[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR20170026289A - 광 가공 장치 및 광 가공물의 생산 방법 - Google Patents

광 가공 장치 및 광 가공물의 생산 방법 Download PDF

Info

Publication number
KR20170026289A
KR20170026289A KR1020160110575A KR20160110575A KR20170026289A KR 20170026289 A KR20170026289 A KR 20170026289A KR 1020160110575 A KR1020160110575 A KR 1020160110575A KR 20160110575 A KR20160110575 A KR 20160110575A KR 20170026289 A KR20170026289 A KR 20170026289A
Authority
KR
South Korea
Prior art keywords
light
moving
moving means
light source
machining
Prior art date
Application number
KR1020160110575A
Other languages
English (en)
Korean (ko)
Inventor
료마 나카무라
도모히로 나카지마
Original Assignee
가부시키가이샤 리코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 리코 filed Critical 가부시키가이샤 리코
Publication of KR20170026289A publication Critical patent/KR20170026289A/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
KR1020160110575A 2015-08-31 2016-08-30 광 가공 장치 및 광 가공물의 생산 방법 KR20170026289A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2015171211 2015-08-31
JPJP-P-2015-171211 2015-08-31
JP2015182070 2015-09-15
JPJP-P-2015-182070 2015-09-15
JPJP-P-2016-136656 2016-07-11
JP2016136656A JP2017056489A (ja) 2015-08-31 2016-07-11 光加工装置及び光加工物の生産方法

Publications (1)

Publication Number Publication Date
KR20170026289A true KR20170026289A (ko) 2017-03-08

Family

ID=58388920

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160110575A KR20170026289A (ko) 2015-08-31 2016-08-30 광 가공 장치 및 광 가공물의 생산 방법

Country Status (3)

Country Link
JP (1) JP2017056489A (ja)
KR (1) KR20170026289A (ja)
TW (1) TWI622446B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220176493A1 (en) * 2019-03-20 2022-06-09 Bobst Mex Sa Characterization method and system for a laser processing machine with a moving sheet or web
CN112192034A (zh) * 2020-10-23 2021-01-08 新代科技(苏州)有限公司 镭射加工系统及其镭射加工方法
TWI755109B (zh) * 2020-10-23 2022-02-11 新代科技股份有限公司 雷射加工系統及其雷射加工方法
WO2024058237A1 (ja) * 2022-09-16 2024-03-21 株式会社ニコン 光学装置、光加工装置、顕微鏡装置、および走査方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205384A (ja) 2002-01-11 2003-07-22 Ricoh Microelectronics Co Ltd レーザ加工装置
JP2004090062A (ja) * 2002-09-02 2004-03-25 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP2010234420A (ja) * 2009-03-31 2010-10-21 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工方法
KR20150058975A (ko) * 2013-11-21 2015-05-29 주식회사 솔바인 필름가공장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5311682B2 (ja) * 1974-03-08 1978-04-24
JP5311682B2 (ja) 2010-06-17 2013-10-09 株式会社レザック 抜型製造用レーザー加工装置
JP5409711B2 (ja) * 2011-06-29 2014-02-05 三星ダイヤモンド工業株式会社 レーザ光によるワーク加工装置
JP5717146B2 (ja) * 2012-10-23 2015-05-13 株式会社日本製鋼所 レーザラインビーム改善装置およびレーザ処理装置
US20140363326A1 (en) * 2013-06-10 2014-12-11 Grid Logic Incorporated System and method for additive manufacturing
JP5627760B1 (ja) * 2013-12-18 2014-11-19 三菱重工業株式会社 レーザ加工装置及びレーザ加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205384A (ja) 2002-01-11 2003-07-22 Ricoh Microelectronics Co Ltd レーザ加工装置
JP2004090062A (ja) * 2002-09-02 2004-03-25 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP2010234420A (ja) * 2009-03-31 2010-10-21 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工方法
KR20150058975A (ko) * 2013-11-21 2015-05-29 주식회사 솔바인 필름가공장치

Also Published As

Publication number Publication date
TWI622446B (zh) 2018-05-01
TW201707825A (zh) 2017-03-01
JP2017056489A (ja) 2017-03-23

Similar Documents

Publication Publication Date Title
US10500677B2 (en) Laser machining systems and methods with vision correction and/or tracking
JP2004515365A (ja) 半導体材料のレーザー加工
KR20110112282A (ko) 레이저 가공장치
US20090212030A1 (en) Autofocus for Ablation Laser
KR20170026289A (ko) 광 가공 장치 및 광 가공물의 생산 방법
EP1990124A1 (en) Multi laser system
JP2018008307A (ja) 光加工装置及び光加工物の生産方法
TWI682823B (zh) 光學加工裝置
CN106475681B (zh) 光加工装置和光加工物的生产方法
JP2010219171A (ja) スクライブ加工方法及び装置
JP6761590B2 (ja) 光加工装置
TWI601591B (zh) 光學加工裝置
JP4648044B2 (ja) レーザー加工装置
JP2017124416A (ja) レーザ加工装置及びレーザ加工方法
CN206230183U (zh) 光加工装置
JP2011167724A (ja) レーザ加工装置
JP2017109221A (ja) レーザ加工装置
JP6013708B2 (ja) 姿勢修正装置
JP5274404B2 (ja) レーザ加工装置及びレーザ加工方法
JP2018140419A (ja) 光加工装置及び光加工物の生産方法
CN206335247U (zh) 光加工装置
CN214489229U (zh) 一种超高速激光加工用多边形扫描振镜装置
JP7323304B2 (ja) 被加工物の分割方法
JP7269090B2 (ja) 被加工物の分割方法
JP2006150406A (ja) 位置検出装置及び方法、並びに、レーザ加工装置及び方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment