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IL176057A - Exposure facility, exposure method, method of creating the facility and optical component - Google Patents

Exposure facility, exposure method, method of creating the facility and optical component

Info

Publication number
IL176057A
IL176057A IL176057A IL17605706A IL176057A IL 176057 A IL176057 A IL 176057A IL 176057 A IL176057 A IL 176057A IL 17605706 A IL17605706 A IL 17605706A IL 176057 A IL176057 A IL 176057A
Authority
IL
Israel
Prior art keywords
substrate
liquid
exposure apparatus
exposure
repellent
Prior art date
Application number
IL176057A
Other languages
English (en)
Hebrew (he)
Other versions
IL176057A0 (en
Inventor
Hitoshi Ishizawa
Hiroyuki Nagasaka
Hiroaki Takaiwa
Shigeru Hirukawa
Ryuichi Hoshika
Original Assignee
Nikon Corp
Hitoshi Ishizawa
Hiroyuki Nagasaka
Hiroaki Takaiwa
Shigeru Hirukawa
Ryuichi Hoshika
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Hitoshi Ishizawa, Hiroyuki Nagasaka, Hiroaki Takaiwa, Shigeru Hirukawa, Ryuichi Hoshika filed Critical Nikon Corp
Publication of IL176057A0 publication Critical patent/IL176057A0/en
Publication of IL176057A publication Critical patent/IL176057A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
IL176057A 2003-12-03 2006-05-31 Exposure facility, exposure method, method of creating the facility and optical component IL176057A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003404384 2003-12-03
JP2004042496 2004-02-19
PCT/JP2004/018435 WO2005055296A1 (ja) 2003-12-03 2004-12-03 露光装置、露光方法及びデバイス製造方法、並びに光学部品

Publications (2)

Publication Number Publication Date
IL176057A0 IL176057A0 (en) 2006-10-05
IL176057A true IL176057A (en) 2013-01-31

Family

ID=34656211

Family Applications (4)

Application Number Title Priority Date Filing Date
IL176057A IL176057A (en) 2003-12-03 2006-05-31 Exposure facility, exposure method, method of creating the facility and optical component
IL207788A IL207788A0 (en) 2003-12-03 2010-08-24 Exposure apparatus, exposure method, method for producing device , and optical part
IL207790A IL207790A (en) 2003-12-03 2010-08-24 Exposure facility, exposure method, method of creating the facility and optical component
IL223536A IL223536A (en) 2003-12-03 2012-12-09 Exposure facility, method of exposure, method of facility creation and optical component

Family Applications After (3)

Application Number Title Priority Date Filing Date
IL207788A IL207788A0 (en) 2003-12-03 2010-08-24 Exposure apparatus, exposure method, method for producing device , and optical part
IL207790A IL207790A (en) 2003-12-03 2010-08-24 Exposure facility, exposure method, method of creating the facility and optical component
IL223536A IL223536A (en) 2003-12-03 2012-12-09 Exposure facility, method of exposure, method of facility creation and optical component

Country Status (9)

Country Link
US (5) US8054447B2 (zh)
EP (4) EP2717295B1 (zh)
KR (9) KR101682884B1 (zh)
CN (2) CN102163004B (zh)
HK (1) HK1089292A1 (zh)
IL (4) IL176057A (zh)
SG (3) SG148994A1 (zh)
TW (6) TWI470371B (zh)
WO (1) WO2005055296A1 (zh)

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