SE9704149D0 - A semiconductor device of SiC and a transistor of SiC having an insulated gate - Google Patents
A semiconductor device of SiC and a transistor of SiC having an insulated gateInfo
- Publication number
- SE9704149D0 SE9704149D0 SE9704149A SE9704149A SE9704149D0 SE 9704149 D0 SE9704149 D0 SE 9704149D0 SE 9704149 A SE9704149 A SE 9704149A SE 9704149 A SE9704149 A SE 9704149A SE 9704149 D0 SE9704149 D0 SE 9704149D0
- Authority
- SE
- Sweden
- Prior art keywords
- sic
- semiconductor device
- blocking state
- transistor
- insulated gate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 230000000903 blocking effect Effects 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
- H10D62/107—Buried supplementary regions, e.g. buried guard rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/109—Reduced surface field [RESURF] PN junction structures
- H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Bipolar Transistors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9704149A SE9704149D0 (sv) | 1997-11-13 | 1997-11-13 | A semiconductor device of SiC and a transistor of SiC having an insulated gate |
US08/971,682 US6091108A (en) | 1997-11-13 | 1997-11-17 | Semiconductor device of SiC having an insulated gate and buried grid region for high breakdown voltage |
PCT/SE1998/002048 WO1999026296A2 (en) | 1997-11-13 | 1998-11-13 | A SEMICONDUCTOR DEVICE OF SiC AND A TRANSISTOR OF SiC HAVING AN INSULATED GATE |
EP09174562A EP2144277A3 (en) | 1997-11-13 | 1998-11-13 | A transistor of SiC having an insulated gate |
JP2000521555A JP2001523895A (ja) | 1997-11-13 | 1998-11-13 | 半導体デバイスおよびSiCトランジスタ |
EP98956064A EP1029363A2 (en) | 1997-11-13 | 1998-11-13 | A SEMICONDUCTOR DEVICE OF SiC AND A TRANSISTOR OF SiC HAVING AN INSULATED GATE |
JP2012120452A JP5829975B2 (ja) | 1997-11-13 | 2012-05-28 | 半導体デバイスおよびSiCトランジスタ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9704149A SE9704149D0 (sv) | 1997-11-13 | 1997-11-13 | A semiconductor device of SiC and a transistor of SiC having an insulated gate |
US08/971,682 US6091108A (en) | 1997-11-13 | 1997-11-17 | Semiconductor device of SiC having an insulated gate and buried grid region for high breakdown voltage |
Publications (1)
Publication Number | Publication Date |
---|---|
SE9704149D0 true SE9704149D0 (sv) | 1997-11-13 |
Family
ID=20408960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9704149A SE9704149D0 (sv) | 1997-11-13 | 1997-11-13 | A semiconductor device of SiC and a transistor of SiC having an insulated gate |
Country Status (5)
Country | Link |
---|---|
US (1) | US6091108A (sv) |
EP (2) | EP1029363A2 (sv) |
JP (2) | JP2001523895A (sv) |
SE (1) | SE9704149D0 (sv) |
WO (1) | WO1999026296A2 (sv) |
Families Citing this family (76)
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DE19832327A1 (de) * | 1997-07-31 | 1999-02-04 | Siemens Ag | Halbleiterstruktur auf Basis von Silizium-Carbid-Material mit mehreren elektrisch unterschiedlichen Teilgebieten |
DE19823944A1 (de) * | 1998-05-28 | 1999-12-02 | Siemens Ag | Leistungsdioden-Struktur |
DE19830332C2 (de) * | 1998-07-07 | 2003-04-17 | Infineon Technologies Ag | Vertikales Halbleiterbauelement mit reduziertem elektrischem Oberflächenfeld |
US6621121B2 (en) * | 1998-10-26 | 2003-09-16 | Silicon Semiconductor Corporation | Vertical MOSFETs having trench-based gate electrodes within deeper trench-based source electrodes |
JP2002530869A (ja) * | 1998-11-18 | 2002-09-17 | インフィネオン テクノロジース アクチエンゲゼルシャフト | 誘電性または半絶縁性シールド構造体を有する半導体構成素子 |
DE19961297A1 (de) | 1999-12-18 | 2001-06-21 | Bosch Gmbh Robert | Schaltungsanordnung zur Verpolsicherung eines DMOS-Transistors |
FR2803094B1 (fr) * | 1999-12-22 | 2003-07-25 | St Microelectronics Sa | Fabrication de composants unipolaires |
DE10026925C2 (de) * | 2000-05-30 | 2002-04-18 | Infineon Technologies Ag | Feldeffektgesteuertes, vertikales Halbleiterbauelement |
FR2816113A1 (fr) * | 2000-10-31 | 2002-05-03 | St Microelectronics Sa | Procede de realisation d'une zone dopee dans du carbure de silicium et application a une diode schottky |
JP3506676B2 (ja) * | 2001-01-25 | 2004-03-15 | Necエレクトロニクス株式会社 | 半導体装置 |
US6855998B2 (en) | 2002-03-26 | 2005-02-15 | Kabushiki Kaisha Toshiba | Semiconductor device |
DE10214176B4 (de) * | 2002-03-28 | 2010-09-02 | Infineon Technologies Ag | Halbleiterbauelement mit einer vergrabenen Stoppzone und Verfahren zur Herstellung einer Stoppzone in einem Halbleiterbauelement |
DE10243758A1 (de) * | 2002-09-20 | 2004-04-01 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren zur Herstellung einer vergrabenen Stoppzone in einem Halbleiterbauelement und Halbleiterbauelement mit einer vergrabenen Stoppzone |
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JP5997426B2 (ja) | 2011-08-19 | 2016-09-28 | 株式会社日立製作所 | 半導体装置および半導体装置の製造方法 |
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JP5983415B2 (ja) * | 2013-01-15 | 2016-08-31 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
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CN103400860B (zh) * | 2013-08-21 | 2017-04-19 | 东南大学 | 一种高击穿电压的n型纵向碳化硅金属氧化物半导体管 |
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CN105390536A (zh) * | 2015-09-30 | 2016-03-09 | 深圳市可易亚半导体科技有限公司 | 绝缘栅双极型晶体管及其制备方法 |
US11011631B2 (en) | 2017-07-04 | 2021-05-18 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device |
SE541290C2 (en) | 2017-09-15 | 2019-06-11 | Ascatron Ab | A method for manufacturing a grid |
SE541466C2 (en) * | 2017-09-15 | 2019-10-08 | Ascatron Ab | A concept for silicon carbide power devices |
SE541402C2 (en) | 2017-09-15 | 2019-09-17 | Ascatron Ab | Integration of a schottky diode with a mosfet |
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1997
- 1997-11-13 SE SE9704149A patent/SE9704149D0/sv unknown
- 1997-11-17 US US08/971,682 patent/US6091108A/en not_active Expired - Lifetime
-
1998
- 1998-11-13 EP EP98956064A patent/EP1029363A2/en not_active Ceased
- 1998-11-13 WO PCT/SE1998/002048 patent/WO1999026296A2/en active Application Filing
- 1998-11-13 JP JP2000521555A patent/JP2001523895A/ja active Pending
- 1998-11-13 EP EP09174562A patent/EP2144277A3/en not_active Withdrawn
-
2012
- 2012-05-28 JP JP2012120452A patent/JP5829975B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6091108A (en) | 2000-07-18 |
WO1999026296A2 (en) | 1999-05-27 |
EP2144277A3 (en) | 2010-03-17 |
WO1999026296A3 (en) | 1999-07-29 |
JP5829975B2 (ja) | 2015-12-09 |
EP2144277A2 (en) | 2010-01-13 |
EP1029363A2 (en) | 2000-08-23 |
JP2012191229A (ja) | 2012-10-04 |
JP2001523895A (ja) | 2001-11-27 |
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