JPH0350347U - - Google Patents
Info
- Publication number
- JPH0350347U JPH0350347U JP11036889U JP11036889U JPH0350347U JP H0350347 U JPH0350347 U JP H0350347U JP 11036889 U JP11036889 U JP 11036889U JP 11036889 U JP11036889 U JP 11036889U JP H0350347 U JPH0350347 U JP H0350347U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- integrated circuit
- wiring board
- semiconductor integrated
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000009499 grossing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の実施例の電子装置の概略
構成を示す要部断面図、第２図は、第１図のＡで
示す矢印の方向から見た平滑コンデンサの平面図
、第３図は、実施例の電子装置の概略構成を示
す要部断面図、第４図は、第３図のＢで示す矢印
の方向から見た平滑コンデンサの平面図である。
図中、１……電子装置、２……実装配線基板、
３……貫通孔、４……半導体集積回路装置、５…
…半導体基板、１５ａ〜１５ｃ……外部ピン、２
０……平滑コンデンサ、２１……電極部、２２…
…貫通孔、２３……誘電体部である。
FIG. 1 is a cross-sectional view of a main part showing a schematic configuration of an electronic device according to an embodiment of the present invention, FIG. 2 is a plan view of a smoothing capacitor viewed from the direction of arrow A in FIG. 1, and FIG. 4 is a sectional view of a main part showing a schematic configuration of an electronic device according to an embodiment, and FIG. 4 is a plan view of a smoothing capacitor viewed from the direction of the arrow B in FIG. 3. In the figure, 1...electronic device, 2...mounted wiring board,
3...Through hole, 4...Semiconductor integrated circuit device, 5...
...Semiconductor substrate, 15a-15c...External pin, 2
0... Smoothing capacitor, 21... Electrode part, 22...
...through hole, 23... dielectric part.
Claims (1)
装配線基板に実装する電子装置において、前記半
導体集積回路装置の電源用外部ピンと実装配線基
板とを電気的に接続する部分に、前記電源用外部
ピンに直接接続された平滑コンデンサを設けたこ
とを特徴とする電子装置。 In an electronic device in which a semiconductor integrated circuit device having a large number of pins is mounted on a mounting wiring board, a portion of the semiconductor integrated circuit device that electrically connects the power supply external pin and the mounting wiring board is provided with a power supply external pin. An electronic device characterized in that it is provided with a directly connected smoothing capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11036889U JPH0350347U (en) | 1989-09-22 | 1989-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11036889U JPH0350347U (en) | 1989-09-22 | 1989-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350347U true JPH0350347U (en) | 1991-05-16 |
Family
ID=31658904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11036889U Pending JPH0350347U (en) | 1989-09-22 | 1989-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350347U (en) |
-
1989
- 1989-09-22 JP JP11036889U patent/JPH0350347U/ja active Pending