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TW200521637A - Exposure device for printed circuit board responsive to board dimension variation - Google Patents

Exposure device for printed circuit board responsive to board dimension variation Download PDF

Info

Publication number
TW200521637A
TW200521637A TW093132494A TW93132494A TW200521637A TW 200521637 A TW200521637 A TW 200521637A TW 093132494 A TW093132494 A TW 093132494A TW 93132494 A TW93132494 A TW 93132494A TW 200521637 A TW200521637 A TW 200521637A
Authority
TW
Taiwan
Prior art keywords
printed circuit
exposure
circuit board
photomask
photomasks
Prior art date
Application number
TW093132494A
Other languages
English (en)
Chinese (zh)
Inventor
Ryoichi Ida
Original Assignee
Adtec Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adtec Eng Co Ltd filed Critical Adtec Eng Co Ltd
Publication of TW200521637A publication Critical patent/TW200521637A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW093132494A 2003-11-18 2004-10-27 Exposure device for printed circuit board responsive to board dimension variation TW200521637A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003387755A JP2005148531A (ja) 2003-11-18 2003-11-18 基板伸縮に対応したプリント配線基板用露光装置

Publications (1)

Publication Number Publication Date
TW200521637A true TW200521637A (en) 2005-07-01

Family

ID=34695018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132494A TW200521637A (en) 2003-11-18 2004-10-27 Exposure device for printed circuit board responsive to board dimension variation

Country Status (4)

Country Link
JP (1) JP2005148531A (ko)
KR (1) KR20050048466A (ko)
CN (1) CN100437357C (ko)
TW (1) TW200521637A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100548937B1 (ko) * 2004-02-02 2006-02-02 엘지전자 주식회사 필름 마스크를 이용한 스캔 타입 노광장치
CN101523287B (zh) * 2006-09-29 2011-05-11 朗姆研究公司 用于基板定位和检测的偏移校正方法和装置
JP4937859B2 (ja) * 2007-08-16 2012-05-23 株式会社アルバック 光照射装置
JP5166916B2 (ja) * 2008-03-04 2013-03-21 キヤノン株式会社 パターンの重ね合わせを行う装置およびデバイス製造方法
JP5477862B2 (ja) * 2010-09-06 2014-04-23 株式会社ブイ・テクノロジー フィルム露光装置及びフィルム露光方法
CN103279012A (zh) * 2013-03-26 2013-09-04 宁波东盛集成电路元件有限公司 一种新型蚀刻片连续曝光机及其工艺方法
CN104425308B (zh) * 2013-09-09 2018-03-09 东京毅力科创株式会社 测定装置、基板处理系统和测定方法
CN105246258B (zh) * 2015-10-27 2018-08-07 珠海方正科技高密电子有限公司 一种电路板涨缩比例控制方法及系统
CN110632831A (zh) * 2019-11-14 2019-12-31 江苏上达电子有限公司 一种cof基板的新冲孔式样和曝光对位mark设计方法
KR20210113496A (ko) * 2020-03-06 2021-09-16 삼성디스플레이 주식회사 마스크 및 이의 제조 방법
CN111278230A (zh) * 2020-03-26 2020-06-12 定颖电子(黄石)有限公司 一种印刷线路板底片筛选方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146817A (en) * 1991-12-06 2000-11-14 Agfa-Gevaert Aktiengesellschaft Method of and apparatus for masking a master for reproduction
KR100471461B1 (ko) * 1996-05-16 2005-07-07 가부시키가이샤 니콘 노광방법및노광장치
JP4177682B2 (ja) * 2003-02-26 2008-11-05 株式会社オーク製作所 露光機構および露光方法

Also Published As

Publication number Publication date
CN100437357C (zh) 2008-11-26
CN1619421A (zh) 2005-05-25
JP2005148531A (ja) 2005-06-09
KR20050048466A (ko) 2005-05-24

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