JPS63115235U - - Google Patents
Info
- Publication number
- JPS63115235U JPS63115235U JP706287U JP706287U JPS63115235U JP S63115235 U JPS63115235 U JP S63115235U JP 706287 U JP706287 U JP 706287U JP 706287 U JP706287 U JP 706287U JP S63115235 U JPS63115235 U JP S63115235U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- electronic component
- supply electrode
- substrate
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図乃至第５図は考案の一実施による電子部
品の基板接続構造を示し、第１図は基板に実装さ
れた電子部品の側面図、第２図は電子部品の底面
図、第３図は電子部品の側面図、第４図は電子部
品の平面図、第５図は基板に実装された電子部品
の斜視図である。第６図乃至第８図は従来例の電
子部品を示し、第６図は平面図、第７図は底面図
、第８図は側面図である。
図において、１は容器、３は信号用リードピン
、４は電源用リードピン、５は電源用電極、６は
基板、７は電極、８は導体片、９は電子部品であ
る。なお、図中、同一符号は同一または相当部分
を示す。
Figures 1 to 5 show a circuit board connection structure for electronic components according to one implementation of the invention, in which Figure 1 is a side view of the electronic component mounted on the board, Figure 2 is a bottom view of the electronic component, and Figure 3 is a bottom view of the electronic component. 4 is a side view of the electronic component, FIG. 4 is a plan view of the electronic component, and FIG. 5 is a perspective view of the electronic component mounted on the board. 6 to 8 show conventional electronic components, with FIG. 6 being a plan view, FIG. 7 being a bottom view, and FIG. 8 being a side view. In the figure, 1 is a container, 3 is a signal lead pin, 4 is a power supply lead pin, 5 is a power supply electrode, 6 is a substrate, 7 is an electrode, 8 is a conductor piece, and 9 is an electronic component. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
電子部品の基板接続構造において、前記電子部品
の側面に電源用電極を設け、該電源用電極は前記
基板上の対応する箇所に設けられた電源用電極に
接続する構造としたことを特徴とする電子部品の
基板接続構造。 In a substrate connection structure for an electronic component that houses a semiconductor circuit and has lead pins on the bottom surface, a power supply electrode is provided on a side surface of the electronic component, and the power supply electrode is connected to a power supply electrode provided at a corresponding location on the substrate. A board connection structure for electronic components, characterized by having a structure for connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP706287U JPS63115235U (en) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP706287U JPS63115235U (en) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115235U true JPS63115235U (en) | 1988-07-25 |
Family
ID=30790166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP706287U Pending JPS63115235U (en) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115235U (en) |
-
1987
- 1987-01-21 JP JP706287U patent/JPS63115235U/ja active Pending