JP6005930B2 - Channel member, heat exchanger using the same, electronic component device, and semiconductor manufacturing device - Google Patents

Description

  The present invention relates to a flow path member, a heat exchanger using the same, an electronic component device, and a semiconductor manufacturing apparatus.

  2. Description of the Related Art In recent years, the amount of heat generated from electronic components has increased with the increase in integration and speed of electronic components such as semiconductor elements mounted on electronic component devices. Furthermore, in a semiconductor manufacturing apparatus, for example, a wafer or the like that is processed to become an electronic component is processed in a high-temperature environment. Therefore, there is an increasing need to cool electronic parts and objects that are processed to become electronic parts.

  The flow path member disclosed in Patent Document 1 is a circuit board formed by firing a plurality of laminated sheets, and has a substantially circular cross-section refrigerant flow path formed therein for passing a refrigerant. Yes.

Japanese Unexamined Patent Publication No. 7-142822

  Particularly in recent years, there has been a demand for a flow path member capable of efficiently cooling electronic components, and a flow path member with improved heat exchange efficiency is required.

  Therefore, an object of the present invention is to provide a flow path member with improved heat exchange efficiency, a heat exchanger using the same, an electronic component device, and a semiconductor manufacturing apparatus.

The flow path member of the present invention is a flow path member made of ceramics, which includes a lid part, a side wall part, and a bottom plate part, and has a flow path through which a fluid flows. The flow path member forms the flow path. At least a part of the surface is intermittently provided with irregularities extending along the direction in which the fluid flows.

  The heat exchanger according to the present invention is characterized in that a metal plate is provided on the lid portion of the flow path member.

  The electronic component device of the present invention is characterized in that an electronic component is mounted on the metal plate.

  Moreover, the semiconductor manufacturing apparatus of this invention is equipped with the heat exchanger of the said structure, It is characterized by the above-mentioned.

According to the flow path member of the present invention, the flow path member is made of ceramics, which includes a lid body part, a side wall part, and a bottom plate part, and has a flow path through which a fluid flows. By having irregularities extending intermittently along the direction in which the fluid flows in at least a part of the surface to be formed, the volume of the flow path for the fluid to flow increases and the heat exchange efficiency with the lid portion increases. Can do.

Moreover, according to the heat exchanger of this invention, since the metal plate is provided in the outer surface of the cover body part of the flow path member of the said structure, a heat exchanger with high heat exchange efficiency can be provided.

  In addition, according to the electronic component device of the present invention, an electronic component device having high heat exchange efficiency can be provided because the electronic component is mounted on the heat exchanger configured as described above.

  Further, according to the semiconductor manufacturing apparatus of the present invention, since the heat exchanger having the above configuration is provided, for example, the metal plate in the above configuration can be used together as a wafer mounting table and a processing electrode, and has a simple structure. Thus, it is possible to provide a semiconductor manufacturing apparatus for manufacturing a semiconductor element with high dimensional accuracy by improving the heat dissipation of the electrode that generates heat and preventing the temperature of the wafer from rising.

An example of the flow path member of this embodiment is shown. (A) is an external perspective view and a perspective view showing a cross section perpendicular to the direction in which fluid flows. (B), (c), (d) and (e) ) Is a partially enlarged cross-sectional view of a circle surrounded by a broken line in FIG. Another example of the flow path member of this embodiment is shown, (a) is an external perspective view and a perspective view showing a cross section perpendicular to the direction in which the fluid flows, and (b) and (c) are (a). It is sectional drawing which expanded partially the inside of the circle | round | yen enclosed with the broken line. FIG. 5A shows still another example of the flow path member of the present embodiment, FIG. 5A is an external perspective view and a cross-sectional view perpendicular to the direction in which fluid flows, and FIG. 5B is a circle surrounded by a broken line in FIG. It is sectional drawing which expanded the inside partially. FIG. 5A shows still another example of the flow path member of the present embodiment, FIG. 5A is an external perspective view and a cross-sectional view perpendicular to the direction in which fluid flows, and FIG. 5B is a circle surrounded by a broken line in FIG. It is sectional drawing which expanded the inside partially. It is a top view of the example provided with the partition part which comprises the flow path which shows another example of the flow path member of this embodiment. It is a top view of an example provided with a meandering flow path which shows other examples of a flow path member of this embodiment. It is a perspective view which shows an example of the heat exchanger which provided the metal plate in the outer surface of the cover body part of the flow-path member of this embodiment. It is a perspective view which shows an example of the electronic component apparatus which mounted the electronic component in the heat exchanger of this embodiment. It is the schematic which shows an example of the whole system configuration | structure of the semiconductor manufacturing apparatus provided with the heat exchanger of this embodiment.

  Hereinafter, examples of embodiments of the flow path member of the present invention will be described.

  An example of the flow path member of this embodiment is shown, (a) is an external perspective view and a perspective view showing a cross section perpendicular to the direction of fluid flow, (b), (c), (d) and ( e) is a partially enlarged cross-sectional view of a circle surrounded by a broken line in FIG.

As shown in FIGS. 1 (a), (b), (c), (d) and (e), the flow path member 1 of this embodiment includes a lid portion 1a, a side wall portion 1c, and a bottom plate portion 1b. And has a flow path 3 for flowing a fluid such as a gas or a liquid for cooling an electronic component to be described later, and a side wall portion of a surface forming the flow path 3. It has the unevenness | corrugation 2 extended along the direction where a fluid flows to 1c. And the unevenness | corrugation 2 is an angular shape as shown in (b), an S shape as shown in (c), a shape in which the lid side 1a side as shown in FIG. It may have various uneven shapes such as a shape in which the lid 1a side is greatly recessed as shown in e). Moreover, in FIG. 1, although shown about one surface which contact | connects the flow path 3 of the side wall part 1c, it is preferable that the other surface also has the unevenness | corrugation 2 similarly. Furthermore, the lid portion 1a and the bottom plate portion 1b may also have irregularities 2 on the surface on which the flow path 3 is formed.

  According to the flow path member 1 of the present embodiment, the flow path member 1 includes a lid portion 1a, a side wall portion 1c, and a bottom plate portion 1b, and includes a flow channel 3 through which a fluid flows. It is important to have irregularities 2 extending along the direction in which the fluid flows in at least a part of the surface forming the path 3.

  And according to the flow path member 1 of this embodiment, it has the unevenness | corrugation 2 extended along the direction through which the fluid flows in at least one part of the surface which forms the flow path 3 into which the fluid flows into the flow path member 1. The surface area of the side wall 1c constituting the flow path 3 can be increased, the volume of the flow path 3 for flowing the fluid can be increased, and heat exchange with a fluid such as gas or liquid flowing in the flow path member 1 can be performed. Efficiency can be increased. In particular, in order to increase the heat exchange efficiency, it is easy to exchange heat by having asperities 2 extending along the direction in which the fluid flows and at the same time reducing the thickness of the lid 1a as much as possible without causing any problems in strength. Especially preferred. Furthermore, when cooling the electronic component that generates heat disposed on the lid 1a, the fluid forms the flow path 3 of the side wall 1c by having the unevenness 2 on the side of the flow path 3 of the side wall 1c. By generating a vortex in the vicinity of the surface to be performed, the fluid tends to flow in a convection direction toward the lid 1a side where the temperature is high. As a result, the heat exchange efficiency is increased and at the same time, dust or the like contained in gas or liquid flowing in the flow path 3 adheres to the flow path 3, so that the surface area of the side wall portion 1 c constituting the flow path 3 or the flow path is increased. 3 can be suppressed, the heat exchange efficiency can be reduced and the flow of fluid can be prevented from being hindered. At the same time, when dust or the like adheres to the surface forming the flow path 3, It becomes easy to peel off from the part 1c.

  Moreover, it is preferable that the flow path member 1 of this embodiment has the unevenness | corrugation 2 extended along the direction through which a fluid flows, in order to make heat exchange efficiency still higher. When it has the unevenness | corrugation 2 extended along the direction where a fluid flows intermittently, a vortex | eddy_current can be further generated by the part which the unevenness | corrugation 2 interrupted. As a result, the efficiency of heat exchange with the fluid can be increased efficiently. Further, since this eddy current is generated, it is possible to make it difficult for dust or the like contained in the gas or liquid flowing inside the flow path 3 to adhere, and at the same time, dust or the like adheres to the surface forming the flow path 3. In some cases, the eddy current can be easily peeled off from the surface on which the flow path 3 is formed.

Furthermore, the flow path member 1 of the present embodiment preferably has an arithmetic average roughness (Ra) of 0.2 μm or more and 0.8 μm or less on each surface of the lid portion 1a and the bottom plate portion 1b in contact with the fluid. The arithmetic average roughness (Ra) on each surface of the lid portion 1a and the bottom plate portion 1b in contact with the fluid is 0.2.
If it is not less than μm and not more than 0.8 μm, a vortex is further generated on each surface of the lid portion 1a and the bottom plate portion 1b in contact with the fluid, and the heat exchange efficiency with the fluid can be further improved. In addition, what is necessary is just to measure arithmetic mean roughness (Ra) in the surface which contact | connects a fluid based on JISB0601-2001.

  FIG. 2 shows another example of the flow path member of the present embodiment, (a) is an external perspective view and a perspective view showing a cross section perpendicular to the direction in which the fluid flows, and (b) and (c). FIG. 4 is a partially enlarged cross-sectional view of a circle surrounded by a broken line in FIG.

  2 (a), 2 (b), and 2 (c), the flow path member 11 forms a flow path 3 through which fluid flows through the lid portion 1a, the side wall portion 1c, and the bottom plate portion 1b. In addition, the corner portion 5 of the flow path 3 constituted by the lid portion 1a and the side wall portion 1c and the bottom plate portion 1b and the side wall portion 1c is crushed, and (b) is the shape of the corner portion 5. (C) makes the shape of the corner portion 5 a curved surface.

Thus, by making the corner part 5 of the flow path 3 comprised by the cover body part 1a and the side wall part 1c and the bottom plate part 1b and the side wall part 1c into a crushed shape, the gas, liquid, etc. which flow through the flow path 3 Even in an environment where the pressure of the fluid is increased, it is easy to relieve stress on the corner portion 5 of the flow path 3, so that the corner portion 5 is less likely to crack and the flow path is prevented from being broken. it can. Moreover, in order to keep the volume of the flow path 3 large while suppressing the reduction of the surface area of the side wall part 1c constituting the flow path 3, the dimensions of the inclined surface and the curved surface are, for example, the lid part 1a, the side wall part 1c, and the bottom plate part 1b. It is preferable that the dimensions be in the range of 0.01 to 0.05 mm from the corner 5 where the surface forming the flow path 3 intersects with the side wall 1c.

  3A and 3B show still another example of the flow path member of the present embodiment. FIG. 3A is an external perspective view and a perspective view showing a cross section perpendicular to the direction in which the fluid flows, and FIG. FIG.

  3 (a) and 3 (b), a flow path member 12 showing still another example of the present embodiment is formed by laminating a plurality of plate-like bodies 4 in which the side wall portion 1c has a through hole that becomes the flow path 3. Concavities and convexities 2 are formed in the portion of the plate-like body 4 in contact with the fluid in the through holes that form the flow paths 3.

  Since a plurality of plate-like bodies 4 constituting the side wall 1c are laminated in this way, the surface area of the side wall 1c constituting the flow path 3 can be increased and the volume of the flow path 3 for flowing fluid can be further increased. The flow path member 1 can be obtained. For example, particularly when an electronic component is used in a high-temperature environment, a large amount of fluid can be flowed for the purpose of efficiently cooling the electronic component, so that the heat exchange efficiency of the flow path member 12 can be further increased. In order to achieve this, the side wall 1c is preferably a laminated body including a plurality of plate-like bodies 4 having holes for forming the flow paths 3.

  4A and 4B show still another example of the flow path member of the present embodiment. FIG. 4A is an external perspective view and a perspective view showing a cross section perpendicular to the direction in which the fluid flows, and FIG. FIG.

  A flow path member 13 showing still another example of the present embodiment shown in FIG. 4 is formed by laminating a plurality of plate-like bodies 4 in which the side wall portion 1c has a through-hole that becomes the flow path 3, and this plate shape Concavities and convexities 2 are formed in the portion of the body 4 that is in contact with the fluid in the through hole that becomes the flow path 3, and a gap 8 that connects to the flow path 3 between the plate-like bodies 4 of the side wall 1 c (joining portion 1 d). have.

  In such a flow path member 13, for example, in order to make it excellent in chemical resistance as a chemical heat exchanger, the lid portion 1a, the side wall portion 1c, and the bottom plate portion 1b can be made of ceramics, respectively. preferable. In producing each member with ceramics, for example, it can be produced by firing a laminate in which ceramic green sheets are laminated.

  In order to form the flow path 3 through which the fluid flows, for example, a through hole to be an arbitrary flow path 3 is formed in advance in the ceramic green sheet to be the side wall 1c by punching with a mold or cutting with a laser. In addition, the unevenness may be processed on each surface of the through hole using an internal grinding machine or the like. Then, a ceramic green sheet having a through hole formed in such a ceramic green sheet by punching with a die or a cutting process with a laser and a ceramic green sheet for closing the upper and lower sides of the through hole are prepared. The channel member 13 can be formed by firing after laminating and pressurizing.

By the way, when producing a plate-like body serving as the side wall portion 1c, it is inevitable that burrs are generated on the end face of the through hole by punching with a mold or cutting with a laser. When laminating and pressing, the burrs generated on the end face of the through-hole are sandwiched between the ceramic green sheet joints 1d, and even if the laminated ceramic green sheets are pressed, the pressure is concentrated on the burrs sandwiched between the joints. Bonding defects are likely to occur due to uneven pressurization. In the flow path member 13 of the present embodiment, the joint 1d connected to the flow path 3
By providing the gap 8 in the gap, there is less possibility that burrs generated on the end face of the side wall 1c will be sandwiched between the joints 1d, and the occurrence of poor joints can be kept low. Therefore, the occurrence of problems such as cracks and breakage of the flow path 3 can be suppressed.

  In the above description, the material of the flow path member 13 is ceramic. However, the same applies to the case where the lid portion 1a is ceramic and the side wall portion 1c is other material such as aluminum or copper. The effect of can be obtained.

  As described above, the flow path member 13 of the present embodiment is a case in which the occurrence of cracks in the joint portion 1d is small when a plurality of the plate-like bodies 4 serving as the side wall portions 1c are laminated, and a fluid is flowed at a high pressure. However, the occurrence of breakage from the inside of the flow path 3 can be suppressed. Furthermore, since the heat exchange efficiency is high, as a channel member for cooling of a semiconductor device or a semiconductor manufacturing device, as a channel member for heat exchange of a semiconductor manufacturing device that repeats heating and cooling, and further, the heat of a chemical solution It can be used as an ink flow path member used for an exchanger, a printer, or the like.

And in order to maintain the intensity | strength in the flow path members 1, 11, 12, and 13 of this actual embodiment, the thickness of the side wall part 1c should just be 0.3 mm or more and 8 mm or less.

  FIG. 5 is a plan view of an example including a partition wall portion constituting a flow path, showing still another example of the flow path member of the present embodiment.

  A flow path member 14 showing still another example of the present embodiment shown in FIG. 5 includes an outer wall portion 1 f and a partition wall portion 1 e constituting the flow path 3.

  In this embodiment and still other embodiments described later, the outer wall portion 1f is a wall portion that forms an outer peripheral surface in the side wall portion of the flow path member 14 and is in contact with the fluid inside, and the partition wall portion 1e Means a wall portion that is in contact with the fluid but does not constitute the outer peripheral surface of the flow path member.

  And it is suitable to have the unevenness | corrugation extended along the direction (vertical direction in FIG. 5, horizontal direction in FIG. 6 mentioned later) which a fluid flows into at least one part of the surface which forms the partition part 1e.

  As described above, in this embodiment, the flow of the fluid can be controlled by forming the partition wall portion 1e, and the side wall portion 1e constituting the flow path 3 is formed by the unevenness of the partition wall portion 1e. The surface area of can be further increased. Thereby, the heat transferred from the lid portion 1a side to the side wall portion 1e can be efficiently exchanged with the fluid.

  FIG. 6 is a plan view of an example including a meandering flow path, showing still another example of the flow path member of the present embodiment.

  A flow path member 15 showing still another example of the present embodiment shown in FIG. 6 includes an outer wall portion 1 f and a partition wall portion 1 e that constitute a meandering flow path 3. Thus, the flow path 3 in the flow path member 1 can be lengthened by forming the meandering flow path 3 with the outer wall portion 1f and the partition wall portion 1e. Thereby, the total volume of the flow path 3 can be increased, and the residence time of the fluid flowing through the flow path 3 can be increased. As a result, heat exchange with the fluid can be efficiently performed and a uniform temperature can be maintained.

In addition, in order to easily spread the fluid to every corner of the flow path 3 and efficiently exchange heat, the partition walls 1e constituting the meandering flow path 3 are arranged in parallel with the outer wall portions 1f, respectively. preferable. In addition, as long as it is parallel to the outer wall part 1f, it may be parallel to either the short side direction or the long side direction of the outer wall part 1f.

Moreover, although the flow path members 14 and 15 of this embodiment can exchange heat efficiently even when the thickness of the outer wall part 1f and the partition part 1e is the same or different, in order to improve heat exchange efficiency further, The thickness of the outer wall portion 1f is preferably thinner than the thickness of the partition wall portion 1e. When the thickness of the outer wall portion 1f is thinner than the thickness of the partition wall portion 1e, the heat from the lid portion 1a is transmitted to the outer wall portion 1f having a low thermal resistance, so that heat is easily radiated to the outside of the flow path members 14 and 15. Further, the heat exchange efficiency can be further increased.

  The partition wall portion 1e may be provided by being joined to at least a part of the lid portion 1a, the bottom plate portion 1b, or the outer wall portion 1f. It should be.

  FIG. 7 is a perspective view showing an example of a heat exchanger in which a metal plate is provided on the outer surface of the lid portion of the flow path member of the present embodiment.

  The heat exchanger 20 of the present embodiment shown in FIG. 7 is provided on the outer surface of the lid portion 1a of the flow path members 1, 11, 12, 13, 14, and 15 of the present embodiment having the flow path 3 through which the fluid flows. The metal plate 6 is joined. Thus, when the metal plate 6 is joined to the outer surface of the lid portion 1a, the heat exchange with the fluid is facilitated by mounting the heat exchange object on the metal plate 6.

  FIG. 8 is a perspective view showing an example of an electronic component device in which an electronic component is mounted on the metal plate of the heat exchanger of the present embodiment.

  The electronic component device 40 of the present embodiment shown in FIG. 8 includes a heat exchanger 20 in which a metal plate 6 is joined above the lid portion 1a of the flow path members 1, 11, 12, 13, 14, and 15 of the present embodiment. This is an electronic component device 40 using. By flowing a fluid as a refrigerant through the flow paths of the flow path members 1, 11, 12, 13, 14, and 15, the electronic component 7 can be effectively cooled, and the occurrence of flow path destruction is small, and The electronic component device 40 having high heat exchange efficiency can be provided.

  In particular, the electronic component device 40 is useful as a device that generates high heat during operation, such as a semiconductor module such as a PCU, a semiconductor device of a high-power LED headlamp, a DC high-voltage power supply device, and a switching device.

  FIG. 9 is a schematic diagram illustrating an example of an overall system configuration of a semiconductor manufacturing apparatus including the heat exchanger according to the present embodiment.

  A semiconductor manufacturing apparatus 50 according to this embodiment shown in FIG. 9 includes a heat exchanger 20 in which a metal plate 6 is joined above the lid portion 1a of the flow path members 1, 11, 12, 13, 14, and 15 according to this embodiment. This is a semiconductor manufacturing apparatus 50 using

For example, in the case of a plasma processing apparatus which is one of the semiconductor manufacturing apparatuses 50, the metal plate 6 of the heat exchanger 20 can be used as the lower electrode 22 for processing the wafer 29, and the antenna electrode is formed in the upper part of the processing chamber 28. 25, each electrode 22, 25 is connected to a power source 30, fluid flows to the flow path members 1, 11, 12, 13, 14, 15 from the supply pipe 31 to the supply port 10, and the discharge port 16 and By discharging from the discharge pipe 32, the electrodes 22 and 25 that are at a high temperature during the plasma treatment can be cooled and maintained at a stable temperature. Thereby, since the temperature of the wafer 29 is also controlled, processing with high dimensional accuracy can be performed.

  The semiconductor manufacturing apparatus 50 according to the present embodiment can be used as a sputtering apparatus, a resist coating apparatus, a CVD apparatus, or an etching processing apparatus in addition to a plasma processing apparatus.

  Hereinafter, an example of the manufacturing method of the flow path member 1 of this embodiment is demonstrated.

  The flow path member 1 can be made of a metal such as aluminum or copper, or a ceramic material. For example, the flow path member 1 is preferably made of a ceramic material in order to have excellent chemical resistance. , Zirconia, silicon nitride, silicon carbide and aluminum nitride, boron nitride or a composite thereof can be used. Of these, alumina is preferable in consideration of insulation properties and material costs. Furthermore, a material containing silicon oxide or the like and having an alumina content of 94 to 97% by mass is particularly preferable in view of firing costs because sintering is performed at a relatively low temperature. Further, silicon carbide or boron nitride is preferable in consideration of improvement in thermal conductivity and weight reduction of the flow path member.

  Hereinafter, production of the flow path members 1, 11, 12, 13, 14, and 15 will be described in detail.

First, when the flow path members 1, 11, 12, 13, 14, 15 are made of alumina, the average particle size is 1.4.
About 1.8 μm of aluminum oxide (Al ₂ O ₃ ) powder, silicon oxide (SiO ₂ ),
Preparation of at least one powder of calcium oxide (CaO) and magnesium oxide (MgO), for example, the mixing ratio of each powder is 96.4% by mass of aluminum oxide, 2.3% by mass of silicon oxide, 0.3% by mass of calcium oxide, and oxidation The mixed powder weighed and mixed so as to be 1.0% by mass of magnesium is put into a rotating mill together with a binder made of polyethylene glycol and mixed with high-purity alumina balls. Here, the additive amount of the binder is about 4 to 8% by mass with respect to 100% by mass of the mixed powder. In addition, if the addition amount of the binder is within the range of about 4 to 8% by mass with respect to 100% by mass of the mixed powder, the strength and flexibility of the molded body are good, and the molding binder is degreased during firing. Insufficient defects can be suppressed.

When the flow path members 1, 11, 12, 13, 14, 15 are made of silicon carbide, water, a dispersant, boron carbide is added to silicon carbide powder having an average particle size (D50) of 0.5 μm to 2 μm. Powder, carboxylate powder and polyethylene glycol are added, and mixed and pulverized by a mill such as a ball mill, rotary mill, vibration mill, bead mill, etc. to obtain a mixed powder. Here, the content of each of the boron carbide powder and the carboxylate powder is, for example, 0.12% by mass to 1.4% by mass and 1% by mass to 3.4% by mass with respect to 100% by mass of the silicon carbide powder. The addition amount of polyethylene glycol is 4% by mass or more and 8% by mass or less with respect to 100% by mass of the mixed powder. If the addition amount of polyethylene glycol is 4% by mass or more and 8% by mass or less with respect to 100% by mass of the mixed powder, the strength and flexibility of the molded article are good and the degreasing of polyethylene glycol can be facilitated. it can.

Next, a binder such as polyvinyl alcohol, polyethylene glycol, an acrylic resin or a butyral resin is added thereto in an amount of about 4 to 8% by mass with respect to 100% by mass of the mixed powder, and mixed to obtain a slurry. Here, the added amount of the binder is 4 to 8 with respect to 100% by mass of the mixed powder.
If it is about mass%, the strength and flexibility of the molded product are good, and the problem of insufficient degreasing of the molding binder during firing can be suppressed.

  Next, using this slurry, a ceramic green sheet is formed by a doctor blade method or a roll compaction method, which is a general ceramic forming method, and then punched out with a mold for forming a product shape. Is made. The ceramic green sheets to be laminated are preferably used in the same lot in order to reduce deformation and warpage due to shrinkage differences during firing and the occurrence of cracks.

  And processing of the unevenness | corrugation 2 to the surface which forms the flow path 3 in the ceramic green sheet for comprising the side wall part 1c of the flow path members 1, 11, 12, 13 and the unevenness | corrugation to the cover part 1a and the baseplate part 1b 2. Processing, laminating the corner portion of the flow path 3 composed of the lid portion 1a and the side wall portion 1c and the bottom plate portion 1b and the side wall portion 1c into a shape that is crushed into an inclined surface shape or a curved surface shape, lamination As a processing method for providing the gap 8 in the joint portion 1d connected to the flow path 3 at first, a hole to be the flow path 3 is formed by punching a ceramic green sheet or cutting with a laser. Form. It should be noted that the corner portion 5 of the flow path 3 composed of the unevenness 2, the lid portion 1 a and the side wall portion 1 c, and the bottom plate portion 1 b and the side wall portion 1 c is formed on the side surface of the hole that becomes the flow channel 3. In addition, when processing the gap 8 in the joint 1d connected to the flow path 3 when stacked, the shape of the grindstone is formed in accordance with the side surface shape of the flow path 3 and processed using an internal grinder. That's fine. Moreover, when processing the unevenness | corrugation 2 in the cover body part 1a and the baseplate part 1b, what is necessary is just to process using the surface grinder after shaping | molding the grindstone processed so that the unevenness | corrugation 2 may attach the shape of a grindstone. Further, when the flow path members 14 and 15 of the present embodiment as shown in FIGS. 5 and 6 are used, the shape of the portion that becomes the flow path 3 as shown in FIGS. What is necessary is just to process the partition part 1e which comprises the flow path 3, and the partition part 1e which comprises the serpentine flow path 3 by carrying out the punching process with a type | mold, or a cutting process using a laser beam.

A plurality of ceramic green sheets produced in this way are laminated so as to form a desired flow path 3, and the same binder as that used when producing the ceramic green sheets is formed on the bonding surface of each ceramic green sheet. Is applied as a close contact liquid, and after laminating ceramic green sheets, a pressure of about 0.5 MPa is applied through a flat plate-shaped pressurizing tool,
Then, it is dried at room temperature of about 50-70 ° C. for about 10-15 hours.

  Next, the laminated ceramic green sheets to be the flow path member 1 are fired in, for example, a known pusher type or roller type continuous tunnel furnace. The firing temperature differs depending on the material, but if the material has an alumina content of 94 to 97% by mass, the maximum temperature is about 1500 to 1650 ° C in an oxidizing atmosphere for 10 minutes to 20 hours, and the silicon carbide content If the material is 98.6 mass% or more and 99.9 mass% or less, hold in an inert gas atmosphere or vacuum atmosphere at a temperature range of 1800-2200 ° C for 10 minutes to 10 hours, and then a temperature range of 2200-2350 ° C It may be fired in 10 minutes to 20 hours.

  And the arithmetic mean roughness (Ra) of a flow path can be adjusted suitably by adjusting each baking temperature and baking time.

  Further, by grinding the outer peripheral surfaces of the obtained flow path members 14 and 15, the outer wall portion 1f can be made thinner than the partition wall portion 1e by adjusting the thickness of the outer wall portion 1f. In particular, in the case of a heat exchanger used in a semiconductor manufacturing apparatus as shown in FIG. 9, it is preferable to reduce the thickness of the outer wall 1f, and in order to efficiently exchange heat with the outside air, the thickness is set to 0.3. It is preferable to be about ~ 2.0 mm.

  In addition, when the thickness of the outer wall portion 1f is reduced in this way, the heat transferred from the lid portion 1a to the side wall portion 1e is efficiently exchanged with the fluid while maintaining the strength of the flow path member. In doing so, it is preferable that the thickness of the partition wall 1e is 2 to 4 times the thickness of the outer wall 1f.

  In particular, when a substrate on which an electronic component 7 generating high heat is mounted as shown in FIG. 9 is mounted on the lid portion 1a of the flow path member 1, the lid that seals the through holes to form the flow path The thickness of the body part 1a is preferably as thin as possible in order to improve the heat exchange efficiency. In the lid part 1a having an alumina content of 94 to 97% by mass, the silicon carbide lid body is about 0.3 to 0.5 mm. In the part 1a, it is preferable to set it as about 0.2-0.5 mm.

Thus, the flow path members 1, 11, 12, 13, 14, 15 are produced.
, 14 and 15 are mounted with electronic parts 7 such as LSIs and LEDs via a metal plate 6 so that a refrigerant such as a gas or a liquid flows through the flow path members 1, 11, 12, 13, 14 and 15. The electronic component 7 can be cooled by passing through.

  Further, the flow path members 1, 11, 12, 13, 14, and 15 of the present embodiment can be used not only for cooling applications but also for a wide range of applications such as thermal applications. Since adhesion of dust and the like can be reduced inside the path member, it can also be used as a suction conveyance member for conveying a wafer or the like.

1, 11, 12, 13, 14, 15: Channel member 1a: Lid portion 1b: Bottom plate portion 1c: Side wall portion 1d: Joint portion 1e: Partition portion 1f: Outer wall portion 2: Concavity and convexity 3: Channel
20: Heat exchanger
40: Electronic component equipment
50: Semiconductor manufacturing equipment

Claims (7)

A lid portion, a side wall portion, is composed of a bottom plate, having a flow passage through which fluid therein, a flow passage member made of ceramics, at least a portion of the surfaces forming the flow path, the fluid A flow path member characterized by having irregularities extending intermittently along the direction in which the gas flows.   The flow path member according to claim 1, wherein the side wall portion is a laminated body including a plurality of plate-like bodies having holes for forming the flow path.   3. The structure according to claim 1, further comprising a partition portion that constitutes the flow path, and at least part of a surface that forms the partition portion, having irregularities extending along a direction in which a fluid flows. Channel member.   The flow path member according to claim 3, wherein a thickness of the side wall portion is smaller than a thickness of the partition wall portion.   A heat exchanger comprising a metal plate provided on an outer surface of the lid portion of the flow path member according to any one of claims 1 to 4.   An electronic component device comprising an electronic component mounted on the metal plate of the heat exchanger according to claim 5.   A semiconductor manufacturing apparatus comprising the heat exchanger according to claim 5.

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