WO2004106247A1 - シリコン単結晶引上げ用石英ガラスルツボ - Google Patents
シリコン単結晶引上げ用石英ガラスルツボ Download PDFInfo
- Publication number
- WO2004106247A1 WO2004106247A1 PCT/JP2004/006947 JP2004006947W WO2004106247A1 WO 2004106247 A1 WO2004106247 A1 WO 2004106247A1 JP 2004006947 W JP2004006947 W JP 2004006947W WO 2004106247 A1 WO2004106247 A1 WO 2004106247A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- quartz glass
- single crystal
- concentration
- layer
- glass crucible
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2201/00—Type of glass produced
- C03B2201/02—Pure silica glass, e.g. pure fused quartz
- C03B2201/03—Impurity concentration specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/90—Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/08—Quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
Definitions
- the present invention relates to a quartz glass crucible used for pulling a silicon single crystal.
- CZ method Czochralski method
- a silicon polycrystal is melted in a crucible made of quartz glass, a silicon single crystal seed crystal is immersed in the silicon melt, and the seed crystal is gradually pulled up while rotating the crucible to form a silicon single crystal.
- This is a method of growing crystals using seed crystals as nuclei.
- the single crystal produced by the CZ method needs to be high-purity and capable of producing silicon wafers with good yield, and the quartz glass crucible used for the production has a transparent inner layer and a bubble-free layer. Quartz glass crucibles with a two-layer structure consisting of an opaque outer layer are generally used!
- the transparent inner layer has a two-layer structure of synthetic quartz glass and the outer layer has a two-layer structure of natural quartz glass.
- the boundary between the two layers is distorted due to the difference in viscosity due to the A1 concentration in the curved part of the crucible, especially when the heat load is high due to the heater and the contact time with the silicon melt is long. Is deformed into distortion, causing large undulation on the inner surface of the crucible, and the single crystal step There was a problem that the retention was reduced.
- Patent Document 1 Patent No. 2811290, Patent No. 2933404
- Patent Document 2 JP-A-11-199368
- the present inventors have conducted intensive studies and as a result, at least in the curved portion of the quartz glass crucible for pulling a silicon single crystal, a transparent inner layer having a low A1 concentration, an outer opaque layer having a high A1 concentration, and It has been found that by providing an intermediate layer having an intermediate A1 concentration between the two layers, the deformation of the transparent inner layer can be easily prevented. Furthermore, even if the contact area between the quartz glass crucible and the silicon melt is reduced by reducing the thickness of the transparent inner layer of the quartz glass crucible from the lower part to the upper part of the crucible, the melting amount of the quartz glass crucible does not change.
- the present invention can suppress the formation of oxygen and can make the oxygen concentration in the length direction of the single crystal uniform, and have completed the present invention. That is, [0008]
- the present invention provides a silicon single crystal in which the deformation of the transparent inner layer is small, the change in the amount of melting of the quartz glass crucible accompanying the pulling of the single crystal is suppressed, and the oxygen concentration in the length direction of the single crystal can be made uniform.
- An object of the present invention is to provide a quartz glass crucible for pulling.
- the present invention provides a quartz glass crucible used for pulling a silicon single crystal, which has at least a curved portion force, a synthetic quartz glass force, a transparent inner layer having a low A1 concentration, a natural or natural synthetic mixed quartz glass.
- the quartz glass crucible for pulling a silicon single crystal of the present invention has at least a curved portion made of synthetic quartz glass, a transparent inner layer having a low A1 concentration, and natural or natural synthetic mixed quartz glass having an A1 concentration.
- C is a quartz glass crucible in the range of 20 ppm.
- the concentration of other elements increases, which adversely affects the quality of silicon single crystals.
- the A1 concentration of the transparent inner layer, the transparent or opaque intermediate layer made of natural or natural synthetic mixed quartz glass, and the opaque outer layer that also has natural quartz glass force can be adjusted by mixing silica powder with silica powder if necessary.
- a method of hydrolyzing, drying and calcining a homogeneous solution of the A1 conjugate and a method of coating the silica powder with the A1 compound after immersing the silica powder in the solution of the A1 conjugate. Etc. can be adjusted.
- an A1-containing synthetic silica glass for example, a method is employed in which a predetermined amount of aluminum chloride is added to a tetrachloride silicon solution, mixed uniformly, then hydrolyzed, dried, and fired. It is preferable to obtain a synthetic quartz glass having a uniform and desired A1 concentration.
- the A1 concentration C of the opaque outer layer is as high as 12 to 20 ppm.
- the distortion at the boundary between the layers can be further reduced.
- the A1 concentration C of the opaque outer layer is set
- the crucible can quickly adapt to the outer carbon crucible, which can reduce defects in the initial process. Also, in this case, since the difference between C and the binding is not so large, the intermediate layer is not easily formed.
- a transparent layer is more cost effective.
- the synthetic quartz glass is used.
- the thickness of the transparent inner layer with low A1 concentration gradually decreases from the bottom to the top of the crucible. More specifically, the bottommost force at the bottom of the crucible base is also 0 to 0.25H with respect to the height (H) up to the top surface of the direct acting portion. .5H average thickness T 2 0.
- the thickness of the transparent inner layer gradually decreases as going upward.
- the thickness of the transparent inner layer In pulling a silicon single crystal, by setting the thickness of the transparent inner layer within the above range, when the polycrystalline silicon is melted and melted, the thin T 3 is almost dissolved, and the A1 concentration is high and the melt is high. The intermediate layer, which is hardly soluble in water, is exposed. So
- the oxygen concentration of the silicon single crystal is governed by the leaching of the transparent inner layer below the crucible, and the change in the amount of crucible leaching accompanying the progress of the silicon single crystal can be suppressed.
- the thickness of the transparent inner layer is graded to T 1> T 2> ⁇ 3 to allow the exposure of the intermediate layer.
- the function as the relaxing portion is optimized.
- the present invention has a three-layer structure having at least a transparent inner layer having a low A1 concentration, an opaque outer layer having a high A1 concentration, and an intermediate layer having an intermediate A1 concentration between the two layers at least in the curved portion. More preferably, the thickness of the transparent inner layer, the silicon being thinner from the bottom to the top of the crucible.
- This is a quartz glass crucible for pulling a single crystal.
- the quartz glass crucible for pulling a silicon single crystal of the present invention has a small deformation of the transparent inner layer under heat load, and has a reduced contact area with the silicon melt. The change in the amount of penetration is suppressed, the oxygen concentration in the length direction of the single crystal can be maintained uniform, and the silicon single crystal can be pulled up with a high crystallization rate.
- FIG. 1 shows a quartz glass crucible for pulling a silicon single crystal of the present invention.
- 1 is a quartz glass crucible
- 2 is the bottom of the crucible
- 3 is a straight body
- 4 is an opaque outer layer made of natural quartz glass
- 5 is a transparent or opaque intermediate layer made of natural or natural synthetic quartz glass
- 6 is a synthetic stone.
- 7 is a curved portion.
- FIG. 2 shows an apparatus for manufacturing the quartz glass crucible.
- 8 is a rotating mold
- 9 is a crucible substrate
- 10 and 15 are silica powder supply means
- 11 is a plate-like lid
- 12 is a flow control valve
- 13 is a power supply
- 14 is an arc electrode
- 16 is a high temperature.
- the quartz glass crucible for pulling a silicon single crystal of the present invention is obtained by introducing natural silica powder into a rotating mold 8, forming the crucible shape, inserting an arc electrode 14 into the crucible shape, and opening the crucible-shaped body. Is covered with a plate-like lid 11, and the internal cavity of the crucible-shaped body is made into a high-temperature gas atmosphere by an arc electrode 14 to at least partially melt vitrify to form a translucent crucible substrate 9, and then supply silica powder.
- the natural or natural synthetic mixed silica powder is supplied to the high-temperature atmosphere 16 while adjusting the supply amount with the flow rate regulating valve 12 from the means 10, and is melted and vitrified to form a transparent or opaque intermediate layer.
- the transparent powder is supplied from the silica powder supply means 15 to the high-temperature atmosphere 16 and is melted and vitrified to form a transparent layer that also has a synthetic quartz glass strength.
- the range of 0-0.25H is the average thickness T1 and the range of 0.5-10.5mm is this, and the range of 0.25-0.5H is the average thickness T2. 0.3-1 2mm [this, 0.5
- the average thickness T 3 in the range of 1H is set to 0—0.9 mm, and T 1> T 2> ⁇ 3
- Example 1 is manufactured by setting the thickness of the transparent inner layer so as to decrease from the bottom to the top.
- the polycrystalline silicon was filled and melted, and the single crystal was pulled five times by the CZ method.
- the average single crystallinity was 94% and the oxygen concentration distribution in the single crystal was uniform.
- a quartz glass crucible for pulling a 24-inch silicon single crystal was prepared.
- C of the crucible is 0
- a 24-inch silicon single crystal bow I raising quartz glass crucible was prepared in the same manner as in Example 2 except that the quartz glass crucible was not provided with a natural transparent intermediate layer.
- C of the crucible was 0.02 ppm and C was 14 ppm. Using this quartz glass crucible
- the purified high-purity natural silica powder is put into a rotating mold 8, formed into a quartz glass crucible shape by centrifugal force, and furthermore, natural synthetic mixed silica is placed inside.
- the powder is charged and a natural synthetic mixed silica layer of about 3 mm is formed by the same centrifugal force, the arc electrode 14 is inserted into the layer, the opening is covered with a plate-like lid 11, and the internal cavity is formed by the arc electrode 14.
- the inside was made into a high-temperature gas atmosphere, melt-vitrified, and cooled to produce an opaque quartz glass crucible-shaped molded body 9 consisting of a natural synthetic mixed quartz glass layer of about 2 mm and a natural quartz glass layer on the outside.
- the interior of the opaque quartz glass crucible-shaped molded body 9 is heated to a high-temperature atmosphere 16 with the arc electrode 14 while rotating the mold 8 while rotating the mold 8, and the synthetic silica powder is supplied from the silica powder supply means 10 while controlling the flow regulating valve 100.
- gZmin, and T1 is 2.8 mm
- T2 is 2 mm
- T3 is 0
- the diameter of the obtained quartz glass crucible for pulling a silicon single crystal is 22 inches, C is 0.03 ppm, C is 2 ppm, and C is
- This quartz glass crucible was filled with polycrystalline silicon, melted, and a single crystal was pulled five times by the CZ method. The average single crystallinity was 93%, and the oxygen concentration distribution in the single crystal was uniform. Met.
- Example 3 a 22-inch quartz glass crucible for pulling a silicon single crystal was produced in the same manner as in Example 3, except that a natural synthetic opaque intermediate layer was not provided on the quartz glass crucible.
- C in the crucible was 0.03 ppm and C was 7 ppm.
- FIG. 1 is a schematic sectional view of a quartz glass crucible for pulling a silicon single crystal of the present invention.
- FIG. 2 is a schematic view of a manufacturing apparatus for manufacturing the above quartz glass crucible for pulling a silicon single crystal.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Glass Melting And Manufacturing (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005506471A JP4526034B2 (ja) | 2003-05-30 | 2004-05-21 | シリコン単結晶引上げ用石英ガラスルツボ |
US10/559,086 US7299658B2 (en) | 2003-05-30 | 2004-05-21 | Quartz glass crucible for the pulling up of silicon single crystal |
DE602004029057T DE602004029057D1 (de) | 2003-05-30 | 2004-05-21 | Quarzglastiegel zum ziehen von siliciumeinkristall |
EP04734356A EP1655270B1 (en) | 2003-05-30 | 2004-05-21 | Quartz glass crucible for pulling up silicon single crystal |
NO20056184A NO20056184L (no) | 2003-05-30 | 2005-12-23 | Kvartsglassdigler for trekking av siliciumenkeltkrystaller |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-154845 | 2003-05-30 | ||
JP2003154845 | 2003-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004106247A1 true WO2004106247A1 (ja) | 2004-12-09 |
Family
ID=33487337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/006947 WO2004106247A1 (ja) | 2003-05-30 | 2004-05-21 | シリコン単結晶引上げ用石英ガラスルツボ |
Country Status (8)
Country | Link |
---|---|
US (1) | US7299658B2 (ja) |
EP (1) | EP1655270B1 (ja) |
JP (1) | JP4526034B2 (ja) |
KR (1) | KR100731833B1 (ja) |
DE (1) | DE602004029057D1 (ja) |
NO (1) | NO20056184L (ja) |
TW (1) | TWI247730B (ja) |
WO (1) | WO2004106247A1 (ja) |
Cited By (9)
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JP2005343774A (ja) * | 2004-06-07 | 2005-12-15 | Shinetsu Quartz Prod Co Ltd | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
JP2010138005A (ja) * | 2008-12-09 | 2010-06-24 | Japan Siper Quarts Corp | シリコン単結晶引き上げ用石英ガラスルツボ及びその製造方法 |
WO2011013695A1 (ja) | 2009-07-31 | 2011-02-03 | ジャパンスーパークォーツ株式会社 | シリコン単結晶引き上げ用シリカガラスルツボ |
WO2011030658A1 (ja) * | 2009-09-09 | 2011-03-17 | ジャパンスーパークォーツ株式会社 | 複合ルツボ及びその製造方法並びにシリコン結晶の製造方法 |
JP2011068522A (ja) * | 2009-09-28 | 2011-04-07 | Covalent Materials Corp | シリコン単結晶引上げ用シリカガラスルツボ |
JP2013035727A (ja) * | 2011-08-10 | 2013-02-21 | Covalent Materials Corp | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
KR20190002594A (ko) | 2016-09-13 | 2019-01-08 | 가부시키가이샤 사무코 | 석영 유리 도가니 및 그 제조 방법 |
KR20200131164A (ko) | 2019-05-13 | 2020-11-23 | 가부시키가이샤 사무코 | 실리콘 단결정 인상용 석영 유리 도가니 및 그 제조 방법 |
WO2021095324A1 (ja) * | 2019-11-11 | 2021-05-20 | グローバルウェーハズ・ジャパン株式会社 | シリコン単結晶の製造方法 |
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JP4086283B2 (ja) * | 2002-07-31 | 2008-05-14 | 信越石英株式会社 | シリコン単結晶引上げ用石英ガラスルツボおよびその製造方法 |
US7497907B2 (en) * | 2004-07-23 | 2009-03-03 | Memc Electronic Materials, Inc. | Partially devitrified crucible |
US20070084400A1 (en) * | 2005-10-19 | 2007-04-19 | General Electric Company | Quartz glass crucible and method for treating surface of quartz glass crucible |
US7716948B2 (en) * | 2006-12-18 | 2010-05-18 | Heraeus Shin-Etsu America, Inc. | Crucible having a doped upper wall portion and method for making the same |
EP2248776A4 (en) * | 2008-02-05 | 2013-10-30 | Japan Super Quartz Corp | QUARTZ GLASS CRUCIBLE |
EP2436658A4 (en) * | 2009-05-26 | 2015-04-22 | Shinetsu Quartz Prod | SILICONE CONTAINER AND MANUFACTURING METHOD THEREFOR |
JP4951040B2 (ja) | 2009-08-05 | 2012-06-13 | 信越石英株式会社 | シリカ容器及びその製造方法 |
JP5453677B2 (ja) * | 2010-06-25 | 2014-03-26 | 株式会社Sumco | シリカガラスルツボ、シリコンインゴットの製造方法 |
US9193620B2 (en) | 2011-03-31 | 2015-11-24 | Raytheon Company | Fused silica body with vitreous silica inner layer, and method for making same |
US9221709B2 (en) * | 2011-03-31 | 2015-12-29 | Raytheon Company | Apparatus for producing a vitreous inner layer on a fused silica body, and method of operating same |
CN108977879B (zh) * | 2018-09-13 | 2021-02-26 | 浙江美晶新材料有限公司 | 一种单晶用高纯石英坩埚及其制备方法 |
CN109467306B (zh) * | 2018-11-08 | 2021-10-19 | 锦州佑鑫石英科技有限公司 | 单晶硅生产用高强度石英坩埚的加工方法 |
JP7157932B2 (ja) * | 2019-01-11 | 2022-10-21 | 株式会社Sumco | シリカガラスルツボの製造装置および製造方法 |
DE102020000701A1 (de) * | 2020-02-03 | 2021-08-05 | Siltronic Ag | Quarzglastiegel zur Herstellung von Siliciumkristallen und Verfahren zur Herstellung von Quarzglastiegel |
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JPH11199368A (ja) | 1997-12-26 | 1999-07-27 | Komatsu Electron Metals Co Ltd | シリコン単結晶引き上げ方法 |
JP2933404B2 (ja) | 1990-06-25 | 1999-08-16 | 信越石英 株式会社 | シリコン単結晶引き上げ用石英ガラスルツボとその製造方法 |
JP2000247778A (ja) | 1999-02-25 | 2000-09-12 | Toshiba Ceramics Co Ltd | 石英ガラスルツボおよびその製造方法ならびにこれを用いたシリコン単結晶の引上げ方法 |
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DE69508473T2 (de) * | 1994-07-06 | 1999-10-28 | Shin-Etsu Handotai Co., Ltd. | Verfahren zur Herstellung von Silizium-Einkristall und Tiegel aus geschmolzenem Silika dafür |
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2004
- 2004-05-21 US US10/559,086 patent/US7299658B2/en not_active Expired - Lifetime
- 2004-05-21 EP EP04734356A patent/EP1655270B1/en not_active Expired - Lifetime
- 2004-05-21 KR KR1020057012775A patent/KR100731833B1/ko active IP Right Grant
- 2004-05-21 DE DE602004029057T patent/DE602004029057D1/de not_active Expired - Lifetime
- 2004-05-21 WO PCT/JP2004/006947 patent/WO2004106247A1/ja active Application Filing
- 2004-05-21 JP JP2005506471A patent/JP4526034B2/ja not_active Expired - Lifetime
- 2004-05-26 TW TW093115013A patent/TWI247730B/zh not_active IP Right Cessation
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2005
- 2005-12-23 NO NO20056184A patent/NO20056184L/no not_active Application Discontinuation
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Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005343774A (ja) * | 2004-06-07 | 2005-12-15 | Shinetsu Quartz Prod Co Ltd | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
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Also Published As
Publication number | Publication date |
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EP1655270B1 (en) | 2010-09-08 |
JPWO2004106247A1 (ja) | 2006-07-20 |
TWI247730B (en) | 2006-01-21 |
US7299658B2 (en) | 2007-11-27 |
DE602004029057D1 (de) | 2010-10-21 |
KR100731833B1 (ko) | 2007-06-25 |
TW200426121A (en) | 2004-12-01 |
US20060144327A1 (en) | 2006-07-06 |
EP1655270A4 (en) | 2008-07-09 |
EP1655270A1 (en) | 2006-05-10 |
NO20056184L (no) | 2006-02-07 |
JP4526034B2 (ja) | 2010-08-18 |
KR20050087880A (ko) | 2005-08-31 |
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