TW202012917A - Foreign object inspection device, exposure device, and article manufacturing method to be robust against a decrease in flatness of an inspection object - Google Patents
Foreign object inspection device, exposure device, and article manufacturing method to be robust against a decrease in flatness of an inspection object Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
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Abstract
Description
本發明涉及異物檢查裝置、曝光裝置及物品製造方法。The invention relates to a foreign object inspection device, an exposure device, and an article manufacturing method.
近年來,擔心由於用於曝光裝置的遮罩的大型化導致遮罩因自重而撓曲從而像性能劣化。於是已知一種曝光裝置,通過平面玻璃將遮罩的上側封閉來構成密閉室,檢測遮罩下表面的撓曲,基於其檢測結果調整密閉室的壓力從而校正遮罩的撓曲。In recent years, there is a concern that due to the enlargement of the mask used in the exposure device, the mask will deflect due to its own weight and the image performance will deteriorate. Therefore, an exposure apparatus is known that closes the upper side of the mask by a flat glass to form a sealed chamber, detects the deflection of the lower surface of the mask, and adjusts the pressure of the sealed chamber based on the detection result to correct the deflection of the mask.
另外,已知一種檢查物體的被檢查面上的異物的異物檢查裝置(例如專利文獻1)。在關於具有上述那樣的結構的曝光裝置進行異物檢查的情況下,不僅遮罩,上述平面玻璃也可以成為檢查的對象。 [先前技術文獻] [專利文獻]In addition, a foreign object inspection device for inspecting foreign objects on an inspection surface of an object is known (for example, Patent Document 1). When foreign object inspection is performed on an exposure apparatus having the above-described structure, not only the mask but also the above-mentioned flat glass may be the object of inspection. [Prior Technical Literature] [Patent Literature]
專利文獻1:日本特開2012-032252號公報Patent Document 1: Japanese Patent Application Publication No. 2012-032252
[發明所要解決的問題][Problems to be solved by the invention]
但是該平面玻璃一般形成得比遮罩薄,這樣的話預計平面玻璃的撓曲量比遮罩的撓曲量大。這樣的檢查對象物的大的撓曲會對異物的有無的判定的精度產生影響。However, the flat glass is generally formed to be thinner than the mask. In this case, the amount of deflection of the flat glass is expected to be greater than that of the mask. Such a large deflection of the inspection object affects the accuracy of determination of the presence or absence of foreign objects.
本發明的目的在於提供一種例如相對於檢查對象物的平坦度的下降而言強健的異物檢查裝置。 [解決問題的手段]An object of the present invention is to provide, for example, a foreign object inspection apparatus that is robust against a decrease in flatness of an inspection object. [Means for solving the problem]
根據本發明的第一方面,提供一種異物檢查裝置,其為檢查物體的被檢查面上的異物者,具有:投光部,其向前述被檢查面投射檢查光;以及受光部,其接受由於通過前述投光部投射前述檢查光而產生的來自前述異物的散射光;前述異物檢查裝置以前述投光部的光軸與前述受光部的光軸相交的點位於從前述被檢查面可取的高度範圍偏移的位置的方式配置了前述投光部和前述受光部。 [發明功效]According to a first aspect of the present invention, there is provided a foreign object inspection device, which is a foreign object on an inspection surface of an inspection object, and has: a light projection unit that projects inspection light onto the inspection surface; and a light reception unit that accepts Scattered light from the foreign object generated by projecting the inspection light by the light projection unit; the foreign object inspection device is located at a height that can be taken from the surface to be inspected at a point where the optical axis of the light projection unit and the optical axis of the light receiving unit intersect The light projecting portion and the light receiving portion are arranged in such a manner that the range is shifted. [Effect of invention]
根據本發明,例如能夠提供一種相對於檢查對象物的平坦度的下降而言強健的異物檢查裝置。According to the present invention, for example, it is possible to provide a foreign object inspection apparatus that is robust against the decrease in the flatness of the inspection object.
以下,參照附圖對本發明的實施方式詳細地進行說明。此外,以下的實施方式不過是示出了本發明的實施的具體例,本發明不限於以下的實施方式。另外,在以下的實施方式中所說明的特徵的組合的全部並非都是為了解決本發明的課題所必需者。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the following embodiments are merely specific examples showing the implementation of the present invention, and the present invention is not limited to the following embodiments. In addition, not all combinations of features described in the following embodiments are necessary for solving the problems of the present invention.
[曝光裝置]
圖1示出實施方式的曝光裝置的結構。曝光裝置為將遮罩的圖案投影於基板上而將基板曝光的裝置。遮罩5以圖案面向下而被遮罩保持件6通過真空吸附保持。在遮罩5的上方設置射出曝光光的光源1,在光源1與遮罩5之間設置照明光學系統2。在遮罩5的透射出了曝光光的一側隔著投影光學系統11配置有作為曝光的對象的基板12。從光源1射出的曝光光被照明光學系統2照射於遮罩5。形成於遮罩5的圖案的像利用曝光光經過投影光學系統11而投影於基板12上。在遮罩保持件6的下側設置檢測遮罩5的撓曲的檢測系統21。[Exposure device]
FIG. 1 shows the structure of the exposure apparatus of the embodiment. The exposure device is a device that projects the pattern of the mask on the substrate and exposes the substrate. The
檢測系統21具備斜入射型的聚焦感測器的結構、功能。從發光二極體等光源10經由投影透鏡(未圖示)相對於遮罩5的圖案面從斜方向投射檢測光。其反射光經由受光透鏡(未圖示)被光電二極體等探測器9檢測,從而檢測遮罩5的撓曲。The
探測器9的檢測信號輸出側連接於運算部8。在運算部8的輸出側連接有氣壓控制部7,該氣壓控制部7經由管4連接於校正遮罩5的撓曲的氣密室13。氣密室13成為下表面側被遮罩5封閉、上表面側被平面玻璃3(玻璃板)封閉的密閉箱狀。平面玻璃3在遮罩5之上與遮罩5分離地配置,被用於界定作為用於校正遮罩5的撓曲的空間的氣密室13。平面玻璃3由於為平面板因此對曝光光不產生影響。被平面玻璃3和遮罩5隔出的空間被作為氣密室13,通過氣壓控制部7控制該氣密室內的壓力從而控制遮罩5的撓曲。氣壓控制部7基於從運算部8輸入的氣壓控制量控制氣密室13的氣壓。如此,由檢測系統21檢測遮罩5的撓曲,由運算部8進行撓曲量和校正該撓曲量的氣壓控制量的計算,由氣壓控制部7控制氣密室13的氣壓。因此,由於遮罩5的自重而產生的撓曲所導致的圖案的橫偏移、像面的彎曲、遮罩5的熱變形所導致的失真、像面彎曲等被減輕,能夠良好地進行遮罩5的圖案的投影。The detection signal output side of the
[異物檢查裝置]
在平面玻璃3的上下表面(尤其是上表面)、遮罩5的上表面(非圖案面)、保護遮罩5的圖案的防護膜27附著有異物時,曝光時的像性能可能會下降。因此,使用異物檢查裝置從這些部位檢測異物,在檢測出異物的情況下需要去除該異物。[Foreign Object Inspection Device]
When foreign matter adheres to the upper and lower surfaces (especially the upper surface) of the
在本實施方式中,異物檢查裝置可以設置於曝光裝置內,也可以設置為曝光裝置的外部裝置。例如,如圖2所示,能夠利用曝光裝置內的異物檢查裝置50來進行平面玻璃3的異物檢查。異物檢查裝置50檢查配置於曝光裝置內的光透射性的板狀部件的表面所附著的異物。光透射性的板狀部件例如為平面玻璃3。在遮罩5和平面玻璃3被如圖2那樣配置於曝光用的遮罩載置台14上的狀態下實施平面玻璃3上的異物檢查。In this embodiment, the foreign object inspection device may be provided in the exposure device or may be provided as an external device of the exposure device. For example, as shown in FIG. 2, the foreign object inspection device of the
異物檢查裝置50包括:投光部25,其向物體的被檢查面投射檢查光(照明光);以及受光部26,其接受由於通過投光部投射檢查光而產生的來自異物的散射光。投光部25可以包括:光源16,其為發光二極體(LED)等;照明透鏡17,其為從光源16出射的出射光通過者;以及平行平板玻璃24,為變更經過照明透鏡17到達被檢查面的出射光的光路的光路變更部件。光源16例如可以為發出與曝光裝置的光源1(圖1)的光相同波長的光的LED。近年來,遮罩的大型化不斷發展,為了應對這種情況,光源16也可以為在異物檢查中也在與檢查驅動方向(圖2中的Y方向)正交的方向(X方向)上配置了多列LED的線LED。另外,投光部25可以包括作為調整投光部25在Y方向上的位置的機構的調整部51。The foreign
受光部26可以包括受光透鏡18和將經過了受光透鏡18的光轉換為電信號的感測器部19。在線LED被用作投光部25的光源16的情況下,受光透鏡18可以為與之相應地在X方向上延伸的陣列透鏡。另外,受光部26可以包括作為調整受光部26在Y方向上的位置的機構的調整部52。The
投光部25向作為物體的被檢查面的平面玻璃3上從斜方向投射檢查光。受光部26接受由於投射檢查光而產生的來自異物的散射光。在實施方式中,來自光源16的檢查光的入射角度相對於被檢查面的法線傾斜地設定。另外,受光部26的光軸(被檢查面→受光透鏡18→感測器部19)相對於被檢查面的法線傾斜地設定。The
如此異物檢查裝置50被配置於平面玻璃3的上側,檢查平面玻璃3的上表面的異物。如上所述,由於為由遮罩5和平面玻璃3構成的密閉空間,在平面玻璃3的下表面附著異物的概率低,因此可以將平面玻璃3的下表面從檢查對象中排除。異物檢查裝置50為了在平面玻璃3的作為檢查的對象的全部區域實施異物檢查,能夠一邊使遮罩載置台14在Y方向上驅動一邊進行檢查。In this way, the foreign
圖3為示出設置於曝光裝置的外部的異物檢查裝置501的結構示例的圖。在圖3的示例中,遮罩5被遮罩保持件28(檢查載置台)保持,遮罩5之上的平面玻璃3被作為被檢查面。第一檢查部70具有與圖2的異物檢查裝置50同樣的結構。另外,第一檢查部70可以包括作為調整第一檢查部70在Z方向上的位置的機構的調整部53。在不是將平面玻璃3而是將遮罩5的表面作為被檢查面的情況下,能夠通過使平面玻璃3(以及形成密閉空間的其他部件)從遮罩5之上退避,利用調整部53調整第一檢查部70的Z方向的位置,來進行檢查。FIG. 3 is a diagram showing a configuration example of a foreign
另外,異物檢查裝置501具有第二檢查部80,該第二檢查部80用於針對作為光透射性的板狀部件的防護膜27進行異物檢查。第二檢查部80包括投光部56和受光部57。投光部56以及受光部57分別可以為與圖2所示的異物檢查裝置50的投光部25以及受光部26同樣的結構。此外,投光部56包括作為調整投光部56在Y方向上的位置的機構的調整部58,受光部57包括作為調整受光部57在Y方向上的位置的機構的調整部59。另外,第二檢查部80可以包括作為調整第二檢查部80在Z方向上的位置的機構的調整部60。控制部C控制設置於第一檢查部70以及第二檢查部80的各個調整部。另外,控制部C具有例如包含CPU以及記憶體的處理器,也作為處理受光部26、受光部57的受光結果來進行異物的有無的判定的處理部發揮功能(此外,在圖2中也具有這樣的控制部,但是在圖2中省略了這些的圖示。)。In addition, the foreign
根據這樣的設置於曝光裝置的外部的異物檢查裝置501,針對平面玻璃3、遮罩5的上表面(非圖案面)、防護膜27中的任意部件也能夠進行異物檢查。在圖4中,左上的圖示出了第一檢查部70針對遮罩5的上表面實施異物檢查的情形。右上的圖示出了第一檢查部70針對平面玻璃3的上表面實施異物檢查的情形。如此,控制部C控制第一檢查部70的調整部53,將第一檢查部70在Z方向上的位置調整以ΔZ示出的量,以使得能夠正確地探測來自異物的散射光。另外,遮罩保持件28構成為利用未圖示的驅動機構而能夠在Y方向上移動。因此,異物檢查裝置501為了在作為檢查的對象的全部區域中實施異物檢查,能夠一邊使遮罩保持件28在Y方向上驅動一邊進行檢查。According to such a foreign
[關於投光部和受光部的配置]
以下,對圖2或者圖3的投光部25與受光部26的關係進行說明。關於圖3的投光部56與受光部57的關係也能夠進行同樣的討論。[About the arrangement of the light projecting part and the light receiving part]
Hereinafter, the relationship between the light projecting
如上所述,在實施方式中,來自光源16的檢查光的入射角度相對於被檢查面的法線傾斜地設定。另外,受光部26的光軸(被檢查面→受光透鏡18→感測器部19)相對於被檢查面的法線傾斜地設定。關於投光部25和受光部的配置,遵循如下等的檢查規格而決定:(1)來自被檢查面的檢查光的正反射光不入射於感測器部19;(2)閃光等雜散光不入射於感測器部19;(3)滿足異物的檢測精度。As described above, in the embodiment, the incident angle of the inspection light from the
但是LED的發光光沒有指向性而是具有配光角度分佈。因此,即使假如在LED發光面~被檢查面之間恰當地配置準直透鏡,在被檢查面上照明區域也擴展,在該區域內產生強度分佈(與配置了多列LED發光元件的方向正交的方向的強度分佈)。例如,如圖5所示,從光源向被檢查面斜入射的檢查光的強度分佈I具有在入射光軸上變得最大而在離軸方向變小的傾向。However, the light emitted by the LED has no directivity but has a light distribution angle distribution. Therefore, even if the collimating lens is properly arranged between the LED light emitting surface and the inspection surface, the illumination area on the inspection surface expands, and an intensity distribution is generated in this area (in the direction in which the rows of LED light emitting elements are arranged Intensity distribution in the direction of intersection). For example, as shown in FIG. 5, the intensity distribution I of the inspection light obliquely incident from the light source to the inspection surface tends to become largest on the incident optical axis and become smaller in the off-axis direction.
這意味著由於被檢查面的形狀不同,被檢查面上的受光部的光軸與具有強度分佈的照明區域的相對位置關係在檢查區域內變化,結果是相同大小的異物的檢查結果產生偏差。以下提出抑制這樣的檢查結果的偏差的結構。This means that due to the difference in the shape of the inspection surface, the relative positional relationship between the optical axis of the light-receiving portion on the inspection surface and the illumination area with intensity distribution changes within the inspection area, and as a result, the inspection results of foreign objects of the same size are deviated. In the following, a structure for suppressing such variations in the inspection results is proposed.
通常,與遮罩相比平面玻璃3的厚度小。理由是為了哪怕稍微抑制與重量相關的效用、成本。另外,是由於由厚度變小引起的撓曲的增加對曝光性能帶來的不利影響與遮罩相比要小。在圖4的左下示出了遮罩5的撓曲的示例,在右下示出了平面玻璃3的撓曲的示例。撓曲以虛線示出。如此,遮罩的撓曲比平面玻璃3的撓曲小,因此在檢查對象的物體為遮罩的情況下,不易受到檢查光的強度變化的影響。在圖5的示例中,在Y方向上的位置A、B、C處,被檢查面的高度(Z方向上的位置)幾乎相同。在這種情況下,在Y方向上的位置A、B、C處,受光部26的光軸分別在被檢查面上的光強度分佈的頂峰位置附近,如圖6的(A)所示,在位置A、B、C之間光強度變化小。因此,如圖6的(B)所示,針對相同大小的異物接受的光信號強度的偏差小。因而,在被檢查面上以投光部的光軸與受光部的光軸相交的方式配置投光部和受光部即可,在這種情況下,檢查光的強度、來自異物的光也變大而能夠將感測器上的信號輸出維持為高。Generally, the thickness of the
與之相對,在平面玻璃3的情況下,由於撓曲比較大,因此容易受到檢查光的強度變化的影響。如圖7所示,在位置A處,當以位置B為基準而被檢查面的高度(Z方向上的位置)變化了Z1時,照明區域與被檢查面平行地偏移了a。同樣地,在位置C處,當以位置B為基準而被檢查面的高度(Z方向上的位置)變化了Z2時,照明區域與被檢查面平行地偏移了b。In contrast, in the case of the
在檢查對象為平面玻璃3的情況下,當在被檢查面上以投光部的光軸與受光部的光軸相交的方式調整配置時,針對相同大小的異物的信號強度的偏差變大。這是因為由於投光部的光軸附近的強度變化大,因此對於被檢查面的高度變化敏感。由於照明區域與被檢查面上的撓曲(Z1、Z2)相對應地在與被檢查面平行的方向(a、b)上發生偏移,如圖8的(A)所示,在Y方向上的位置A、B、C之間被檢查面上的受光部的光軸上的照明強度敏感地變化。因此,如圖8的(B)所示,針對相同大小的異物的信號強度的偏差變大。When the inspection object is the
於是,在實施方式中,以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式配置投光部25和受光部26。例如,如圖9所示,以使受光部26的光軸位於在被檢查面上的從投光部25的光軸偏移了的區域中的在與被檢查面平行的方向(Y方向)上光強度的變化平緩的區域的方式,配置投光部25和受光部26。於是,如圖10的(A)所示,即使照明區域與被檢查面上的撓曲(Z1、Z2)相對應地在與被檢查面平行的方向(a、b)上發生偏移,在Y方向上的位置A、B、C之間被檢查面上的受光部的光軸上的光強度也遲鈍地(緩慢地)變化。因此,如圖10的(B)所示,針對相同大小的異物的信號強度的偏差也小。此時,照明光的強度、來自異物的光也變小,感測器上的信號輸出變低,但是只要確保不影響異物的有無的判別的信號強度即可。在調整受光部相對於照明區域的相對位置時產生的、通過感測器部檢測出的來自異物的光量的變化能夠調整光源的輸出。Therefore, in the embodiment, the
此外,在遮罩5的情況下,當以受光部的光軸來到平面玻璃3時那樣的照明區域中的方式進行調整時,遮罩下表面的圖案在被照明時產生的繞射光可能會被受光部誤探測。對此的對策後述。In addition, in the case of the
投光部25與受光部26的相對位置的調整能夠使用投光部25的調整部51或受光部26的調整部52、或者這兩者來進行。圖11示出了使用投光部25的調整部51在檢查驅動方向(Y方向)上調整投光部25的示例。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部51。圖12示出了使用受光部26的調整部52在檢查驅動方向(Y方向)上調整受光部26的示例。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部52。圖13示出了使用投光部25的平行平板玻璃24調整投光部25的光軸的位置的示例。在此,如圖13所示,投光部25包括調整部24a,該調整部24a通過調整作為光路變更部件的平行平板玻璃24的旋轉角度來調整到達被檢查面的出射光的光路的變更量。控制部C能夠以投光部25的光軸與受光部26的光軸相交的點位於從被檢查面可取的高度範圍偏移的位置的方式控制調整部24a。The adjustment of the relative position of the
在實施方式中,控制部C根據被檢查面的平坦度(包括撓曲、凹凸形狀)控制這些調整部。例如也可以事前記錄下根據檢查對象的物體的物理特性值計算的被檢查面的平坦度、被檢查面上的光強度分佈和需要的調整量的關係,基於該關係來決定調整量。在此,被檢查面的平坦度為示出被檢查面可取的高度範圍的值即可。另外,也可以在異物檢查前,基於預先計算或實際測量到的被檢查面的平坦度和針對樣本異物檢測的信號強度的變化,決定調整量。如此,控制部C能夠基於被檢查面的平坦度與基於調整部的調整量之間的預先得到的關係,決定調整量。In the embodiment, the control section C controls these adjustment sections according to the flatness (including deflection and unevenness shape) of the surface to be inspected. For example, the relationship between the flatness of the surface to be inspected, the light intensity distribution on the surface to be inspected, and the required adjustment amount calculated from the physical characteristic values of the object to be inspected may be recorded in advance, and the adjustment amount may be determined based on the relationship. Here, the flatness of the surface to be inspected may be a value showing a range of heights that the surface to be inspected can take. In addition, before the foreign object inspection, the adjustment amount may be determined based on the pre-calculated or actually measured flatness of the inspection surface and the change in signal intensity for the sample foreign object detection. In this way, the control unit C can determine the adjustment amount based on the previously obtained relationship between the flatness of the inspection surface and the adjustment amount by the adjustment unit.
進行上述那樣的調整以使得在被檢查面上的檢查區域內,在被檢查面可取的高度範圍(包括撓曲、形狀)中,在該檢查區域內的相同大小的異物的輸出變化達到異物檢查的檢測再現性水平。即,控制部C以即使在被檢查面存在依照預計的平坦度的變形也能夠確保異物有無的判定的預定的精度的方式決定基於調整部的調整量。Adjust as described above so that in the inspection area on the inspection surface, in the desired height range (including deflection and shape) of the inspection surface, the output change of the same size foreign object in the inspection area reaches the foreign object inspection Detection reproducibility level. That is, the control unit C determines the adjustment amount by the adjustment unit so that the predetermined accuracy of the determination of the presence or absence of foreign matter can be ensured even if there is deformation according to the expected flatness on the inspection surface.
接下來,對來自遮罩圖案的繞射光的誤檢測的對策進行說明。Next, countermeasures for erroneous detection of diffracted light from the mask pattern will be described.
在曝光裝置用的遮罩形成有應被曝光的處理圖案。因此,在異物檢查裝置的檢查對象的物體為遮罩的情況下,由投光部投射檢查光從而在遮罩的圖案部產生繞射光。這樣的繞射光可能會對異物的有無的判別產生不利影響。由於圖案的種類為任意,因此為了防止在受光部發生誤探測,需要隔斷向圖案入射的檢查光。In the mask for the exposure device, a processing pattern to be exposed is formed. Therefore, when the object to be inspected by the foreign object inspection apparatus is a mask, the inspection light is projected by the light projection unit to generate diffracted light in the pattern portion of the mask. Such diffracted light may adversely affect the presence or absence of foreign objects. Since the type of pattern is arbitrary, in order to prevent erroneous detection in the light-receiving portion, it is necessary to block inspection light incident on the pattern.
於是在實施方式中,如圖14所示,在被檢查面附近配置遮擋檢查光的一部分的遮光部件35。在利用第一檢查部70檢查遮罩5的上表面時,如圖15所示,檢查光入射於遮罩5的上表面,經過折射而入射到圖案部P,源於此的繞射光可以入射到受光部26。因而在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。Therefore, in the embodiment, as shown in FIG. 14, a
在利用第二檢查部80檢查防護膜27時,如圖16所示,檢查光入射於防護膜面,經過折射,入射到圖案部P,源於此的繞射光可以入射到受光部56。因而在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。When the
另外,在利用第一檢查部70檢查平面玻璃3的上表面時,如圖17所示,檢查光入射於平面玻璃3的上表面,經過折射而出射,並入射於遮罩5的上表面,經過折射而入射到圖案部P。因此,來自圖案部P的繞射光可以入射到受光部26。因而,在實施方式中,以檢查光不到達(入射)圖案的位置的方式配置遮光部件35。In addition, when inspecting the upper surface of the
在以上的圖15~圖17的示例中,異物檢查裝置具有調整遮光部件35的位置的遮光調整部35a。控制部C能夠以檢查光不到達圖案部P的位置的方式控制遮光調整部35a。此時,即使產生了被檢查面的變化(平坦度、姿態、形狀、撓曲、厚度),控制部C也以或是遮擋向著被檢查面上的異物的檢查光,或是反而使檢查光無法到達圖案部的方式控制遮光調整部35a。另外,控制部C與調整部調整了投光部與受光部的相對位置相應地實施基於遮光調整部35a的調整。據此,每當投光部與受光部的相對位置被調整時,遮光部件35都被配置於恰當的位置。In the above examples of FIGS. 15 to 17, the foreign object inspection device has a light-shielding
<物品製造方法的實施方式> 本發明的實施方式的物品製造方法適用於製造例如半導體裝置等微型裝置、具有微細構造的元件、平板顯示器等物品。本實施方式的物品製造方法包括對塗敷於基板的感光劑使用上述曝光裝置而形成潛像圖案的程序(將基板曝光的程序)和將通過該程序形成了潛像圖案的基板顯影的程序。此外,該製造方法包括其他的公知的程序(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、鍵合、封裝等)。與以往的方法相比,本實施方式的物品製造方法在物品的性能、質量、生產率、生產成本中的至少一個方面有利。<Embodiment of the article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro-devices such as semiconductor devices, devices with fine structures, and flat panel displays. The article manufacturing method of the present embodiment includes a procedure for forming a latent image pattern (a procedure for exposing the substrate) to the photosensitive agent applied to the substrate using the above-mentioned exposure device, and a procedure for developing the substrate on which the latent image pattern has been formed by the procedure. In addition, the manufacturing method includes other well-known procedures (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). Compared with the conventional method, the article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.
3:平面玻璃 5:遮罩 25:投光部 26:受光部 27:防護膜 50:異物檢查裝置3: flat glass 5: Mask 25: Projection Department 26: Light receiving department 27: Protective film 50: Foreign body inspection device
圖1為示出實施方式的曝光裝置的結構示例的圖。 圖2為示出設置於曝光裝置內的異物檢查裝置的結構示例的圖。 圖3為示出設置於曝光裝置的外部的異物檢查裝置的結構示例的圖。 圖4為示出圖3的異物檢查裝置的動作示例的圖。 圖5為說明在沒有被檢查面的撓曲的情況下的異物檢查的示例的圖。 圖6為說明在沒有被檢查面的撓曲的情況下的針對異物的信號強度的偏差的圖。 圖7為說明在被檢查面存在撓曲的情況下照明區域偏移的現象的圖。 圖8為說明在存在被檢查面的撓曲的情況下的針對異物的信號強度的偏差的圖。 圖9為說明實施方式的投光部和受光部的配置的示例的圖。 圖10為說明圖10的投光部和受光部的配置的、針對異物的信號強度的偏差的圖。 圖11為說明調整投光部與受光部的相對位置的示例的圖。 圖12為說明調整投光部與受光部的相對位置的示例的圖。 圖13為說明調整平行平板玻璃的示例的圖。 圖14為示出遮光部件的配置示例的圖。 圖15為示出遮光部件的配置示例的圖。 圖16為示出遮光部件的配置示例的圖。 圖17為示出遮光部件的配置示例的圖。FIG. 1 is a diagram illustrating a configuration example of an exposure apparatus of an embodiment. FIG. 2 is a diagram showing a configuration example of a foreign object inspection device provided in an exposure device. FIG. 3 is a diagram showing a configuration example of a foreign object inspection device provided outside the exposure device. FIG. 4 is a diagram illustrating an example of the operation of the foreign object inspection device of FIG. 3. 5 is a diagram illustrating an example of foreign object inspection without deflection of an inspection surface. FIG. 6 is a diagram for explaining the deviation of the signal intensity with respect to a foreign object without deflection of the inspection surface. 7 is a diagram illustrating a phenomenon in which the illumination area shifts when there is deflection on the inspection surface. FIG. 8 is a diagram for explaining the deviation of the signal intensity with respect to a foreign object when there is deflection of the inspection surface. 9 is a diagram illustrating an example of the arrangement of a light projecting section and a light receiving section according to an embodiment. FIG. 10 is a diagram illustrating the deviation of the signal intensity with respect to a foreign object in the arrangement of the light projecting portion and the light receiving portion of FIG. 10. FIG. 11 is a diagram illustrating an example of adjusting the relative positions of the light projecting portion and the light receiving portion. FIG. 12 is a diagram illustrating an example of adjusting the relative positions of the light projecting section and the light receiving section. 13 is a diagram illustrating an example of adjusting parallel flat glass. 14 is a diagram showing a configuration example of a light-shielding member. 15 is a diagram showing a configuration example of a light-shielding member. 16 is a diagram showing a configuration example of a light-shielding member. 17 is a diagram showing a configuration example of a light-shielding member.
3:平面玻璃 3: flat glass
5:遮罩 5: Mask
6:遮罩保持件 6: mask holder
14:遮罩載置台 14: Mask mounting table
16:光源 16: Light source
17:照明透鏡 17: Illumination lens
18:受光透鏡 18: light receiving lens
19:感測器部 19: Sensor Department
24:平行平板玻璃 24: parallel flat glass
25:投光部 25: Projection Department
26:受光部 26: Light receiving department
27:防護膜 27: Protective film
50:異物檢查裝置 50: Foreign body inspection device
51:調整部 51: Adjustment Department
52:調整部 52: Adjustment Department
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JP5520737B2 (en) | 2010-07-30 | 2014-06-11 | 株式会社日立ハイテクノロジーズ | Defect inspection apparatus and defect inspection method |
JP2012119512A (en) * | 2010-12-01 | 2012-06-21 | Hitachi High-Technologies Corp | Substrate quality evaluation method and apparatus therefor |
JP5824780B2 (en) * | 2011-11-30 | 2015-12-02 | 株式会社ブイ・テクノロジー | Transparent film inspection apparatus and inspection method |
JP5820735B2 (en) * | 2012-01-27 | 2015-11-24 | 昭和電工株式会社 | Surface inspection method and surface inspection apparatus |
JP5647716B2 (en) * | 2013-07-24 | 2015-01-07 | 株式会社リューズ | A simple telecentric lens device for micro unevenness inspection machine |
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JP2016125968A (en) * | 2015-01-07 | 2016-07-11 | 旭硝子株式会社 | Check device and method for checking |
JP6613029B2 (en) * | 2015-01-16 | 2019-11-27 | キヤノン株式会社 | Foreign matter inspection apparatus, exposure apparatus, and device manufacturing method |
JP7170491B2 (en) * | 2018-10-12 | 2022-11-14 | キヤノン株式会社 | Foreign matter detection device, exposure device, and article manufacturing method |
-
2018
- 2018-09-21 JP JP2018178081A patent/JP7292842B2/en active Active
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2019
- 2019-08-27 TW TW108130577A patent/TWI845542B/en active
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CN110941138A (en) | 2020-03-31 |
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TWI845542B (en) | 2024-06-21 |
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