JP2024140523A - Foreign body inspection apparatus, exposure apparatus, and method for manufacturing article - Google Patents

Abstract

[Problem] To improve the accuracy of foreign matter inspection. [Solution] A foreign matter inspection device for inspecting a surface to be inspected for foreign matters includes a light receiving unit that receives reflected light from the illuminated foreign matter, an acquisition unit that acquires height information relating to the position of the surface to be inspected in a vertical direction perpendicular to the surface of the surface to be inspected, and a control unit that detects foreign matters on the surface to be inspected based on a measurement result obtained by the light receiving unit, and the control unit corrects the measurement result based on the height information. [Selected Figure] Figure 10

Description

The present invention relates to a foreign matter inspection device, an exposure device, and a method for manufacturing an article.

In the lithography process, which is one of the manufacturing processes for semiconductor devices and liquid crystal display devices, a circuit pattern formed on a mask using an exposure device is exposed onto a wafer or glass substrate coated with resist via a projection optical system. If a foreign object is attached to the mask, which serves as the original, the shape of the foreign object will be exposed onto the wafer or glass substrate at the same time as the circuit pattern, causing a decrease in yield. For this reason, a foreign object inspection device is installed in the exposure device, and the presence or absence of foreign objects on the original is inspected using the foreign object inspection device.

A foreign body inspection device can detect foreign bodies by projecting inspection light from a light-projecting unit onto the surface to be inspected and receiving the light reflected from foreign bodies on the surface to be inspected with a light-receiving unit. However, if the intersection of the optical axis of the light-projecting unit and the optical axis of the light-receiving unit does not coincide with the position of the surface to be inspected, the amount of light detected by the light-receiving unit will decrease. In addition, because a foreign body inspection device is a device that determines foreign bodies on the surface to be inspected based on the amount of light received by the light-receiving unit, there is a risk that foreign body inspection will not be performed correctly in the above cases.

Patent Document 1 discloses a foreign body inspection device that can measure the height of a test surface and then drive a light projector to change the irradiation position of the inspection light in the height direction relative to the test surface. This can improve the accuracy of foreign body inspection.

JP 2007-178152 A

However, the method of Patent Document 1 requires a drive mechanism to drive the light-projecting unit, which can be disadvantageous in terms of installation space. In addition, driving the light-projecting unit may lead to a decrease in throughput.

Therefore, the present invention aims to provide a foreign body inspection device that is advantageous in improving the accuracy of foreign body inspection.

To achieve the above object, a foreign body inspection device according to one aspect of the present invention is a foreign body inspection device for inspecting a surface to be inspected for foreign bodies, and includes a light receiving unit that receives reflected light from the illuminated foreign body, an acquisition unit that acquires height information relating to the position of the surface to be inspected in a vertical direction perpendicular to the surface of the surface to be inspected, and a control unit that detects foreign bodies on the surface to be inspected based on the measurement results obtained by the light receiving unit, and the control unit corrects the measurement results based on the height information.

The present invention provides a foreign body inspection device that is advantageous in improving the accuracy of foreign body inspection.

FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus. 1 is a schematic diagram showing a configuration of a foreign matter inspection device according to a first embodiment. FIG. 1 is a diagram for explaining a foreign matter inspection device having a plurality of light receiving units. This is the one-dimensional distribution of foreign particles measured by the light receiving unit. FIG. 13 is a diagram showing mapping data of foreign matter. FIG. 13 is a diagram for explaining a case where defocusing occurs. This is a one-dimensional distribution of foreign particles measured by the light receiving unit when there is defocus. 13 is a flowchart of a foreign matter inspection process. 11 is a simulation result showing the relationship between the defocus amount and the amount of light. FIG. 13 is a diagram for explaining correction of mapping data. 1 is a schematic diagram of a foreign object inspection device having a plurality of distance sensors in the x direction. 1 is a flowchart of a method for manufacturing an article. 1 is a flowchart of a method for manufacturing an article.

Below, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings. Note that in each drawing, the same reference numbers are used for the same components, and duplicated explanations will be omitted.

First Embodiment
First, the configuration of the foreign matter inspection device according to the present embodiment will be described. FIG. 1 is a diagram showing a part of the configuration of an exposure apparatus 100, and is a diagram for explaining the foreign matter inspection device according to the present embodiment. The foreign matter inspection device is a device that can inspect the presence or absence of foreign matter (dust, dirt, scratches, defects, etc.) attached to the original 7 on which a pattern is formed, a pellicle that is a film that protects the pattern surface of the original 7, and a deflection compensation member. A detailed explanation of the deflection compensation member will be given later. In the following, an example will be described in which the foreign matter inspection device is mounted on the exposure apparatus and inspects the presence or absence of foreign matter on the upper surface (inspected surface) of the deflection compensation member 6, but if the deflection compensation member 6 is not arranged, foreign matter attached to the original 7 may be inspected. That is, it is sufficient to inspect foreign matter attached to at least one of the original 7 and the deflection compensation member 6 depending on the presence or absence of the deflection compensation member 6. In this embodiment, the surface on which the original 7 is placed is defined as the xy plane, and the direction perpendicular to the xy plane is defined as the z direction.

As shown in FIG. 1, the exposure apparatus 100 has an illumination optical system 1, a deflection correction member 6, an original stage 8 that holds an original 7 on which a pattern for exposure is drawn, a projection optical system 9, and a foreign matter inspection device. Light from a light source is illuminated onto the original 7 via the illumination optical system 1, and an image of the pattern on the original 7 is transferred onto a substrate coated with a photosensitive material via the projection optical system 9. The exposure apparatus 100 may be a so-called step-and-scan type exposure apparatus that performs the above transfer while driving the original stage 8 and the substrate in the Y direction in synchronization. The exposure apparatus 100 is not limited to this, and may be a step-and-repeat type exposure apparatus.

The deflection correction member 6 is disposed on the upper surface side of the original 7, and can adjust the air pressure in the airtight chamber 5 (sealed space) between the deflection correction member 6 and the original 7. This makes it possible to correct the deflection caused by the original 7's own weight (self-weight deflection). The deflection correction member 6 can be a transparent flat plate (glass flat plate) that transmits the exposure light.

If foreign matter is attached to the deflection correction member 6 or the original 7, poor exposure resolution may occur during the exposure process of the exposure device 100. This is because part of the illumination light 23 that is irradiated from the light source onto the pattern surface of the original is blocked by the foreign matter, causing uneven illuminance.

A foreign matter inspection device is disposed near the deflection compensation member 6 to inspect for foreign matter adhering to the upper surface of the deflection compensation member 6. The foreign matter inspection device has a light receiving unit 20 including a light receiving element 3 and a lens 4, a photoelectric conversion unit 21, and a control unit 40. The foreign matter inspection device may have its own light source for foreign matter inspection, or may use an exposure light source of an exposure device as a light source for foreign matter inspection. Furthermore, foreign matter inspection may be performed in parallel with an exposure process in which the substrate is exposed to light, or the exposure process and foreign matter inspection may be performed at different times.

The following describes how the foreign body inspection device performs foreign body inspection. Inspection light emitted from the light source illuminates the inspection area of the deflection compensation member 6, and illuminates any foreign bodies present in the inspection area. At this time, reflected light from the foreign body is received (detected) by the light receiving element 3 via the lens 4 configured in the light receiving unit 2. The reflected light may be scattered light from the foreign body.

The photoelectric conversion unit 21 converts the light received by the light receiving unit 2 into an electrical signal. The signal generated by the photoelectric conversion unit 21 is input to the control unit 40.

The control unit 40 determines whether the input signal (i.e., the signal indicating the amount of light received by the light receiving unit 2) is within the tolerance, and if it is within the tolerance, determines that a foreign object is present in the inspection area. Specifically, it can determine from the input signal which area in the inspection area the foreign object is located in and how large it is. Here, the relationship between signal strength and foreign object size can be recorded in the control unit 40 as an actual measurement result or a simulation prior to foreign object inspection.

If the control unit 40 detects a foreign object, it may interrupt the exposure process and automatically transition to a process of removing the foreign object. Alternatively, the exposure process in progress may be continued, and the process of removing the foreign object may be executed when the exposed substrate is transported to the next process. Furthermore, if the control unit 40 detects a foreign object, it may notify the user that a foreign object is present in the inspection area.

In FIG. 1, an example of foreign matter inspection is illustrated in which the original is mounted on the original stage of the exposure device, but this is not limiting. For example, the foreign matter inspection device in this embodiment may inspect the original or the deflection correction member for foreign matter before the original is mounted on the original stage. For example, when the original is removed from a stocker that can accommodate multiple originals, foreign matter inspection may be performed by a foreign matter inspection device provided near the exit of the stocker. In terms of space, it may be difficult to provide a driving mechanism for the components that constitute the foreign matter inspection device near the exit of the stocker. In this embodiment, as described later, the accuracy of the foreign matter inspection device can be improved without providing a driving mechanism for the light projecting unit, the light receiving unit, and the stage that holds the original. Therefore, this embodiment may be advantageous when the foreign matter inspection device is placed in a location with limited space as described above.

Figure 2 is a schematic diagram of a foreign matter inspection device 200 in this embodiment. The foreign matter inspection device 200 may further include a light projection unit 10 that projects inspection light onto the inspection surface 11. The foreign matter inspection device 200 may further include a distance sensor 30 (acquisition unit). The inspection surface 11 may be the surface of an original or the top surface of a deflection correction member.

The light receiving unit 20 is arranged at an angle so that it can receive reflected light from the area where the light projecting unit 10 projects the inspection light. In other words, it can be arranged so that the intersection of the optical axis of the light projecting unit and the optical axis of the light receiving unit does not deviate significantly from the intersection with the surface to be inspected 11. The inspection light from the light projecting unit 10 can be emitted at an angle to the vertical direction perpendicular to the surface to be inspected 11. The light reflected or scattered from the foreign matter P on the surface to be inspected is arranged to be incident on the light receiving unit 20. The light projecting unit 10 preferably uses an LED having the same wavelength as the exposure light. The light receiving unit 20 can include a line sensor. The light projecting unit 10 and the light receiving unit 20 do not have to be arranged one-to-one, and as shown in FIG. 3, there may be one light projecting unit 10 and multiple light receiving units 20 (for example, two).

The control unit 40 converts the measurement results obtained by the light receiving unit 20 into information about foreign matter as described above. For example, if the voltage value measured by the light receiving unit 20 is small, it is determined that a small foreign matter exists, and if the voltage value measured by the light receiving unit 20 is large, it is determined that a large foreign matter exists. In addition, the control unit 40 may output the number of foreign matters existing in one dimension measured by the light receiving unit 20 and the distribution of the size of the foreign matter as shown in FIG. 4. The control unit 40 may classify the size of the foreign matter based on the voltage value and multiple threshold values set. Note that the leftmost peak in the distribution in FIG. 4 is noise (dark noise) that is not a foreign matter. In addition, as shown in FIG. 5, based on the results measured by the light receiving unit 20, it may output mapping data in which information about foreign matters on the test surface 11 is mapped in two dimensions. The user can grasp the foreign matter information on the test surface 11 by checking the mapping data.

The control unit 40 stores the voltage value (design value) related to dark noise and can identify dark noise. This allows the control unit 40 to suppress the influence of dark noise by performing filter correction on the dark noise voltage value obtained from the light receiving unit 20. Dark noise is a voltage value outside the inspection target area of the test surface 11. For example, it is a measurement result that is reflected by structures around the inspection target, such as a frame that holds a deflection correction member or a tray that stores an original, and is measured by the light receiving unit.

The distance sensor 30 measures the distance from the distance sensor 30 to the test surface 11 in a vertical direction (z direction) perpendicular to the surface of the test surface, and measures the position of the test surface 11 in the z direction (obtains height information related to the position of the test surface 11). The distance sensor can also obtain deflection information indicating the magnitude of deflection of the test surface 11 by obtaining height information of a wide area of the test surface. The distance sensor 30 can be configured in the same housing as the light projecting unit 10 and the light receiving unit 20. The distance sensor 30 is also fixedly disposed relative to the light projecting unit 10 and the light receiving unit 20, and the above measurement is synonymous with measuring the distance from the light projecting unit 10 to the test surface 11 and the distance from the light receiving unit 20 to the test surface 11.

The distance sensor 30 can measure the surface 11 to be inspected, for example, in a non-contact manner using a laser. Here, the laser spot diameter is about 1 to 2 mm, and the diameter of any foreign matter present on the surface to be inspected is a maximum of about 500 μm. Because the laser spot diameter is large compared to the diameter of the foreign matter, the presence or absence of a foreign matter does not significantly change the detection results of the height information, and this does not pose a major problem in measuring the height information.

The height information acquired by the distance sensor 30 is used to correct the measurement results by the light receiving unit 20 as described below, so it is preferable that the distance sensor 30 and the light receiving unit 20 perform measurements at the same time. It is preferable that the distance sensor 30 measures the point where the optical axis of the light projecting unit 10 and the optical axis of the light receiving unit 20 intersect, or a position in the vicinity of that point. In other words, it is preferable to measure the z-direction position of an area that includes at least a part of the area on the test surface 11 where the light receiving unit 20 receives reflected light from a foreign object. If the distance sensor 30 and the light receiving unit 20 perform measurements at different times, this may be disadvantageous in terms of measurement accuracy.

The distance sensor 30 may measure the surface 11 to be inspected, for example, by a contact method. However, if a contact method is used, it is difficult to have the distance sensor 30 and the light receiving unit 20 measure at the same time, and processing is required such as first measuring with the distance sensor 30 and then measuring with the light receiving unit 20. Therefore, in terms of measurement accuracy, a non-contact method may be more advantageous.

As shown in FIG. 6, in the foreign matter inspection device 200, when the intersection between the optical axis of the light projector 10 and the optical axis of the light receiver 20 is shifted in the z-direction with respect to the surface 11 to be inspected (when in a defocused state), the amount of light detected by the light receiver 20 decreases. At this time, as the amount of defocus increases, the amount of light detected decreases. This can lead to erroneous judgments in foreign matter inspection. FIG. 7 shows the distribution of the number of foreign matters present in one dimension and their sizes measured by the light receiver 20 as in FIG. 4 in a defocused state. As shown in FIG. 7, when there is a defocus, the voltage values detected overall become smaller, and the foreign matters are judged to be small.

In addition, when the test surface 11 is bent, the defocus state is different between a first position in the z direction in the first region of the test surface 11 and a second position in the z direction in the second region of the test surface 11 (the positions in the z direction are different). In such a case, the relationship between the voltage value obtained by the light receiving unit 20 and the size of the foreign object is different between the first region and the second region, so accurate foreign object determination cannot be performed. In addition, when the test surface is defocused, the position where the foreign object actually exists on the test surface may differ from the position where the voltage value has a peak in the mapping data.

In this embodiment, the distance sensor 30 acquires height information of the test surface 11, and the measurement results obtained by the light receiving unit 20 are corrected based on the height information. This makes it possible to reduce erroneous foreign object determinations even when the intersection between the optical axis of the light projecting unit 10 and the optical axis of the light receiving unit 20 is shifted in the z direction relative to the test surface 11, or when the test surface 11 is warped.

As a comparative example, there is a method in which height information of the test surface 11 is acquired by the distance sensor 30, and then the test surface 11, the light projecting unit 10, the light receiving unit 20, etc. are driven, for example, in the z direction to prevent a defocused state from occurring. However, the comparative example requires a drive mechanism for driving in the z direction, which may be disadvantageous in terms of space, etc. Furthermore, if the test surface 11 is warped, the drive mechanism must be controlled with high precision in response to the warp, and it may be difficult to perform foreign body inspection with high measurement accuracy. In this embodiment, it is possible to improve the measurement accuracy compared to the comparative example without using a drive mechanism.

The processing of the control unit 40 in this embodiment will now be described. FIG. 8 is a flowchart of the foreign body inspection processing in this embodiment. In step S101, the light receiving unit 20 receives reflected light from the illuminated foreign body, and the light receiving unit 20 outputs the measurement result to the control unit. Also in step S101, the distance sensor 30 acquires height information, and the distance sensor 30 outputs the height information to the control unit.

In step S102, it is determined whether or not there is defocus based on the height information acquired in step S101. The control unit 40 preliminarily stores the height position of the test surface 11 that serves as a reference value, and calculates the difference between the reference value and the measured value. Then, for example, if the difference is within a predetermined standard, it is determined that there is no defocus, and the process proceeds to step S104. If it is outside the predetermined standard, it is determined that there is defocus, and the process proceeds to step S103. Note that step S102 may be omitted, and in the correction stage of step S103, if there is no defocus, the correction value may be set to 0.

In step S103, the measurement results measured by the light receiving unit 20 are corrected based on the height information measured by the distance sensor 30. Details of the correction will be described later. In step S104, the measurement results are output as two-dimensional mapping data. Alternatively, the results of the foreign body inspection are output in a format that allows the user to understand them (images, audio, device stop, etc.).

In step S103, the height information may be deflection information related to the deflection of the test surface 11, where the height differs between the first position and the second position of the test surface 11. The measurement result measured by the light receiving unit 20 may be corrected based on the deflection information measured by the distance sensor 30. That is, first height information related to the first position in the z direction of the first region and second height information related to the second position in the z direction of the second region may be acquired in step S101. Then, the measurement result at the first position and the measurement result at the second position may be corrected by different correction amounts.

Next, the correction of the measurement result in step S103 will be described in detail. The control unit 40 holds a table in advance that indicates the relationship between the defocus amount of the test surface and the amount of light obtained by the light receiving unit 20. The table is obtained by prior simulation, experiment, etc. FIG. 9 is a table showing the relationship between the defocus amount of the test surface and the amount of light obtained by the light receiving unit 20, obtained by prior simulation. FIG. 9(a) is a table when a foreign object of 200 μm is on the test surface, and FIG. 9(b) is a table when a foreign object of 80 μm is on the test surface. By holding a table such as that shown in FIG. 9 in advance, the control unit can accurately correct the measurement result of the light receiving unit 20. Then, the control unit 40 corrects the measurement result of the light receiving unit 20 based on the difference (defocus amount) in the z direction between the intersection point of the optical axis of the light projecting unit 10 and the optical axis of the light receiving unit 20 and the position of the test surface.

Before step S103, the control unit 40 may output mapping data in which information about foreign objects on the test surface 11 is mapped two-dimensionally based on the measurement results of the light receiving unit 20. Then, the control unit 40 may correct the mapping data based on the height information measured in step S101. FIG. 10 is a diagram showing the mapping data before and after correction. The peak value of the mapping data before correction was 5, but the peak value of the mapping data after correction has been corrected to 8. This correction may be generated by performing pattern matching on the inspection results for the detected foreign object to detect the foreign object, and performing filtering processing such as a high-pass emphasis filter on the image of the detected foreign object.

In addition, the correction may involve processing the distribution including the peak value of the mapping data based on the height information so that the distribution becomes steeper, as shown in FIG. 10. "Correction to make the distribution steeper" may involve at least one of processing to increase the peak value of the distribution and decreasing values in the vicinity of the peak value of the distribution. In the example of FIG. 10, the peak value is increased from 5 to 8, and the values in the vicinity of the peak value (adjacent pixels) are decreased from 3 to 1.

In addition, in the correction, a distribution including the peak values of the mapping data may be processed based on height information so that the peak values are shifted. This is because there is a risk that the detection position of the foreign object may be deceived and shifted due to defocus. The control unit 40 can perform the correction in step S103 by storing in advance the relationship between defocus and the shift in the amount of light. The correction to cause the shift may be performed in combination with the above-mentioned correction to make the shift steeper. In addition, when it is not necessary to perform a correction to cause the shift to be steeper (for example, when the size of the foreign object is large), only the shift correction may be performed without performing the correction to cause the shift to be steeper.

In this embodiment, multiple distance sensors 30 may be provided, and multiple positions on the test surface 11 in the z direction in three or more areas may be measured in parallel. Measuring in parallel means that at least a portion of two or more measurements are performed at overlapping times. Figure 11 shows an example in which three distance sensors 30a to 30c are arranged in the x direction.

Figure 11(a) is a front view seen from the x direction, and Figure 11(b) is a top view seen from the z direction. The control unit 40 can calculate the pitch angle or roll angle of the test surface 11 based on multiple positions (z positions) where the distance sensors 30a to 30c are arranged, and correct the measurement results of the light receiving unit 20 based on the pitch angle or roll angle. By arranging multiple distance sensors 30 in the x direction, the height position in the x direction can also be taken into account, making it possible to correct the measurement results with higher accuracy.

As described above, in this embodiment, foreign matter determination can be performed with high accuracy even when the intersection of the optical axis of the light-projecting unit 10 and the optical axis of the light-receiving unit 20 is shifted in the z-direction relative to the test surface 11, or when the test surface 11 is warped. In addition, since there is no need to provide a driving mechanism for driving each unit, it is possible to provide a foreign matter inspection device that is advantageous in terms of installation space and cost.

Second Embodiment
In the first embodiment, an example in which the distance sensor 30 is configured as an acquisition unit that acquires height information of the test surface 11 has been described. In the present embodiment, an example in which the distance sensor 30 is not configured will be described. Note that the configuration of the foreign matter inspection device other than the acquisition unit is similar to that of the first embodiment, and therefore description thereof will be omitted. Also, matters not mentioned in this embodiment follow the first embodiment.

Figure 12 is a schematic diagram showing the configuration of a foreign matter inspection apparatus 200' in this embodiment. The foreign matter inspection apparatus 200' has a receiving unit 30' (acquisition unit) that receives (acquires) information about the position of the test surface 11 in the z direction (height information) from a device other than the foreign matter inspection apparatus 200'. The receiving unit 30' can be connected to the device other than the foreign matter inspection apparatus 200' via a wired or wireless network. Alternatively, it can be configured to acquire contents input from a user interface (e.g., a console in an exposure apparatus). The receiving unit 30' may be configured as an integrated unit as the control unit 40.

The height information may be acquired by the receiver 30' each time a foreign body inspection is performed, or may be acquired at a specific frequency. For example, if the test surface has a specific deflection each time, the height information does not need to be acquired frequently.

<Embodiments of a method for manufacturing an article>
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. FIG. 13 is a flowchart of the method for manufacturing an article according to the present embodiment. The method for manufacturing an article according to the present embodiment includes a step of performing a foreign matter inspection on an original using the foreign matter inspection device according to the above embodiment (inspection step, step S11). In addition, the method for manufacturing an article according to the present embodiment includes a step of transferring an image of the inspected original onto a substrate (forming a latent image pattern on a photosensitive material applied to the substrate) to obtain an exposed substrate (exposure step, step S12). In addition, the method for manufacturing an article according to the present embodiment includes a step of developing the substrate exposed in the above step to obtain a developed substrate (development step, step S13). Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S14). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and variations are possible within the scope of the gist of the present invention. The scope of application of the present invention may be, for example, foreign matter inspection devices for substrate processing devices such as semiconductor manufacturing devices (film formation devices, sputtering devices, annealing devices, inspection devices, etc.), organic electroluminescence deposition devices, imprint devices, and planarization devices.

The disclosure of this specification includes at least the following foreign matter inspection apparatus, exposure apparatus, and article manufacturing method.

(Item 1)
A foreign matter inspection device for inspecting a foreign matter on a test surface, comprising:
a light receiving unit that receives light reflected from the illuminated foreign object;
an acquisition unit that acquires height information regarding a position of the test surface in a vertical direction perpendicular to a surface of the test surface;
a control unit that detects foreign matter on the test surface based on a measurement result obtained by the light receiving unit,
The foreign body inspection apparatus according to claim 1, wherein the control unit corrects the measurement result based on the height information.

(Item 2)
2. The foreign body inspection apparatus according to item 1, wherein the acquisition unit is a distance sensor that measures the position of the test surface in the vertical direction.

(Item 3)
3. The foreign body inspection device according to claim 2, wherein the distance sensor measures the surface to be inspected in a non-contact manner.

(Item 4)
4. The foreign body inspection device according to item 3, wherein the distance sensor measures the vertical position of an area on the test surface that includes at least a portion of an area where the light receiving unit receives the reflected light from the foreign body.

(Item 5)
3. The foreign body inspection device according to item 2, wherein the distance sensor measures the surface to be inspected by a contact method.

(Item 6)
2. The foreign matter inspection apparatus according to item 1, wherein the acquisition unit acquires information regarding the position of the test surface in the vertical direction from a device different from the foreign matter inspection apparatus.

(Item 7)
The acquisition unit acquires deflection information indicating a magnitude of deflection of the test surface,
7. The foreign body inspection apparatus according to any one of items 1 to 6, wherein the control unit corrects the measurement result based on the deflection information.

(Item 8)
The acquisition unit is
first height information relating to a first position in the vertical direction of a first region of the test surface;
and acquiring second height information relating to a second position in the vertical direction of the second region of the test surface, the second position being different from the first position;
8. The foreign body inspection apparatus according to claim 1, wherein the control unit corrects the measurement result at the first position and the measurement result at the second position with different correction amounts.

(Item 9)
The foreign body inspection device described in any one of items 1 to 8, characterized in that the control unit stores a table indicating a relationship between the height information and the amount of light received by the light receiving unit, and corrects the measurement result based on the table.

(Item 10)
10. The foreign body inspection device according to any one of items 1 to 9, wherein the control unit stores a design value of dark noise detected by the light receiving unit and discriminates the dark noise.

(Item 11)
A light projecting unit that projects an inspection light onto the foreign object,
11. The foreign body inspection device according to any one of items 1 to 10, wherein the control unit corrects the measurement result based on a difference between an intersection point between an optical axis of the light projecting unit and an optical axis of the light receiving unit and a position of the test surface.

(Item 12)
12. The foreign matter inspection device according to any one of items 1 to 11, wherein the control unit outputs mapping data in which information regarding foreign matters on the test surface is two-dimensionally mapped based on the measurement results.

(Item 13)
13. The foreign body inspection apparatus according to item 12, wherein the control unit corrects the mapping data based on the height information.

(Item 14)
14. The foreign body inspection apparatus according to item 13, wherein the control unit corrects a distribution including a peak value of the mapping data based on the height information so that the distribution becomes steeper.

(Item 15)
15. The foreign body inspection apparatus according to item 13 or 14, wherein the control unit corrects a distribution including a peak value of the mapping data based on the height information so that the peak value is shifted.

(Item 16)
16. The foreign body inspection device according to any one of items 12 to 15, wherein the control unit performs pattern matching on the mapping data based on the height information, and performs filter processing on an image of the foreign body detected by the pattern matching.

(Item 17)
The distance sensor measures a plurality of positions of the test surface in the vertical direction in three or more areas;
3. The foreign body inspection apparatus according to item 2, wherein the control unit calculates a pitch angle or a roll angle of the surface to be inspected based on the multiple positions, and corrects the measurement result based on the pitch angle or the roll angle.

(Item 18)
A foreign body inspection device according to any one of items 1 to 17,
a projection optical system that projects an image of the pattern of the original onto the substrate;
The foreign matter inspection device is an exposure apparatus that inspects the original for foreign matters.

(Item 19)
an exposure step of exposing a substrate using the exposure apparatus according to item 18 to obtain an exposed substrate;
a developing step of developing the exposed substrate to obtain a developed substrate,
A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

11: Test surface 20: Light receiving unit 30: Distance sensor (acquisition unit)
30' Receiving unit (acquiring unit)
40 Control unit 200 Foreign body inspection device P Foreign body

Claims (19)

A foreign matter inspection device for inspecting a foreign matter on a test surface, comprising:
a light receiving unit that receives light reflected from the illuminated foreign object;
an acquisition unit that acquires height information regarding a position of the test surface in a vertical direction perpendicular to a surface of the test surface;
a control unit that detects foreign matter on the test surface based on a measurement result obtained by the light receiving unit,
The foreign body inspection apparatus according to claim 1, wherein the control unit corrects the measurement result based on the height information. The foreign body inspection device according to claim 1, characterized in that the acquisition unit is a distance sensor that measures the position of the test surface in the vertical direction. The foreign body inspection device according to claim 2, characterized in that the distance sensor measures the surface to be inspected in a non-contact manner. The foreign body inspection device according to claim 3, characterized in that the distance sensor measures the vertical position of an area on the test surface that includes at least a portion of the area where the light receiving unit receives the reflected light from the foreign body. The foreign body inspection device according to claim 2, characterized in that the distance sensor measures the surface to be inspected by a contact method. The foreign matter inspection device according to claim 1, characterized in that the acquisition unit acquires information regarding the position of the test surface in the vertical direction from a device other than the foreign matter inspection device. The acquisition unit acquires deflection information indicating a magnitude of deflection of the test surface,
2. The foreign matter inspection apparatus according to claim 1, wherein the control unit corrects the measurement result based on the deflection information. The acquisition unit is
first height information relating to a first position in the vertical direction of a first region of the test surface;
and acquiring second height information relating to a second position in the vertical direction of the second region of the test surface, the second position being different from the first position;
2. The foreign matter inspection apparatus according to claim 1, wherein the control unit corrects the measurement result at the first position and the measurement result at the second position with different correction amounts. The foreign body inspection device according to claim 1, characterized in that the control unit stores a table showing the relationship between the height information and the amount of light received by the light receiving unit, and corrects the measurement results based on the table. The foreign body inspection device according to claim 1, characterized in that the control unit stores a design value of the dark noise detected by the light receiving unit and distinguishes the dark noise. A light projecting unit that projects an inspection light onto the foreign object,
2. The foreign body inspection device according to claim 1, wherein the control unit corrects the measurement result based on a difference between an intersection point between an optical axis of the light projecting unit and an optical axis of the light receiving unit and a position of the inspection surface. The foreign matter inspection device according to claim 1, characterized in that the control unit outputs mapping data in which information about foreign matters on the test surface is two-dimensionally mapped based on the measurement results. The foreign body inspection device according to claim 12, characterized in that the control unit corrects the mapping data based on the height information. The foreign body inspection device according to claim 13, characterized in that the control unit corrects the distribution including the peak value of the mapping data based on the height information so that the distribution becomes steeper. The foreign body inspection device according to claim 13, characterized in that the control unit corrects a distribution including a peak value of the mapping data based on the height information so that the peak value is shifted. The foreign body inspection device according to claim 12, characterized in that the control unit performs pattern matching on the mapping data based on the height information, and performs filtering on the image of the foreign body detected by the pattern matching. The distance sensor measures a plurality of positions of the test surface in the vertical direction in three or more areas;
3. The foreign body inspection device according to claim 2, wherein the control unit calculates a pitch angle or a roll angle of the surface to be inspected based on the plurality of positions, and corrects the measurement result based on the pitch angle or the roll angle. The foreign matter inspection device according to any one of claims 1 to 17,
a projection optical system that projects an image of the pattern of the original onto the substrate;
The foreign matter inspection device is an exposure apparatus that inspects the original for foreign matters. an exposure step of exposing a substrate using the exposure apparatus according to claim 18 to obtain an exposed substrate;
a developing step of developing the exposed substrate to obtain a developed substrate,
A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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