[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6379677U - - Google Patents

Info

Publication number
JPS6379677U
JPS6379677U JP17347886U JP17347886U JPS6379677U JP S6379677 U JPS6379677 U JP S6379677U JP 17347886 U JP17347886 U JP 17347886U JP 17347886 U JP17347886 U JP 17347886U JP S6379677 U JPS6379677 U JP S6379677U
Authority
JP
Japan
Prior art keywords
board
side electrode
substrate
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17347886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17347886U priority Critical patent/JPS6379677U/ja
Publication of JPS6379677U publication Critical patent/JPS6379677U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す平面図、第2
図は第1図の―線断面図、第3図は従来の混
成集積回路装置を示す平面図、第4図は第3図の
―線断面図である。 1:基板、2:リードレスチツプキヤリア、3
:基板側電極、4:キヤリア側電極、5:ハンダ
、6:配線パターン、7:絶縁パターン。
Figure 1 is a plan view showing one embodiment of the present invention;
1, FIG. 3 is a plan view showing a conventional hybrid integrated circuit device, and FIG. 4 is a sectional view taken along the line in FIG. 3. 1: Board, 2: Leadless chip carrier, 3
: Board side electrode, 4: Carrier side electrode, 5: Solder, 6: Wiring pattern, 7: Insulating pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板にリードレスチツプキヤリアを搭載し、前
記基板に設けた接続用の基板側電極と前記リード
レスチツプキヤリアに設けた接続用のキヤリア側
電極とをハンダにより電気的に接続した混成集積
回路装置において、前記基板側電極の相互間に、
当該基板側電極の厚みよりも厚く且つ隣合う基板
側電極間を仕切る絶縁パターンを形成したことを
特徴とする混成集積回路装置。
In a hybrid integrated circuit device in which a leadless chip carrier is mounted on a board, and a board side electrode for connection provided on the board and a carrier side electrode for connection provided on the leadless chip carrier are electrically connected by solder. , between the substrate side electrodes,
A hybrid integrated circuit device characterized in that an insulating pattern is formed that is thicker than the thickness of the substrate-side electrode and partitions between adjacent substrate-side electrodes.
JP17347886U 1986-11-12 1986-11-12 Pending JPS6379677U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17347886U JPS6379677U (en) 1986-11-12 1986-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17347886U JPS6379677U (en) 1986-11-12 1986-11-12

Publications (1)

Publication Number Publication Date
JPS6379677U true JPS6379677U (en) 1988-05-26

Family

ID=31110973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17347886U Pending JPS6379677U (en) 1986-11-12 1986-11-12

Country Status (1)

Country Link
JP (1) JPS6379677U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212228A (en) * 2008-03-03 2009-09-17 Shinko Electric Ind Co Ltd Wiring substrate and method of manufacturing the same
JP2011134818A (en) * 2009-12-24 2011-07-07 Shinko Electric Ind Co Ltd Semiconductor element built-in substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212228A (en) * 2008-03-03 2009-09-17 Shinko Electric Ind Co Ltd Wiring substrate and method of manufacturing the same
JP2011134818A (en) * 2009-12-24 2011-07-07 Shinko Electric Ind Co Ltd Semiconductor element built-in substrate

Similar Documents

Publication Publication Date Title
JPS6379677U (en)
JPS6338328U (en)
JPS6429872U (en)
JPS6226048U (en)
JPS61153374U (en)
JPH0272536U (en)
JPS62199367U (en)
JPS61177446U (en)
JPS63164246U (en)
JPH01174940U (en)
JPH0270440U (en)
JPH0238743U (en)
JPH01162273U (en)
JPS61158955U (en)
JPS6049669U (en) Connection structure of chip carrier type package
JPS63145343U (en)
JPH02110349U (en)
JPH0221754U (en)
JPS6336077U (en)
JPS61157363U (en)
JPS6186950U (en)
JPS6194376U (en)
JPS628666U (en)
JPS6222871U (en)
JPH0390468U (en)