JP6154248B2 - Channel member, heat exchanger using the same, and semiconductor manufacturing apparatus - Google Patents

Description

  The present invention relates to a flow path member, a heat exchanger using the same, and a semiconductor manufacturing apparatus.

  The flow path member having the flow path inside allows heat exchange between the flow path member and another member in contact with the flow path member by flowing a fluid through the flow path, thereby contacting the flow path member. The temperature of other members can be adjusted.

  For example, Patent Document 1 includes at least one semiconductor element and a pair of lead frames sandwiching the semiconductor element, and a semiconductor component molded with resin by exposing an outer surface of the lead frame, and a pair of lead frames. A ceramic tube having a refrigerant passage joined to the outer surface of each lead frame with a joining metal, and the thickness of the first wall of the refrigerant passage on the side joined to the lead frame of the ceramic tube is A semiconductor device smaller than the thickness of the second wall of the refrigerant passage facing the first wall is disclosed.

JP 2008-103623 A

  However, the semiconductor device of Patent Document 1 has improved the heat exchange efficiency because the thickness of the first wall is smaller than the thickness of the second wall of the refrigerant passage facing the first wall. In order to increase the heat exchange efficiency, when the pressure of the fluid flowing in the flow path is set to be high, there is a problem that the first wall is particularly easily damaged by the pressure from the fluid.

  Therefore, an object of the present invention is to provide a flow path member with improved reliability, a heat exchanger using the same, and a semiconductor manufacturing apparatus.

The flow path member of the present invention includes a lid body portion on which an object to be processed is placed, a bottom plate portion, and a plurality of side wall portions connected to the lid body portion and the bottom plate portion. A flow path member having a flow path, wherein at least one of the plurality of side wall portions is wide in a stepwise manner from the bottom plate portion to the lid body portion in a cross-sectional view orthogonal to the direction in which the fluid flows. It is the 1st side wall part which has become, It is characterized by the above-mentioned.
Further, the flow includes a lid part on which the workpiece is placed, a bottom plate part, and a plurality of side wall parts connected to the lid part and the bottom plate part, and has a flow path through which fluid flows. The channel member has a plurality of flow channel ports in a cross-sectional view orthogonal to the direction in which the fluid flows, and among the side wall portions sandwiched between the flow channel ports, at least the side wall portion positioned on the supply port side is The first side wall portion is widened from the bottom plate portion to the lid body portion, and the first side wall portion is a portion in contact with the lid body portion rather than the side wall portion located on the discharge port side. It is characterized by a wide width.

  The heat exchanger according to the present invention is characterized in that a metal member is provided on the surface or inside of the lid portion of the flow path member having the above-described configuration.

  The semiconductor manufacturing apparatus of the present invention is characterized by including a heat exchanger in which a metal member is provided inside the lid portion of the flow path member having the above configuration.

According to the flow path member of the present invention, since the lid portion is not easily damaged, the flow path member can be improved in reliability.

  Moreover, according to the heat exchanger of this invention, it can be set as the heat exchanger with improved reliability.

  Moreover, according to the semiconductor manufacturing apparatus of the present invention, a semiconductor manufacturing apparatus with improved reliability can be obtained.

An example of the flow path member of the present embodiment is shown, (a) is an external perspective view, and (b) is a cross-sectional view taken along line A-A 'shown in (a). Another example of the flow path member of this embodiment is shown, (a) is an external perspective view, and (b) is a cross-sectional view taken along line A-A ′ shown in (a). Another example of the flow path member of this embodiment is shown, (a) is a sectional view on the supply port side, and (b) is a sectional view on the discharge port side. Another example of the flow path member of this embodiment is shown, (a) is an external perspective view, and (b) is a cross-sectional view taken along line A-A ′ shown in (a). Another example of the flow path member of this embodiment is shown, (a) is an external perspective view, and (b) is a cross-sectional view taken along line A-A ′ shown in (a). As still another example of the flow path member of the present embodiment, it is a cross-sectional view showing a horizontal cross section with respect to the direction of fluid flow, (a) is a meandering flow path, (b) is a spiral flow path It is. It is the schematic which shows an example of a semiconductor manufacturing apparatus provided with the heat exchanger of this embodiment.

  Hereinafter, examples of embodiments of the flow path member of the present invention will be described.

  1A and 1B show an example of a flow path member of the present embodiment. FIG. 1A is an external perspective view, and FIG. 1B is a cross-sectional view taken along line A-A ′ shown in FIG. In the following drawings, the same components are described using the same reference numerals.

  As shown in FIG. 1, the flow path member 10 of the present embodiment includes a lid body portion 1 on which an object to be processed is placed, a bottom plate portion 3, and a plurality connected to the lid body portion 1 and the bottom plate portion 3. 1 is provided, and has a flow path 4 (in the cross-sectional view in FIG. 1B, shown as a flow path port 4a indicating a cross section of the flow path 4) through which the fluid flows. In a cross-sectional view orthogonal to the at least one side wall portion 2, at least one of the plurality of side wall portions 2 is a first side wall portion 2 a that is wide from the bottom plate portion 3 to the lid body portion 1. 2 to 5 including FIG. 1, an example is shown in which three of the five side walls 2 excluding the outer wall are the first side walls 2 a.

  Here, as shown in FIG. 1 (b), the first side wall portion 2a having a wide width from the bottom plate portion 3 to the lid portion 1 is a portion in contact with the bottom plate portion 3 of the first side wall portion 2a. The width 2c of the portion in contact with the lid body portion 1 is 2c and the width 2b of the portion in contact with the bottom plate portion 3 is 2c. It is wide. By satisfying such a configuration, the width of the portion in contact with the lid body portion 1 in the first side wall portion 2a is wide, and the connection area between the lid body portion 1 and the first side wall portion 2a is large. Since the lid 1 is not easily damaged, the flow path member 10 with improved reliability can be obtained. In particular, in order to improve the heat exchange efficiency, it is useful to use this configuration for the flow path member in which the thickness of the lid portion 1 is reduced.

Further, although the surface area of the portion that comes into contact with the fluid is relatively smaller in the lid body portion 1 than in the bottom plate portion 3, the lid body portion 1 is less likely to be damaged, so that a high-pressure fluid is allowed to flow. Therefore, heat exchange efficiency can be maintained. Therefore, the flow path member 10 with improved reliability while maintaining heat exchange efficiency can be obtained. In order to obtain a highly reliable flow path member 10 while maintaining heat exchange efficiency, when there are a plurality of side wall portions 2 excluding the outer wall, as shown in FIG. 2 is preferably the first side wall 2a. Needless to say, the outer wall may be the first side wall 2a.

  Further, as shown in FIG. 1B, in the flow path member 10 in which the height dimension 4b of the flow path opening 4a is longer than the width dimension of the flow path opening 4a on the bottom plate portion 3 side, Since the contact area with the fluid of the 1st side wall part 2a close | similar to the cover body part 1 in which an object is mounted can be made comparatively large, since heat exchange efficiency can be maintained highly, it is suitable.

Further, the dimension of the width 2b of the portion in contact with the bottom plate portion 3 of the first side wall portion 2a is 0.2 times or more of the height size 4b of the flow path port 4a, and the bottom plate portion 3 of the first side wall portion 2a. If the width of the portion of the first side wall portion 2a in contact with the lid portion 1 is in the range of 1.3 times to 3.0 times the width 2b of the portion in contact with the width 2b, heat exchange efficiency should be maintained high. In addition, the flow path member 10 having excellent mechanical strength that allows the lid 1 to withstand physical impact from the outside can be obtained.

  In addition, when there is a difference in heat distribution in the object to be processed, in addition to adjusting the interval between the side wall parts 2 as appropriate, the width of the first side wall part 2a is adjusted as appropriate. For example, when the temperature of the central portion of the object to be processed is high and the outside is low, the interval between the side wall portions 2 at the central portion of the flow path member 10 is widened, and the outer interval is narrowed. That's fine.

  Here, the lid part 1, the side wall part 2, and the bottom plate part 3 constituting the flow path member 10 can be made of metal, resin, ceramics, or the like. Moreover, the cover part 1, the side wall part 2, and the baseplate part 3 may be produced with the same material, and may be produced with another material. And when flowing highly corrosive gas or liquid to the flow path 4, it is suitable to produce each member with ceramics, and as ceramics, alumina, zirconia, silicon nitride, aluminum nitride, silicon carbide, cordierite, Mullite, boron carbide, or a composite thereof can be used.

In particular, the flow path member 10 of the present embodiment is preferably made of a silicon carbide sintered body mainly composed of silicon carbide. Here, a main component means the component which occupies in the ratio of 80 mass% or more among 100 mass% of all the components which comprise a sintered compact. And when the flow path member 10 of the present embodiment is made of a silicon carbide sintered body containing silicon carbide as a main component, in addition to excellent durability and corrosion resistance, the heat conductivity is high, so the heat exchange efficiency is high. An improved flow path member 10 can be obtained. In addition, since the silicon carbide sintered body has a specific gravity smaller than that of other ceramics, for example, alumina, and the weight of the flow path member 10 can be reduced, the large flow path member is obtained. Useful when 10 is needed.

  In addition, when the flow path member 10 of this embodiment consists of ceramics, in order to maintain or improve heat exchange efficiency high, it has high thermal conductivity as ceramics which comprise the side wall part 2 including the 1st side wall part 2a. It is preferable to use ceramics. This is because the heat propagated to the lid part 1 is efficiently propagated to the side wall part 2, thereby enabling efficient heat exchange between the side wall part 2 and the fluid. Further, when the thickness of the lid portion 1 is reduced to improve the heat exchange efficiency, it is preferable to produce the side wall portion 2 using a ceramic having a higher thermal conductivity than the lid portion 1. It is.

  For example, the side wall part 2 including the first side wall part 2a is a silicon carbide based sintered body mainly composed of silicon carbide, and the lid body part 1 and the bottom plate part 3 are alumina based sintered bodies mainly composed of alumina. Then, the flow path member 10 having excellent heat exchange efficiency can be obtained, and the cover body portion 1 and the bottom plate portion 3 are made of alumina whose raw material price is lower than that of silicon carbide. 10 manufacturing costs can be reduced.

  When the channel member 10 is made of ceramics, the crystal structure of the components including the main component is identified by cutting a sample of a predetermined size from the channel member 10 and measuring it with an X-ray diffractometer (XRD). Can be confirmed. The content of each component element can be confirmed by measuring with an energy dispersive X-ray analyzer (EDS) attached to a scanning electron microscope (SEM). In addition, the content of each element can be determined using an ICP emission spectroscopic analyzer or a fluorescent X-ray analyzer, and the content can be confirmed by converting to carbide, oxide, nitride, etc. based on the crystal structure. it can.

  2A and 2B show another example of the flow path member of the present embodiment. FIG. 2A is an external perspective view, and FIG. 2B is a cross-sectional view taken along line A-A ′ shown in FIG.

  The flow path member 20 of the present embodiment shown in FIG. 2 is arranged such that the width of the first side wall 2a is gradually increased from the bottom plate 3 to the lid 1.

  With such a configuration, the fluid flowing in the flow path is likely to cause turbulence, and the width of the flow path on the lid body 1 side is narrowed, so that the fluid tends to flow faster. Therefore, in addition to the effect obtained by the configuration shown in FIG. 1, the heat exchange efficiency between the object to be processed and the fluid placed on the lid 1 of the flow path member 10 can be increased. it can. In addition, the heat exchange efficiency can be improved because the surface area of the first side wall 2a can be increased.

Further, as shown in FIG. 2B, the flow path member 20 of the present embodiment has a width of a portion in contact with the bottom plate part 3 of the first side wall part 2a with respect to the height dimension 4b of the flow path port 4a. When the dimension 2b is 0.2 times or more, the height 2d of the narrowest portion of the first side wall 2a on the side of the bottom plate 3 is preferably 30% or more and 45% or less. If it is this range, it can be set as the reliable flow path member 20 provided with the heat exchange efficiency and mechanical strength which are required as a flow path member.

  3A and 3B show another example of the flow path member of the present embodiment. FIG. 3A is a cross-sectional view on the supply port side, and FIG. 3B is a cross-sectional view on the discharge port side.

  The flow path member 30 of this embodiment shown in FIG. 3 has a plurality of flow path ports 4a in a cross-sectional view, and among the side wall portions 2 sandwiched between the flow path ports 4a, the side wall portion 2 located on the supply port side is the first. 1 and the first side wall portion 2a is wider at the portion in contact with the lid portion 1 than the side wall portion 2 located on the discharge port side. As shown in FIG. 3, in the case where a plurality of flow paths 4 are provided, the comparison of the widths of the portions in contact with the lid body portion 1 may be performed on the same first side wall portion 2a. In the flow path member having one flow path, the side wall portions 2 sandwiched by the flow path ports 4a in the cross-sectional view on the supply port side and the discharge port side may be compared.

  With such a configuration, the side wall portion 2 sandwiched between the flow path ports 4a is the first side wall portion 2a, and the portion in contact with the lid body portion 1 rather than the side wall portion 2 located on the discharge port side. Since the width is wide, the greatest pressure is applied when the fluid is supplied, and the damage due to the pressure of the fluid can be suppressed, and the reliability can be improved, particularly on the supply port side which is easily damaged.

  4A and 4B show another example of the flow path member of the present embodiment. FIG. 4A is an external perspective view, and FIG. 4B is a cross-sectional view taken along line A-A ′ shown in FIG.

In the flow path member 40 of the present embodiment shown in FIG. 4, the first side wall 2a is joined to at least the first stage on the bottom plate part 3 side and the first-stage lid part 1 side in a cross-sectional view. And at least part of the first stage side of the second stage has a convex portion 2e that protrudes toward the first stage. In addition, in FIG. 4, it has the shape which has 3 steps | paragraphs and has the convex part 2e in the 1st step side of each of the 2nd step and the 3rd step.

  The flow path member 40 has a convex portion 2e protruding toward the first stage on at least a part of the first stage side in the second stage of the first side wall portion 2a, so that a fluid with a high pressure is provided. Suppresses breakage caused by the first stage shifting at the joint between the first stage and the second stage of the first side wall 2a when the lid body part 1 is subjected to a physical impact. In addition, the flow path member 40 with improved reliability can be obtained. Similar effects can be obtained in the second and third stages. Furthermore, as shown in FIG. 4B, the surface area of the first side wall portion 2a can be increased by forming the convex portion 2e on the first step side of each of the second step and the third step. In addition, since the fluid flowing in the flow path 4 is likely to generate turbulent flow, the heat exchange efficiency between the first side wall 2a and the fluid can be improved.

  5A and 5B show another example of the flow path member of the present embodiment. FIG. 5A is an external perspective view, and FIG. 5B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In the flow path member 50 of the present embodiment shown in FIG. 5, in a cross-sectional view, at least a part of the first side wall portion 2 a is inwardly facing the lid body portion 1 side at the joint portion 2 f with the lid body portion 1. It is curved. With such a configuration, the surface area of the flow path can be increased. Thereby, the heat exchange efficiency with the 1st side wall part 2a and the cover body part 1, and a fluid can be improved. Furthermore, for example, in FIG. 5, the angle of the corner portion formed by the first side wall portion 2 a and the lid portion 1 in the flow path can be an acute angle. At the joint between the lid body portion 1 and the side wall portion 2, cracks may occur on the lid body portion 1 side, but at least a part of the first side wall portion 2 constituting the flow path 4 is in contact with the lid body portion 1. By bending inward toward the lid portion 1 at the joint portion, the direction of the stress generated in the corner portion can be tilted, and the crack propagation distance can be increased. Thereby, since the breakage of the flow path member 50 can be suppressed, the reliability can be improved.

  In addition, the shape etc. of the 1st side wall part 2a demonstrated so far can confirm the cut surface of each flow path member using a well-known optical microscope, a microscope, etc. FIG.

  FIG. 6 is a cross-sectional view showing a horizontal cross section with respect to the lid portion and the bottom plate portion as still another example of the flow path member of the present embodiment, where (a) is a meandering flow path, (b) Is a spiral channel.

  The flow path member 60 of the present embodiment shown in FIG. 6 shows an example in which the flow paths are connected in the flow path member 60 and formed as a single flow path 4.

  For example, when the supply port is provided at a single location and distributed to the plurality of flow paths 4, the fluid tends to flow through the flow path where the pressure applied to the fluid is low, and there is a tendency that the heat exchange varies, as shown in FIG. Thus, if it is formed as one flow path 4 connected in the flow path member 60, the fluid can efficiently flow through the entire flow path. Therefore, it is possible to improve the heat exchange efficiency between the member to be heat exchanged and the fluid. Further, the flow path member 60a having the meandering flow path 4 shown in FIG. 6A or the flow path member 60b having the spiral flow path 4 shown in FIG. Since the fluid can stay for a long time in 60, heat exchange can be performed efficiently.

  Moreover, it can be set as a heat exchanger by providing a metal member in the surface 1a or the inside of the cover part of the flow path member 10, 20, 30, 40, 50, 60 of this embodiment.

In such a heat exchanger, for example, when a metal member is provided on the surface 1a of the lid 1 and a heat generating member is further disposed on the surface of the metal member, heat generated by the heat generating member is efficiently transferred to the metal member. Then, the transmitted heat is further transmitted to each side wall 2 through the lid 1. Thereby, it is possible to efficiently exchange heat with the fluid flowing through the flow path. Furthermore, since the flow path members 10, 20, 30, 40, 50, 60 of this embodiment are highly reliable, the heat exchanger is also highly reliable. In the heat exchanger of this embodiment, it is particularly effective when an electronic component that generates heat such as an LED element or a power semiconductor is disposed as the heat generating member.

  FIG. 7 is a schematic diagram illustrating an example of a semiconductor manufacturing apparatus including the heat exchanger according to the present embodiment.

  The semiconductor manufacturing apparatus 70 is a plasma processing apparatus for a wafer 72, and the wafer 72 has a metal member 11 inside the lid portion 1 of the flow path members 10, 20, 30, 40, 50, 60 of this embodiment. An example in which the heat exchanger 71 is provided is shown. The flow path members 10, 20, 30, 40, 50, 60 have a supply tube 7 connected to the supply port 5 and a discharge tube 8 connected to the discharge port 6. The wafer 72 is heated or cooled by flowing through the flow path 4 provided in the flow path members 10, 20, 30, 40, 50, 60.

  In addition, an upper electrode 12 for generating plasma is provided above the wafer 72, and inside the lid portion 1 of the flow path members 10, 20, 30, 40, 50, 60 constituting the heat exchanger 71. A metal member 11 is used as a lower electrode for generating plasma, and a voltage is applied between the metal member 11 serving as the lower electrode and the upper electrode 12, whereby the metal member 11 serving as the lower electrode and the upper electrode are applied. Plasma generated between the electrodes 12 can be applied to the wafer 72. And since the heat exchanger 71 includes the flow path members 10, 20, 30, 40, 50, 60 of this embodiment, the metal member 11 as the lower electrode that becomes high temperature during plasma processing is stabilized. Can be maintained at temperature. Further, since the temperature of the wafer 72 is also controlled, processing with high dimensional accuracy can be performed.

  Although FIG. 7 shows an example in which the metal member 11 is used as a lower electrode for generating plasma, if the metal member 11 is heated by flowing an electric current, the temperature of the fluid can be adjusted. Furthermore, if the lid 1 is formed of a dielectric material, the metal member 11 is used as an electrode for electrostatic attraction, and a voltage is applied to the metal member 11, the clonal force generated between the wafer 72 and the dielectric layer The wafer 72 can also be attracted and held by an electrostatic attraction force such as the John Larbeck force.

  As described above, the heat exchanger 71 of the present embodiment is provided with the metal member 11 inside the lid portion 1 of the highly reliable flow path members 10, 20, 30, 40, 50, 60 of the present embodiment. Therefore, the heat exchanger 71 having high heat exchange efficiency and high reliability that can withstand long-term use can be obtained.

  The semiconductor manufacturing apparatus 70 of the present embodiment including the heat exchanger 71 of the present embodiment can be a highly reliable semiconductor manufacturing apparatus that does not interfere with the manufacture and inspection of semiconductor elements. Further, as the semiconductor manufacturing apparatus 70 of the present embodiment, there are a sputtering apparatus, a resist coating apparatus, a CVD apparatus, an etching processing apparatus, etc. in addition to the plasma processing apparatus of FIG. By providing the heat exchanger 71 of the form, the above-described effects can be obtained.

  Hereinafter, an example of the manufacturing method of the flow path member of the present embodiment will be shown (in the following description, the following flow path members are denoted by reference numerals except when specialized in the shape shown in FIGS. 1 to 6. I'll explain it first.)

First, in the manufacture of the flow path members 10, 20, 30, 40 and 60, a base plate having a recess (hereinafter simply referred to as a bottom plate portion 3, a lid portion 1 and a side wall portion 2 formed integrally therewith). And the base plate portion 3 and the base body using a bonding agent to obtain the molded body to become the flow path members 10, 20, 30, 40 and 60. A process for obtaining a post-sintered body will be described.

  Prepare a ceramic raw material with a purity of 90% or more and an average particle diameter of about 1 μm, and add a predetermined amount of sintering aid, binder, solvent, dispersant, etc. to this and mix the slurry, then spray granulation method (spray Spray-dried by a dry method) and granulated to be a primary raw material. Next, the spray-dried and granulated primary raw material is put into a rubber mold of a predetermined shape and molded by an isostatic press molding method (rubber press method), and then the molded body is removed from the rubber mold and cut. Apply.

  In this cutting process, with respect to the molded body serving as the base, the recesses forming the outer shape and the flow path are processed into desired shapes, and a fluid supply port and a discharge port are formed.

  Next, the bottom plate portion of the flow path members 10, 20, 30, 40 and 60 is subjected to roll compaction after granulation of a doctor blade method or slurry, which is a general ceramic forming method using a hydrostatic press method or slurry. A molded body obtained by a green sheet produced by a molding method is formed.

  Next, the molded body to be the base and the molded body to be the bottom plate portion 3 are joined. As a bonding agent used for bonding, a predetermined amount of a ceramic raw material, a sintering aid, a binder, a dispersing agent, and a solvent used for producing a molded body to be a base body and a molded body to be a bottom plate portion 3 are weighed and mixed. A bonding agent is used. Then, this bonding agent is applied to at least one joint portion of the molded body that becomes the base body and the molded body that becomes the bottom plate portion 3 constituting the lid portion 1 and the side wall portion 2, and the molded body and the bottom plate portion 3 that become the base body. A bonded molded body integrated with the molded body to be obtained is obtained. Then, by firing this bonded molded body in an atmosphere corresponding to the ceramic raw material, the flow path members 10, 20, 30, 40 and 60 of the present embodiment can be obtained.

  In addition, as another example of the manufacturing method, after forming a molded body to be a base constituting the lid body portion 1 and the side wall portion 2 and a molded body to be the bottom plate portion 3 by the same method as described above, Firing is performed in an appropriate atmosphere to obtain a sintered body of the base body and the bottom plate portion 3. Thereafter, using a bonding agent made of glass, the bonding agent is applied to and integrated with at least one bonding portion of the base and the sintered body of the bottom plate portion 3, and the flow path member of this embodiment is formed by heat treatment. Can be obtained.

  Next, a method for producing the flow path members 10, 20, 40 and 50 using the extrusion molding method will be described.

  A flow path member 10, 20, 40 and 50 can be obtained by preparing a mold that has a desired shape, obtaining a molded body of the substrate by a known extrusion molding method, and firing it. In addition, the molded body which is integrally formed with the lid body part 1, the side wall part 2 and the bottom plate part 3 obtained by the extrusion molding method is formed by bonding clay in the mold, This corresponds to the manufacturing method of the flow path member of the present embodiment.

  Furthermore, in order to connect a plurality of flow paths in the flow path member to form a single flow path, for example, after processing the side wall portion 2 of the molded body obtained by the extrusion molding method by cutting, It can be obtained by bonding a molded body for sealing the open part using a bonding agent made of slurry and firing.

As another example, a doctor blade method, which is a general ceramic molding method using slurry, and a green sheet is formed by roll compaction molding after granulating the slurry, and then molded into a desired shape using a die It may be laminated using a body.

For example, as an example of this, as a method for producing a slurry, first, the average particle size is 0.5 μm or more 2
A silicon carbide powder having a size of μm or less and boron carbide and carboxylate powder as a sintering aid are prepared. Then, for example, with respect to 100% by mass of silicon carbide powder, each powder may be 0.12% by mass to 1.4% by mass of boron carbide powder, and 1% by mass to 3.4% by mass of carboxylate powder. Weigh and mix to obtain a mixed powder.

  Next, together with this mixed powder, a binder such as polyvinyl alcohol, polyethylene glycol, acrylic resin or butyral resin, water, and a dispersing agent are mixed in a ball mill, a rotating mill, a vibration mill or a bead mill. Here, the amount of the binder added is such that the strength and flexibility of the molded body are good, and it is sufficient that the molding binder is not sufficiently degreased during firing. May be used.

  A plurality of green sheets thus produced are laminated so as to form a desired flow path 4, but it is preferable that the green sheets be formed so as to form the first side wall portion 2a of the flow path member. The thickness of each green sheet may be changed, or the number of green sheets to be stacked may be changed. When the flow path members 40 and 50 are obtained, the green sheet is ground or laser processed in the state of the green sheet before being laminated, and the convex portion 2e or the side wall of the first side wall portion 2a is obtained. What is necessary is just to use what was processed so that at least one part of a part might become the shape which curves inside toward a cover body part in a junction part with a cover body part.

  In addition, a slurry similar to that used for producing the green sheet is applied as a bonding agent to the bonding surface of each green sheet, and after the green sheets are laminated, a flat plate-like pressurizing tool is used. A pressure of about 0.5 MPa is applied, followed by drying at room temperature of about 50 to 70 ° C. for about 10 to 15 hours.

  Next, the laminated green sheets to be the flow path members are baked in, for example, a known pusher type or roller type continuous tunnel furnace. Although the firing temperature differs depending on the material, for example, if silicon carbide is the main component, after holding in an inert gas atmosphere or vacuum atmosphere at a temperature range of 1800-2200 ° C. for 10 minutes to 10 hours And firing in a temperature range of 2200 to 2350 ° C. for 10 minutes to 20 hours.

  Next, a manufacturing method in the case where a ceramic having a high thermal conductivity is used as the ceramic constituting the side wall 2 (including the first side wall 2a) in the flow path member will be described. In the description here, the case where the lid portion 1 and the bottom plate portion 3 are made of ceramic will be described.

  The cover body 1, the first side wall portion 2a, the side wall portion 2 excluding the first side wall portion 2a, and the parts constituting the bottom plate portion 3 are ground or laser processed as necessary using a known pressing method or green sheet. After forming, a molded body is prepared by laminating, and a ceramic sintered body is manufactured by firing in an atmosphere corresponding to each ceramic raw material. For example, the side wall part 2 (including the first side wall part 2a) is made by using a raw material mainly composed of silicon carbide, and then fired in an inert gas atmosphere or a vacuum atmosphere. The body part 1 and the bottom plate part 3 can obtain a sintered body by producing a molded body using a raw material mainly composed of alumina and firing it in an air atmosphere. Thereafter, using a bonding agent made of glass, at least one of the sintered bodies of the lid body 1, the first side wall 2a, the side wall 2 excluding the first side wall 2a, and the bottom plate 3 is joined. The flow path member of the present embodiment can be obtained by applying and bonding the bonding agent and heat-treating.

  Here, for example, in order to provide the metal member 11 on the surface 1a of the lid portion 1 of the flow path member of the present embodiment, tungsten, molybdenum, silver, copper or aluminum is formed by a known printing method or activated. Bonding may be performed using a metal method or a brazing method. Further, in order to provide the metal member 11 inside the lid portion 1, a hole or the like is formed inside the lid portion 1, and the formed hole or the like is filled with tungsten, molybdenum, silver, copper or aluminum. Good. By forming in this way, the heat exchanger 71 can be obtained.

  The flow path member of the present embodiment obtained as described above includes a first side wall portion 2a in which at least one of the plurality of side wall portions 2 is wide from the bottom plate portion 3 to the lid body portion 1; As a result, since the width of the portion of the first side wall portion 2a in contact with the lid body portion 1 is wide, the lid body portion 1 is not easily damaged, so that the flow path member with improved reliability can be obtained. . In addition, the heat exchanger 71 of the present embodiment is provided with a metal member on the surface or inside of the lid portion 1 of the flow path member of the present embodiment, so that the heat exchanger 71 with improved reliability can be obtained. it can. In particular, since the semiconductor manufacturing apparatus 70 includes the heat exchanger 71 of the present embodiment, highly reliable semiconductor elements can be manufactured and inspected.

10, 20, 30, 40, 50, 60: flow path member 1: lid part 2: side wall part 2a: first side wall part 2e: convex part 2f: joint part 3: bottom plate part 4: flow path 4a: flow Roadway 5: Supply port 6: Discharge port 7: Supply tube 8: Discharge tube
11: Metal parts
12: Electrode
70: Semiconductor manufacturing equipment
71: Heat exchanger
72: Wafer

Claims (7)

A flow path member having a flow path through which a fluid flows, including a lid body portion on which a workpiece is placed, a bottom plate portion, and a plurality of side wall portions connected to the lid body portion and the bottom plate portion. And in a cross-sectional view perpendicular to the direction in which the fluid flows,
At least one of the plurality of side wall portions is a first side wall portion whose width gradually increases from the bottom plate portion to the lid body portion. A flow path member having a flow path through which a fluid flows, including a lid body portion on which a workpiece is placed, a bottom plate portion, and a plurality of side wall portions connected to the lid body portion and the bottom plate portion. And having a plurality of flow passage openings in a cross-sectional view orthogonal to the direction in which the fluid flows,
Of the side wall portions sandwiched between the flow path ports, at least a side wall portion located on the supply port side is a first side wall portion that is wide from the bottom plate portion to the lid body portion, The flow path member characterized in that the first side wall portion has a wider width in a portion in contact with the lid body portion than the side wall portion located on the discharge port side. Among the side wall portions sandwiched between the flow path ports in the cross-sectional view, a side wall portion located on the supply port side is the first side wall portion, and the first side wall portion 2. The flow path member according to claim 1, wherein the side wall portion is wider in a portion in contact with the lid body portion than the side wall portion located on the discharge port side. In the cross-sectional view, the first side wall portion has at least a first step on the bottom plate portion side and a second step joined to the lid portion side of the first step, the second step wherein at least a portion of the first stage side, the flow path member according to claim 1 or 3, characterized in that it has a protrusion protruding toward the first stage in the.   2. The cross-sectional view, wherein at least a part of the first side wall portion is curved inward toward the lid body portion at a joint portion with the lid body portion. Item 5. The flow path member according to any one of Items 4 to 5.   A heat exchanger, wherein a metal member is provided on the surface or inside of the lid portion of the flow path member according to any one of claims 1 to 5.   A semiconductor manufacturing apparatus comprising a heat exchanger in which a metal member is provided inside the lid portion of the flow path member according to claim 1.

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