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NO20022132D0 - Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse - Google Patents

Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse

Info

Publication number
NO20022132D0
NO20022132D0 NO20022132A NO20022132A NO20022132D0 NO 20022132 D0 NO20022132 D0 NO 20022132D0 NO 20022132 A NO20022132 A NO 20022132A NO 20022132 A NO20022132 A NO 20022132A NO 20022132 D0 NO20022132 D0 NO 20022132D0
Authority
NO
Norway
Prior art keywords
component
solder material
providing
soldered connection
cooled
Prior art date
Application number
NO20022132A
Other languages
English (en)
Other versions
NO20022132L (no
NO323074B1 (no
Inventor
Stefan Weber
Alfred Kemper
Original Assignee
Ping Gmbh Vakuumtechnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ping Gmbh Vakuumtechnik filed Critical Ping Gmbh Vakuumtechnik
Publication of NO20022132L publication Critical patent/NO20022132L/no
Publication of NO20022132D0 publication Critical patent/NO20022132D0/no
Publication of NO323074B1 publication Critical patent/NO323074B1/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Die Bonding (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Heat Treatment Of Articles (AREA)
  • Coating With Molten Metal (AREA)
  • Tunnel Furnaces (AREA)
NO20022132A 1999-11-08 2002-05-03 Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse NO323074B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19953654A DE19953654A1 (de) 1999-11-08 1999-11-08 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
PCT/DE2000/003848 WO2001034334A1 (de) 1999-11-08 2000-11-02 Verfahren und vorrichtung zur herstellung einer lotverbindung

Publications (3)

Publication Number Publication Date
NO20022132L NO20022132L (no) 2002-05-03
NO20022132D0 true NO20022132D0 (no) 2002-05-03
NO323074B1 NO323074B1 (no) 2006-12-27

Family

ID=7928273

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20022132A NO323074B1 (no) 1999-11-08 2002-05-03 Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse

Country Status (19)

Country Link
US (1) US6796483B1 (no)
EP (1) EP1233841B1 (no)
JP (1) JP4727110B2 (no)
KR (1) KR100645984B1 (no)
CN (1) CN1275730C (no)
AT (1) ATE297829T1 (no)
AU (1) AU779191B2 (no)
CA (1) CA2390498C (no)
CZ (1) CZ302495B6 (no)
DE (2) DE19953654A1 (no)
DK (1) DK1233841T3 (no)
ES (1) ES2243338T3 (no)
HU (1) HU225907B1 (no)
IL (2) IL149489A0 (no)
MX (1) MXPA02004579A (no)
NO (1) NO323074B1 (no)
PL (1) PL194904B1 (no)
PT (1) PT1233841E (no)
WO (1) WO2001034334A1 (no)

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DE10304774B3 (de) * 2003-02-05 2004-07-15 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Temperaturbeaufschlagung von Werkstücken
JP4537019B2 (ja) * 2003-06-04 2010-09-01 古河スカイ株式会社 アルミニウム材のろう付け方法
DE102004047359B3 (de) * 2004-09-29 2006-01-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses
US7845540B2 (en) * 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces
DE502007006611D1 (de) * 2006-05-29 2011-04-14 Kirsten Soldering Ag Lötanlage mit lötmodulen und mindestens einer mobilen und auswechselbar in einem lötmodul einsetzbaren lötstation ; entsprechende stand-by station
DE102006029593A1 (de) * 2006-05-29 2007-12-13 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
ES2366237T3 (es) * 2006-05-29 2011-10-18 Pink Gmbh Thermosysteme Procedimiento y dispositivo para el tratamiento térmico, en particular unión por soldadura.
DE102006034600B4 (de) * 2006-07-26 2010-01-14 Infineon Technologies Ag Verfahren zur Herstellung einer Lötverbindung
US7793819B2 (en) 2007-03-19 2010-09-14 Infineon Technologies Ag Apparatus and method for connecting a component with a substrate
WO2009026765A1 (en) * 2007-08-29 2009-03-05 Acm Research (Shanghai) Inc. Method and apparatus for thermal treatment of semiconductor workpieces
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DE102011081606B4 (de) * 2011-08-26 2022-08-04 Infineon Technologies Ag Kühlvorrichtung und Lötanlage
JP5778731B2 (ja) * 2012-09-17 2015-09-16 ピーエスケー・インコーポレーテッド 連続線形熱処理装置の配列
CN102896391B (zh) * 2012-10-15 2015-10-07 泗阳群鑫电子有限公司 一种链式真空炉
US9733130B2 (en) * 2013-05-10 2017-08-15 Illinois Tool Works Inc. Temperature sensor belt
DE102014106631B4 (de) 2013-05-10 2021-12-02 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Lötverbindungen
JP2015009262A (ja) * 2013-07-01 2015-01-19 三菱電機株式会社 リフロー装置
MX2017007008A (es) 2014-12-09 2017-12-04 Pink Gmbh Thermosysteme Dispositivo de transferencia de calor para producir una conexion soldada de componentes electricos.
DE102016103213A1 (de) * 2016-02-24 2017-08-24 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN109059543A (zh) * 2018-07-16 2018-12-21 苏州洛特兰新材料科技有限公司 一种用于陶瓷材料生产的工业窑炉
DE102019211212A1 (de) 2019-07-29 2021-02-04 Rehm Thermal Systems Gmbh Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN113543514B (zh) * 2020-04-15 2022-09-23 昆山达菲乐电子产品有限公司 回焊炉
EP4149708B1 (de) * 2020-05-15 2024-01-10 PINK GmbH Thermosysteme Anlage zum verbinden von elektronischen baugruppen
KR102704735B1 (ko) * 2022-05-09 2024-09-09 한국광기술원 레이저 진공용접 장치
CN115922172B (zh) * 2023-03-14 2023-06-02 无锡昌鼎电子有限公司 一种在线式真空焊接炉组装设备及其组装方法
CN117139941A (zh) * 2023-10-30 2023-12-01 北京中科同志科技股份有限公司 真空系统及其工作方法

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US5147083A (en) * 1991-09-25 1992-09-15 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
JPH05308186A (ja) * 1991-11-06 1993-11-19 Sanden Corp ろう付加熱装置
JPH05161961A (ja) * 1991-11-14 1993-06-29 Tamura Seisakusho Co Ltd リフロー炉
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JPH08125099A (ja) * 1994-10-28 1996-05-17 Toshiba Corp 半導体装置の製造方法
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JPH10339377A (ja) * 1997-06-06 1998-12-22 Nec Corp ゲートバルブ
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JPH1177294A (ja) * 1997-08-28 1999-03-23 Toyota Motor Corp 減圧ロウ付け方法

Also Published As

Publication number Publication date
NO20022132L (no) 2002-05-03
US6796483B1 (en) 2004-09-28
CZ20021603A3 (cs) 2003-05-14
NO323074B1 (no) 2006-12-27
PL355529A1 (en) 2004-05-04
DE50010577D1 (de) 2005-07-21
EP1233841B1 (de) 2005-06-15
DK1233841T3 (da) 2005-10-10
IL149489A0 (en) 2002-11-10
KR100645984B1 (ko) 2006-11-13
CZ302495B6 (cs) 2011-06-15
JP4727110B2 (ja) 2011-07-20
ATE297829T1 (de) 2005-07-15
CA2390498A1 (en) 2001-05-17
EP1233841A1 (de) 2002-08-28
AU779191B2 (en) 2005-01-13
HU225907B1 (en) 2007-12-28
DE19953654A1 (de) 2001-05-23
PL194904B1 (pl) 2007-07-31
WO2001034334A1 (de) 2001-05-17
CA2390498C (en) 2009-06-30
AU2501001A (en) 2001-06-06
IL149489A (en) 2006-10-31
KR20020062935A (ko) 2002-07-31
HUP0203145A2 (en) 2002-12-28
MXPA02004579A (es) 2004-09-10
CN1275730C (zh) 2006-09-20
PT1233841E (pt) 2005-09-30
JP2003517376A (ja) 2003-05-27
ES2243338T3 (es) 2005-12-01
CN1387468A (zh) 2002-12-25

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