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TW202012917A - Foreign object inspection device, exposure device, and article manufacturing method to be robust against a decrease in flatness of an inspection object - Google Patents

Foreign object inspection device, exposure device, and article manufacturing method to be robust against a decrease in flatness of an inspection object Download PDF

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TW202012917A
TW202012917A TW108130577A TW108130577A TW202012917A TW 202012917 A TW202012917 A TW 202012917A TW 108130577 A TW108130577 A TW 108130577A TW 108130577 A TW108130577 A TW 108130577A TW 202012917 A TW202012917 A TW 202012917A
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light
inspection
foreign object
unit
mask
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TW108130577A
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TWI845542B (en
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前田浩平
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日商佳能股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95676Masks, reticles, shadow masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides a foreign object inspection device that is robust against a decrease in flatness of an inspection object. A foreign object inspection device for inspecting a foreign object on an inspection surface of an object includes a light projection unit that projects an inspection light onto the inspection surface; and a light receiving unit that receives the scattered light from the foreign object generated due to the inspection light projected through the light projection unit. In the foreign object inspection device, the light projection unit and the light receiving unit are configured based on an offset position on a height range with respect to the inspection surface where the optic axis of light projection unit intersects the optic axis of light receiving unit.

Description

異物檢查裝置、曝光裝置及物品製造方法Foreign matter inspection device, exposure device and article manufacturing method

本發明涉及異物檢查裝置、曝光裝置及物品製造方法。The invention relates to a foreign object inspection device, an exposure device, and an article manufacturing method.

近年來,擔心由於用於曝光裝置的遮罩的大型化導致遮罩因自重而撓曲從而像性能劣化。於是已知一種曝光裝置,通過平面玻璃將遮罩的上側封閉來構成密閉室,檢測遮罩下表面的撓曲,基於其檢測結果調整密閉室的壓力從而校正遮罩的撓曲。In recent years, there is a concern that due to the enlargement of the mask used in the exposure device, the mask will deflect due to its own weight and the image performance will deteriorate. Therefore, an exposure apparatus is known that closes the upper side of the mask by a flat glass to form a sealed chamber, detects the deflection of the lower surface of the mask, and adjusts the pressure of the sealed chamber based on the detection result to correct the deflection of the mask.

另外,已知一種檢查物體的被檢查面上的異物的異物檢查裝置(例如專利文獻1)。在關於具有上述那樣的結構的曝光裝置進行異物檢查的情況下,不僅遮罩,上述平面玻璃也可以成為檢查的對象。 [先前技術文獻] [專利文獻]In addition, a foreign object inspection device for inspecting foreign objects on an inspection surface of an object is known (for example, Patent Document 1). When foreign object inspection is performed on an exposure apparatus having the above-described structure, not only the mask but also the above-mentioned flat glass may be the object of inspection. [Prior Technical Literature] [Patent Literature]

專利文獻1:日本特開2012-032252號公報Patent Document 1: Japanese Patent Application Publication No. 2012-032252

[發明所要解決的問題][Problems to be solved by the invention]

但是該平面玻璃一般形成得比遮罩薄,這樣的話預計平面玻璃的撓曲量比遮罩的撓曲量大。這樣的檢查對象物的大的撓曲會對異物的有無的判定的精度產生影響。However, the flat glass is generally formed to be thinner than the mask. In this case, the amount of deflection of the flat glass is expected to be greater than that of the mask. Such a large deflection of the inspection object affects the accuracy of determination of the presence or absence of foreign objects.

本發明的目的在於提供一種例如相對於檢查對象物的平坦度的下降而言強健的異物檢查裝置。 [解決問題的手段]An object of the present invention is to provide, for example, a foreign object inspection apparatus that is robust against a decrease in flatness of an inspection object. [Means for solving the problem]

根據本發明的第一方面,提供一種異物檢查裝置,其為檢查物體的被檢查面上的異物者,具有:投光部,其向前述被檢查面投射檢查光;以及受光部,其接受由於通過前述投光部投射前述檢查光而產生的來自前述異物的散射光;前述異物檢查裝置以前述投光部的光軸與前述受光部的光軸相交的點位於從前述被檢查面可取的高度範圍偏移的位置的方式配置了前述投光部和前述受光部。 [發明功效]According to a first aspect of the present invention, there is provided a foreign object inspection device, which is a foreign object on an inspection surface of an inspection object, and has: a light projection unit that projects inspection light onto the inspection surface; and a light reception unit that accepts Scattered light from the foreign object generated by projecting the inspection light by the light projection unit; the foreign object inspection device is located at a height that can be taken from the surface to be inspected at a point where the optical axis of the light projection unit and the optical axis of the light receiving unit intersect The light projecting portion and the light receiving portion are arranged in such a manner that the range is shifted. [Effect of invention]

根據本發明,例如能夠提供一種相對於檢查對象物的平坦度的下降而言強健的異物檢查裝置。According to the present invention, for example, it is possible to provide a foreign object inspection apparatus that is robust against the decrease in the flatness of the inspection object.

以下,參照附圖對本發明的實施方式詳細地進行說明。此外,以下的實施方式不過是示出了本發明的實施的具體例,本發明不限於以下的實施方式。另外,在以下的實施方式中所說明的特徵的組合的全部並非都是為了解決本發明的課題所必需者。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the following embodiments are merely specific examples showing the implementation of the present invention, and the present invention is not limited to the following embodiments. In addition, not all combinations of features described in the following embodiments are necessary for solving the problems of the present invention.

[曝光裝置] 圖1示出實施方式的曝光裝置的結構。曝光裝置為將遮罩的圖案投影於基板上而將基板曝光的裝置。遮罩5以圖案面向下而被遮罩保持件6通過真空吸附保持。在遮罩5的上方設置射出曝光光的光源1,在光源1與遮罩5之間設置照明光學系統2。在遮罩5的透射出了曝光光的一側隔著投影光學系統11配置有作為曝光的對象的基板12。從光源1射出的曝光光被照明光學系統2照射於遮罩5。形成於遮罩5的圖案的像利用曝光光經過投影光學系統11而投影於基板12上。在遮罩保持件6的下側設置檢測遮罩5的撓曲的檢測系統21。[Exposure device] FIG. 1 shows the structure of the exposure apparatus of the embodiment. The exposure device is a device that projects the pattern of the mask on the substrate and exposes the substrate. The mask 5 faces downward with the pattern and is held by the mask holder 6 by vacuum suction. A light source 1 that emits exposure light is provided above the mask 5, and an illumination optical system 2 is provided between the light source 1 and the mask 5. On the side of the mask 5 through which the exposure light is transmitted, a substrate 12 that is an object of exposure is disposed via the projection optical system 11. The exposure light emitted from the light source 1 is irradiated to the mask 5 by the illumination optical system 2. The image of the pattern formed on the mask 5 is projected onto the substrate 12 through the projection optical system 11 using the exposure light. A detection system 21 that detects the deflection of the mask 5 is provided below the mask holder 6.

檢測系統21具備斜入射型的聚焦感測器的結構、功能。從發光二極體等光源10經由投影透鏡(未圖示)相對於遮罩5的圖案面從斜方向投射檢測光。其反射光經由受光透鏡(未圖示)被光電二極體等探測器9檢測,從而檢測遮罩5的撓曲。The detection system 21 has a structure and function of an oblique incidence type focus sensor. The detection light is projected from an oblique direction with respect to the pattern surface of the mask 5 from a light source 10 such as a light emitting diode via a projection lens (not shown). The reflected light is detected by a detector 9 such as a photodiode through a light-receiving lens (not shown) to detect the deflection of the mask 5.

探測器9的檢測信號輸出側連接於運算部8。在運算部8的輸出側連接有氣壓控制部7,該氣壓控制部7經由管4連接於校正遮罩5的撓曲的氣密室13。氣密室13成為下表面側被遮罩5封閉、上表面側被平面玻璃3(玻璃板)封閉的密閉箱狀。平面玻璃3在遮罩5之上與遮罩5分離地配置,被用於界定作為用於校正遮罩5的撓曲的空間的氣密室13。平面玻璃3由於為平面板因此對曝光光不產生影響。被平面玻璃3和遮罩5隔出的空間被作為氣密室13,通過氣壓控制部7控制該氣密室內的壓力從而控制遮罩5的撓曲。氣壓控制部7基於從運算部8輸入的氣壓控制量控制氣密室13的氣壓。如此,由檢測系統21檢測遮罩5的撓曲,由運算部8進行撓曲量和校正該撓曲量的氣壓控制量的計算,由氣壓控制部7控制氣密室13的氣壓。因此,由於遮罩5的自重而產生的撓曲所導致的圖案的橫偏移、像面的彎曲、遮罩5的熱變形所導致的失真、像面彎曲等被減輕,能夠良好地進行遮罩5的圖案的投影。The detection signal output side of the probe 9 is connected to the calculation unit 8. An air pressure control unit 7 is connected to the output side of the computing unit 8. The air pressure control unit 7 is connected to the airtight chamber 13 that corrects the deflection of the mask 5 via the tube 4. The airtight chamber 13 has a closed box shape in which the lower surface side is closed by the cover 5 and the upper surface side is closed by the flat glass 3 (glass plate). The flat glass 3 is disposed above the cover 5 separately from the cover 5 and is used to define an airtight chamber 13 as a space for correcting the deflection of the cover 5. Since the flat glass 3 is a flat plate, it does not affect the exposure light. The space partitioned by the flat glass 3 and the cover 5 is used as an airtight chamber 13, and the pressure of the airtight chamber is controlled by the air pressure control unit 7 to control the deflection of the cover 5. The air pressure control unit 7 controls the air pressure of the airtight chamber 13 based on the air pressure control amount input from the calculation unit 8. In this way, the detection system 21 detects the deflection of the mask 5, the calculation unit 8 calculates the deflection amount and the air pressure control amount that corrects the deflection amount, and the air pressure control unit 7 controls the air pressure of the airtight chamber 13. Therefore, the lateral shift of the pattern due to the deflection due to the dead weight of the mask 5, the curvature of the image plane, the distortion due to the thermal deformation of the mask 5, the curvature of the image plane, etc. are alleviated, and the mask can be shielded well The projection of the pattern of the cover 5.

[異物檢查裝置] 在平面玻璃3的上下表面(尤其是上表面)、遮罩5的上表面(非圖案面)、保護遮罩5的圖案的防護膜27附著有異物時,曝光時的像性能可能會下降。因此,使用異物檢查裝置從這些部位檢測異物,在檢測出異物的情況下需要去除該異物。[Foreign Object Inspection Device] When foreign matter adheres to the upper and lower surfaces (especially the upper surface) of the flat glass 3, the upper surface (non-patterned surface) of the mask 5, and the protective film 27 that protects the pattern of the mask 5, image performance during exposure may deteriorate. Therefore, a foreign object inspection device is used to detect a foreign object from these parts, and when a foreign object is detected, the foreign object needs to be removed.

在本實施方式中,異物檢查裝置可以設置於曝光裝置內,也可以設置為曝光裝置的外部裝置。例如,如圖2所示,能夠利用曝光裝置內的異物檢查裝置50來進行平面玻璃3的異物檢查。異物檢查裝置50檢查配置於曝光裝置內的光透射性的板狀部件的表面所附著的異物。光透射性的板狀部件例如為平面玻璃3。在遮罩5和平面玻璃3被如圖2那樣配置於曝光用的遮罩載置台14上的狀態下實施平面玻璃3上的異物檢查。In this embodiment, the foreign object inspection device may be provided in the exposure device or may be provided as an external device of the exposure device. For example, as shown in FIG. 2, the foreign object inspection device of the flat glass 3 can be inspected by the foreign object inspection device 50 in the exposure device. The foreign object inspection device 50 inspects the foreign objects adhering to the surface of the light-transmitting plate-shaped member disposed in the exposure device. The light-transmitting plate-shaped member is, for example, flat glass 3. The foreign matter inspection on the flat glass 3 is performed in a state where the mask 5 and the flat glass 3 are arranged on the mask mount 14 for exposure as shown in FIG. 2.

異物檢查裝置50包括:投光部25,其向物體的被檢查面投射檢查光(照明光);以及受光部26,其接受由於通過投光部投射檢查光而產生的來自異物的散射光。投光部25可以包括:光源16,其為發光二極體(LED)等;照明透鏡17,其為從光源16出射的出射光通過者;以及平行平板玻璃24,為變更經過照明透鏡17到達被檢查面的出射光的光路的光路變更部件。光源16例如可以為發出與曝光裝置的光源1(圖1)的光相同波長的光的LED。近年來,遮罩的大型化不斷發展,為了應對這種情況,光源16也可以為在異物檢查中也在與檢查驅動方向(圖2中的Y方向)正交的方向(X方向)上配置了多列LED的線LED。另外,投光部25可以包括作為調整投光部25在Y方向上的位置的機構的調整部51。The foreign object inspection device 50 includes a light projection unit 25 that projects inspection light (illumination light) onto the inspection surface of the object, and a light receiving unit 26 that receives scattered light from foreign objects generated by the projection light projected by the light projection unit. The light projection section 25 may include: a light source 16, which is a light emitting diode (LED), etc.; an illumination lens 17, which is a passer of outgoing light emitted from the light source 16; and a parallel flat glass 24, which passes through the illumination lens 17 for modification An optical path changing member of the optical path of the emitted light on the inspection surface. The light source 16 may be, for example, an LED that emits light of the same wavelength as the light of the light source 1 (FIG. 1) of the exposure device. In recent years, the size of the mask has been continuously developed. In order to cope with this situation, the light source 16 may be arranged in a direction (X direction) orthogonal to the inspection drive direction (Y direction in FIG. 2) during foreign object inspection. Line LEDs with multiple columns of LEDs. In addition, the light projection unit 25 may include an adjustment unit 51 as a mechanism for adjusting the position of the light projection unit 25 in the Y direction.

受光部26可以包括受光透鏡18和將經過了受光透鏡18的光轉換為電信號的感測器部19。在線LED被用作投光部25的光源16的情況下,受光透鏡18可以為與之相應地在X方向上延伸的陣列透鏡。另外,受光部26可以包括作為調整受光部26在Y方向上的位置的機構的調整部52。The light receiving unit 26 may include a light receiving lens 18 and a sensor unit 19 that converts light passing through the light receiving lens 18 into an electrical signal. When the line LED is used as the light source 16 of the light projecting section 25, the light receiving lens 18 may be an array lens extending in the X direction accordingly. In addition, the light receiving unit 26 may include an adjustment unit 52 as a mechanism for adjusting the position of the light receiving unit 26 in the Y direction.

投光部25向作為物體的被檢查面的平面玻璃3上從斜方向投射檢查光。受光部26接受由於投射檢查光而產生的來自異物的散射光。在實施方式中,來自光源16的檢查光的入射角度相對於被檢查面的法線傾斜地設定。另外,受光部26的光軸(被檢查面→受光透鏡18→感測器部19)相對於被檢查面的法線傾斜地設定。The light projection unit 25 projects inspection light from an oblique direction onto the flat glass 3 as the inspection surface of the object. The light-receiving unit 26 receives scattered light from foreign matter generated by projecting inspection light. In the embodiment, the incident angle of the inspection light from the light source 16 is set obliquely with respect to the normal of the inspection surface. In addition, the optical axis of the light-receiving unit 26 (surface to be inspected → light-receiving lens 18 → sensor unit 19) is set obliquely to the normal to the surface to be inspected.

如此異物檢查裝置50被配置於平面玻璃3的上側,檢查平面玻璃3的上表面的異物。如上所述,由於為由遮罩5和平面玻璃3構成的密閉空間,在平面玻璃3的下表面附著異物的概率低,因此可以將平面玻璃3的下表面從檢查對象中排除。異物檢查裝置50為了在平面玻璃3的作為檢查的對象的全部區域實施異物檢查,能夠一邊使遮罩載置台14在Y方向上驅動一邊進行檢查。In this way, the foreign object inspection device 50 is arranged on the upper side of the flat glass 3 and inspects the foreign objects on the upper surface of the flat glass 3. As described above, since the sealed space formed by the mask 5 and the flat glass 3 has a low probability of adhering to the lower surface of the flat glass 3, the lower surface of the flat glass 3 can be excluded from the inspection object. The foreign object inspection device 50 can perform inspection while driving the mask stage 14 in the Y direction in order to perform foreign object inspection on the entire area of the flat glass 3 to be inspected.

圖3為示出設置於曝光裝置的外部的異物檢查裝置501的結構示例的圖。在圖3的示例中,遮罩5被遮罩保持件28(檢查載置台)保持,遮罩5之上的平面玻璃3被作為被檢查面。第一檢查部70具有與圖2的異物檢查裝置50同樣的結構。另外,第一檢查部70可以包括作為調整第一檢查部70在Z方向上的位置的機構的調整部53。在不是將平面玻璃3而是將遮罩5的表面作為被檢查面的情況下,能夠通過使平面玻璃3(以及形成密閉空間的其他部件)從遮罩5之上退避,利用調整部53調整第一檢查部70的Z方向的位置,來進行檢查。FIG. 3 is a diagram showing a configuration example of a foreign object inspection device 501 provided outside the exposure device. In the example of FIG. 3, the mask 5 is held by the mask holder 28 (inspection mounting table), and the flat glass 3 above the mask 5 is used as the inspection surface. The first inspection unit 70 has the same structure as the foreign object inspection device 50 of FIG. 2. In addition, the first inspection section 70 may include an adjustment section 53 as a mechanism for adjusting the position of the first inspection section 70 in the Z direction. When the surface of the mask 5 is not the flat glass 3 but the surface to be inspected, it can be adjusted by the adjustment unit 53 by withdrawing the flat glass 3 (and other components forming a closed space) from above the mask 5 The position of the first inspection unit 70 in the Z direction is used for inspection.

另外,異物檢查裝置501具有第二檢查部80,該第二檢查部80用於針對作為光透射性的板狀部件的防護膜27進行異物檢查。第二檢查部80包括投光部56和受光部57。投光部56以及受光部57分別可以為與圖2所示的異物檢查裝置50的投光部25以及受光部26同樣的結構。此外,投光部56包括作為調整投光部56在Y方向上的位置的機構的調整部58,受光部57包括作為調整受光部57在Y方向上的位置的機構的調整部59。另外,第二檢查部80可以包括作為調整第二檢查部80在Z方向上的位置的機構的調整部60。控制部C控制設置於第一檢查部70以及第二檢查部80的各個調整部。另外,控制部C具有例如包含CPU以及記憶體的處理器,也作為處理受光部26、受光部57的受光結果來進行異物的有無的判定的處理部發揮功能(此外,在圖2中也具有這樣的控制部,但是在圖2中省略了這些的圖示。)。In addition, the foreign object inspection device 501 includes a second inspection unit 80 for inspecting the foreign object against the protective film 27 that is a light-transmitting plate-shaped member. The second inspection unit 80 includes a light projecting unit 56 and a light receiving unit 57. The light projecting portion 56 and the light receiving portion 57 may have the same structure as the light projecting portion 25 and the light receiving portion 26 of the foreign object inspection device 50 shown in FIG. 2, respectively. In addition, the light projecting portion 56 includes an adjusting portion 58 as a mechanism for adjusting the position of the light projecting portion 56 in the Y direction, and the light receiving portion 57 includes an adjusting portion 59 as a mechanism for adjusting the position of the light receiving portion 57 in the Y direction. In addition, the second inspection section 80 may include an adjustment section 60 as a mechanism for adjusting the position of the second inspection section 80 in the Z direction. The control unit C controls each adjustment unit provided in the first inspection unit 70 and the second inspection unit 80. In addition, the control unit C includes, for example, a processor including a CPU and a memory, and also functions as a processing unit that processes the light-receiving results of the light-receiving unit 26 and the light-receiving unit 57 to determine the presence or absence of foreign matter (in addition, FIG. 2 also has Such a control unit, but these illustrations are omitted in FIG. 2 ).

根據這樣的設置於曝光裝置的外部的異物檢查裝置501,針對平面玻璃3、遮罩5的上表面(非圖案面)、防護膜27中的任意部件也能夠進行異物檢查。在圖4中,左上的圖示出了第一檢查部70針對遮罩5的上表面實施異物檢查的情形。右上的圖示出了第一檢查部70針對平面玻璃3的上表面實施異物檢查的情形。如此,控制部C控制第一檢查部70的調整部53,將第一檢查部70在Z方向上的位置調整以ΔZ示出的量,以使得能夠正確地探測來自異物的散射光。另外,遮罩保持件28構成為利用未圖示的驅動機構而能夠在Y方向上移動。因此,異物檢查裝置501為了在作為檢查的對象的全部區域中實施異物檢查,能夠一邊使遮罩保持件28在Y方向上驅動一邊進行檢查。According to such a foreign object inspection device 501 provided outside the exposure device, foreign objects can be inspected also on arbitrary components of the flat glass 3, the upper surface (non-patterned surface) of the mask 5, and the protective film 27. In FIG. 4, the upper left diagram shows a case where the first inspection section 70 performs foreign object inspection on the upper surface of the mask 5. The upper right diagram shows a case where the first inspection unit 70 performs foreign matter inspection on the upper surface of the flat glass 3. In this way, the control section C controls the adjustment section 53 of the first inspection section 70 to adjust the position of the first inspection section 70 in the Z direction by the amount indicated by ΔZ, so that the scattered light from the foreign matter can be accurately detected. In addition, the mask holder 28 is configured to be movable in the Y direction by a drive mechanism (not shown). Therefore, in order to perform the foreign object inspection in the entire area to be inspected, the foreign object inspection device 501 can perform the inspection while driving the mask holder 28 in the Y direction.

[關於投光部和受光部的配置] 以下,對圖2或者圖3的投光部25與受光部26的關係進行說明。關於圖3的投光部56與受光部57的關係也能夠進行同樣的討論。[About the arrangement of the light projecting part and the light receiving part] Hereinafter, the relationship between the light projecting section 25 and the light receiving section 26 of FIG. 2 or FIG. 3 will be described. The relationship between the light projecting unit 56 and the light receiving unit 57 in FIG. 3 can also be discussed in the same way.

如上所述,在實施方式中,來自光源16的檢查光的入射角度相對於被檢查面的法線傾斜地設定。另外,受光部26的光軸(被檢查面→受光透鏡18→感測器部19)相對於被檢查面的法線傾斜地設定。關於投光部25和受光部的配置,遵循如下等的檢查規格而決定:(1)來自被檢查面的檢查光的正反射光不入射於感測器部19;(2)閃光等雜散光不入射於感測器部19;(3)滿足異物的檢測精度。As described above, in the embodiment, the incident angle of the inspection light from the light source 16 is set obliquely with respect to the normal line of the inspection surface. In addition, the optical axis of the light-receiving unit 26 (surface to be inspected → light-receiving lens 18 → sensor unit 19) is set obliquely to the normal to the surface to be inspected. The arrangement of the light projecting portion 25 and the light receiving portion is determined in accordance with the following inspection specifications: (1) the regular reflection light of the inspection light from the inspection surface does not enter the sensor portion 19; (2) stray light such as flash light It is not incident on the sensor part 19; (3) Satisfies the detection accuracy of foreign objects.

但是LED的發光光沒有指向性而是具有配光角度分佈。因此,即使假如在LED發光面~被檢查面之間恰當地配置準直透鏡,在被檢查面上照明區域也擴展,在該區域內產生強度分佈(與配置了多列LED發光元件的方向正交的方向的強度分佈)。例如,如圖5所示,從光源向被檢查面斜入射的檢查光的強度分佈I具有在入射光軸上變得最大而在離軸方向變小的傾向。However, the light emitted by the LED has no directivity but has a light distribution angle distribution. Therefore, even if the collimating lens is properly arranged between the LED light emitting surface and the inspection surface, the illumination area on the inspection surface expands, and an intensity distribution is generated in this area (in the direction in which the rows of LED light emitting elements are arranged Intensity distribution in the direction of intersection). For example, as shown in FIG. 5, the intensity distribution I of the inspection light obliquely incident from the light source to the inspection surface tends to become largest on the incident optical axis and become smaller in the off-axis direction.

這意味著由於被檢查面的形狀不同,被檢查面上的受光部的光軸與具有強度分佈的照明區域的相對位置關係在檢查區域內變化,結果是相同大小的異物的檢查結果產生偏差。以下提出抑制這樣的檢查結果的偏差的結構。This means that due to the difference in the shape of the inspection surface, the relative positional relationship between the optical axis of the light-receiving portion on the inspection surface and the illumination area with intensity distribution changes within the inspection area, and as a result, the inspection results of foreign objects of the same size are deviated. In the following, a structure for suppressing such variations in the inspection results is proposed.

通常,與遮罩相比平面玻璃3的厚度小。理由是為了哪怕稍微抑制與重量相關的效用、成本。另外,是由於由厚度變小引起的撓曲的增加對曝光性能帶來的不利影響與遮罩相比要小。在圖4的左下示出了遮罩5的撓曲的示例,在右下示出了平面玻璃3的撓曲的示例。撓曲以虛線示出。如此,遮罩的撓曲比平面玻璃3的撓曲小,因此在檢查對象的物體為遮罩的情況下,不易受到檢查光的強度變化的影響。在圖5的示例中,在Y方向上的位置A、B、C處,被檢查面的高度(Z方向上的位置)幾乎相同。在這種情況下,在Y方向上的位置A、B、C處,受光部26的光軸分別在被檢查面上的光強度分佈的頂峰位置附近,如圖6的(A)所示,在位置A、B、C之間光強度變化小。因此,如圖6的(B)所示,針對相同大小的異物接受的光信號強度的偏差小。因而,在被檢查面上以投光部的光軸與受光部的光軸相交的方式配置投光部和受光部即可,在這種情況下,檢查光的強度、來自異物的光也變大而能夠將感測器上的信號輸出維持為高。Generally, the thickness of the flat glass 3 is smaller than that of the mask. The reason is to suppress the utility and cost related to weight even slightly. In addition, it is because the increase in the deflection caused by the decrease in thickness has a smaller adverse effect on the exposure performance than the mask. An example of the deflection of the mask 5 is shown in the lower left of FIG. 4, and an example of the deflection of the flat glass 3 is shown in the lower right. The deflection is shown in dashed lines. In this way, the deflection of the mask is smaller than the deflection of the flat glass 3. Therefore, when the object to be inspected is the mask, it is less likely to be affected by the change in the intensity of the inspection light. In the example of FIG. 5, at positions A, B, and C in the Y direction, the height of the inspected surface (position in the Z direction) is almost the same. In this case, at positions A, B, and C in the Y direction, the optical axis of the light-receiving section 26 is respectively near the peak position of the light intensity distribution on the inspection surface, as shown in FIG. 6(A), The light intensity changes little between positions A, B, and C. Therefore, as shown in (B) of FIG. 6, the variation in the intensity of the optical signal received for foreign objects of the same size is small. Therefore, it is sufficient to arrange the light projecting part and the light receiving part on the inspection surface such that the optical axis of the light projecting part and the light receiving part intersect. In this case, the intensity of the inspection light and the light from the foreign matter also change It is large enough to maintain the signal output on the sensor high.

與之相對,在平面玻璃3的情況下,由於撓曲比較大,因此容易受到檢查光的強度變化的影響。如圖7所示,在位置A處,當以位置B為基準而被檢查面的高度(Z方向上的位置)變化了Z1時,照明區域與被檢查面平行地偏移了a。同樣地,在位置C處,當以位置B為基準而被檢查面的高度(Z方向上的位置)變化了Z2時,照明區域與被檢查面平行地偏移了b。In contrast, in the case of the flat glass 3, since the deflection is relatively large, it is easily affected by the change in the intensity of the inspection light. As shown in FIG. 7, at the position A, when the height of the inspection surface (position in the Z direction) changes by Z1 based on the position B, the illumination area is shifted by a in parallel with the inspection surface. Similarly, at the position C, when the height of the inspection surface (position in the Z direction) changes by Z2 based on the location B, the illumination area is shifted by b in parallel to the inspection surface.

在檢查對象為平面玻璃3的情況下,當在被檢查面上以投光部的光軸與受光部的光軸相交的方式調整配置時,針對相同大小的異物的信號強度的偏差變大。這是因為由於投光部的光軸附近的強度變化大,因此對於被檢查面的高度變化敏感。由於照明區域與被檢查面上的撓曲(Z1、Z2)相對應地在與被檢查面平行的方向(a、b)上發生偏移,如圖8的(A)所示,在Y方向上的位置A、B、C之間被檢查面上的受光部的光軸上的照明強度敏感地變化。因此,如圖8的(B)所示,針對相同大小的異物的信號強度的偏差變大。When the inspection object is the flat glass 3, when the arrangement is adjusted on the inspection surface such that the optical axis of the light-emitting portion and the optical axis of the light-receiving portion intersect, the variation in signal intensity for foreign objects of the same size becomes larger. This is because the intensity change in the vicinity of the optical axis of the light projecting portion is large, so it is sensitive to the height change of the inspection surface. Since the illumination area shifts in the direction (a, b) parallel to the inspected surface corresponding to the deflection (Z1, Z2) on the inspected surface, as shown in (A) of FIG. 8, in the Y direction The illumination intensity on the optical axis of the light receiving section on the inspection surface between the upper positions A, B, and C changes sensitively. Therefore, as shown in (B) of FIG. 8, the variation in signal intensity for foreign objects of the same size becomes larger.

於是,在實施方式中,以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式配置投光部25和受光部26。例如,如圖9所示,以使受光部26的光軸位於在被檢查面上的從投光部25的光軸偏移了的區域中的在與被檢查面平行的方向(Y方向)上光強度的變化平緩的區域的方式,配置投光部25和受光部26。於是,如圖10的(A)所示,即使照明區域與被檢查面上的撓曲(Z1、Z2)相對應地在與被檢查面平行的方向(a、b)上發生偏移,在Y方向上的位置A、B、C之間被檢查面上的受光部的光軸上的光強度也遲鈍地(緩慢地)變化。因此,如圖10的(B)所示,針對相同大小的異物的信號強度的偏差也小。此時,照明光的強度、來自異物的光也變小,感測器上的信號輸出變低,但是只要確保不影響異物的有無的判別的信號強度即可。在調整受光部相對於照明區域的相對位置時產生的、通過感測器部檢測出的來自異物的光量的變化能夠調整光源的輸出。Therefore, in the embodiment, the light projecting unit 25 and the light receiving unit 26 are arranged so that the point where the optical axis of the light projecting unit 25 and the optical axis of the light receiving unit 26 intersect at a position offset from the height range that can be taken by the inspection surface. For example, as shown in FIG. 9, the optical axis of the light-receiving unit 26 is located in a direction (Y direction) parallel to the surface to be inspected in a region on the inspection plane that is offset from the optical axis of the light-projecting unit 25. The light projecting portion 25 and the light receiving portion 26 are arranged in a region where the change in glazing intensity is gentle. Therefore, as shown in FIG. 10(A), even if the illumination area shifts in the direction (a, b) parallel to the inspected surface corresponding to the deflection (Z1, Z2) on the inspected surface, the The light intensity on the optical axis of the light receiving portion on the inspection surface between the positions A, B, and C in the Y direction also changes slowly (slowly). Therefore, as shown in (B) of FIG. 10, the variation in signal intensity for foreign objects of the same size is also small. At this time, the intensity of the illumination light and the light from the foreign object also become smaller, and the signal output on the sensor becomes lower. However, it suffices to ensure the signal strength that does not affect the presence or absence of the foreign object. The output of the light source can be adjusted by a change in the amount of light from the foreign object detected by the sensor unit that occurs when the relative position of the light receiving unit with respect to the illumination area is adjusted.

此外,在遮罩5的情況下,當以受光部的光軸來到平面玻璃3時那樣的照明區域中的方式進行調整時,遮罩下表面的圖案在被照明時產生的繞射光可能會被受光部誤探測。對此的對策後述。In addition, in the case of the mask 5, when the optical axis of the light-receiving part comes to the illumination area as when the flat glass 3 is adjusted, the diffracted light generated when the pattern on the lower surface of the mask is illuminated may be Detected by the light receiving unit by mistake. The countermeasures to this will be described later.

投光部25與受光部26的相對位置的調整能夠使用投光部25的調整部51或受光部26的調整部52、或者這兩者來進行。圖11示出了使用投光部25的調整部51在檢查驅動方向(Y方向)上調整投光部25的示例。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部51。圖12示出了使用受光部26的調整部52在檢查驅動方向(Y方向)上調整受光部26的示例。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部52。圖13示出了使用投光部25的平行平板玻璃24調整投光部25的光軸的位置的示例。在此,如圖13所示,投光部25包括調整部24a,該調整部24a通過調整作為光路變更部件的平行平板玻璃24的旋轉角度來調整到達被檢查面的出射光的光路的變更量。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部24a。The adjustment of the relative position of the light projecting part 25 and the light receiving part 26 can be performed using the adjustment part 51 of the light projecting part 25, the adjustment part 52 of the light receiving part 26, or both. FIG. 11 shows an example in which the adjustment portion 51 using the light projection portion 25 adjusts the light projection portion 25 in the inspection driving direction (Y direction). The control unit C can control the adjustment unit 51 such that the point where the optical axis of the light projecting unit 25 and the optical axis of the light receiving unit 26 intersect at a position offset from the height range that can be taken by the inspection surface. FIG. 12 shows an example of adjusting the light receiving unit 26 in the inspection driving direction (Y direction) using the adjustment unit 52 of the light receiving unit 26. The control unit C can control the adjustment unit 52 such that the point where the optical axis of the light projecting unit 25 and the optical axis of the light receiving unit 26 intersect is at a position offset from the height range that can be taken by the inspection surface. FIG. 13 shows an example of adjusting the position of the optical axis of the light projecting section 25 using the parallel flat glass 24 of the light projecting section 25. Here, as shown in FIG. 13, the light projecting section 25 includes an adjusting section 24a that adjusts the amount of change in the optical path of the outgoing light reaching the inspection surface by adjusting the rotation angle of the parallel plate glass 24 as an optical path changing member . The control unit C can control the adjustment unit 24a such that the point where the optical axis of the light projecting unit 25 and the optical axis of the light receiving unit 26 intersect is at a position offset from the height range that can be taken by the inspection surface.

在實施方式中,控制部C根據被檢查面的平坦度(包括撓曲、凹凸形狀)控制這些調整部。例如也可以事前記錄下根據檢查對象的物體的物理特性值計算的被檢查面的平坦度、被檢查面上的光強度分佈和需要的調整量的關係,基於該關係來決定調整量。在此,被檢查面的平坦度為示出被檢查面可取的高度範圍的值即可。另外,也可以在異物檢查前,基於預先計算或實際測量到的被檢查面的平坦度和針對樣本異物檢測的信號強度的變化,決定調整量。如此,控制部C能夠基於被檢查面的平坦度與基於調整部的調整量之間的預先得到的關係,決定調整量。In the embodiment, the control section C controls these adjustment sections according to the flatness (including deflection and unevenness shape) of the surface to be inspected. For example, the relationship between the flatness of the surface to be inspected, the light intensity distribution on the surface to be inspected, and the required adjustment amount calculated from the physical characteristic values of the object to be inspected may be recorded in advance, and the adjustment amount may be determined based on the relationship. Here, the flatness of the surface to be inspected may be a value showing a range of heights that the surface to be inspected can take. In addition, before the foreign object inspection, the adjustment amount may be determined based on the pre-calculated or actually measured flatness of the inspection surface and the change in signal intensity for the sample foreign object detection. In this way, the control unit C can determine the adjustment amount based on the previously obtained relationship between the flatness of the inspection surface and the adjustment amount by the adjustment unit.

進行上述那樣的調整以使得在被檢查面上的檢查區域內,在被檢查面可取的高度範圍(包括撓曲、形狀)中,在該檢查區域內的相同大小的異物的輸出變化達到異物檢查的檢測再現性水平。即,控制部C以即使在被檢查面存在依照預計的平坦度的變形也能夠確保異物有無的判定的預定的精度的方式決定基於調整部的調整量。Adjust as described above so that in the inspection area on the inspection surface, in the desired height range (including deflection and shape) of the inspection surface, the output change of the same size foreign object in the inspection area reaches the foreign object inspection Detection reproducibility level. That is, the control unit C determines the adjustment amount by the adjustment unit so that the predetermined accuracy of the determination of the presence or absence of foreign matter can be ensured even if there is deformation according to the expected flatness on the inspection surface.

接下來,對來自遮罩圖案的繞射光的誤檢測的對策進行說明。Next, countermeasures for erroneous detection of diffracted light from the mask pattern will be described.

在曝光裝置用的遮罩形成有應被曝光的處理圖案。因此,在異物檢查裝置的檢查對象的物體為遮罩的情況下,由投光部投射檢查光從而在遮罩的圖案部產生繞射光。這樣的繞射光可能會對異物的有無的判別產生不利影響。由於圖案的種類為任意,因此為了防止在受光部發生誤探測,需要隔斷向圖案入射的檢查光。In the mask for the exposure device, a processing pattern to be exposed is formed. Therefore, when the object to be inspected by the foreign object inspection apparatus is a mask, the inspection light is projected by the light projection unit to generate diffracted light in the pattern portion of the mask. Such diffracted light may adversely affect the presence or absence of foreign objects. Since the type of pattern is arbitrary, in order to prevent erroneous detection in the light-receiving portion, it is necessary to block inspection light incident on the pattern.

於是在實施方式中,如圖14所示,在被檢查面附近配置遮擋檢查光的一部分的遮光部件35。在利用第一檢查部70檢查遮罩5的上表面時,如圖15所示,檢查光入射於遮罩5的上表面,經過折射而入射到圖案部P,源於此的繞射光可以入射到受光部26。因而在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。Therefore, in the embodiment, as shown in FIG. 14, a light blocking member 35 that blocks part of the inspection light is arranged near the inspection surface. When the upper surface of the mask 5 is inspected by the first inspection portion 70, as shown in FIG. 15, inspection light is incident on the upper surface of the shield 5, and is refracted to enter the pattern portion P, and the diffracted light from this can enter到光受部26。 The light receiving section 26. Therefore, in the embodiment, the light blocking member 35 is arranged so that the inspection light does not reach (incident) the position of the pattern.

在利用第二檢查部80檢查防護膜27時,如圖16所示,檢查光入射於防護膜面,經過折射,入射到圖案部P,源於此的繞射光可以入射到受光部56。因而在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。When the protective film 27 is inspected by the second inspection part 80, as shown in FIG. 16, the inspection light enters the surface of the protective film, undergoes refraction, and enters the pattern part P, and the diffracted light from this can enter the light receiving part 56. Therefore, in the embodiment, the light blocking member 35 is arranged so that the inspection light does not reach (incident) the position of the pattern.

另外,在利用第一檢查部70檢查平面玻璃3的上表面時,如圖17所示,檢查光入射於平面玻璃3的上表面,經過折射而出射,並入射於遮罩5的上表面,經過折射而入射到圖案部P。因此,來自圖案部P的繞射光可以入射到受光部26。因而,在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。In addition, when inspecting the upper surface of the flat glass 3 by the first inspection section 70, as shown in FIG. 17, inspection light enters the upper surface of the flat glass 3, exits through refraction, and enters the upper surface of the mask 5, After being refracted, it enters the pattern portion P. Therefore, the diffracted light from the pattern portion P can enter the light receiving portion 26. Therefore, in the embodiment, the light blocking member 35 is arranged so that the inspection light does not reach (incident) the position of the pattern.

在以上的圖15~圖17的示例中,異物檢查裝置具有調整遮光部件35的位置的遮光調整部35a。控制部C能夠以檢查光不到達圖案部P的位置的方式控制遮光調整部35a。此時,即使產生了被檢查面的變化(平坦度、姿態、形狀、撓曲、厚度),控制部C也以或是遮擋向著被檢查面上的異物的檢查光,或是反而使檢查光無法到達圖案部的方式控制遮光調整部35a。另外,控制部C與調整部調整了投光部與受光部的相對位置相應地實施基於遮光調整部35a的調整。據此,每當投光部與受光部的相對位置被調整時,遮光部件35都被配置於恰當的位置。In the above examples of FIGS. 15 to 17, the foreign object inspection device has a light-shielding adjustment portion 35 a that adjusts the position of the light-shielding member 35. The control section C can control the light-shielding adjustment section 35a so that the inspection light does not reach the position of the pattern section P. At this time, even if a change (flatness, posture, shape, deflection, thickness) of the inspection surface occurs, the control unit C may block the inspection light toward the foreign object on the inspection surface, or may instead cause the inspection light The shading adjustment part 35a is controlled so that the pattern part cannot be reached. In addition, the control unit C and the adjustment unit adjust the relative position of the light-emitting unit and the light-receiving unit to adjust the light-shielding adjustment unit 35a. According to this, each time the relative position of the light projecting portion and the light receiving portion is adjusted, the light blocking member 35 is arranged at an appropriate position.

<物品製造方法的實施方式> 本發明的實施方式的物品製造方法適用於製造例如半導體裝置等微型裝置、具有微細構造的元件、平板顯示器等物品。本實施方式的物品製造方法包括對塗敷於基板的感光劑使用上述曝光裝置而形成潛像圖案的程序(將基板曝光的程序)和將通過該程序形成了潛像圖案的基板顯影的程序。此外,該製造方法包括其他的公知的程序(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、鍵合、封裝等)。與以往的方法相比,本實施方式的物品製造方法在物品的性能、質量、生產率、生產成本中的至少一個方面有利。<Embodiment of the article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro-devices such as semiconductor devices, devices with fine structures, and flat panel displays. The article manufacturing method of the present embodiment includes a procedure for forming a latent image pattern (a procedure for exposing the substrate) to the photosensitive agent applied to the substrate using the above-mentioned exposure device, and a procedure for developing the substrate on which the latent image pattern has been formed by the procedure. In addition, the manufacturing method includes other well-known procedures (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). Compared with the conventional method, the article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

3:平面玻璃 5:遮罩 25:投光部 26:受光部 27:防護膜 50:異物檢查裝置3: flat glass 5: Mask 25: Projection Department 26: Light receiving department 27: Protective film 50: Foreign body inspection device

圖1為示出實施方式的曝光裝置的結構示例的圖。 圖2為示出設置於曝光裝置內的異物檢查裝置的結構示例的圖。 圖3為示出設置於曝光裝置的外部的異物檢查裝置的結構示例的圖。 圖4為示出圖3的異物檢查裝置的動作示例的圖。 圖5為說明在沒有被檢查面的撓曲的情況下的異物檢查的示例的圖。 圖6為說明在沒有被檢查面的撓曲的情況下的針對異物的信號強度的偏差的圖。 圖7為說明在被檢查面存在撓曲的情況下照明區域偏移的現象的圖。 圖8為說明在存在被檢查面的撓曲的情況下的針對異物的信號強度的偏差的圖。 圖9為說明實施方式的投光部和受光部的配置的示例的圖。 圖10為說明圖10的投光部和受光部的配置的、針對異物的信號強度的偏差的圖。 圖11為說明調整投光部與受光部的相對位置的示例的圖。 圖12為說明調整投光部與受光部的相對位置的示例的圖。 圖13為說明調整平行平板玻璃的示例的圖。 圖14為示出遮光部件的配置示例的圖。 圖15為示出遮光部件的配置示例的圖。 圖16為示出遮光部件的配置示例的圖。 圖17為示出遮光部件的配置示例的圖。FIG. 1 is a diagram illustrating a configuration example of an exposure apparatus of an embodiment. FIG. 2 is a diagram showing a configuration example of a foreign object inspection device provided in an exposure device. FIG. 3 is a diagram showing a configuration example of a foreign object inspection device provided outside the exposure device. FIG. 4 is a diagram illustrating an example of the operation of the foreign object inspection device of FIG. 3. 5 is a diagram illustrating an example of foreign object inspection without deflection of an inspection surface. FIG. 6 is a diagram for explaining the deviation of the signal intensity with respect to a foreign object without deflection of the inspection surface. 7 is a diagram illustrating a phenomenon in which the illumination area shifts when there is deflection on the inspection surface. FIG. 8 is a diagram for explaining the deviation of the signal intensity with respect to a foreign object when there is deflection of the inspection surface. 9 is a diagram illustrating an example of the arrangement of a light projecting section and a light receiving section according to an embodiment. FIG. 10 is a diagram illustrating the deviation of the signal intensity with respect to a foreign object in the arrangement of the light projecting portion and the light receiving portion of FIG. 10. FIG. 11 is a diagram illustrating an example of adjusting the relative positions of the light projecting portion and the light receiving portion. FIG. 12 is a diagram illustrating an example of adjusting the relative positions of the light projecting section and the light receiving section. 13 is a diagram illustrating an example of adjusting parallel flat glass. 14 is a diagram showing a configuration example of a light-shielding member. 15 is a diagram showing a configuration example of a light-shielding member. 16 is a diagram showing a configuration example of a light-shielding member. 17 is a diagram showing a configuration example of a light-shielding member.

3:平面玻璃 3: flat glass

5:遮罩 5: Mask

6:遮罩保持件 6: mask holder

14:遮罩載置台 14: Mask mounting table

16:光源 16: Light source

17:照明透鏡 17: Illumination lens

18:受光透鏡 18: light receiving lens

19:感測器部 19: Sensor Department

24:平行平板玻璃 24: parallel flat glass

25:投光部 25: Projection Department

26:受光部 26: Light receiving department

27:防護膜 27: Protective film

50:異物檢查裝置 50: Foreign body inspection device

51:調整部 51: Adjustment Department

52:調整部 52: Adjustment Department

Claims (12)

一種異物檢查裝置,其為檢查物體的被檢查面上的異物者,具有: 投光部,其向前述被檢查面投射檢查光;以及 受光部,其接受由於通過前述投光部投射前述檢查光而產生的來自前述異物的散射光; 前述異物檢查裝置以前述投光部的光軸與前述受光部的光軸相交的點位於從前述被檢查面可取的高度範圍偏移的位置的方式配置了前述投光部和前述受光部。A foreign object inspection device, which is a foreign object on an inspection surface of an inspection object, has: A light projection section which projects inspection light onto the aforementioned surface to be inspected; and A light-receiving part, which receives scattered light from the foreign matter generated by projecting the inspection light through the light-projecting part; In the foreign object inspection device, the light projection unit and the light receiving unit are arranged such that a point where the optical axis of the light projection unit and the optical axis of the light receiving unit intersect is located at a position offset from a height range that can be taken by the inspection surface. 根據申請專利範圍第1項的異物檢查裝置,其具有: 調整部,其調整前述投光部與前述受光部的相對位置;以及 控制部,其以前述投光部的光軸與前述受光部的光軸相交的點位於從前述高度範圍偏移的位置的方式控制前述調整部。The foreign matter inspection device according to item 1 of the patent application scope has: An adjusting part that adjusts the relative position of the light projecting part and the light receiving part; and The control unit controls the adjustment unit such that the point where the optical axis of the light projecting unit and the optical axis of the light receiving unit intersect is at a position offset from the height range. 根據申請專利範圍第1項的異物檢查裝置,其中, 前述投光部包括:光源;透鏡,其從前述光源出射的出射光通過;以及光路變更部件,其變更經由前述透鏡到達前述被檢查面的前述出射光的光路; 前述異物檢查裝置具有: 調整部,其通過調整前述光路變更部件的旋轉角度來調整前述光路的變更量;以及 控制部,其以前述投光部的光軸與前述受光部的光軸相交的點位於從前述高度範圍偏移的位置的方式控制前述調整部。The foreign object inspection device according to item 1 of the patent application scope, in which The light projecting section includes: a light source; a lens that passes outgoing light emitted from the light source; and an optical path changing member that changes the optical path of the outgoing light that reaches the inspection surface via the lens; The aforementioned foreign body inspection device has: An adjustment section that adjusts the amount of change in the optical path by adjusting the rotation angle of the optical path changing member; and The control unit controls the adjustment unit such that the point where the optical axis of the light projecting unit and the optical axis of the light receiving unit intersect is at a position offset from the height range. 根據申請專利範圍第2或3項的異物檢查裝置,其中,前述控制部根據前述被檢查面的平坦度控制前述調整部。The foreign object inspection device according to claim 2 or 3, wherein the control unit controls the adjustment unit based on the flatness of the inspected surface. 根據申請專利範圍第4項的異物檢查裝置,其具有處理部,該處理部處理前述受光部的受光結果而進行前述異物的有無的判定, 前述控制部以即使在前述被檢查面存在依照前述平坦度的變形也能夠確保前述判定的預定的精度的方式決定基於前述調整部的調整量。The foreign object inspection device according to item 4 of the patent application scope includes a processing unit that processes the light receiving result of the light receiving unit to determine the presence or absence of the foreign object, The control unit determines the adjustment amount based on the adjustment unit so that the predetermined accuracy of the determination can be ensured even if there is a deformation according to the flatness on the inspection surface. 根據申請專利範圍第5項的異物檢查裝置,其中,前述控制部基於前述被檢查面的平坦度與基於前述調整部的調整量之間的預先得到的關係,決定前述調整量。According to the foreign object inspection device of claim 5 of the patent application range, the control unit determines the adjustment amount based on a previously obtained relationship between the flatness of the inspected surface and the adjustment amount based on the adjustment unit. 根據申請專利範圍第2項的異物檢查裝置,其中, 前述物體為形成有圖案的曝光裝置用的遮罩, 前述異物檢查裝置還具有: 遮光部件,其遮擋前述檢查光的一部分;以及 遮光調整部,其調整前述遮光部件的位置, 前述控制部還以前述檢查光不到達前述圖案的位置的方式控制前述遮光調整部。The foreign object inspection device according to item 2 of the patent application scope, in which The aforementioned object is a mask for a patterned exposure device, The aforementioned foreign object inspection device further includes: A light blocking member that blocks a part of the aforementioned inspection light; and The shading adjustment part adjusts the position of the shading member, The control section also controls the shading adjustment section so that the inspection light does not reach the position of the pattern. 根據申請專利範圍第7項的異物檢查裝置,其中,前述控制部與對前述調整部進行的控制相應地控制前述遮光調整部。The foreign object inspection device according to item 7 of the patent application range, wherein the control section controls the shading adjustment section in accordance with the control performed on the adjustment section. 一種曝光裝置,其將遮罩的圖案投影於基板上而將前述基板曝光者, 包括根據申請專利範圍第1項的異物檢查裝置,該異物檢查裝置檢查配置於前述曝光裝置內的光透射性的板狀部件的表面所附著的異物。An exposure device that projects a mask pattern on a substrate to expose the substrate, It includes a foreign object inspection device according to item 1 of the patent application scope, which inspects foreign objects adhering to the surface of a light-transmitting plate-shaped member disposed in the exposure device. 根據申請專利範圍第9項的曝光裝置,其中,前述板狀部件包括玻璃板,前述玻璃板在前述遮罩之上與前述遮罩分離地配置,用於校正前述遮罩的撓曲。The exposure apparatus according to item 9 of the patent application range, wherein the plate-shaped member includes a glass plate, and the glass plate is disposed on the mask separately from the mask to correct the deflection of the mask. 根據申請專利範圍第9項的曝光裝置,其中,前述板狀部件包括防護膜,前述防護膜保護前述遮罩的前述圖案。The exposure apparatus according to item 9 of the patent application range, wherein the plate-shaped member includes a protective film, and the protective film protects the pattern of the mask. 一種物品製造方法,包括以下程序: 使用根據申請專利範圍第9至11項中任一項的曝光裝置將基板曝光;以及 將通過前述程序曝光的前述基板顯影; 前述物品製造方法從顯影的前述基板製造物品。An article manufacturing method, including the following procedures: Expose the substrate using the exposure device according to any one of items 9 to 11 of the patent application scope; and Developing the aforementioned substrate exposed by the aforementioned procedure; The aforementioned article manufacturing method produces articles from the developed aforementioned substrate.
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Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06235624A (en) * 1992-12-15 1994-08-23 Hitachi Ltd Inspecting method and apparatus for transparent sheet
JPH06288902A (en) * 1993-03-31 1994-10-18 Sony Corp Attenuated total reflactance type thin film evaluating device
JPH0815169A (en) * 1994-06-28 1996-01-19 Canon Inc Foreign matter inspection apparatus and manufacture of semiconductor device using the same
US7046353B2 (en) * 2001-12-04 2006-05-16 Kabushiki Kaisha Topcon Surface inspection system
JP4217692B2 (en) * 2005-04-20 2009-02-04 キヤノン株式会社 Foreign matter inspection apparatus, foreign matter inspection method, exposure apparatus, and device manufacturing method
JP4996116B2 (en) * 2006-03-20 2012-08-08 株式会社堀場製作所 Defect inspection equipment
JP4869129B2 (en) * 2007-03-30 2012-02-08 Hoya株式会社 Pattern defect inspection method
JP5078583B2 (en) * 2007-12-10 2012-11-21 インターナショナル・ビジネス・マシーンズ・コーポレーション Macro inspection device and macro inspection method
JP2011174817A (en) * 2010-02-24 2011-09-08 Canon Inc Foreign matter inspection system, exposure system, and device manufacturing method
JP5506555B2 (en) * 2010-06-11 2014-05-28 キヤノン株式会社 Foreign matter inspection apparatus, exposure apparatus using the same, and device manufacturing method
JP5520737B2 (en) 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
JP2012119512A (en) * 2010-12-01 2012-06-21 Hitachi High-Technologies Corp Substrate quality evaluation method and apparatus therefor
JP5824780B2 (en) * 2011-11-30 2015-12-02 株式会社ブイ・テクノロジー Transparent film inspection apparatus and inspection method
JP5820735B2 (en) * 2012-01-27 2015-11-24 昭和電工株式会社 Surface inspection method and surface inspection apparatus
JP5647716B2 (en) * 2013-07-24 2015-01-07 株式会社リューズ A simple telecentric lens device for micro unevenness inspection machine
JP2016057180A (en) * 2014-09-10 2016-04-21 東レエンジニアリング株式会社 Substrate inspection device
JP2016125968A (en) * 2015-01-07 2016-07-11 旭硝子株式会社 Check device and method for checking
JP6613029B2 (en) * 2015-01-16 2019-11-27 キヤノン株式会社 Foreign matter inspection apparatus, exposure apparatus, and device manufacturing method
JP7170491B2 (en) * 2018-10-12 2022-11-14 キヤノン株式会社 Foreign matter detection device, exposure device, and article manufacturing method

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