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JPH02110349U - - Google Patents

Info

Publication number
JPH02110349U
JPH02110349U JP1989019464U JP1946489U JPH02110349U JP H02110349 U JPH02110349 U JP H02110349U JP 1989019464 U JP1989019464 U JP 1989019464U JP 1946489 U JP1946489 U JP 1946489U JP H02110349 U JPH02110349 U JP H02110349U
Authority
JP
Japan
Prior art keywords
semiconductor chip
connection
bump electrodes
connection means
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989019464U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989019464U priority Critical patent/JPH02110349U/ja
Publication of JPH02110349U publication Critical patent/JPH02110349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による集積回路装置用半導体チ
ツプの実装構造の実施例の側面図および要部の一
部拡大断面図である。第２図は従来技術による実
装構造の側面図である。図において、 １０：集積回路装置用半導体チツプ、１１：接
続手段、１２：バンプ電極、１３：導電性接着剤
、２０：集積回路装置用の別の半導体チツプ、２
２：バンプ電極、３０：配線基板、３１：外部接
続導体、３２：実装用導体、３３：相互接続導体
、４０：接続線、５０：従来構造における半導体
チツプ、５２：バンプ電極、６０：従来構造にお
ける半導体チツプ、６２：バンプ電極、Ｒ：樹脂
、である。 FIG. 1 is a side view and a partially enlarged sectional view of a main part of an embodiment of a mounting structure for a semiconductor chip for an integrated circuit device according to the present invention. FIG. 2 is a side view of a mounting structure according to the prior art. In the figure, 10: semiconductor chip for integrated circuit device, 11: connection means, 12: bump electrode, 13: conductive adhesive, 20: another semiconductor chip for integrated circuit device, 2
2: Bump electrode, 30: Wiring board, 31: External connection conductor, 32: Mounting conductor, 33: Interconnection conductor, 40: Connection line, 50: Semiconductor chip in conventional structure, 52: Bump electrode, 60: Conventional structure 62: bump electrode, R: resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 周縁部には接続線との接続手段が、中央部には
バンプ電極がそれぞれ複数個配設された半導体チ
ツプ上に別の半導体チツプを重ねて配置し、この
別の半導体チツプとの接続は中央部のバンプ電極
を、外部との接続は周縁部の接続手段をそれぞれ
介して行なうようにしたことを特徴とする集積回
路装置用半導体チツプの実装構造。 Another semiconductor chip is placed on top of a semiconductor chip, which has connection means with connection lines on the periphery and a plurality of bump electrodes on the center part, and the connection with this other semiconductor chip is made in the center. 1. A mounting structure for a semiconductor chip for an integrated circuit device, characterized in that the bump electrodes of the semiconductor chip are connected to the outside through connection means of the peripheral part.
JP1989019464U 1989-02-21 1989-02-21 Pending JPH02110349U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989019464U JPH02110349U (en) 1989-02-21 1989-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989019464U JPH02110349U (en) 1989-02-21 1989-02-21

Publications (1)

Publication Number Publication Date
JPH02110349U true JPH02110349U (en) 1990-09-04

Family

ID=31235000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989019464U Pending JPH02110349U (en) 1989-02-21 1989-02-21

Country Status (1)

Country Link
JP (1) JPH02110349U (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5866347A (en) * 1981-10-16 1983-04-20 Nec Corp Composite semiconductor pellet
JPS58154254A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Semiconductor device
JPS5929036B2 (en) * 1973-06-29 1984-07-17 株式会社日立製作所 semiconductor communication path switch
JPS60150660A (en) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929036B2 (en) * 1973-06-29 1984-07-17 株式会社日立製作所 semiconductor communication path switch
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5866347A (en) * 1981-10-16 1983-04-20 Nec Corp Composite semiconductor pellet
JPS58154254A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Semiconductor device
JPS60150660A (en) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp Semiconductor device

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