JPH03109377U - - Google Patents
Info
- Publication number
- JPH03109377U JPH03109377U JP1783390U JP1783390U JPH03109377U JP H03109377 U JPH03109377 U JP H03109377U JP 1783390 U JP1783390 U JP 1783390U JP 1783390 U JP1783390 U JP 1783390U JP H03109377 U JPH03109377 U JP H03109377U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic
- power supply
- bypass capacitor
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 2
Description
第１図は本考案の一実施例の断面図、第２図は
第１図に示す積層セラミツク電源用バイパスコン
デンサ４の電気的な接続状態を示すための模式的
な断面図、第３図は電源用バイパスコンデンサ及
び集積回路を実装した従来のセラミツク多層配線
基板の断面図である。
１…セラミツク多層配線基板、２…集積回路、
３…電源用バイパスコンデンサ、４…積層セラミ
ツク電源用バイパスコンデツサ、５…セラミツク
、多層配線基板、１０…取り付けパツト、１１…
ハンダ、１５…電源層パターン、１６…アース層
パターン、１７…コンデンサ外部電極、１８…コ
ンデンサ内部電極、１９…セラミツク誘電体、２
０…はんだ、２１，２２，２３…セラミツク基板
、３２…信号用スルーホール、３３…ＩＣピン。
FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view showing the electrical connection state of the multilayer ceramic power supply bypass capacitor 4 shown in FIG. 1, and FIG. 1 is a sectional view of a conventional ceramic multilayer wiring board on which a power supply bypass capacitor and an integrated circuit are mounted. 1... Ceramic multilayer wiring board, 2... Integrated circuit,
3... Bypass capacitor for power supply, 4... Bypass capacitor for laminated ceramic power supply, 5... Ceramic, multilayer wiring board, 10... Mounting part, 11...
Solder, 15...Power layer pattern, 16...Earth layer pattern, 17...Capacitor external electrode, 18...Capacitor internal electrode, 19...Ceramic dielectric, 2
0...Solder, 21, 22, 23...Ceramic board, 32...Signal through hole, 33...IC pin.
Claims (1)
イパス用コンデンサを設けたことを特徴とする配
線基板。 A wiring board characterized in that a power supply bypass capacitor is provided in a second layer between the first layer and the third layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1783390U JPH03109377U (en) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1783390U JPH03109377U (en) | 1990-02-22 | 1990-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109377U true JPH03109377U (en) | 1991-11-11 |
Family
ID=31521011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1783390U Pending JPH03109377U (en) | 1990-02-22 | 1990-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109377U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007244846A (en) * | 2006-02-14 | 2007-09-27 | Izumi Kazumura | Cleaning tool |
| JP4484163B1 (en) * | 2009-08-21 | 2010-06-16 | 凉子 岡本 | Whisk |
| JP2012129443A (en) * | 2010-12-17 | 2012-07-05 | Canon Inc | Printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5222162B2 (en) * | 1972-02-25 | 1977-06-15 |
-
1990
- 1990-02-22 JP JP1783390U patent/JPH03109377U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5222162B2 (en) * | 1972-02-25 | 1977-06-15 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007244846A (en) * | 2006-02-14 | 2007-09-27 | Izumi Kazumura | Cleaning tool |
| JP4484163B1 (en) * | 2009-08-21 | 2010-06-16 | 凉子 岡本 | Whisk |
| JP2011041677A (en) * | 2009-08-21 | 2011-03-03 | Ryoko Okamoto | Foaming device |
| JP2012129443A (en) * | 2010-12-17 | 2012-07-05 | Canon Inc | Printed circuit board |