JP6162558B2 - Channel member, heat exchanger using the same, and semiconductor manufacturing apparatus - Google Patents

Description

  The present invention relates to a flow path member, a heat exchanger using the same, and a semiconductor manufacturing apparatus.

  The flow path member having the flow path inside allows heat exchange between the flow path member and another member in contact with the flow path member by flowing a fluid through the flow path, thereby contacting the flow path member. The temperature of other members can be adjusted.

  For example, Patent Document 1 discloses that an electrostatic chuck used for fixing a wafer and performing dry etching or CVD processing includes a plurality of ceramic layers, and a refrigerant is provided in an intermediate ceramic layer among the plurality of ceramic layers. A flow path is formed, and a supply flow path for sending the refrigerant to the refrigerant flow path and a return flow path for discharging the refrigerant from the refrigerant flow path are formed in the ceramic layer below the intermediate ceramic layer. An electrostatic chuck having a refrigerant flow path is disclosed.

Japanese Patent Laid-Open No. 3-108737

  However, in the electrostatic chuck having the configuration described in Patent Document 1, when the temperature of the wafer suddenly rises due to plasma or electron beam irradiation, the temperature at the part on which the wafer is placed also rises, and this wafer is loaded. There is a tendency that heat is easily generated at the connection portion between the placed portion and the lower layer. Then, when the soaking heat is high, there is a problem that a thermal stress is generated due to a temperature difference from the refrigerant flowing through the refrigerant flow path, and the connection portion is broken. Therefore, a flow path member having improved reliability against thermal stress is demanded.

  Therefore, an object of the present invention is to provide a flow path member with improved reliability against thermal stress, a heat exchanger using the same, and a semiconductor manufacturing apparatus.

The flow path member of the present invention includes a lid body portion on which an object to be processed is placed, a bottom plate portion, and a plurality of side wall portions connected to the lid body portion and the bottom plate portion. A flow channel member having a flow channel, wherein at least one of the plurality of side wall portions narrows in a stepwise manner from the bottom plate portion to the lid body portion in a cross-sectional view orthogonal to the direction in which the fluid flows. It is the 1st side wall part which has become, It is characterized by the above-mentioned.

  The heat exchanger according to the present invention is characterized in that a metal member is provided on the surface or inside of the lid portion of the flow path member having the above-described configuration.

  Moreover, the semiconductor manufacturing apparatus of this invention is equipped with the heat exchanger by which the metal member is provided in the inside of the cover body part of the flow-path member of the said structure, It is characterized by the above-mentioned.

According to the flow path member of the present invention, since the width of the first side wall portion in contact with the lid body portion is narrow, the heat exchange efficiency on the lid body side can be improved, and the heat generation can be suppressed. Thereby, since it can suppress that the connection part of a cover body part and a side wall part is destroyed, it can be set as the flow-path member which improved the reliability with respect to a thermal stress.

  Moreover, according to the heat exchanger of this invention, it can be set as the heat exchanger with improved reliability.

  Moreover, according to the semiconductor manufacturing apparatus of the present invention, since the heat exchanger having the above configuration is provided, a semiconductor manufacturing apparatus with improved reliability against thermal stress can be obtained.

An example of the flow path member of this embodiment is shown, (a) is an external perspective view in a state of being cut in a direction orthogonal to the fluid flow direction, and (b) is a portion surrounded by a broken line in (a). FIG. The other example of the flow-path member of this embodiment is shown, (a) is an external appearance perspective view of the state cut | disconnected in the direction orthogonal to the flow direction of a fluid, (b) is enclosed with the broken line in (a). It is sectional drawing which expanded the part. (A) is an external appearance perspective view of the state cut | disconnected in the direction orthogonal to the fluid flow direction, (b) is a broken line in (a) which shows the other example of the flow-path member of this embodiment. It is sectional drawing to which the enclosed part was expanded. (A) is an external appearance perspective view of the state cut | disconnected in the direction orthogonal to the fluid flow direction, (b) is a broken line in (a) which shows the other example of the flow-path member of this embodiment. It is sectional drawing to which the enclosed part was expanded. It is an external appearance perspective view which shows the state cut | disconnected in the direction orthogonal to the fluid flow direction as another example of the flow-path member of this embodiment, (a) is the narrowest width | variety of a 1st side wall part. The length in the height direction in the part is a flow path member that gradually becomes shorter toward the center part side, and (b) shows the length in the height direction in the narrowest part of the width of the first side wall part. The flow path member gradually becomes longer toward the center side. It is an external appearance perspective view which shows the state cut | disconnected in the direction orthogonal to the fluid flow direction as another example of the flow-path member of this embodiment, (a) is the widest width | variety of a 1st side wall part. The width of the narrow portion of the flow path member gradually increases toward the center of the flow path member, and (b) shows the width of the first side wall portion at the narrowest width portion of the flow path member. It is the flow path member which becomes gradually narrow toward the center part side. As still another example of the flow path member of the present embodiment, it is a cross-sectional view showing a horizontal cross section with respect to the direction of fluid flow, (a) is a meandering flow path, (b) is a spiral flow path It is. It is the schematic which shows an example of a semiconductor manufacturing apparatus provided with the heat exchanger of this embodiment.

  Hereinafter, examples of embodiments of the flow path member of the present invention will be described.

  1A and 1B show an example of a flow path member of the present embodiment, in which FIG. 1A is an external perspective view in a state of being cut in a direction orthogonal to a fluid flow direction, and FIG. 1B is a broken line in FIG. It is sectional drawing to which the part enclosed by is expanded. In the following drawings, the same components are described using the same reference numerals.

As shown in FIG. 1 (a), the flow path member 10 of the present embodiment is connected to the lid body portion 1, the bottom plate portion 3, the lid body portion 1 and the bottom plate portion 3 on which the object to be processed is placed. A space surrounded by the lid body portion 1, the bottom plate portion 3, and the side wall portion 2 is defined as a flow path 4, and a flow path member 10 having the flow path 4 therein. Yes. Further, in the flow path member 10 of the present embodiment, at least one of the plurality of wall-measurement portions 2 is narrow from the bottom plate portion 3 to the lid portion 1 in a cross-sectional view orthogonal to the direction in which the fluid flows. It is set as the 1st side wall part 2a. In FIG. 1B, the flow path 4
It is shown as a flow path port 4a showing the cross section of FIG. 2 to 6 including FIG. 1, an example is shown in which five of the seven side walls 2 excluding the outer wall are the first side walls 2 a.

  Here, as shown in FIG. 1 (b), the first side wall portion 2a whose width is narrowed from the bottom plate portion 3 to the lid portion 1 is a portion in contact with the bottom plate portion 3 of the first side wall portion 2a. The width 2c in contact with the lid body portion 1 is narrower than the width 2b of the portion in contact with the bottom plate portion 3 where the width of the portion in contact with the lid body portion 1 of the first side wall portion 2a is 2c. It is. By satisfying such a configuration, it is possible to efficiently cool the connection portion between the lid portion 1 and the first side wall portion 2a where heat is easily generated by flowing a cooling fluid through the flow path 4, and the thermal stress is reduced. By suppressing the generation, the connection portion between the lid portion 1 and the first side wall portion 2a is prevented from being broken. Thereby, the flow path member 10 with improved reliability against thermal stress can be obtained. In particular, this effect is obtained when the thickness of the lid body portion 1 is made thinner than the thickness of the bottom plate portion 3 in order to increase the heat exchange efficiency with other members in contact with the lid body portion 1 of the flow path member 10. It is effective because it is more effective. In the following description, a case where a cooling fluid is allowed to flow through the flow path 4 will be described unless otherwise specified.

  Further, when the object to be processed has a temperature distribution, the interval between the side wall parts 2 is adjusted as appropriate, and the width of the first side wall part 2a is adjusted as appropriate so that the temperature of the object to be processed is equalized. Can be achieved. For example, when the temperature of the central portion of the object to be processed is high and the outside is low, the interval between the side wall portions 2 in the flow path member 10 is adjusted to widen the interval between the central side wall portions 2 and narrow the outside interval. That's fine.

  Here, the lid part 1, the side wall part 2, and the bottom plate part 3 constituting the flow path member 10 can be made of metal, resin, ceramics, or the like. Moreover, the cover part 1, the side wall part 2, and the baseplate part 3 may be produced with the same material, respectively, and may be produced with a different material. In addition, when flowing highly corrosive gas or liquid to the flow path 4, it is suitable to produce each member with ceramics. As the ceramic, alumina, zirconia, silicon nitride, aluminum nitride, silicon carbide, boron carbide, cordierite, mullite, or a composite thereof can be used.

In particular, the flow path member 10 of the present embodiment is preferably made of a silicon carbide sintered body mainly composed of silicon carbide. Here, a main component means the component which occupies in the ratio of 80 mass% or more among 100 mass% of all the components which comprise a sintered compact. And when the flow path member 10 of the present embodiment is made of a silicon carbide sintered body containing silicon carbide as a main component, in addition to excellent mechanical properties and corrosion resistance, the heat conductivity is high, so the heat exchange efficiency The flow path member 10 can be improved. In addition, since the silicon carbide sintered body has a specific gravity smaller than that of other ceramics, for example, alumina, and the weight of the flow path member 10 can be reduced, the large flow path member is obtained. Useful when 10 is needed.

  Here, in the flow path member 10 of this embodiment, since it has the structure which has the 1st side wall part 2a from which the width | variety becomes narrow at least from the baseplate part 3 to the cover body part 1, the side wall part 2 is the same. The volume of the flow path 4 can be increased (the surface area of the side wall part 2 constituting the flow path 4 can be increased) compared to the case of the width configuration. As a result, the efficiency of heat exchange with the cooling fluid flowing through the flow path 4 can be improved.

  Further, when the flow path member 10 of the present embodiment is made of ceramics, in order to maintain or further improve the heat exchange efficiency, the ceramics constituting the side wall part 2 including the first side wall part 2a has high thermal conductivity. It is preferable to use ceramics. This is because the heat propagated to the lid part 1 is efficiently propagated to the side wall part 2, thereby enabling efficient heat exchange between the side wall part 2 and the fluid.

  For example, the side wall part 2 including the first side wall part 2a is a silicon carbide sintered body mainly composed of silicon carbide, and the lid body part 1 and the bottom plate part 3 are ceramic sintered bodies mainly composed of alumina. In this case, the flow path member 10 having excellent heat exchange efficiency can be obtained, and the flow path member 10 can be obtained by making the lid portion 1 and the bottom plate portion 3 with alumina whose raw material price is lower than that of silicon carbide. The manufacturing cost can be reduced.

  When the channel member 10 is made of ceramics, the crystal structure of the components including the main component is identified by cutting a sample of a predetermined size from the channel member 10 and measuring it with an X-ray diffractometer (XRD). Can be confirmed. The content of each element can be confirmed by measuring with an energy dispersive X-ray (EDS) attached to a scanning electron microscope (SEM). In addition, the content based on the crystal structure is obtained by calculating the content of each element using an ICP emission spectroscopic analyzer or a fluorescent X-ray analyzer and converting it to carbide, oxide, nitride, etc. based on the crystal structure. Can also be confirmed.

  2A and 2B show another example of the flow path member of the present embodiment, in which FIG. 2A is an external perspective view in a state cut in a direction perpendicular to the direction of fluid flow, and FIG. It is sectional drawing to which the part enclosed with the broken line in FIG.

  In the flow path member 20 of the present embodiment shown in FIG. 2, the width of the first side wall 2 a is gradually reduced from the bottom plate 3 to the lid 1.

  With such a configuration, the cooling fluid flowing in the flow path 4 is likely to generate turbulent flow, so that the heat exchange efficiency can be improved. Moreover, since the flow path 4 has a narrower width on the bottom plate part 3 side than the lid part 1 side, the flow rate on the bottom plate part 3 side becomes faster, and dust or the like is less likely to accumulate on the bottom plate part 3 side. Since the flow of the cooling fluid can be made smooth, the heat exchange efficiency can be increased.

  Further, as shown in FIG. 2B, the flow channel member 20 of the present embodiment has the narrowest width in contact with the lid portion 1 of the first side wall portion 2a with respect to the height 4b of the flow channel port 4a. It is preferable that the length in the height direction (hereinafter sometimes simply referred to as height) 2d in the part is 30% or more and 45% or less. If it is this range, it can be set as the reliable flow path member 20 provided with the heat exchange efficiency and mechanical strength which are required as a flow path member.

  In FIG. 1A and FIG. 2A, five of the seven side wall portions 2 are shown as first side wall portions 2a, and a part of the side wall portion 2 is the first side wall portion 2a. If the side wall portion 2a is used, the above-described effects can be obtained. However, all the side wall portions 2 are the first side wall portions 2a that are narrowed from the bottom plate portion 3 to the lid body portion 1. Needless to say, it may be.

  FIG. 3 shows still another example of the flow path member of the present embodiment, in which (a) is an external perspective view in a state cut in a direction orthogonal to the fluid flow direction, and (b) is (a) ) Is an enlarged cross-sectional view of a portion surrounded by a broken line.

  In the cross-sectional view of the flow path member 30 of the present embodiment shown in FIG. 3, the first side wall 2a is joined to at least the first stage on the lid 1 side and the first stage bottom plate 3 side. The second stage has at least a part of the first stage side of the second stage, and has a convex part 2f protruding toward the first stage. In addition, in FIG. 3, it has the 1st stage, the 2nd stage, and the 3rd stage joined to the baseplate part 3 side of the 2nd stage, and each 1st stage of the 2nd stage and the 3rd stage It has a shape having a convex portion 2f on the eye side.

  The flow path member 30 has a convex portion 2f that protrudes toward the first stage on at least a part of the first stage side of the second stage of the first side wall 2a. Suppresses breakage caused by the first stage shifting at the joint between the first stage and the second stage of the first side wall 2a when the lid body part 1 is subjected to a physical impact. In addition, the flow path member 30 with improved reliability can be obtained. The same effect can be obtained in the second stage. Furthermore, as shown in FIG. 3B, the surface area of the first side wall portion 2a can be increased by forming the convex portion 2f on the first step side of each of the second step and the third step. In addition, since the fluid flowing in the flow path 4 is likely to generate turbulent flow, the heat exchange efficiency between the first side wall portion 2a and the fluid can be improved.

  FIG. 4 shows still another example of the flow path member of the present embodiment, in which (a) is an external perspective view in a state cut in a direction orthogonal to the fluid flow direction, and (b) is (a). ) Is an enlarged cross-sectional view of a portion surrounded by a broken line.

  The flow path member 40 of the present embodiment shown in FIG. 4 shows an example in which a portion constituting the flow path 4 in the lid 1 is curved toward the flow path side.

  With such a configuration, the volume of the flow path 4 (surface area on the flow path 4 side of the lid portion 1) can be increased. Thereby, it is possible to improve the efficiency of heat exchange between the member to be heat exchanged and the fluid. Furthermore, when a high-pressure fluid is flowed through the flow path 4 or when the lid body portion 1 is subjected to a physical impact, etc., at the joint between the lid body portion 1 and the first side wall portion 2a, the first Breakage due to the shift of the side wall 2a can be suppressed, and the flow path member 40 with improved reliability can be obtained.

  In addition, in order to suppress the breakage of the flow path 4 and to suppress a decrease in heat exchange efficiency, the degree of curvature toward the flow path side in the portion constituting the flow path 4 in the lid 1 is 0.01 mm or more. And it is preferable that it is 20% or less with respect to the height 4b of the flow path 4. The degree of curvature is, for example, the distance between the line connecting the corners of the flow passage opening 4a on the lid 1 side and the perpendicular of the portion curved most to the flow passage side, as in the portion A shown in FIG. expressed.

  FIG. 5 is an external perspective view showing a state cut in a direction orthogonal to the fluid flow direction as still another example of the flow path member of the present embodiment, and FIG. The length in the height direction at the narrowest portion is a flow path member that gradually becomes shorter toward the center, and (b) is the height direction at the narrowest portion of the first side wall. Is a flow path member whose length gradually increases toward the center side.

  The flow path member 50 (50a, 50b) has a length in the height direction at the narrowest part of the first side wall 2a, and the first side wall 2a located at both ends is positioned at the center. By adopting a configuration that is gradually different toward the side wall portion 2a, the temperature gradient is inclined toward the center side or the end side (outside), and the temperature distribution of the member to be heat exchanged Can be made uniform.

  For example, when the object to be heat exchanged has a high temperature on the end side, a flow channel member 50a shown in FIG. The volume of the path 4 can be increased, and heat exchange on the end side can be made more effective.

  On the other hand, for example, when the object to be heat-exchanged has a high temperature on the center side, a configuration like the flow path member 50b shown in FIG. The volume of the flow path 4 to be increased can be increased, and the heat exchange on the center side can be made more effective.

Thus, if the form of FIG. 5 (a) or FIG. 5 (b) is appropriately used in accordance with the temperature distribution of the object to be heat exchanged, the temperature distribution of the object to be heat exchanged is used. Can be made uniform.

  FIG. 6 is an external perspective view showing a state cut in a direction orthogonal to the fluid flow direction as still another example of the flow path member of the present embodiment, and FIG. The width of the narrowest width portion of the flow path member is gradually increased toward the central portion of the flow path member, and (b) is the width of the first side wall portion of the narrowest width portion. Is a channel member that gradually becomes narrower toward the center of the channel member.

  The first side wall portion in which the width of the channel member 60 (60a, 60b) in the narrowest part of the width of the first side wall portion 2a is located at the center from the first side wall portion located at both ends. By gradually changing toward the direction, the temperature gradient is inclined toward the center side or the end side (outside), and the temperature distribution of the heat exchange target is made uniform. You can get closer.

  For example, when the object to be heat exchanged has a high temperature on the end side, the volume of the flow path at the center can be obtained by adopting a configuration like the flow path member 60a shown in FIG. Is small, in other words, the volume of the flow path on the end side (outside) can be made larger than that of the central portion, so heat exchange on the end side can be made more effective.

  On the other hand, for example, when the temperature of the object to be heat exchanged is high or low on the central side, a configuration like the flow path member 60b shown in FIG. Since the volume of the flow path can be made larger than the volume of the flow path on the end side (outside), heat exchange on the center side can be made more effective.

  Thus, by using the flow path member 60 in the form of FIG. 6 (a) or FIG. 6 (b) in accordance with the temperature distribution of the object to be heat exchanged, the heat exchange object can be efficiently obtained. The temperature distribution of the workpiece to be processed can be made closer to uniform. Heretofore, the width of the narrowest portion of the first side wall portion 2a has been described. However, in the case where the width of the first side wall portion 2a is changed in three stages as shown in FIG. Each of them may be gradually narrowed toward the central portion.

  In the above description, the first side wall 2a has a stepped shape. However, the shape of the first side wall 2a is not limited to this, and the first side wall 2a is tapered as shown in FIG. What is necessary is just to select the shape of the 1st side wall part 2a as needed.

  In addition, the shape of the 1st side wall part 2a and the curvature degree of the cover body part 1 can confirm the cut surface of each flow path member using a well-known optical microscope, a microscope, etc.

  FIG. 7 is a cross-sectional view showing a horizontal cross section with respect to the direction in which the fluid flows as still another example of the flow path member of the present embodiment, where (a) is a meandering flow path and (b) is a spiral. It is a channel.

  The flow path member 70 of the present embodiment shown in FIG. 7 is configured as a single flow path 4 in the flow path member.

For example, when the supply port is provided at a single location and distributed to the plurality of flow paths 4, the fluid tends to flow through the flow path where the pressure applied to the fluid is low, and there is a tendency that the heat exchange varies, as shown in FIG. Thus, if it forms as one flow path 4 in a flow path member, a fluid can be efficiently flowed to the whole flow path 4. FIG. Therefore, it is possible to improve the heat exchange efficiency between the member to be heat exchanged and the fluid. Further, the flow path member 70a having the meandering flow path 4 shown in FIG. 7A and the flow path member 70b having the spiral flow path 4 shown in FIG. Since the fluid can stay in the interior of the chamber for a long time, heat exchange can be performed efficiently.

  Moreover, it can be set as a heat exchanger by providing a metal member in the surface 1a or the inside of the cover part of the flow-path members 10-70 of this embodiment.

  In such a heat exchanger, for example, when a metal member is provided on the surface 1a of the lid 1 and a heat generating member is further disposed on the surface of the metal member, heat generated by the heat generating member is efficiently transferred to the metal member. Then, the transmitted heat is further transmitted to each side wall 2 through the lid 1. Thereby, it is possible to efficiently exchange heat with the fluid flowing through the flow path. Furthermore, since the flow path members 10 to 70 of the present embodiment are highly reliable, the heat exchanger is also highly reliable. In the heat exchanger of this embodiment, it is particularly effective when an electronic component that generates heat such as an LED element or a power semiconductor is disposed as the heat generating member.

  FIG. 8 is a schematic diagram illustrating an example of a semiconductor manufacturing apparatus including the heat exchanger according to the present embodiment.

  The semiconductor manufacturing apparatus 80 is a plasma processing apparatus for a wafer 82, and the wafer 82 is a heat exchanger 81 in which a metal member 11 is provided inside the lid portion 1 of the flow path members 10 to 70 of the present embodiment. An example is shown. The flow path members 10 to 70 have a supply tube 7 connected to the supply port 5 and a discharge tube 8 connected to the discharge port 6 so that a fluid such as a high-temperature or low-temperature gas or liquid can be passed through the flow-path members 10 to 70. The wafer 82 is heated or cooled by flowing in the flow path 4 included in the above.

  Further, an upper electrode 12 for generating plasma is provided above the wafer 82, and the metal member 11 inside the lid portion 1 of the flow path members 10 to 70 constituting the heat exchanger 81 is supplied with plasma. This is used as a lower electrode for generating, and a voltage is applied between the metal member 11 that is the lower electrode and the upper electrode 12, thereby generating the metal member 11 that is the lower electrode and the upper electrode 12. Plasma can be applied to the wafer 82. And since the heat exchanger 81 is provided with the flow path members 10 to 70 of the present embodiment, the metal member 11 as the lower electrode that becomes a high temperature during plasma processing can be maintained at a stable temperature. Further, since the temperature of the wafer 82 is also controlled, processing with high dimensional accuracy can be performed.

  Although FIG. 8 shows an example in which the metal member 11 is used as a lower electrode for plasma generation, if the metal member 11 is heated by flowing an electric current, the temperature of the fluid can be adjusted. Furthermore, if the lid 1 is formed of a dielectric material, the metal member 11 is used as an electrode for electrostatic attraction, and a voltage is applied to the metal member 11, the clonal force generated between the wafer 82 and the dielectric layer Alternatively, the wafer 82 can be attracted and held by electrostatic attraction such as Johnson or Rahbek force.

  Thus, since the heat exchanger 81 of this embodiment is provided with the metal member 11 inside the lid part 1 of the highly reliable flow path members 10 to 70 of this embodiment, the heat exchange efficiency. Therefore, it is possible to provide a heat exchanger 81 with high reliability that can withstand long-term use.

  The semiconductor manufacturing apparatus 80 of the present embodiment including the heat exchanger 81 of the present embodiment can be a highly reliable semiconductor manufacturing apparatus that does not interfere with the manufacture and inspection of semiconductor elements. Further, as the semiconductor manufacturing apparatus 80 of the present embodiment, there are a sputtering apparatus, a resist coating apparatus, a CVD apparatus, an etching processing apparatus, etc. in addition to the plasma processing apparatus of FIG. The effect mentioned above can be acquired by providing the heat exchanger 81 of a form.

Hereinafter, an example of the manufacturing method of the flow path member of this embodiment is shown. In the following description, except for the case specialized in the shape shown in FIGS. 1 to 7, the following flow path members will be described without reference numerals.

  First, in the production of the flow path member, the lid body 1 and a base body (hereinafter also simply referred to as a base body) having a recess formed integrally with the bottom plate part 3 and the side wall part 2 other than that are formed. After obtaining a body, the process of obtaining the molded object used as a flow-path member by joining the cover part 1 and a base | substrate using a bonding agent is demonstrated.

  Prepare a ceramic raw material with a purity of 90% or more and an average particle diameter of about 1 μm, and add a predetermined amount of sintering aid, binder, solvent, dispersant, etc. to this and mix the slurry, then spray granulation method (spray Spray-dried by a dry method) and granulated to be a primary raw material. Next, the spray-dried and granulated primary raw material is put into a rubber mold of a predetermined shape and molded by an isostatic press molding method (rubber press method), and then the molded body is removed from the rubber mold and cut. Apply.

  In this cutting process, with respect to the molded body serving as the base, the recesses forming the outer shape and the flow path are processed into desired shapes, and a fluid supply port and a discharge port are formed.

  Next, the cover member 1 of the flow path member is a green sheet produced by a roll compaction molding method after granulating a doctor blade method or a slurry which is a general ceramic molding method using an isostatic pressing method or slurry. The molded body obtained by the above is formed.

  Next, the molded body to be the lid portion 1 and the molded body to be the base are joined. As a bonding agent used for bonding, a ceramic raw material, a sintering aid, a binder, a dispersant, and a solvent used for producing the molded body to be the lid 1 and the molded body to be the base are weighed and mixed in predetermined amounts. A bonding agent made of the prepared slurry is used. Then, this bonding agent is applied to at least one joint portion of the molded body to be the lid body portion 1 and the molded body to be the base body constituting the bottom plate portion 3 and the side wall portion 2, and the bottom plate portion 3 and the side wall portion 2 are A bonded molded body is obtained in which the molded body to be the base body and the molded body to be the lid body 1 are integrated. And the flow-path member of this embodiment can be obtained by baking this joining molded object in the atmosphere according to a ceramic raw material.

  As another example of the manufacturing method, the molded body to be the lid portion 1 and the molded body to be the base body are fired in an atmosphere corresponding to the ceramic raw material in the same manner as described above, and the base body and the lid body portion 1 To obtain a sintered body. Thereafter, using a bonding agent made of glass, the bonding agent is applied to and integrated with at least one bonding portion of the base body and the sintered body of the lid portion 1, and heat treatment is performed. Can be obtained.

  Next, a method for producing the flow path members 10 to 60 by an extrusion molding method will be described.

  After preparing a mold that has a desired shape and obtaining a molded body by a known extrusion molding method, the molded body for sealing the open part is bonded using a bonding agent made of slurry and fired. Thus, the flow path members 10 to 60 can be obtained. Note that the molded body to be the lid body portion 1 obtained by the extrusion molding method and the molded body to be the base body by integrally forming the side wall portion 2 and the bottom plate portion 3 are bonded with clay in the mold. It corresponds to the manufacturing method of the flow path member of this embodiment.

  Further, in order to form a single flow path by connecting a plurality of flow paths in the flow path member, for example, after processing the side wall 2 of the molded body obtained by the extrusion molding method by cutting It can be obtained by bonding a molded body for sealing the open part using a bonding agent made of slurry and firing.

  As another example, a doctor blade method, which is a general ceramic molding method using slurry, or a slurry after granulating the slurry, a green sheet is formed by roll compaction molding, and the desired shape is obtained by laser processing or mold. Lamination may be performed using the processed molded body.

As an example of a method for preparing a slurry for obtaining a green sheet, first, the average particle size is 0.5.
A silicon carbide powder having a particle size of not less than μm and not more than 2 μm, and boron carbide and carboxylate powder as a sintering aid are prepared. The sintering aid is, for example, 0.12% by mass to 1.4% by mass of boron carbide powder and 1% by mass to 3.4% by mass of carboxylate powder with respect to 100% by mass of silicon carbide powder. Weigh and mix as above.

  Next, together with this mixed powder, a binder such as polyvinyl alcohol, polyethylene glycol, acrylic resin or butyral resin, water, and a dispersing agent are mixed in a ball mill, a rotating mill, a vibration mill or a bead mill. Here, the added amount of the binder may be such that the strength and flexibility of the molded body are good and that the debinding of the molding binder is not insufficient during firing. What is necessary is just to produce a green sheet using the slurry produced in this way.

  Next, a plurality of green sheets produced in this manner are stacked so as to form a desired flow path 4, but it is often necessary to stack so as to form the first side wall 2a of the flow path member. Accordingly, the thickness of each green sheet may be changed, or the number of green sheets to be stacked may be changed.

  If the side wall 2 for forming the flow path 4 is formed of only one green sheet, the green sheet is pressed using a tapered mold, and the output and focus of the laser are adjusted. By performing laser processing to process the irradiated portion of the green sheet so as to be tapered, a molded body for making the first side wall portion 2a can be obtained.

  When the flow path member 30 is obtained, the green sheet to be the first side wall 2a is subjected to grinding or laser processing in the state of the green sheet before being laminated, so that the first side wall 2a is convex. What was processed so that it may become part 2f should just be used.

  When the flow path member 40 is obtained, the green sheet in the state of the green sheet before being laminated is curved on the portion of the lid portion 1 that becomes the flow path, and is subjected to grinding or laser processing. Therefore, what is necessary is just to use what processed so that the site | part which comprises a flow path among the cover parts 1 may become curved toward the flow path side.

  In addition, a slurry similar to that used for producing the green sheet is applied as a bonding agent to the bonding surface of each green sheet, and after the green sheets are laminated, a flat plate-like pressurizing tool is used. A pressure of about 0.5 MPa is applied, followed by drying at room temperature of about 50 to 70 ° C. for about 10 to 15 hours.

  Next, the laminated green sheets to be the flow path members are baked in, for example, a known pusher type or roller type continuous tunnel furnace. Although the firing temperature differs depending on the material, for example, if silicon carbide is the main component, after holding in an inert gas atmosphere or vacuum atmosphere at a temperature range of 1800-2200 ° C. for 10 minutes to 10 hours And firing in a temperature range of 2200 to 2350 ° C. for 10 minutes to 20 hours.

Next, in the flow path member, the ceramics constituting the side wall part 2 (including the first side wall part 2a) are manufactured using ceramics having higher thermal conductivity than the lid body part 1 and the bottom plate part 3. A method will be described. In the description here, the case where the lid portion 1 and the bottom plate portion 3 are made of ceramic will be described.

  The part which comprises the cover part 1, the 1st side wall part 2a, the side wall part 2 except the 1st side wall part 2a, and the baseplate part 3 is cut and laser-processed by a well-known press method or a green sheet as needed. After forming, a molded body is prepared by laminating, and a ceramic sintered body is manufactured by firing in an atmosphere corresponding to each ceramic raw material. In addition, what is necessary is just to process the part used as a flow path by the well-known cutting process, the punching using a metal mold | die, or a laser. For example, the side wall part 2 (including the first side wall part 2a) is made by using a raw material mainly composed of silicon carbide, and then fired in an inert gas atmosphere or a vacuum atmosphere. The body part 1 and the bottom plate part 3 can obtain a sintered body by producing a molded body using a raw material mainly composed of alumina and firing it in an air atmosphere. Thereafter, using a bonding agent made of glass, at least one joint portion of each of the sintered bodies of the lid portion 1, the first sidewall portion 2 a, the sidewall portion 2 excluding the first sidewall portion 2 a, and the bottom plate portion 3. The flow path member of the present embodiment can be obtained by applying and bonding the bonding agent and heat-treating.

  In addition, in order to form a metal member on the surface 1a of the lid part of the flow path member of the present embodiment, tungsten, molybdenum, silver, copper or aluminum is formed by a known printing method, or an active metal method or a soldering method. What is necessary is just to join using the attaching method. Further, in order to provide the metal member 11 inside the lid portion 1, a hole or the like is formed inside the lid portion 1, and the formed hole or the like is filled with tungsten, molybdenum, silver, copper or aluminum. Good. By forming in this way, the heat exchanger 81 can be obtained.

  The flow path member of the present embodiment obtained as described above includes a first side wall portion 2a in which at least one of the plurality of side wall portions 2 is narrowed from the bottom plate portion 3 to the lid body portion 1; As a result, the width of the first side wall portion 2a in contact with the lid body portion 1 is narrow, so that the heat exchange efficiency on the lid body side can be improved, and the heat generation can be suppressed. Thereby, the thermal stress which arises in the connection part of the cover part 1 and a side wall part can be reduced, and it can be set as the flow path member which improved reliability. In addition, the heat exchanger 81 of the present embodiment is provided with a metal member on the surface or inside of the lid portion 1 of the flow path member of the present embodiment, so that the heat exchanger 81 with improved reliability can be obtained. it can. In addition, the semiconductor manufacturing apparatus 80 of the present embodiment includes the heat exchanger 81 of the present embodiment in which the metal member is provided inside the lid portion 1 of the flow path member, thereby manufacturing a highly reliable semiconductor element. And inspection.

10, 20, 30, 40, 50 (50a, 50b), 60 (60a, 60b), 70: flow path member 1: lid part 2: side wall part 2a: first side wall part 3: bottom plate part 4: flow Channel 4a: Channel port 5: Supply port 6: Discharge port 7: Supply tube 8: Discharge tube
11: Metal parts
80: Semiconductor manufacturing equipment
81: Heat exchanger
82: Wafer

Claims (7)

A flow path member having a flow path through which a fluid flows, including a lid body portion on which a workpiece is placed, a bottom plate portion, and a plurality of side wall portions connected to the lid body portion and the bottom plate portion. And in a cross-sectional view perpendicular to the direction in which the fluid flows,
The flow path member, wherein at least one of the plurality of side wall portions is a first side wall portion whose width gradually decreases from the bottom plate portion to the lid body portion. In the cross-sectional view, the first side wall portion has at least a first step on the lid body side and a second step joined to the first plate on the bottom plate portion side, and the second step the flow path member according to claim 1, wherein the first stage side, at least partially, characterized in that it has a protrusion protruding toward the first stage in the. The flow path member according to claim 1 or 2 , wherein a portion of the lid part that constitutes the flow path is curved toward the flow path side. In the cross-sectional view, three or more first side wall portions are provided, and the length in the height direction at the narrowest portion of the first side wall portion is from the first side wall portions located at both ends. the flow path member according to any one of claims 1 to 3, characterized in that different gradually towards the said first side wall portion located in the center. In the cross-sectional view, three or more first side wall portions are provided, and the width of the first side wall portion at the narrowest portion from the bottom plate portion to the lid body portion is located at both ends. the flow path member according to any one of claims 1 to 3, characterized in that different gradually towards the said first side wall portion located in the center of one of the side wall portion. A heat exchanger, wherein a metal member is provided on the surface or inside of the lid portion of the flow path member according to any one of claims 1 to 5 . The semiconductor manufacturing apparatus characterized by comprising a heat exchanger in which the metal member is provided inside the lid portion of the flow path member according to any one of claims 1 to 5.

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