長を種々選択することができる。また、半導体活性層を量子効果が生ずる程度に薄く形成した単一量子井戸構造や多重量子井戸構造とすることもできる。特に、本願発明においては、発光素子の活性層をInGaNの単一量子井戸構造とすることにより、フォトルミネセンス蛍光体の劣化がなく、より高輝度に発光する発光ダイオードとして利用することができる。
一方、p型窒化ガリウム半導体を形成する場合は、p型ドーパンドであるZn、Mg、Be、Ca、Sr、Ba等をドープする。尚、窒化ガリウム系化合物半導体は、p型ドーパントをドーブしただけではp型化しにくいためp型ドーパント導入後に、炉による加熱、低速電子線照射やプラズマ照射等によりp型化させることが好ましい。エッチングなどによりp型及びN型の窒化ガリウム半導体の表面を露出させた後、各半導体層上にスバッタリング法や真空蒸着法などを用いて所望の形状の各電極を形成する。
(導電性ワイヤー103、203)
導電性ワイヤー103、203としては、発光素子102、202の電極とのオーミック性、機械的接続性、電気伝導性及び熱伝導性がよいものが求められる。熱伝導度としては0.01cal/(s)(cm2)(℃/cm)以上が好ましく、より好ましくは0.5cal/(s)(cm2)(℃/cm)以上である。また、作業性を考慮すると導電性ワイヤーの直径は、10μm以上、45μm以下であることが好ましい。特に、蛍光体が含有されたコーティング部とモールド部材とをそれぞれ同一材料を用いたとしても、どちらか一方に蛍光体が入ることによる熱膨張係数の違いにより、それらの界面においては、導電性ワイヤーは断線し易い。そのために導電性ワイヤーの直径は、25μm以上がより好ましく、発光面積や取り扱い易さの観点から35μm以下が好ましい。導電性ワイヤーの材質としては、金、銅、白金、アルミニウム等の金属及びそれらの合金が挙げられる。このような材質、形状からなる導電性ワイヤーを用いることにより、ワイヤーボンディング装置によって、各発光素子の電極と、インナー・リード及びマウント・リードとを容易に接続することができる。
マウント・リード105は、カップ部105aとリード部105bとからなり、カップ部105aに、ダイボンディング装置で発光素子102を載置する十分な大きさがあれば良い。また、複数の発光素子をカップ内に設け、マウント・リードを発光素子の共通電極として利用する場合においては、異なる電極材料を用いる場合があるので、それぞれに十分な電気伝導性とボンディングワイヤー等との接続性が求められる。また、マウント・リード上のカップ内に発光素子を配置すると共に蛍光体をカップ内部に充填する場合は、蛍光体からの光が当方的に放出されたとしても、カップにより所望の方向に反射されるので、近接して配置させた別の発光ダイオードからの光による疑似点灯を防止することができる。ここで、擬似点灯とは、近接して配置された別の発光ダイオードに電力を供給していなくても発光しているように見える現象のことをいう。
インナー・リード106は、マウント・リード105上に配置された発光素子102の一方の電極に、導電性ワイヤー等で接続される。マウント・リード上に複数の発光素子を設けた発光ダイオードの場合は、インナーリード106を複数設け、各導電性ワイヤー同士が接触しないよう各インナーリードを配置する必要がある。例えば、マウント・リードから離れるに従って、各インナー・リードのワイヤーボンディングされる各端面の面積を順次大きくすることによって、導電性ワイヤー間の間隔を開けるようにボンディングし、導電性ワイヤー間の接触を防ぐことができる。インナーリードの導電性ワイヤーとの接続端面の粗さは、密着性を考慮して1.6S以上1OS以下に設定することが好ましい。
コーティング部101は、モールド部材104とは別にマウント・リードのカップに設けられるものであり、本実施の形態1では、発光素子の発光を変換するフォトルミネセンス蛍光体が含有されるものである。コーティング部の具体的材料としては、エポキシ樹脂、ユリア樹脂、シリコーンなどの耐侯性に優れた透明樹脂や硝子などが適する。また、フォトルミネセンス蛍光体と共に拡散剤を含有させても良い。具体的な拡散剤としては、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素等を用いることが好ましい。さらに、蛍光体をスパッタリングにより形成する場合、コーティング部を省略することもできる。この場合、膜厚を調整したり蛍光体層に開口部を設けることで混色表示が可能な発光ダイオードとすることができる。
モールド部材104は、発光素子102、導電性ワイヤー103、フォトルミネセンス蛍光体が含有されたコーティング部101などを外部から保護する機能を有する。本実施形態1では、モールド部材104にさらに拡散剤を含有させることが好ましく、これによって発光素子102からの指向性を緩和させることができ、視野角を増やすことができる。また、モールド部材104は、発光ダイオードにおいて、発光素子からの発光を集束させたり拡散させたりするレンズ機能を有する。従って、モールド部材104は、通常、凸レンズ形状、凹レンズ形状さらには、発光観測面から見て楕円形状やそれらを複数組み合わせた形状に形成される。また、モールド部材104は、それぞれ異なる材料を複数積層した構造にしてもよい。モールド部材104の具体的材料としては、主としてエポキシ樹脂、ユリア樹脂、シリコーン樹脂などの耐候性に優れた透明樹脂や硝子などが好適に用いられる。また、拡散剤としては、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素等を用いることができる。さらに、本願発明では、拡散剤に加えてモールド部材中にフォトルミネセンス蛍光体を含有させてもよい。すなわち、本願発明では、フォトルミネセンス蛍光体をコーティング部に含有させても良いし、モールド部材中に含有させてもよい。モールド部材にフォトルミネセンス蛍光体を含有させることにより、視野角をさらに大きくすることができる。また、コーティング部とモールド部材の双方に含有させてもよい。またさらに、コーティング部をフォトルミネセンス蛍光体が含有された樹脂とし、モールド部材を、コーティング部と異なる部材である硝子を用いて形成しても良く、このようにすることにより、水分などの影響が少ない発光ダイオードを生産性良く製造できる。また、用途によっては、屈折率を合わせるために、モールド部材とコーティング部とを同じ部材を用いて形成してもよい。本願発明においてモールド部材に拡散剤や着色剤を含有させることによって、発光観測面側から見た蛍光体の着色を隠すことができると共により混色性を向上させることができる。すなわち、蛍光体は強い外光のうち青色成分を吸収し発光し、黄色に着色しているように見える。しかしながら、モールド部材に含有された拡散剤はモールド部材を乳白色にし、着色剤は所望の色に着色する。これによって、発光観測面から蛍光体の色が観測されることはない。さらに、発光素子の主発光波長が430nm以上では、光安定化剤である紫外線吸収剤を含有させることがより好ましい。
本発明に係る実施の形態2の発光ダイオードは、発光素子として発光層に高エネルギーバンドギャップを有する窒化ガリウム系半導体を備えた素子を用い、フォトルミネセンス蛍光体として、互いに組成の異なる2種類以上のフォトルミネセンス蛍光体、好ましくはセリウムで付活されたイットリウム・アルミニウム・ガーネット系蛍光体を含む蛍光体を用いる。これにより実施の形態2の発光ダイオードは、発光素子によって発光されるLED光の発光波長が、製造バラツキ等により所望値からずれた場合でも、2種類以上の蛍光体の含有量を調節することによって所望の色調を持った発光ダイオードを作製できる。この場合、発光波長が比較的短い発光素子に対しては、発光波長が比較的短い蛍光体を用い、発光波長が比較的長い発光素子には発光波長が比較的長い蛍光体を用いることで発光ダイオードから出力される発光色を一定にすることができる。 蛍光体に関して言うと、フォトルミネセンス蛍光体として、一般式(Re1-rSmr)3(Al1-sGas)5O12:Ceで表されるセリウムで付活された蛍光体を用いることもできる。但し、0<r≦1、0≦s≦1、Reは、Y、Gd、Laから選択される少なくとも一種である。これにより発光素子から放出された可視光域における高エネルギーを有する光が長時間高輝度に照射された場合や種々の外部環境の使用下においても蛍光体の変質を少なくできるので、発光色の色ずれや発光輝度の低下が極めて少なく、かつ高輝度の所望の発光成分を有する発光ダイオードを構成できる。
実施の形態2の発光ダイオードに用いられるフォトルミネセンス蛍光体について詳細に説明する。実施の形態2においては、上述したように、フォトルミネセンス蛍光体として組成の異なる2種類以上のセリウムで付活されたフォトルミネセンス蛍光体を使用した以外は、実施の形態1と同様に構成され、蛍光体の使用方法は実施の形態と同様である。
したがって、実施形態2では、使用条件などに対応させて、蛍光体の分布濃度が設定される。また、実施の形態2では、2種類以上の蛍光体をそれぞれ発光素子から出力される光に対応して配置を工夫(例えば、発光素子に近い方から順番に配置する等)することによって発光効率を高くすることができる。
ガーネット構造を持ったYAG系蛍光体の組成の内、Alの一部をGaで置換することで発光波長が短波長側にシフトし、また組成のYの一部をGd及び/又はLaで置換することで、発光波長が長波長側へシフトする。AlのGaへの置換は、発光効率と発光波長を考慮してGa:Al=1:1から4:6が好ましい。同様に、Yの一部をGd及び/又はLaで置換することは、Y:Gd及び/又はLa=9:1から1:9であり、より好ましくは、Y:Gd及び/又はLa=4:1から2:3である。置換が2割未満では、緑色成分が大きく赤色成分が少なくなる。また、6割以上では、赤み成分が増えるものの輝度が急激に低下する。
物半導体層のバンドギャップよりも小さく、該窒化物半導体層に吸収されにくい。従って、蛍光体が等方的に発光するために発光された光はLED素子にも向かうが、蛍光体によって発光された光はLED素子に吸収されることはないので、発光ダイオードの発光効率を低下させることはない。
本発明に係る別の実施形態である面状発光光源の例を図7に示す。
図7に示す面状発光光源では、実施形態1又は2で用いたフォトルミネセンス蛍光体が、コーティング部701に含有されている。これによって、窒化ガリウム系発光素子が発生する青色系の光を、コーティング部で色変換した後、導光板704及び散乱シート706を介して面状にして出力する。
(表示装置)
次に、本願発明に係る表示装置について説明する。図10は本願発明に係る表示装置の構成を示すブロック図である。該表示装置は、図10に示すように、LED表示器601と、ドライバー回路602、画像データ記憶手段603及び階調制御手段604を備えた駆動回路610とからなる。
ここで、LED表示器601は、図11に示すように、図1又は図2に示す白色系の発光ダイオード501が、筺体504にマトリクス状に配列され、白黒用のLED表示装置として使用される。ここで、筺体504には遮光部材505が一体で成形されている。
本願発明の発光ダイオードを用いることにより、図12に示すように、RGBの3つの発光ダイオードに本願発明の発光ダイオードを加えたものを1絵素とするLED表示器を構成することができる。そして、このLED表示器と所定の駆動回路とを接続することにより種々の画像を表示することができる表示装置を構成できる。この表示装置における駆動回路は、モノクロームの表示装置と同様に、入力される表示データを一時的に記憶する画像データー記憶手段(RAM)と、RAMに記憶されたデータに基づいて各発光ダイオードを所定の明るさに点灯させるための階調信号を演算する階調制御回路と、階調制御回路の出力信号でスイッチングされて、各発光ダイオードを点灯させるドライバーとを備える。ただし、この駆動回路は、RGBと白色系に発光する各発光ダイオードをそれぞれ制御する専用の回路を必要とする。階調制御回路は、RAMに記憶されるデータから、それぞれの発光ダイオードの点灯時間を演算して、点滅させるパルス信号を出力する。ここで、白色系の表示を行う場合は、RGB各発光ダイオードを点灯するパルス信号のパルス幅を短く、あるいは、パルス信号のピーク値を低く、あるいは全くパルス信号を出力しないようにする。他方、それを補償するように(すなわち、パルス信号のパルス幅を短く、あるいは、パルス信号のピーク値を低く、あるいは全くパルス信号を出力しない分を補うように)白色系発光ダイオードにパルス信号を供給する。これにより、LED表示器の白色を表示する。
本願発明の発光ダイオードを表示装置の1種である信号機として利用した場合、長時間安定して発光させることが可能であると共に発光ダイオードの一部が消灯しても色むらなどが生じないという特長がある。本願発明の発光ダイオードを用いた信号機の概略構成として、導電性パターンが形成された基坂上に白色系発光ダイオードを所定の配列に配置する。このような発光ダイオードを直列又は直並列に接続された発光ダイオードの回路を発光ダイオード群として扱う。発光ダイオード群を2つ以上用いそれぞれ渦巻き状に発光ダイオードを配置させる。全ての発光ダイオードが配置されると円状に全面に配置される。各発光ダイオード及び基板から外部電力と接続させる電源コードをそれぞれ、ハンダにより接続した後、鉄道信号用の匡体内に固定する。LED表示器は、遮光部材が付いたアルミダイキャストの匡体内に配置され表面にシリコーンゴムの充填材で封止されている。匡体の表示面は、白色レンズを設けてある。また、LED表示器の電気的配線は、筺体の裏面から筺体を密閉するためにゴムパッキンを介して通し、筺体内を密閉する。このようにして白色系信号機を形成することができる。本願発明の発光ダイオードを、複数の群に分け中心部から外側に向け輪を描く渦巻き状などに配置し、並列接続することでより信頼性が高い信号機を構成することができる。この場合、中心部から外側に向け輪を描くことにより、信頼性が高い信号機を構成することができる。中心部から外側に向け輪を描くことには、連続的に輪を描くものも断続的に配置するものの双方を含む。したがって、LED表示器の表示面積などを考慮して、配置される発光ダイオードの数や発光ダイオード群の数を種々選択することができる。この信号機により、一方の発光ダイオード群や一部の発光ダイオードが何らかのトラブルにより消灯したとしても他方の発光ダイオード群や残った発光ダイオードにより信号機を円形状に均一に発光させることが可能となるり、色ずれが生ずることもない。渦巻き状に配置してあることから中心部を密に配置することができ電球発光の信号と何ら違和感なく駆動させることができる。
以下、本願発明の実施例について説明するが、本願発明は、以下に示す実施例のみに限定されるものではないことを念のために言っておく。
(実施例1)
実施例1は、発光素子として、GaInN半導体を用いた発光ピークが450nm、半値幅30nmの発光素子を用いた例である。実施例1の発光素子は、洗浄されたサファイ基板上にTMG(トリメチルガリウム)ガス、TMI(トリメチルインジウム)ガス、窒素ガス及びドーバントガスをキャリアガスと共に流し、MOCVD法で窒化ガリウム系化合物半導体を成膜することにより作製される。成膜時に、ドーパントガスとしてSiH4とCp2Mgと、を切り替えることによってN型導電性を有する窒化ガリウム半導体とP型導電性を有する窒化ガリウム半導体を形成する。実施例1のLED素子は、N型導電性を有する窒化ガリウム半導体であるコンタクト層と、P型導電性を有する窒化ガリウムアルミニウム半導体であるクラッド層、P型導電性を有する窒化ガリウム半導体層であるコンタクト層を備え、N型導電性を有するコンタクト層とP型導電性を有するクラッド層との間に厚さ約3nmの、単一量子井戸構造を構成するためのノンドープInGaNからなる活性層が形成されている。尚、サファイア基板上には、バッファ層として低温で窒化ガリウム半導体層が形成されている。また、P型窒化ガリウム半導体は、成膜後400℃以
上の温度でアニールされている。
量部とエポキシ樹脂100重量部とをよく混合してスラリーとし、このスラリーを発光素子が載置されたマウント・リードのカップ内に注入した後、130℃の温度で1時間で硬化させた。こうして発光素子上に厚さ120μmのフォトルミネセンス蛍光体が含有されたコーティング部を形成した。なお、本実施例1では、コーティング部においては、発光素子に向かってフォトルミネセンス蛍光体が徐々に多く分布するように構成した。
こうして得られた白色系が発光可能な発光ダイオードの色度点、色温度、演色性指数を測定した結果、それぞれ、色度点は、(x=0.302、y=0.280)、色温度8080K、演色性指数(Ra)=87.5と三波長型蛍光灯に近い性能を示した。また、発光効率は9.51m/wと白色電球並であった。さらに、温度25℃60mA通電、温度25℃20mA通電、温度60℃90%RH下で20mA通電の各寿命試験においても蛍光体に起因する変化は観測されず通常の青色発光ダイオードと寿命特性に差がないことが確認できた。
フォトルミネセンス蛍光体を(Y0.8Gd0.2)3Al5O12:Ce蛍光体から
(ZnCd)S:Cu、Alとした以外は、実施例1と同様にして発光ダイオードの形成及び寿命試験を行った。形成された発光ダイオードは通電直後、実施例1と同様、白色系の発光が確認されたが輝度は低かった。また、寿命試験においては、約100時間で出力がゼロになった。劣化原因を解析した結果、蛍光体が黒化していた。
実施例2の発光ダイオードは、発光素子における窒化物系化合物半導体のInの含有量を実施例1の発光素子よりも増やすことにより、発光素子の発光ピークを460nmとし、フォトルミネセンス蛍光体のGdの含有量を実施例1よりも増やし(Y0.6Gd0.4)3Al5O12:Ceとした以外は実施例1と同様にして発光ダイオードを作製した。
以上のようにして作製した発光ダイオードは、白色系の発光可能であり、その色度点、色温度、演色性指数を測定した。それぞれ、色度点(x=0.375、y=0.370)、色温度4400K、演色性指数(Ra)=86.0であった。
また、この実施例2の発光ダイオードを100個作製し、初期の光度に対する1000時間発光させた後における光度を調べた。その結果、初期(寿命試験前)の光度を100%とした場合、1000時間経過後における平均光度は、平均して98.8%であり特性に差がないことが確認できた。
実施例3の発光ダイオードは、フォトルミネセンス蛍光体としてY、Gd、Ceの希土類元素に加えSmを含有させた、一般式(Y0.39Gd0.57Ce0.03Sm0.
01)3Al5O12蛍光体を用いた以外は、実施例1と同様に作製した。この実施例3の発光ダイオードを100個作製し、130℃の高温下において評価した結果、実施例1の発光ダイオードと比較して平均温度特性が8%ほど良好であった。
実施例4のLED表示器は、実施例1の発光ダイオードが、図11に示すように銅パターンを形成したセラミックス基坂上に、16×16のマトリックス状に配列されて構成される。尚、実施例4のLED表示器では、発光ダイオードが配列された基板は、フェノール樹脂からなり遮光部材505が一体で形成された筺体504内部に配置され、発光ダイオードの先端部を除いて筺体、発光ダイオード、基板及び遮光部材の一部をピグメントにより黒色に着色したシリコンゴム506が充填される。また、基板と発光ダイオードとの接続は、自動ハンダ実装装置を用いてハンダ付けを行た。
実施例5の発光ダイオードは、フォトルミネセンス蛍光体として一般式(Y0.2Gd0.8)3Al5O12:Ceで表される蛍光体を用いた以外は、実施例1と同様にして作製した。この実施例5の発光ダイオードを100個作製して諸特性を測定した。
その結果、色度点(平均値)は(x=0.450,y=0.420)であり、電球色の光を発光することができた。
また、実施例5の発光ダイオードは、実施例1の発光ダイオードに比較して輝度が約40%低かったが、寿命試験においては、実施例1と同様に優れた耐候性を示していた。
実施例6の発光ダイオードは、フォトルミネセンス蛍光体として一般式Y3Al5O12:Ceで表される蛍光体を用いた以外は、実施例1と同様にして作製した。この実施例6の発光ダイオードを100個作製して諸特性を測定した。
その結果、実施例1に比較してやや黄緑色がかった白色の光を発光することができた。 図20(A〜C)にそれぞれ、実施例6のフォトルミネセンス蛍光体、発光素子及び発光ダイオードの各発光スペクトルを示す。
また、実施例6の発光ダイオードは、寿命試験においては、実施例1と同様に優れた耐候性を示していた。
実施例7の発光ダイオードは、フォトルミネセンス蛍光体として一般式Y3(Al0.5Ga0.5)5O12:Ceで表される蛍光体を用いた以外は、実施例1と同様にして作製した。この実施例7の発光ダイオードを100個作製して諸特性を測定した。
その結果、実施例7の発光ダイオードは、輝度は低いが緑色がかった白色の光を発光することができ、寿命試験においては、実施例1と同様に優れた耐候性を示していた。
図21(A〜C)にそれぞれ、実施例7のフォトルミネセンス蛍光体、発光素子及び発光ダイオードの各発光スペクトルを示す。
実施例8の発光ダイオードは、フォトルミネセンス蛍光体として、一般式Gd3(Al0.5Ga0.5)5O12:Ceで表されるYを含まない蛍光体を用いた以外は、実施例1と同様にして作製した。この実施例8の発光ダイオードを100個作製して諸特性を測定した。
その結果、実施例8の発光ダイオードは、輝度は低いが、寿命試験においては、実施例1と同様に優れた耐候性を示していた。
実施例9の発光ダイオードは、図7に示す構成を有する面状発光の発光装置である。
発光素子として発光ピークが450nmのIn0.05Ga0.95N半導体を用いた。発光素子は、洗浄させたサファイヤ基板上にTMG(トリメチルガリウム)ガス、TMI(トリメチルインジュウム)ガス、窒素ガス及びドーパントガスをキャリアガスと共に流し、MOCVD法で窒化ガリウム系化合物半導体を成膜することにより形成した。ドーパントガスとしてSiH4とCp2Mgと、を切り替えることによってN型導電性を有する窒化ガリウム半導体とP型導電性を有する窒化ガリウム半導体を形成しPN接合を形成した。半導体発光素子としては、N型導電性を有する窒化ガリウム半導体であるコンタクト層、N型導電性を有する窒化ガリウムアルミニウム半導体であるクラッド層、P型導電性を有する窒化ガリウムアルミニウム半導体であるクラッド層、P型導電性を有する窒化ガリウム半導体であるコンタクト層を形成した。N型導電性を有するクラッド層とP型導電性を有するクラッド層との間にダブルヘテロ接合となるZnドープInGaNの活性層を形成した。なお、サファイア基板上には、低温で窒化ガリウム半導体を形成し、バッファ層として用いた。P型窒化物半導体層は、成膜後400℃以上の温度でアニールされている。
銀メッキした銅製リードフレームの先端にカップを有するマウント・リードに発光素子をエポキシ樹脂でダイボンディングした。発光素子の各電極とマウント・リード及びインナー・リードと、をそれぞれ直径が30μmの金線でワイヤボンディングし電気的導通を取った。
表される緑色系が発光可能な第1の蛍光体120重量部と、同様にして作製された、一般式(Y0.4Gd0.6)3Al5O12:Ceで表される赤色系が発光可能な第2の蛍
光体100重量部とを、エポキシ樹脂100重量部とよく混合してスラリーとし、このスラリーを厚さ0.5mmのアクリル層上にマルチコーターを用いて均等に塗布、乾燥し、厚さ約30μmの色変換部材として蛍光体膜を形成した。
蛍光体層を導光板の主発光面と同じ大きさに切断し導光板上に配置することにより面状の発光装置を作製した。以上のように作製した発光装置の色度点、演色性指数を測定した結果、色度点は、(x=0.29,y=0.34)であり、演色性指数(Ra)は、92.0と三波長型蛍光灯に近い性能を示した。また、発光効率は12 lm/wと白色電球並であった。さらに耐侯試験として室温60mA通電、室温20mA通電、60℃90%RH下で20mA通電の各試験においても蛍光体に起因する変化は観測されなかった。
実施例9の一般式Y3(Al0.6Ga0.4)5O12:Ceで表される緑色系が発光可能な第1の蛍光体、及び一般式(Y0.4Gd0.6)3Al5O12:Ceで表される赤色系が発光可能な第2の蛍光体からなるフォトルミネセンス蛍光体に代えて、それぞれペリレン系誘導体である緑色有機蛍光顔料(シンロイヒ(SINLOIHI)化学製FA−001)と赤色有機蛍光顔料(シンロイヒ化学製FA−005)とを用いて同量で混合攪拌した以外は、実施例9と同様にして発光ダイオードを作製して実施例9と同様の耐侯試験を行った。作製した比較例1の発光ダイオードの色度点は、(x=0.34,y=0.35)であった。耐侯性試験として、カーボンアークで紫外線量を200hrで太陽光の1年分とほぼ同等とさせ時間と共に輝度の保持率及び色調を測定した。また、信頼性試験として発光素子を発光させ70℃一定における時間と共に発光輝度及び色調を測定した。この結果を実施例9と共に図14及び図15にそれぞれ示す。図14,15から明らかなように、いずれの試験においても、実施例9は、比較例2より劣化が少ない。
実施例10の発光ダイオードは、リードタイプの発光ダイオードである。
実施例10の発光ダイオードでは、実施例9と同様にして作製した450nmのIn0.05Ga0.95Nの発光層を有する発光素子を用いた。そして、銀メッキした銅製のマウントリードの先端のカップに発光素子をエポキシ樹脂でダイボンディングし、発光素子の各電極とマウント・リード及びインナー・リードとをそれぞれ金線でワイヤーボンディングし電気的に導通させた。
Ceで表される緑色系が発光可能な第1の蛍光体と一般式(Y0.2Gd0.8)3Al5O12:Ceで表される赤色系が発光可能な第2の蛍光体とをそれぞれ以下のようにして作製して混合して用いた。すなわち、必要なY、Gd、Ceの希土類元素を化学量論比で酸に溶解した溶解液を蓚酸で共沈させた。これを焼成して得られる共沈酸化物と、酸化アルミニウム、酸化ガリウムと混合して混合原料をそれぞれ得る。これにフラックスとしてフッ化アンモニウムを混合して坩堝に詰め、空気中1400°Cの温度範囲で3時間焼成してそれぞれ焼成品を得た。焼成品を水中でボールミルして、洗浄、分離、乾燥、最後に篩を通して所定の粒度の第1と第2の蛍光体を作製した。
LED素子として発光ピークが470nmのIn0.4Ga0.6N半導体を用いた。
発光素子は、洗浄させたサファイヤ基板上にTMG(トリメチルガリウム)ガス、TMI(トリメチルインジュウム)ガス、窒素ガス及びドーパントガスをキャリアガスと共に流し、MOCVD法で窒化ガリウム系化合物半導体を成膜させることにより形成した。ドーパントガスとしてSiH4とCp2Mgと、を切り替えることによってN型導電性を有する窒化ガリウム半導体とP型導電性を有する窒化ガリウム半導体を形成しPN接合を形成した。LED素子としては、N型導電性を有する窒化ガリウム半導体であるコンタクト層、P型導電性を有する窒化ガリウムアルミニウム半導体であるクラッド層、P型導電性を有する窒化ガリウム半導体であるコンタクト層を形成した。N型導電性を有するコンタクト層とP型導電性を有するクラッド層との間に厚さ約3nmのノンドープInGaNの活性層を形成することにより単一井戸構造とした。なお、サファイア基板上には、低温で窒化ガリウム半導体をバッファ層として形成した。
Ceで表され比較的短波長側の黄色系が発光可能な蛍光体と、一般式(Y0.4Gd0.6)3Al5O12:Ceで表され比較的長波長側の黄色系が発光可能な蛍光体とを以下のようにして作製して混合して用いた。これらの蛍光体は、それぞれ必要なY、Gd、Ceの希土類元素を化学量論比で酸に溶解した溶解液を蓚酸で共沈させた。これを焼成して得られる共沈酸化物と、酸化アルミニウムと混合して混合原料をそれぞれ得る。これにフラックスとしてフッ化アンモニウムを混合して坩堝に詰め、空気中1400℃の温度範囲で3時間焼成して焼成品を得た。焼成品をそれぞれ水中でボールミルして、洗浄、分離、乾燥、最後に篩を通して形成した。
で表される蛍光体及び発光素子の各発光スペクトルを示す。また、図23には、実施例11の発光ダイオードの発光スペクトルを示す。 さらに耐侯試験として室温60mA通電、室温20mA通電、60℃90%RH下で20mA通電の各試験においても蛍光体に起因する変化は観測されなかった。同様に、この蛍光体の含有量を種々変えることによって発光素子からの波長が変化しても所望の色度点を維持させることができる。
実施例12の発光ダイオードは、フォトルミネセンス蛍光体として一般式Y3In5O12:Ceで表されるAlを含まない蛍光体を用いた以外は、実施例1と同様にして発光ダイオードを100個作製した。実施例9の発光ダイオードは、輝度は低いが寿命試験において実施例1と同様に優れた耐候性を示していた。
Claims (4)
- 発光層が半導体であるLEDチップと、該LEDチップによって発光された光の一部を吸収して、吸収した光の波長と異なる波長を有する光を発光するセリウム付活ガーネット系蛍光体とを備えた発光ダイオードにおいて、
a)前記LEDチップはその発光層がInを含む窒化ガリウム系半導体で、420〜490nmの範囲にピーク波長を有する青色発光が可能であるLEDチップであり、
b)前記セリウム付活ガーネット系蛍光体が、硝子に含まれており、
c)前記セリウム付活ガーネット系蛍光体が、前記LEDチップの青色発光スペクトルの一部を吸収して530〜570nm付近にピーク波長を有し、700nmまで裾をひくブロードな発光スペクトルを発光可能であり、一般式(Re1−rSmr)3(Al1−sGas)5O12:Ceで表される(ただし、0≦r<1、0≦s≦1、Reは、Y、Gdから選択される少なくとも一種である)セリウム付活ガーネット系蛍光体であって、
d)前記セリウム付活ガーネット系蛍光体の発光する530〜570nm付近にピーク波長を有する発光スペクトルと、前記LEDチップからの前記セリウム付活ガーネット系蛍光体に吸収されない、420〜490nmの範囲にピーク波長を有する幅をもった発光スペクトルとの混合により、両スペクトルが重なり合い、連続した合成スペクトルの光が発光可能であることを特徴とする発光ダイオード。 - 発光層が半導体であるLEDチップと、該LEDチップによって発光された光の一部を吸収して、吸収した光の波長と異なる波長を有する光を発光するセリウム付活ガーネット系蛍光体とを備えた発光ダイオードにおいて、
a)前記LEDチップはその発光層がInを含む窒化ガリウム系半導体の単一量子井戸構造又は多重量子井戸構造からなり、450〜475nmの範囲にピーク波長を有する青色発光が可能であるLEDチップであり、
b)前記セリウム付活ガーネット系蛍光体が、硝子に含まれており、
c)前記セリウム付活ガーネット系蛍光体が、前記LEDチップの青色発光スペクトルの一部を吸収して530〜570nm付近にピーク波長を有し、700nmまで裾をひくブロードな発光スペクトルを発光可能であり、一般式(Re1−rSmr)3(Al1−sGas)5O12:Ceで表される(ただし、0≦r<1、0≦s≦1、Reは、Y、Gdから選択される少なくとも一種である)セリウム付活ガーネット系蛍光体であって、
d)前記セリウム付活ガーネット系蛍光体の発光する530〜570nm付近にピーク波長を有する発光スペクトルと、前記LEDチップからの前記セリウム付活ガーネット系蛍光体に吸収されない、450〜475nmの範囲にピーク波長を有する幅をもった発光スペクトルとの混合により、両スペクトルが重なり合い、連続した合成スペクトルの光が発光可能であることを特徴とする発光ダイオード。 - 発光層が半導体であるLEDチップと、該LEDチップによって発光された光の一部を吸収して、吸収した光の波長と異なる波長を有する光を発光するセリウム付活ガーネット系蛍光体とを備えた発光ダイオードにおいて、
a)前記LEDチップはその発光層がInを含む窒化ガリウム系半導体で、420〜490nmの範囲にピーク波長を有する青色発光が可能であるLEDチップであり、
b)前記セリウム付活ガーネット系蛍光体が、硝子に含まれており、
c)前記セリウム付活ガーネット系蛍光体が、それぞれ前記LEDチップの青色発光スペクトルの一部を吸収して530〜570nm付近にピーク波長を有し、700nmまで裾をひくブロードな発光スペクトルを発光可能であり、一般式(Re1−rSmr)3(Al1−sGas)5O12:Ceで表され(ただし、0≦r<1、0≦s≦1、Reは、Y、Gdから選択される少なくとも一種である)、かつ互いに組成の異なる2以上のセリウム付活ガーネット系蛍光体であって、
d)前記セリウム付活ガーネット系蛍光体の発光する530〜570nm付近にピーク波長を有する発光スペクトルと、前記LEDチップからの前記セリウム付活ガーネット系蛍光体に吸収されない、420〜490nmの範囲にピーク波長を有する幅をもった発光スペクトルとの混合により、スペクトルが重なり合い、連続した合成スペクトルの光が発光可能である、
発光ダイオード。 - 前記互いに組成の異なる2以上のセリウム付活ガーネット蛍光体がセリウム付活イットリウム・アルミニウムガーネット系蛍光体であって、前記LEDチップの青色発光スペクトルの一部を吸収して530〜570nm付近にピーク波長を有し、700nmまで裾をひくブロードな発光スペクトルを発光可能であるそれぞれイットリウムの一部がガドリニウムに置換された第1の蛍光体と第2の蛍光体を含んでなり、該第1と第2の蛍光体のイットリウム・アルミニウムガーネット系蛍光体におけるガドリニウムによる置換量がお互いに異なる請求項3記載の発光ダイオード。
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