WO2019009026A1 - 紫外線硬化型シリコーン粘着剤組成物及びシリコーン粘着フィルム - Google Patents
紫外線硬化型シリコーン粘着剤組成物及びシリコーン粘着フィルム Download PDFInfo
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- WO2019009026A1 WO2019009026A1 PCT/JP2018/022407 JP2018022407W WO2019009026A1 WO 2019009026 A1 WO2019009026 A1 WO 2019009026A1 JP 2018022407 W JP2018022407 W JP 2018022407W WO 2019009026 A1 WO2019009026 A1 WO 2019009026A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Definitions
- the present invention relates to an ultraviolet-curable silicone pressure-sensitive adhesive composition and a silicone pressure-sensitive adhesive film which can be suitably used for an image display device.
- the above-mentioned transparent adhesives for optics are roughly classified into OCA (Optical Clear Adhesive; substrateless adhesive tape) and OCR (Optical Clear Resin; liquid reactive resin), and are mainly heat-curable and UV-curable, respectively. .
- OCA Optical Clear Adhesive
- OCR Optical Clear Resin
- the ultraviolet curing type does not contain a solvent or a solvent such as water, there is an advantage that the step of removing the solvent is not required when forming the pressure-sensitive adhesive layer, and heating is not required.
- OCA Optical Clear Adhesive
- OCR Optical Clear Resin
- UV-curable liquid reactive resin
- Patent Document 1 JP-A-2006-104296, JP-A-2009-242786.
- acrylic pressure-sensitive adhesives have a large shrinkage at the time of curing, and the internal stress may cause, for example, deformation of the liquid crystal display panel to cause display defects, and the panel has high brightness and high definition. It has become a major issue in recent years, which is becoming larger.
- acrylic pressure-sensitive adhesives are significantly reduced in transparency and yellowing at high temperatures compared with silicone-based pressure-sensitive adhesives, and elastic modulus fluctuates significantly due to temperature change, they are peeled off from liquid crystal display panels, polarizing plates, etc. It also has the problem of being easy to do.
- Patent Document 3 Japanese Patent No. 58257308
- Patent Document 4 Japanese Patent No. 2631098
- Patent Document 5 Japanese Patent No. 59894107 proposes an ultraviolet-curable silicone resin composition in which linear and branched organopolysiloxanes having a specific (meth) acryloxy group are combined, but polycarbonate (PC) Tack on plastic films used in displays such as) and polymethyl methacrylate (PMMA) has not been evaluated.
- PC polycarbonate
- PMMA polymethyl methacrylate
- the present invention has been made in view of the above circumstances, and it is an ultraviolet curable silicone pressure sensitive adhesive composition which cures rapidly by ultraviolet irradiation and has good adhesion to a sheet-like substrate such as a plastic film, and silicone adhesion It aims to provide a film.
- SiO present inventors have made intensive studies to achieve the above object, R 1 3 SiO 1/2 units (R 1 is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms) and An organopolysiloxane resin having 4/2 units as an essential unit, an organopolysiloxane having a specific viscosity and an average of 1 to 4 specific (meth) acryloxy groups in one molecule, and the following general formula (C) as a reactive diluent
- a low molecular weight (low viscosity) organopolysiloxane having one acryloxyalkyl group shown in 3) in one molecule in combination at a specific compounding ratio, it is rapidly cured by ultraviolet irradiation, and plastic It has been found that an ultraviolet-curable silicone pressure-sensitive adhesive composition having good adhesion to a sheet-like substrate such as a film can be obtained, and the present invention has been achieved.
- the present invention provides the following UV curable silicone pressure sensitive adhesive composition and silicone pressure sensitive adhesive film.
- A (a) R 1 3 SiO 1/2 units (wherein, R 1 is unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms) and (b) SiO 4/2 units 30 to 70 parts by mass of organopolysiloxane resin having an essential unit and a molar ratio of (a) unit to (b) unit in the range of 0.6: 1 to 1.2: 1,
- B The following general formula (1) and / or the following general formula (2) as a monovalent substituent bonded to a silicon atom in a molecule
- R 2 is a hydrogen atom or a methyl group
- a is an integer of 1 to 3.
- the broken line indicates a bond, which is bonded to a silicon atom) (In the formula, R 2 and a are the same as above. The broken line indicates a bond, which is bonded to a silicon atom.) Wherein the viscosity at 25 ° C.
- a reactive diluent comprising an organo (poly) siloxane having a viscosity of 1 to 50 mPa ⁇ s at 25 ° C., containing one group per molecule, at one molecular chain end or molecular chain side chain: 1 to 40 parts by mass (provided that the total of the components (A) to (C) is 100 parts by mass) What is claimed is: 1.
- a UV curable silicone pressure sensitive adhesive composition comprising: [2]
- the component (B) has the following general formula (4) and / or (5) at both ends of the molecular chain (Wherein R 2 is a hydrogen atom or a methyl group, R 3 is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and X is an alkylene group having 2 to 6 carbon atoms A is an integer of 1 to 3 and b is 1 or 2.
- the component (C) is represented by the following general formula (7) or (8) (Wherein, R 6 to R 10 are unsubstituted or substituted monovalent hydrocarbon groups having 1 to 12 carbon atoms, a is an integer of 1 to 3. d to f are the organo (poly) siloxanes. D is an integer of 0 to 3 and e and f are 0 or 1 in a number such that the viscosity at 25 ° C.
- a silicone adhesive film comprising a substrate and an adhesive layer comprising a silicone adhesive formed on at least one surface of the substrate, wherein the adhesive layer is any one of [1] to [6].
- the silicone adhesive film which is an ultraviolet irradiation cured material of the ultraviolet curable silicone adhesive composition of description.
- the ultraviolet-curable silicone pressure-sensitive adhesive composition of the present invention has good curability even with a small amount of ultraviolet irradiation, and has good adhesion to a plastic film such as a polyester film.
- the ultraviolet-curable silicone pressure-sensitive adhesive composition of the present invention is not only excellent in oxygen inhibition resistance at the time of ultraviolet irradiation, but is a composition of low viscosity while being a non-solvent type. It is much more excellent in workability than the pressure-sensitive adhesive composition.
- the UV curable silicone pressure sensitive adhesive composition of the present invention is (A) (a) R 1 3 SiO 1/2 units (wherein, R 1 is unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms) and (b) SiO 4/2 units An organopolysiloxane resin having an essential unit and a molar ratio of (a) unit to (b) unit in the range of 0.6: 1 to 1.2: 1, (B) The following general formula (1) and / or the following general formula (2) as a monovalent substituent bonded to a silicon atom in a molecule (In the formula, R 2 is a hydrogen atom or a methyl group, a is an integer of 1 to 3.
- the broken line indicates a bond, which is bonded to a silicon atom) (In the formula, R 2 and a are the same as above. The broken line indicates a bond, which is bonded to a silicon atom.) Wherein the viscosity at 25 ° C.
- a reactive diluent comprising an organo (poly) siloxane having a viscosity of 1 to 50 mPa ⁇ s at 25 ° C., containing one group per one molecule, a molecular chain terminal or a molecular side chain, Preferably, it further comprises (D) a photoinitiator.
- [(A) component] (A) component used in the present invention is a component which imparts adhesion to the base material sheet, (a) R 1 3 SiO 1/2 units (wherein, R 1 represents a carbon number of 1 to 10 And the (b) SiO 4/2 unit is an essential unit, and the molar ratio of the (a) unit to the (b) unit is ((a): (b)) It is an organopolysiloxane resin (silicone resin) having a three-dimensional network structure in the range of 0.6: 1 to 1.2: 1.
- the monovalent hydrocarbon group having a carbon number of 1 to 10 in R 1 is preferably a carbon group having a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group etc. 2 to 6 alkyl group, vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group etc.
- an aryl group, an aralkyl group such as benzyl group having 7 to 10 carbon atoms, a chloromethyl group in which part or all of hydrogen atoms bonded to carbon atoms of these groups are substituted with a halogen atom, a bromoethyl group, trifluoro
- a halogen-substituted monovalent hydrocarbon group such as cyanoethyl group substituted with a propyl group and a cyano group, a cyano-substituted monovalent hydrocarbon group, etc.
- Rukoto can.
- (A) component (a) R 1 3 SiO 1/2 units and (M units)
- (b) the molar ratio of SiO 4/2 units (Q units) i.e., the (a) units to (b) units
- the molar ratio is 0.6 to 1.2, preferably 0.7 to 1.2.
- the adhesive strength and tackiness may be reduced as a cured product (silicone resin), and when it exceeds 1.2, the adhesive strength and the holding power may be reduced.
- R 1 SiO 3/2 unit (T unit) and / or R 1 2 SiO 2/2 unit (D unit) are the total siloxane in a molecule in total. It may be contained in a proportion of 0 to 30% by mole, particularly 0 to 20% by mole, based on the total of units (ie, the total of M units, D units, T units and Q units).
- the content of the hydroxysilyl group (silanol group) in the organopolysiloxane resin is preferably 0.01 to 0.1 mol / 100 g.
- organopolysiloxane resins can be hydrolyzable triorganosilanes (eg, triorganoalkoxysilanes, triorganochlorosilanes, etc.), and hydrolyzable silanes or siloxanes containing no R 1 group (eg, tetraalkoxysilanes, tetrachlorosilanes) , Ethyl silicate, methyl silicate, etc., and, if necessary, hydrolyzable diorganosilane and / or monoorganosilane (eg, diorganodialkoxysilane, diorganodichlorosilane, organotrialkoxysilane, organotrichlorosilane) And the like) are known materials in the art obtained by cohydrolyzing and con
- the component (A) is homogeneously mixed with the components (B) and (C) (and, optionally, the component (D) as described later).
- the composition can be used as diluted in a solvent such as heptane, but after preparation of the composition, the solvent is finally removed from the composition by means of a strip or the like to form a solventless composition.
- the 60 mass% toluene solution viscosity at 25 ° C. of the component (A) is preferably 1 to 50 mPa ⁇ s, and more preferably 3 to 30 mPa ⁇ s.
- the viscosity can be measured by a rotational viscometer (for example, BL type, BH type, BS type, cone plate type, rheometer, etc.) (the same applies hereinafter).
- the blending amount of the component (A) (blending amount in terms of solid content) is 30 to 70% by mass (based on the total mass of the components (A) to (C) including the components (B) and (C) described later) That is, it is 30 to 70 parts by mass with respect to the total 100 parts by mass of the components (A) to (C), preferably 40 to 70% by mass (also 40 to 70 parts by mass), more preferably 50 It is ⁇ 65 mass% (again, 50 ⁇ 65 mass parts).
- the blending amount of the component (A) is too large, the cohesion and tackiness may decrease due to the aggregation of the organopolysiloxane resin, and when too small, sufficient cohesion and tackiness may not be expressed.
- the component (B) used in the present invention is a base polymer constituting the main skeleton of a siloxane matrix formed by crosslinking (curing) the present composition, and is an ultraviolet curable component which is crosslinked by ultraviolet irradiation.
- a monovalent substituent attached to a silicon atom in the molecule preferably a monovalent substituent attached to a silicon atom at the end of the molecular chain, more preferably a monovalent substituent attached only to the silicon atom at the end of the molecular chain
- the following general formula (1) and / or the following general formula (2) In the formula, R 2 is a hydrogen atom or a methyl group, a is an integer of 1 to 3.
- the broken line indicates a bond, which is bonded to a silicon atom) (In the formula, R 2 and a are the same as above. The broken line indicates a bond, which is bonded to a silicon atom.)
- a linear or branched main chain consisting essentially of repeating diorganosiloxane units, having a viscosity at 25 ° C. of more than 50 mPa ⁇ s and 500,000 mPa ⁇ s or less, preferably 100 to 300,000 mPa ⁇ s And more preferably 300 to 100,000 mPa ⁇ s.
- a is 1, 2 or 3, preferably 2 or 3.
- the bonding position of the group represented by the above general formula (1) or (2) in the organopolysiloxane molecule of the component (B) is not at the end of the molecular chain, even at the molecular chain end (ie, in the middle of the molecular chain or in the molecule) (Chain side chain) or both of them, but preferably the group represented by the above general formula (1) or (2) is at both ends of the molecular chain, more preferably both ends of the molecular chain It is desirable to have only In particular, it is preferable to have a group represented by the following general formula (4) and / or (5) at both ends of the molecular chain. (Wherein R 2 and a are the same as above.
- R 3 is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and X is an alkylene group having 2 to 6 carbon atoms Yes, b is 1 or 2. The broken line indicates a bond, which is bonded to a silicon atom.
- R 3 is independently unsubstituted or substituted, preferably having 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms excluding aliphatic unsaturated groups such as alkenyl groups. It is a monovalent hydrocarbon group.
- examples of the unsubstituted monovalent hydrocarbon group include, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, hexyl group, cyclohexyl group, octyl group, 2-ethylhexyl Group, alkyl group such as decyl group, vinyl group, allyl group, propenyl group, isopropenyl group, alkenyl group such as butenyl group, phenyl group, tolyl group, xylyl group, aryl group such as naphthyl group, benzyl group, phenylethyl group Groups, aralkyl groups such as phenylpropyl group, etc.
- examples of the substituted monovalent hydrocarbon group include, for example, part or all of hydrogen atoms bonded to carbon atoms of the aforementioned unsubstit
- R 3 is preferably an alkyl group, an aryl group or a halogenated alkyl group, more preferably a methyl group, a phenyl group or a trifluoropropyl group.
- X is an alkylene group having a carbon number of 2 to 6, and specific examples thereof include ethylene group, propylene group (trimethylene group, methyl ethylene group), butylene group (tetramethylene group, methyl propylene group), hexamethylene group and the like.
- the “silicon-bonded organic group” is, for example, the same as R 3 described above, usually substituted or unsubstituted, preferably an aliphatic unsaturated group such as an alkenyl group, having a carbon number of usually 1 to 12, Preferably, 1 to 10 monovalent hydrocarbon groups and the like can be mentioned.
- Examples of the unsubstituted or substituted monovalent hydrocarbon group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group and an octyl group.
- Alkyl groups such as 2-ethylhexyl group and decyl group; cycloalkyl groups such as cyclohexyl group; alkenyl groups such as vinyl group, allyl group, propenyl group, isopropenyl group and butenyl group; phenyl group, tolyl group, xylyl group, An aryl group such as a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group, a phenylpropyl group or the like; part or all of the hydrogen atoms of these groups are substituted with a halogen atom such as a chlorine atom, a fluorine atom or a bromine atom; Chloromethyl, bromoethyl, 3-chloropropyl, 3,3,3-trifluoropropyl and the like; And Gen alkyl group, and a cyanoethyl group substituted with
- the molecular structure of the component (B) is basically a linear or branched chain whose main chain is composed of repeating diorganosiloxane units (including a linear chain having a branch in part of the main chain) It is preferably a linear diorganopolysiloxane having both molecular chain ends blocked with a group represented by the above general formula (1) or (2).
- the component (B) may be a single polymer having these molecular structures, a copolymer comprising these molecular structures, or a mixture of two or more of these polymers.
- the viscosity at 25 ° C. of the component (B) is more than 50 mPa ⁇ s and 500,000 mPa ⁇ s or less, preferably 100 to 300, because the workability of the composition and the mechanical properties of the cured product are further improved. It is 000 mPa ⁇ s, particularly preferably 300 to 100,000 mPa ⁇ s.
- the above-mentioned viscosity range usually corresponds to about 50 to 2,000, preferably about 100 to 1,100 in number average polymerization degree in the case of linear organopolysiloxane.
- the degree of polymerization (or molecular weight) can be determined, for example, as a polystyrene-equivalent number average degree of polymerization (or number average molecular weight) in gel permeation chromatography (GPC) analysis using toluene or the like as a developing solvent (following ,the same).
- GPC gel permeation chromatography
- Such component (B) include those represented by the following general formula (9). (Wherein R 3 , X and a are the same as above. R 4 and R 5 are each independently 1 to 12 carbon atoms, preferably unsubstituted or substituted, preferably excluding aliphatic unsaturated groups) 1 to 10 monovalent hydrocarbon groups, c being a number based on the viscosity of the organopolysiloxane, preferably an integer of 11 to 2,000, more preferably an integer of 20 to 1,000, and further Preferably it is an integer of 30 to 800.)
- examples of R 4 and R 5 include the same as those exemplified as the above-mentioned silicon atom-bonded organic group, and among them, an alkyl group, a cycloalkyl group, an aryl group and an aralkyl group can be mentioned. It is preferably a halogenated alkyl group, more preferably a methyl group, a phenyl group or a trifluoropropyl group.
- a diphenyl siloxane unit represented by the following formula (6).
- Me represents a methyl group
- Ph represents a phenyl group
- c1 and c2 are integers satisfying c120
- c2c1 and c1 + c2 c, respectively, preferably c2 / c is 0. 02 to 1.0, particularly 0.05 to 0.3
- the broken line indicates a bond.
- each of the dimethylsiloxane unit and the diphenyl siloxane unit in the formula is The repeating number is 0 or a positive integer which can be optionally selected within the range of 100 to 500,000 mPa ⁇ s, particularly 300 to 100,000 mPa ⁇ s, of the viscosity (25 ° C.) of the organopolysiloxane.
- the arrangement of repeating units that make up is random.
- the compounding amount of the component (B) is 1 to 40% by mass with respect to the total mass of the components (A) to (C) including the component (C) described later (ie, the total of the components (A) to (C) 1 to 40 parts by mass, preferably 5 to 30% by mass (also 5 to 30 parts by mass), and more preferably 10 to 30% by mass (also 10 to 30 parts by mass). ).
- the compounding amount of the component (B) is 40% by mass or less, it is easy to impart and adjust desired physical properties such as flexibility of a cured product obtained by curing the present composition, and if the compounding amount is too small, In some cases, the cured product can not be imparted with sufficient elasticity, and as a result, the target adhesive strength and tackiness can not be imparted.
- the component (C) used in the present invention is a component which acts as a reactive diluent in the composition, and is preferably used as a monovalent substituent bonded to a silicon atom in the molecule (preferably silicon at one end of the molecular chain).
- the present component functions as a curable sensitizer capable of sensitizing the curing reaction utilizing radical polymerization, so the present composition is cured by ultraviolet irradiation. Resistance to oxygen can be improved.
- a is the same as above.
- the broken line is a bond.
- the molecular structure of the component (C) is basically linear in which the main chain is composed of repeating diorganosiloxane units, and the molecular chain end or side chain is blocked with the group represented by the above general formula (3)
- a linear diorgano (poly) siloxane (preferably having one molecular chain end blocked with a group represented by the above general formula (3) and the other molecular chain end blocked with a triorganosilyl group) preferable.
- the component (C) may be a single polymer having these molecular structures, or a mixture of two or more of these polymers.
- the number average degree of polymerization (or the number of silicon atoms in one molecule) of the organo (poly) siloxane of the component (C) is preferably as low as about 2 to 10, particularly about 2 to 6 .
- silicon-bonded organic groups other than the group represented by the general formula (3) are, for example, unsubstituted or substituted aliphatic, such as preferably alkenyl groups.
- the saturated hydrocarbon group is generally 1 to 12, preferably 1 to 10, and the like, excluding the saturated group.
- Examples of the unsubstituted or substituted monovalent hydrocarbon group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group and an octyl group.
- Alkyl groups such as 2-ethylhexyl group and decyl group; cycloalkyl groups such as cyclohexyl group; alkenyl groups such as vinyl group, allyl group, propenyl group, isopropenyl group and butenyl group; phenyl group, tolyl group, xylyl group, An aryl group such as a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group, a phenylpropyl group or the like; part or all of the hydrogen atoms of these groups are substituted with a halogen atom such as a chlorine atom, a fluorine atom or a bromine atom; Chloromethyl, bromoethyl, 3-chloropropyl, 3,3,3-trifluoropropyl and the like; And Gen alkyl group, and a cyanoethyl group substituted with
- component (C) include those represented by the following general formulas (7) and (8).
- R 6 to R 10 are each a monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 10 carbon atoms, excluding unsubstituted or substituted, preferably aliphatic unsaturated groups.
- A is as described above
- d is an integer of 0 to 3
- e and f are 0 or 1.
- examples of R 6 to R 10 include the same ones as exemplified as the silicon-bonded organic group described above, and among them, an alkyl group, a cycloalkyl group, An aryl group, an aralkyl group and a halogenated alkyl group are preferable, and a methyl group, a phenyl group and a trifluoropropyl group are more preferable.
- the compounding amount of the component (C) is 1 to 40% by mass with respect to the total mass of the components (A) to (C) (that is, 1 to 40 parts by mass relative to a total of 100 parts by mass of the components (A) to (C)). 40 parts by mass), preferably 5 to 30% by mass (again, 5 to 30 parts by mass), more preferably 10 to 25% by mass (again, 10 to 25 parts by mass). If the amount of component (C) added is too small, not only the function as a sensitizer will be reduced, but also the viscosity of the composition will be significantly increased and the workability will be reduced.
- the amount of component (C) added is preferably about 1 to 70 parts by mass, particularly about 20 to 50 parts by mass, based on 100 parts by mass of the components (A) and (B).
- the photoinitiator which is the component (D) of the composition of the present invention is an optional component which can be blended as required, and the one which has been conventionally used for the ultraviolet curable organopolysiloxane composition is used. be able to.
- the blending amount is about 0.01 to 10% by mass, preferably 0. to 10% by mass with respect to the total mass of the composition (in particular, the total mass of the components (A) to (D)).
- the content is about 05 to 8% by mass, more preferably about 0.1 to 5% by mass. If the compounding amount of the component (D) is too small, the addition effect may not be obtained. On the other hand, if the compounding amount is too large, the cured product obtained is affected by the decomposition residue of the component (D) and becomes hardened. The physical properties of the object may deteriorate.
- the compounding amount of the component (D) is 0.01 to 15 parts by mass, preferably 0.05 to 10 parts by mass, more preferably 0 based on 100 parts by mass of the total mass of the components (A) to (C). It is desirable that the content be about .05 to 8 parts by mass, more preferably about 0.1 to 6 parts by mass.
- composition of the present invention can be added to the composition of the present invention, as needed, in a range that does not impair the effects of the present invention.
- Such components include, for example, silica-based fillers such as fumed silica that do not inhibit the ultraviolet curing reaction, silicone rubber powders, extenders such as calcium carbonate, and alkoxyorganosilanes that contribute to improvement in adhesion or adhesiveness. And adhesion promoters, heat-resistant additives, flame retardants and the like.
- composition of the present invention can be obtained by uniformly mixing (A) to (D) components and other optional components in predetermined amounts.
- the composition of the present invention depending on the ultraviolet radiation, it is effective to use an ultraviolet radiation having a wavelength of 250 to 450 nm, especially 250 to 380 nm, and an irradiation dose of 1,000 to 10,000 mJ / cm 2 And particularly preferably 2,000 to 5,000 mJ / cm 2 .
- the curing temperature may be room temperature and is usually 25 ° C. ⁇ 10 ° C.
- the cured product obtained by curing the composition of the present invention by ultraviolet irradiation (that is, a cured silicone with a surface tackiness, a silicone adhesive) has a soft rubber hardness as compared with the conventional adhesive composition. It is mentioned as a feature. That is, when the cured product of the ultraviolet-curable silicone pressure-sensitive adhesive composition of the present invention is measured using a rheometer or other viscoelasticity measuring instrument, the storage elastic modulus at 25 ° C. is 1.0 MPa or less, particularly 0.5 MPa or less It is preferable that The lower limit of the storage elastic modulus at 25 ° C. is not particularly limited, but is preferably 0.01 MPa or more, and more preferably 0.02 MPa or more.
- the ultraviolet curable silicone adhesive composition of this invention can obtain an adhesive article by coating on various base materials and making it ultraviolet-cure.
- a plastic film or glass is selected as the substrate.
- a plastic film polyethylene film, polypropylene film, polyester film, polyimide film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, polycarbonate film, polystyrene film, ethylene-vinyl acetate copolymer film, ethylene-vinyl alcohol Copolymer films, triacetyl cellulose films and the like can be mentioned.
- the thickness and type of glass is not particularly limited, and may be chemically strengthened.
- the base materials are not limited to those shown here.
- the substrate may be previously subjected to primer treatment, plasma treatment or the like.
- the coating method may be coating using a known coating method, for example, comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater, gravure coater, screen coating , Dip coating, cast coating and the like.
- the UV-curable silicone pressure-sensitive adhesive composition of the present invention is solventless, and potting is also possible as a method of producing a cured product. At this time, air bubbles may be involved when flowing into the container, but the bubbles can be removed by reduced pressure. When it is desired to take out the cured product from the container after curing, the container needs to be subjected to release treatment before pouring the composition.
- the releasing agent fluorine-based or silicone-based ones can be used.
- the UV-curable silicone pressure-sensitive adhesive composition according to the present invention can usually be used as it is, but in the case where it is necessary to improve the use conditions such as poor handleability, the range which does not impair the characteristics of the present invention It is also acceptable to add and use an organic solvent at.
- (B) Component (B-1) Four molecules of an acryloxyethyloxy group represented by the following formula (10) are contained in one molecule at both ends of the molecular chain (that is, two each at each molecular chain end), A linear diphenylsiloxane / dimethylsiloxane copolymer having a viscosity of 3,000 mPa ⁇ s, the main chain of which is a repetition of diphenylsiloxane units and dimethylsiloxane units (however, the arrangement of diphenylsiloxane units and dimethylsiloxane units in the main chain is Is random) (B-2) An acryloxymethyl group represented by the following formula (11) is contained in one molecule at each end of two molecular chains (ie, one at each molecular chain end), and the main chain is dimethylsiloxane Linear dimethylpolysiloxane having a viscosity of 100 mPa ⁇ s consisting of repeat
- C Component (C-1) (Acryloxypropyl) -pentamethyldisiloxane (viscosity: 2 mPa ⁇ s) represented by the following formula (13) (C-2) 3- (acryloxypropyl) -1,1,1,3,5,5,5-heptamethyltrisiloxane (viscosity: 6 mPa ⁇ s) represented by the following formula (14) (C-3) 3-acryloxypropyl-methyldimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-5102) (C-4) 3-acryloxypropyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-5103)
- Examples 1 to 3 Comparative Examples 1 to 3
- the components (A) to (D) were compounded and mixed as shown in Table 1, and toluene was distilled off at 100 ° C. under reduced pressure to prepare silicone adhesive compositions S1 to S6.
- the prepared silicone pressure-sensitive adhesive compositions S1 to S6 were subjected to ultraviolet light with a wavelength of 365 nm under an atmosphere in air at room temperature (25 ° C.) using an eye UV electronic controller (type UBX 0601-01) manufactured by I GRAPH Co., Ltd.
- the ultraviolet light was irradiated and hardened so that the irradiation dose would be 2,000 mJ / cm 2 .
- the compounding quantity of (A) component shows the mass part of only the solid content except a solvent.
- the silicone pressure-sensitive adhesive composition and the cured product obtained as described above were evaluated according to the following items.
- the storage elastic modulus of the cured product of the obtained silicone pressure-sensitive adhesive composition is measured with a visco-elasticity measuring device (ARES-G2 manufactured by TA Instruments) at a measurement frequency of 1.0 Hz and a swing angle ⁇ of 4.0%. The temperature was measured at 25 ⁇ 0.5 ° C. The results are shown in Table 1.
- the silicone pressure-sensitive adhesive compositions S1 to S6 are coated on a support (sheet-like substrate) made of polyethylene terephthalate (PET) resin film so that the thickness after curing becomes about 400 ⁇ m.
- the ultraviolet ray was irradiated and hardened so that the irradiation amount with ultraviolet light with a wavelength of 365 nm was 2,000 mJ / cm 2 , to prepare a pressure-sensitive adhesive sheet.
- the obtained pressure-sensitive adhesive sheet is attached to a 25 mm wide polyethylene terephthalate (PET) resin film, made one reciprocation with a 2 kg pressure roller, and left in a 23 ° C. atmosphere for 24 hours, and then 0.3 m / min. 180 ° peel force (adhesive force) was measured at a pulling speed of
- the fracture state of the test body was also evaluated (CF; cohesive failure, AF; interfacial peeling).
- Examples 1 to 3 had high adhesion to PET and good adhesion, while having a relatively low storage modulus.
- Comparative Examples 1 and 2 have a high storage elastic modulus after curing and have an adhesive force to PET, the fracture mode is interfacial peeling.
- Comparative Example 3 not only the adhesive strength to PET was low, but the fracture mode was interfacial peeling.
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Abstract
Description
〔1〕
(A)(a)R1 3SiO1/2単位(式中、R1は炭素数1~10の非置換もしくは置換の一価炭化水素基である)と(b)SiO4/2単位を必須単位とし、(b)単位に対する(a)単位のモル比が0.6:1~1.2:1の範囲にあるオルガノポリシロキサンレジン:30~70質量部、
(B)分子中のケイ素原子に結合する1価の置換基として、下記一般式(1)及び/又は下記一般式(2)
で表される基を1分子中に平均1~4個有し、主鎖がジオルガノシロキサン単位の繰返しからなる直鎖状又は分岐鎖状の、25℃での粘度が50mPa・s超500,000mPa・s以下であるオルガノポリシロキサン:1~40質量部、
(C)分子中のケイ素原子に結合する1価の置換基として、下記一般式(3)
で表される基を1分子中に1個、分子鎖末端又は分子鎖側鎖に含有する、25℃での粘度が1~50mPa・sであるオルガノ(ポリ)シロキサンからなる反応性希釈剤:1~40質量部
(但し、(A)~(C)成分の合計は100質量部である。)
を含有してなることを特徴とする紫外線硬化型シリコーン粘着剤組成物。
〔2〕
(B)成分が、分子鎖両末端に下記一般式(4)及び/又は(5)
で表される基を有するものである〔1〕記載の紫外線硬化型シリコーン粘着剤組成物。
〔3〕
(B)成分の主鎖が、下記一般式(6)
で表されるジフェニルシロキサン単位を含むジオルガノシロキサン単位の繰返しからなるものである〔1〕又は〔2〕記載の紫外線硬化型シリコーン粘着剤組成物。
〔4〕
(C)成分が、下記一般式(7)又は(8)
で表されるオルガノ(ポリ)シロキサンからなるものである〔1〕~〔3〕のいずれかに記載の紫外線硬化型シリコーン粘着剤組成物。
〔5〕
更に、(D)光開始剤を(A)~(C)成分の合計100質量部に対して0.01~15質量部含有してなるものである〔1〕~〔4〕のいずれかに記載の紫外線硬化型シリコーン粘着剤組成物。
〔6〕
硬化後の貯蔵弾性率が1.0MPa以下のシリコーン粘着剤を与えるものである〔1〕~〔5〕のいずれかに記載の紫外線硬化型シリコーン粘着剤組成物。
〔7〕
基材と、この基材の少なくとも片方の表面上に形成されたシリコーン粘着剤からなる粘着層とを備えたシリコーン粘着フィルムであって、この粘着層が〔1〕~〔6〕のいずれかに記載の紫外線硬化型シリコーン粘着剤組成物の紫外線照射硬化物であるシリコーン粘着フィルム。
〔8〕
基材がプラスチックフィルムである〔7〕記載のシリコーン粘着フィルム。
本発明の紫外線硬化型シリコーン粘着剤組成物は、
(A)(a)R1 3SiO1/2単位(式中、R1は炭素数1~10の非置換もしくは置換の一価炭化水素基である)と(b)SiO4/2単位を必須単位とし、(b)単位に対する(a)単位のモル比が0.6:1~1.2:1の範囲にあるオルガノポリシロキサンレジン、
(B)分子中のケイ素原子に結合する1価の置換基として、下記一般式(1)及び/又は下記一般式(2)
で表される基を1分子中に平均1~4個有し、主鎖がジオルガノシロキサン単位の繰返しからなる直鎖状又は分岐鎖状の、25℃での粘度が50mPa・s超500,000mPa・s以下であるオルガノポリシロキサン、
(C)分子中のケイ素原子に結合する1価の置換基として、下記一般式(3)
で表される基を1分子中に1個、分子鎖末端又は分子鎖側鎖に含有する、25℃での粘度が1~50mPa・sであるオルガノ(ポリ)シロキサンからなる反応性希釈剤、
好ましくは、更に
(D)光開始剤
を含有してなるものである。
本発明に使用される(A)成分は、シート状基材への密着力を付与する成分であり、(a)R1 3SiO1/2単位(式中、R1は炭素数1~10の非置換もしくは置換の一価炭化水素基である)と(b)SiO4/2単位を必須単位とし、(b)単位に対する(a)単位のモル比((a):(b))が0.6:1~1.2:1の範囲にある三次元網状構造のオルガノポリシロキサンレジン(シリコーンレジン)である。
かかるオルガノポリシロキサンレジンは、加水分解性のトリオルガノシラン(例えば、トリオルガノアルコキシシラン、トリオルガノクロロシランなど)、及びR1基を含まない加水分解性シランあるいはシロキサン(例えば、テトラアルコキシシラン、テトラクロロシラン、エチルシリケート、メチルシリケートなど)、並びに適宜必要に応じて加水分解性のジオルガノシラン及び/又はモノオルガノシラン(例えば、ジオルガノジアルコキシシラン、ジオルガノジクロロシラン、オルガノトリアルコキシシラン、オルガノトリクロロシランなど)を共加水分解、縮合させることによって得られる、当業界においては公知の材料である。
ここで、(A)成分の25℃における60質量%トルエン溶解粘度は、1~50mPa・sであることが好ましく、3~30mPa・sであることが好ましい。なお、本発明において、粘度は回転粘度計(例えば、BL型、BH型、BS型、コーンプレート型、レオメータ等)により測定できる(以下、同じ)。
本発明に使用される(B)成分は、本組成物を架橋(硬化)して形成されるシロキサンマトリックスの主骨格を構成するベースポリマーであり、紫外線照射により架橋する紫外線硬化性の成分であり、分子中のケイ素原子に結合する1価の置換基として(好ましくは分子鎖末端のケイ素原子に結合する1価の置換基として、より好ましくは分子鎖末端のケイ素原子のみに結合する1価の置換基として)、下記一般式(1)及び/又は下記一般式(2)
で表される基を1分子中に(好ましくは分子鎖両末端に、より好ましくは分子鎖両末端のみに)、平均1~4個、好ましくは2~4個、より好ましくは4個有し、主鎖が実質的にジオルガノシロキサン単位の繰返しからなる直鎖状又は分岐鎖状の、25℃での粘度が50mPa・s超500,000mPa・s以下、好ましくは100~300,000mPa・s、より好ましくは300~100,000mPa・sであるオルガノポリシロキサンである。
特には、下記一般式(4)及び/又は(5)で表される基を分子鎖両末端に有することが好ましい。
Xは炭素数2~6のアルキレン基であり、具体的には、エチレン基、プロピレン基(トリメチレン基、メチルエチレン基)、ブチレン基(テトラメチレン基、メチルプロピレン基)、ヘキサメチレン基等が挙げられる。
上記粘度範囲は、通常、直鎖状オルガノポリシロキサンの場合、数平均重合度で、約50~2,000、好ましくは約100~1,100程度に相当するものである。本発明において、重合度(又は分子量)は、例えば、トルエン等を展開溶媒として、ゲルパーミエーションクロマトグラフィ(GPC)分析におけるポリスチレン換算の数平均重合度(又は数平均分子量)として求めることができる(以下、同じ)。
本発明に使用される(C)成分は、組成物中において反応性希釈剤として作用する成分であり、分子中のケイ素原子に結合する1価の置換基として(好ましくは分子鎖片末端のケイ素原子のみに結合する1価の置換基として)、下記一般式(3)で示される基(アクリロキシアルキル基)を1分子中に1個、分子鎖末端又は分子鎖側鎖に(好ましくは分子鎖片末端のみに)有する、前記(B)成分との対比において比較的低分子量(低重合度、低粘度)の25℃での粘度が1~50mPa・sであるオルガノ(ポリ)シロキサンである。本成分を特定の配合割合で組成物中に含有させることで、本成分がラジカル重合を利用した硬化反応を増感できる硬化性増感剤として機能するため、本組成物を紫外線照射により硬化させる際の耐酸素阻害性を向上することができる。また、組成物の低粘度化を可能にし、更には硬化後の貯蔵弾性率を比較的低値にコントロールすることが可能となる。
なお、上記一般式(3)で示される基は、主鎖を構成するジオルガノシロキサン単位中の末端又は非末端のケイ素原子に直接結合しているもの(即ち、CH2=CH-C(=O)-O-(CH2)a-Si-)であるか、或いは、エーテル結合酸素原子を介して前記ケイ素原子に結合しているもの(CH2=CH-C(=O)-O-(CH2)a-O-Si-)であるかのいずれかの形態で分子中に含有されていることが通常であるが、特には、上記一般式(3)で示される基は直接ケイ素原子に結合したものであることが好ましい。また、(C)成分のジオルガノ(ポリ)シロキサンは、分子中にアルコキシ基等の加水分解性官能性基を含有しないものであることが好ましい。
また、(C)成分の配合量は、前記(A)成分と(B)成分の合計100質量部に対して1~70質量部、特には20~50質量部程度とすることが望ましい。
本発明の組成物の(D)成分である光開始剤は、必要に応じて配合することのできる任意成分であり、従来、紫外線硬化性オルガノポリシロキサン組成物に使用されてきたものを使用することができる。具体的には、例えば、アセトフェノン、プロピオフェノン、ベンゾフェノン、フルオレイン、ベンズアルデヒド、アンスラキノン、トリフェニルアミン、カルバゾール、3-メチルアセトフェノン、4-メチルアセトフェノン、3-ペンチルアセトフェノン、4-メトキシアセトフェノン、3-ブロモアセトフェノン、4-アリルアセトフェノン、p-ジアセチルベンゼン、3-メトキシベンゾフェノン、4-メチルベンゾフェノン、4-クロロベンゾフェノン、4,4’-ジメトキシベンゾフェノン、2,2’-ジエトキシアセトフェノン、4-クロロ-4’-ベンジルベンゾフェノン、3-クロロキサントン、3,9-ジクロロキサントン、3-クロロ-8-ノニルキサントン、ベンゾイン、ベンゾインメチルエーテル、ベンゾインブチルエーテル、ビス(4-ジメチルアミノフェニル)ケトン、ベンジルメトキシケタール、2-クロロチオキサントン、ジエチルアセトフェノン、1-ヒドロキシシクロヘキシルフェニルケトン、2-メチル-1[4-(メチルチオ)フェニル]-2-モルフォリノ-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン、1-[4-(2-ヒドロキシエトキシ)フェニル]-2-メチル-1-プロパン-1-オン、2,2-ジメトキシ-2-フェニルアセトフェノン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、シクロヘキシルフェニルケトンなどが挙げられる。
基材としては、プラスチックフィルム、ガラスが選択される。プラスチックフィルムとしては、ポリエチレンフィルム、ポリプロピレンフィルム、ポリエステルフィルム、ポリイミドフィルム、ポリ塩化ビニルフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、ポリカーボネートフィルム、ポリスチレンフィルム、エチレン-酢酸ビニル共重合体フィルム、エチレン-ビニルアルコール共重合体フィルム、トリアセチルセルロースフィルム等が挙げられる。ガラスについても、厚みや種類などについて特に制限はなく、化学強化処理などをしたものでもよい。基材について、こちらに示したものだけに制限されるものではない。
基材と粘着剤層の密着性を向上させるために、基材に予めプライマー処理、プラズマ処理等を施したものを用いてもよい。
(A-1)Me3SiO1/2単位及びSiO2単位を含有し、(Me3SiO1/2単位)/(SiO2単位)のモル比が1.15である三次元網状構造のオルガノポリシロキサンレジンの60質量%トルエン溶液(粘度:10mPa・s)
(B-1)下記式(10)で示されるアクリロキシエチルオキシ基を1分子中に4個分子鎖両末端に(即ち、それぞれの分子鎖末端に2個ずつ)有し、主鎖がジフェニルシロキサン単位とジメチルシロキサン単位の繰返しからなる粘度が3,000mPa・sの直鎖状ジフェニルシロキサン・ジメチルシロキサン共重合体(但し、主鎖中のジフェニルシロキサン単位とジメチルシロキサン単位の配列はランダムである)
(C-1)下記式(13)で示される(アクリロキシプロピル)-ペンタメチルジシロキサン(粘度:2mPa・s)
(C-4)3-アクリロキシプロピル-トリメトキシシラン(信越化学工業株式会社製KBM-5103)
(D-1)BASFジャパン株式会社製ダロキュア1173
上記(A)~(D)成分を表1の通り配合混合し、減圧下にて100℃でトルエンを留去させ、シリコーン粘着剤組成物S1~S6を調製した。調製したシリコーン粘着剤組成物S1~S6を、アイグラフィック株式会社製アイUV電子制御装置(型式UBX0601-01)を用い、室温(25℃)の空気中雰囲気下において、波長365nmの紫外光での照射量が2,000mJ/cm2となるように紫外線を照射し、硬化させた。
但し、表1において(A)成分の配合量は溶剤を除いた固形分のみの質量部を示す。
得られたシリコーン粘着剤組成物の硬化物の貯蔵弾性率を、粘弾性測定器(TAインスツルメント社製ARES-G2)により、測定周波数1.0Hz、振り角γ=4.0%、測定温度25±0.5℃にて測定した。結果を表1に示した。
ポリエチレンテレフタラート(PET)樹脂フィルムからなる支持体(シート状基材)上に、上記シリコーン粘着剤組成物S1~S6を、硬化後の厚みが400μm前後の厚さになるように塗工した後、波長365nmの紫外光での照射量が2,000mJ/cm2となるように紫外線を照射して硬化させ、粘着シートを作製した。得られた粘着シートを、25mm幅のポリエチレンテレフタラート(PET)樹脂フィルムに貼付し、2kgの圧着ローラで一往復後、23℃雰囲気下に24時間放置し、その後0.3m/min.の引張り速度で180°ピール力(粘着力)を測定した。また、試験体の破断状態についても評価した(CF;凝集破壊、AF;界面剥離)。これらの結果を表1に示した。
Claims (8)
- (A)(a)R1 3SiO1/2単位(式中、R1は炭素数1~10の非置換もしくは置換の一価炭化水素基である)と(b)SiO4/2単位を必須単位とし、(b)単位に対する(a)単位のモル比が0.6:1~1.2:1の範囲にあるオルガノポリシロキサンレジン:30~70質量部、
(B)分子中のケイ素原子に結合する1価の置換基として、下記一般式(1)及び/又は下記一般式(2)
で表される基を1分子中に平均1~4個有し、主鎖がジオルガノシロキサン単位の繰返しからなる直鎖状又は分岐鎖状の、25℃での粘度が50mPa・s超500,000mPa・s以下であるオルガノポリシロキサン:1~40質量部、
(C)分子中のケイ素原子に結合する1価の置換基として、下記一般式(3)
で表される基を1分子中に1個、分子鎖末端又は分子鎖側鎖に含有する、25℃での粘度が1~50mPa・sであるオルガノ(ポリ)シロキサンからなる反応性希釈剤:1~40質量部
(但し、(A)~(C)成分の合計は100質量部である。)
を含有してなることを特徴とする紫外線硬化型シリコーン粘着剤組成物。 - 更に、(D)光開始剤を(A)~(C)成分の合計100質量部に対して0.01~15質量部含有してなるものである請求項1~4のいずれか1項に記載の紫外線硬化型シリコーン粘着剤組成物。
- 硬化後の貯蔵弾性率が1.0MPa以下のシリコーン粘着剤を与えるものである請求項1~5のいずれか1項に記載の紫外線硬化型シリコーン粘着剤組成物。
- 基材と、この基材の少なくとも片方の表面上に形成されたシリコーン粘着剤からなる粘着層とを備えたシリコーン粘着フィルムであって、この粘着層が請求項1~6のいずれか1項に記載の紫外線硬化型シリコーン粘着剤組成物の紫外線照射硬化物であるシリコーン粘着フィルム。
- 基材がプラスチックフィルムである請求項7記載のシリコーン粘着フィルム。
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CN110799615A (zh) | 2020-02-14 |
EP3650514A4 (en) | 2021-03-31 |
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JPWO2019009026A1 (ja) | 2020-04-30 |
US11306230B2 (en) | 2022-04-19 |
JP6866925B2 (ja) | 2021-04-28 |
CN110799615B (zh) | 2022-05-24 |
KR102528182B1 (ko) | 2023-05-03 |
US20200172778A1 (en) | 2020-06-04 |
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EP3650514B1 (en) | 2024-09-18 |
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