JPH0289869U - - Google Patents
Info
- Publication number
- JPH0289869U JPH0289869U JP17085888U JP17085888U JPH0289869U JP H0289869 U JPH0289869 U JP H0289869U JP 17085888 U JP17085888 U JP 17085888U JP 17085888 U JP17085888 U JP 17085888U JP H0289869 U JPH0289869 U JP H0289869U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pattern
- lead wire
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案実施例の電気回路図、第２図は
要部の断面図である。
１……プリント基板、２……一面、３……配線
回路パターン、４……他面、５……マイコン、６
……回路部品、７……リード線、８……貫通孔、
１０，１０１……セラミツクコンデンサ、１２…
…電極板、１３……リード脚、１４……アース回
路、５１，５２……入力ポート。
FIG. 1 is an electrical circuit diagram of an embodiment of the present invention, and FIG. 2 is a sectional view of the main parts. 1... Printed circuit board, 2... One side, 3... Wiring circuit pattern, 4... Other side, 5... Microcomputer, 6
...Circuit components, 7...Lead wires, 8...Through holes,
10,101...ceramic capacitor, 12...
... Electrode plate, 13 ... Lead leg, 14 ... Earth circuit, 51, 52 ... Input port.
Claims (1)
のパターンに対応して貫通孔を設けたプリント基
板と、このプリント基板の他面に配置され、リー
ド線を上記貫通孔に挿通して上記配線回路パター
ンに半田付けした電子部品と、上記プリント基板
の一面側で上記電子部品の所望のリード線の半田
付け部分を電極板面によつて覆い、そのリード脚
が上記配線回路パターンに半田付けによつて固定
されたコンデンサとを備えたプリント基板におけ
るシールド構造。 A printed circuit board having a wiring circuit pattern adhered to one side and a through hole corresponding to the pattern, and a printed circuit board disposed on the other side of the printed circuit board with a lead wire inserted through the through hole to form the wiring circuit pattern. The soldered part of the desired lead wire of the electronic component on one side of the printed circuit board is covered by the electrode plate surface, and the lead leg is soldered to the wiring circuit pattern. Shield structure in printed circuit board with fixed capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17085888U JPH058695Y2 (en) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17085888U JPH058695Y2 (en) | 1988-12-27 | 1988-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0289869U true JPH0289869U (en) | 1990-07-17 |
| JPH058695Y2 JPH058695Y2 (en) | 1993-03-04 |
Family
ID=31462169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17085888U Expired - Lifetime JPH058695Y2 (en) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058695Y2 (en) |
-
1988
- 1988-12-27 JP JP17085888U patent/JPH058695Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058695Y2 (en) | 1993-03-04 |