[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

ES2196950A1 - Metodo de solar. - Google Patents

Metodo de solar.

Info

Publication number
ES2196950A1
ES2196950A1 ES200100888A ES200100888A ES2196950A1 ES 2196950 A1 ES2196950 A1 ES 2196950A1 ES 200100888 A ES200100888 A ES 200100888A ES 200100888 A ES200100888 A ES 200100888A ES 2196950 A1 ES2196950 A1 ES 2196950A1
Authority
ES
Spain
Prior art keywords
thyristor
soldering
heat sink
vehicle
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200100888A
Other languages
English (en)
Other versions
ES2196950B2 (es
Inventor
Yoshihiro Nakazawa
Koji Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAVUSHIKI KAISHA
Honda Motor Co Ltd
Shindengen Electric Manufacturing Co Ltd
Original Assignee
KAVUSHIKI KAISHA
Honda Motor Co Ltd
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAVUSHIKI KAISHA, Honda Motor Co Ltd, Shindengen Electric Manufacturing Co Ltd filed Critical KAVUSHIKI KAISHA
Priority to ES200100888A priority Critical patent/ES2196950B2/es
Publication of ES2196950A1 publication Critical patent/ES2196950A1/es
Application granted granted Critical
Publication of ES2196950B2 publication Critical patent/ES2196950B2/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Generation Of Surge Voltage And Current (AREA)
  • Resistance Welding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Método de soldar. Cuando se suelda un elemento electrónico con una pluralidad de materiales a soldar simultáneamente mediante reflujo de calentamiento, los respectivos materiales a soldar se sueldan con el elemento electrónico en las posiciones deseadas. Cuando se suelda un tiristor (1) con un disipador térmico (3) y simultáneamente se suelda electrodos (5 y 6) con el tiristor, una primera aleación de soldar (2a, 4) para conectar el tiristor con el disipador térmico (3) se funde antes que una segunda aleación de soldar (2c, 2g) para conectar el tiristor con los electrodos (5 y 6).
ES200100888A 2001-04-17 2001-04-17 Metodo de soldar. Expired - Fee Related ES2196950B2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200100888A ES2196950B2 (es) 2001-04-17 2001-04-17 Metodo de soldar.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200100888A ES2196950B2 (es) 2001-04-17 2001-04-17 Metodo de soldar.

Publications (2)

Publication Number Publication Date
ES2196950A1 true ES2196950A1 (es) 2003-12-16
ES2196950B2 ES2196950B2 (es) 2006-07-01

Family

ID=30470461

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200100888A Expired - Fee Related ES2196950B2 (es) 2001-04-17 2001-04-17 Metodo de soldar.

Country Status (1)

Country Link
ES (1) ES2196950B2 (es)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344184A (en) * 1976-10-01 1978-04-20 Sansha Electric Mfg Co Ltd Method of producing semiconductor device
JPS58182248A (ja) * 1982-04-19 1983-10-25 Mitsubishi Electric Corp 半導体装置
JPS60202966A (ja) * 1984-03-28 1985-10-14 Hitachi Ltd 半導体装置の製法
JP2000232119A (ja) * 1999-02-10 2000-08-22 Shinko Electric Ind Co Ltd 半導体チップの接続部材及びその製造方法とその接続部材を用いた半導体チップの接続方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344184A (en) * 1976-10-01 1978-04-20 Sansha Electric Mfg Co Ltd Method of producing semiconductor device
JPS58182248A (ja) * 1982-04-19 1983-10-25 Mitsubishi Electric Corp 半導体装置
JPS60202966A (ja) * 1984-03-28 1985-10-14 Hitachi Ltd 半導体装置の製法
JP2000232119A (ja) * 1999-02-10 2000-08-22 Shinko Electric Ind Co Ltd 半導体チップの接続部材及びその製造方法とその接続部材を用いた半導体チップの接続方法

Also Published As

Publication number Publication date
ES2196950B2 (es) 2006-07-01

Similar Documents

Publication Publication Date Title
AU2002248684A1 (en) Flip chip interconnection using no-clean flux
DK1233841T3 (da) Fremgangsmåde og indretning til oprettelse af en loddeforbindelse
US3665590A (en) Semiconductor flip-chip soldering method
DE60219779D1 (de) Flussmittelfreie flip-chip-verbindung
JP2007335538A (ja) 半導体装置の製法
GR3032849T3 (en) Solder/desolder device for integrated circuits.
EP0895281A4 (en) TWO-STAGE HIGHLIGHTS FOR SEMICONDUCTOR CHIP, AND MANUFACTURING METHOD
MY137055A (en) Simplification of ball attach method using super-saturated fine crystal flux
WO2002083350A3 (de) Vorrichtung zum aufbringen von lotkugeln
ES2196950A1 (es) Metodo de solar.
WO2003022504A3 (de) Lötverfahren für metallische befestigungselemente
JP2002280721A5 (es)
DE10335111A1 (de) Montageverfahren für ein Halbleiterbauteil
MY113624A (en) Soldering apparatus and a method thereof
JPH10117065A (ja) バンプ付きワークの半田付け方法
KR100804266B1 (ko) 열융착장치 및 이의 방열방법
JPS6363588A (ja) リ−ドフレ−ム取付方法
EP1535689A3 (en) Method for fluxless soldering of workpieces
KR20000032369A (ko) 금속망사를 이용한 금속재료와 세라믹기판의 납땜구조 및 방법
WO2004057648A3 (en) Localized reflow for wire bonding and flip chip connections
JP2005161336A (ja) ハンダごて
Lodge et al. Methods of Joining Components by Laser Soldering
JP2924059B2 (ja) 半導体ペレットマウント方法及び半導体ペレットマウント装置
JP2007059712A (ja) 実装方法
JPH0226038A (ja) 電子素子の固着方法

Legal Events

Date Code Title Description
EC2A Search report published

Date of ref document: 20031216

Kind code of ref document: A1

FG2A Definitive protection

Ref document number: 2196950B2

Country of ref document: ES

FD2A Announcement of lapse in spain

Effective date: 20211122