KR100471461B1 - 노광방법및노광장치 - Google Patents
노광방법및노광장치 Download PDFInfo
- Publication number
- KR100471461B1 KR100471461B1 KR1019970018304A KR19970018304A KR100471461B1 KR 100471461 B1 KR100471461 B1 KR 100471461B1 KR 1019970018304 A KR1019970018304 A KR 1019970018304A KR 19970018304 A KR19970018304 A KR 19970018304A KR 100471461 B1 KR100471461 B1 KR 100471461B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- shot
- magnification
- correction
- exposure
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 42
- 238000012937 correction Methods 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims description 112
- 230000003287 optical effect Effects 0.000 claims description 37
- 230000008602 contraction Effects 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000003786 synthesis reaction Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 32
- 238000010586 diagram Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000002194 synthesizing effect Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 101100001471 Schizosaccharomyces pombe (strain 972 / ATCC 24843) alm1 gene Proteins 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (11)
- 복수의 쇼트로 된 소자 패턴이 복수 형성된 기판상에 다음 층의 쇼트를 겹쳐 노광하는 노광 방법에 있어서,하나의 소자를 구성하는 복수의 쇼트를 하나의 단위로 해서, 상기 소자 패턴의 상기 쇼트 위치에 관한 위치 정보를 구하고, 상기 위치 정보에 기초하여 상기 소자 패턴마다 상기 다음 층의 쇼트 위치 및 쇼트 배율을 보정하는 것을 특징으로 하는 노광 방법.
- 제 1 항에 있어서, 상기 쇼트 위치 및 쇼트 배율의 보정은 상기 소자 패턴을 구성하는 복수 쇼트의 이음부에서의 중첩 정도가 최소가 되도록 하는 것을 특징으로 하는 노광 방법.
- 제 1 항에 있어서, 상기 쇼트 위치 및 쇼트 배율의 보정은 상기 소자 패턴을 구성하는 복수의 쇼트의 이음부에서의 중첩 정도를 중시해서 하는 것을 특징으로 하는 노광 방법.
- 제 1 항에 있어서, 상기 쇼트 위치 및 쇼트 배율의 보정은 상기 중첩 노광의 중첩 정도를 중시해서 하는 것을 특징으로 하는 노광 방법.
- 제 1 항 내지 제 4 항에 있어서, 상기 보정은 쇼트 위치의 시프트, 회전, 및 쇼트 배율인 것을 특징으로 하는 노광 방법.
- 마스크에 형성된 패턴을 투영 광학계를 통해 기판상에 연속적으로 존재하는 복수의 영역에 이어 이동 좌표계를 따라 전사하는 노광 장치에 있어서,서로 직교하는 제 1 축과 제 2 축으로 결정되는 이동 좌표계를 따라 상기 기판을 올려 2 차원적으로 이동하는 기판 스테이지와; 상기 기판상에 형성된 얼라인먼트 마크의 위치를 검출하는 마크 검출 수단과: 상기 투영광학계의 배율을 보정하는 배율 보정 수단과; 상기 마크 검출 수단에 의해 검출된 얼라인먼트 마크의 위치 정보에 의거해 상기 제 1 축 방향 및 제 2 축 방향의 상기 기판의 신축량을 각각 산출하는 연산 수단과; 상기 연산 수단에 의해 산출된 신축량에 의거해 상기 배율 보정 수단에 의한 배율 보정량을 설정하는 설정 수단과; 상기 설정 수단에 의해 설정되는 배율 보정량에 의거해 상기 기판 스테이지의 이동을 규정하는 상기 이동 좌표계의 제 1 축 및 제 2 축의 스케일을 각각 동일량으로 변경하는 스케일 변경 수단;을 갖춘 것을 특징으로 하는 노광 장치.
- 복수 단위 패턴의 상을 투영 광학계에 의해 투영하고, 감광 기판을 2차원으로 이동해서 상기 감광 기판상에 상기 복수의 단위 패턴을 이어 소정의 패턴을 노 광하는 노광 방법에 있어서,상기 감광 기판상에 제 1 층의 복수의 단위 패턴을 형성하는 단계와;상기 제 1 층이 형성된 상기 감광 기판의 변형량을 검출하는 단계와;상기 검출 결과에 의거해 상기 투영 광학계이 투영 배율을 보정하는 단계와;상기 투영 배율의 보정량에 의거해 상기 감광 기판의 상기 1 차원의 각각의 이동에 관한 보정량을 거의 같게 설정하는 단계;로 이루어지는 것을 특징으로 하는 노광 방법.
- 제 7 항에 있어서, 상기 제 1 층의 복수의 단위의 패턴을 형성하는 단계는 상기 감광 기판에 복수의 얼라인먼트 마크를 형성하는 단계를 포함하고,상기 감광 기판의 변형량을 검출하는 단계는 상기 복수의 얼라인먼트 마크를 검출해서 상기 변형량을 검출하는 것을 특징으로 하는 노광 방법.
- 제 1 항에 있어서, 상기 다음 층의 복수의 쇼트의 이음부에서의 중첩 정도를 중시하고, 상기 소자 패턴에 대한 상기 다음 층의 쇼트의 중첩 오차를 작게 하기 위하여 상기 다음 층의 쇼트의 노광시 배율 보정을 행하는 것을 특징으로 하는 노광 방법.
- 제 9 항에 있어서, 상기 소자 패턴에 마주보는 상기 다음 층의 쇼트의 중첩오차를 작게 하기 위하여 상기 다음 층의 쇼트의 노광시 시프트량과 회전량을 보정하는 것을 특징으로 하는 노광 방법.
- 제 10 항에 있어서, 상기 다음 층의 쇼트의 노광시의 시프트량은 상기 배율 보정에 의한 보정량과 상기 회전량에 의거해 구할 수 있는 것을 특징으로 하는 노광 방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8121940A JPH09306818A (ja) | 1996-05-16 | 1996-05-16 | 露光方法 |
JP121940/1996 | 1996-05-16 | ||
JP123481/1996 | 1996-05-17 | ||
JP8123481A JPH09306819A (ja) | 1996-05-17 | 1996-05-17 | 露光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970077116A KR970077116A (ko) | 1997-12-12 |
KR100471461B1 true KR100471461B1 (ko) | 2005-07-07 |
Family
ID=26459180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970018304A KR100471461B1 (ko) | 1996-05-16 | 1997-05-12 | 노광방법및노광장치 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5973766A (ko) |
KR (1) | KR100471461B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010003438A (ko) * | 1999-06-23 | 2001-01-15 | 김영환 | 티에프티 어레이 기판의 노광방법 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211622A (ja) * | 1994-01-27 | 1995-08-11 | Nikon Corp | 露光方法及び露光システム |
TW432469B (en) * | 1998-02-06 | 2001-05-01 | Nippon Kogaku Kk | Exposure apparatus, exposure method, and recording medium |
US6455211B1 (en) * | 1998-02-09 | 2002-09-24 | Canon Kabushiki Kaisha | Pattern transfer method and apparatus, and device manufacturing method |
JPH11307445A (ja) * | 1998-04-23 | 1999-11-05 | Nikon Corp | 荷電粒子線露光装置及びその投影マスク |
KR20000003752A (ko) * | 1998-06-29 | 2000-01-25 | 김영환 | 패턴 투영 장치 |
JP4100799B2 (ja) * | 1999-01-25 | 2008-06-11 | キヤノン株式会社 | マスクパターン転写方法、マスクパターン転写装置、デバイス製造方法及び転写マスク |
JP3929635B2 (ja) * | 1999-03-08 | 2007-06-13 | 株式会社東芝 | 露光方法 |
EP1186959B1 (en) * | 2000-09-07 | 2009-06-17 | ASML Netherlands B.V. | Method for calibrating a lithographic projection apparatus |
US6580491B2 (en) | 2000-12-26 | 2003-06-17 | International Business Machines Corporation | Apparatus and method for compensating for distortion of a printed circuit workpiece substrate |
US6628372B2 (en) * | 2001-02-16 | 2003-09-30 | Mccullough Andrew W. | Use of multiple reticles in lithographic printing tools |
US6718224B2 (en) * | 2001-09-17 | 2004-04-06 | Yield Dynamics, Inc. | System and method for estimating error in a manufacturing process |
US6580494B1 (en) | 2002-07-16 | 2003-06-17 | International Business Machines Corporation | Method and system of distortion compensation in a projection imaging expose system |
JP2005148531A (ja) * | 2003-11-18 | 2005-06-09 | Adtec Engineeng Co Ltd | 基板伸縮に対応したプリント配線基板用露光装置 |
TWI510869B (zh) * | 2005-03-29 | 2015-12-01 | 尼康股份有限公司 | 曝光裝置、曝光裝置的製造方法以及元件的製造方法 |
US8139218B2 (en) * | 2005-07-06 | 2012-03-20 | Asml Netherlands B.V. | Substrate distortion measurement |
JP5448724B2 (ja) | 2009-10-29 | 2014-03-19 | キヤノン株式会社 | 露光装置及びデバイスの製造方法 |
CN103092005B (zh) * | 2013-01-21 | 2015-01-21 | 深圳市华星光电技术有限公司 | 玻璃基板的曝光对位方法 |
CN107976869B (zh) * | 2016-10-24 | 2023-06-30 | 上海微电子装备(集团)股份有限公司 | 一种工件台非正交校正方法及校正装置 |
KR102735487B1 (ko) * | 2018-06-19 | 2024-11-29 | 에이에스엠엘 네델란즈 비.브이. | 제조 장치 및 연계된 장치를 제어하는 방법 |
EP4212961A1 (en) * | 2022-01-14 | 2023-07-19 | ASML Netherlands B.V. | Lithographic performance qualification and associated apparatuses |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63211623A (ja) * | 1987-02-26 | 1988-09-02 | Nikon Corp | 露光方法 |
JPH07111233A (ja) * | 1993-10-12 | 1995-04-25 | Nikon Corp | 露光方法 |
US5498501A (en) * | 1990-02-02 | 1996-03-12 | Canon Kabushiki Kaisha | Exposure method |
KR100377887B1 (ko) * | 1994-02-10 | 2003-06-18 | 가부시키가이샤 니콘 | 정렬방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4780617A (en) * | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
JP2661015B2 (ja) * | 1986-06-11 | 1997-10-08 | 株式会社ニコン | 位置合わせ方法 |
US5117255A (en) * | 1990-09-19 | 1992-05-26 | Nikon Corporation | Projection exposure apparatus |
JP3265512B2 (ja) * | 1992-06-09 | 2002-03-11 | 株式会社ニコン | 露光方法 |
-
1997
- 1997-05-12 KR KR1019970018304A patent/KR100471461B1/ko not_active IP Right Cessation
- 1997-05-14 US US08/856,029 patent/US5973766A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63211623A (ja) * | 1987-02-26 | 1988-09-02 | Nikon Corp | 露光方法 |
US5498501A (en) * | 1990-02-02 | 1996-03-12 | Canon Kabushiki Kaisha | Exposure method |
JPH07111233A (ja) * | 1993-10-12 | 1995-04-25 | Nikon Corp | 露光方法 |
KR100377887B1 (ko) * | 1994-02-10 | 2003-06-18 | 가부시키가이샤 니콘 | 정렬방법 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010003438A (ko) * | 1999-06-23 | 2001-01-15 | 김영환 | 티에프티 어레이 기판의 노광방법 |
Also Published As
Publication number | Publication date |
---|---|
KR970077116A (ko) | 1997-12-12 |
US5973766A (en) | 1999-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100471461B1 (ko) | 노광방법및노광장치 | |
JP5457767B2 (ja) | 露光装置およびデバイス製造方法 | |
KR20010042133A (ko) | 노광방법, 노광장치, 포토마스크, 포토마스크의 제조방법,마이크로디바이스, 및 마이크로디바이스의 제조방법 | |
KR20010075605A (ko) | 노광방법 및 노광장치 | |
KR20100016315A (ko) | 노광 장치, 노광 방법 및 전자 디바이스 제조 방법 | |
US8149385B2 (en) | Alignment unit and exposure apparatus | |
JP2610815B2 (ja) | 露光方法 | |
JPH1022190A (ja) | 露光装置における位置合わせ誤差補正方法および該方法を用いた露光装置 | |
JPH10223528A (ja) | 投影露光装置及び位置合わせ方法 | |
US6172740B1 (en) | Projection exposure apparatus and device manufacturing method | |
KR100416870B1 (ko) | 노광장치및노광방법 | |
JPH113856A (ja) | 投影露光方法及び投影露光装置 | |
JP2897345B2 (ja) | 投影露光装置 | |
JP2000228344A (ja) | 走査露光装置およびデバイス製造方法 | |
JPH10284396A (ja) | アライメント方法及び重ね合わせ精度計測方法 | |
JP3458477B2 (ja) | 露光装置および露光方法 | |
JP2010192744A (ja) | 露光装置、露光方法、及びデバイス製造方法 | |
JPH1064811A (ja) | 投影露光装置および位置合せ方法 | |
JP3344426B2 (ja) | 計測方法及びデバイス製造方法 | |
JP3702486B2 (ja) | 露光方法及びそれに用いるレチクル | |
JP2020177149A (ja) | 露光装置および物品の製造方法 | |
JP3104813B2 (ja) | アライメント装置、投影露光装置、及び素子製造方法 | |
JPH1152545A (ja) | レチクルおよびそれによって転写されたパターンならびにレチクルと半導体ウエハとの位置合わせ方法 | |
JPH1187228A (ja) | 露光装置及び露光方法 | |
JP2003059808A (ja) | 露光方法及びデバイス製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19970512 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20020510 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19970512 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20040322 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20041115 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20050201 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20050202 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20080122 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20090123 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20100129 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20110126 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20120119 Start annual number: 8 End annual number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20130118 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20130118 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20140117 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20140117 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20150119 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20150119 Start annual number: 11 End annual number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20160105 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20160105 Start annual number: 12 End annual number: 12 |
|
FPAY | Annual fee payment |
Payment date: 20170103 Year of fee payment: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20170103 Start annual number: 13 End annual number: 13 |
|
EXPY | Expiration of term | ||
PC1801 | Expiration of term |