[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6445132A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6445132A
JPS6445132A JP20215187A JP20215187A JPS6445132A JP S6445132 A JPS6445132 A JP S6445132A JP 20215187 A JP20215187 A JP 20215187A JP 20215187 A JP20215187 A JP 20215187A JP S6445132 A JPS6445132 A JP S6445132A
Authority
JP
Japan
Prior art keywords
sinxoy
sio2
film
sin
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20215187A
Other languages
Japanese (ja)
Inventor
Juri Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP20215187A priority Critical patent/JPS6445132A/en
Publication of JPS6445132A publication Critical patent/JPS6445132A/en
Pending legal-status Critical Current

Links

Landscapes

  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To prevent stress migration of wiring, by composing final protective films of three layers of SiN, SiNxOy and SiO2. CONSTITUTION:A final Al wiring 2 is formed on a substrate 1. As final protective films, SiO2 (PSG) film 3, in which SiO2 or phosphorus is doped, an SiNxOy film 4, and an SiN film 5 are formed on the Al wiring 2. The films of SiO2, SiNxOy and SiN can be formed at low temperature by using a CVD method, a plasma CVD method and a photo CVD method. The component of the SiNxOy film 4 can be changed by controlling the flow rates of O2 and N2 as follows: on the SiO2, as SiNxOy (x 0, y 2); beneath the SiN film, as SiNxOy (x 4/3, y 0); and (x) and (y) (SiNxOy) are continuously changed from SiO2 to Si3N4. Thus excellent moisture resistance and contamination resistance are obtained, and stress migration is prevented.
JP20215187A 1987-08-13 1987-08-13 Semiconductor device Pending JPS6445132A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20215187A JPS6445132A (en) 1987-08-13 1987-08-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20215187A JPS6445132A (en) 1987-08-13 1987-08-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6445132A true JPS6445132A (en) 1989-02-17

Family

ID=16452807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20215187A Pending JPS6445132A (en) 1987-08-13 1987-08-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6445132A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851603A (en) * 1997-07-14 1998-12-22 Vanguard International Semiconductor Corporation Method for making a plasma-enhanced chemical vapor deposited SiO2 Si3 N4 multilayer passivation layer for semiconductor applications
CN100380704C (en) * 2003-10-29 2008-04-09 铼宝科技股份有限公司 Organic light-emitting display panel
CN100466328C (en) * 2003-10-29 2009-03-04 铼宝科技股份有限公司 Organic light-emitting display panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851603A (en) * 1997-07-14 1998-12-22 Vanguard International Semiconductor Corporation Method for making a plasma-enhanced chemical vapor deposited SiO2 Si3 N4 multilayer passivation layer for semiconductor applications
CN100380704C (en) * 2003-10-29 2008-04-09 铼宝科技股份有限公司 Organic light-emitting display panel
CN100466328C (en) * 2003-10-29 2009-03-04 铼宝科技股份有限公司 Organic light-emitting display panel

Similar Documents

Publication Publication Date Title
JPS6445132A (en) Semiconductor device
JPS6423564A (en) Space type semiconductor device
JPS56125855A (en) Manufacture of semiconductor device
JPS647550A (en) Semiconductor device
JPS5766673A (en) Manufacture of mos type semiconductor device
JPS6445120A (en) Semiconductor device
JPS5785246A (en) Semiconductor device
JPS56104468A (en) Manufacture of mos semiconductor device
JPS56125867A (en) Semiconductor device
JPS6425551A (en) Semiconductor device
JPS6445133A (en) Semiconductor device
JPS55110056A (en) Semiconductor device
JPS57210659A (en) Semiconductor device
JPS57206071A (en) Semiconductor device and manufacture thereof
JPS5776865A (en) Manufacture of semiconductor device
JPS5776866A (en) Manufacture of semiconductor device
JPS5687346A (en) Manufacture of semiconductor device
JPS5621344A (en) Semiconductor device and manufacture thereof
JPS5645078A (en) Manufacturing of semiconductor device
JPS56133823A (en) Manufacture of semiconductor device
JPS56153777A (en) Semiconductor capacity element
JPS55107243A (en) Manufacture of semiconductor device
JPS56118354A (en) Preparation of semiconductor device
JPS5793574A (en) Manufacture of mis type semiconductor device
JPS5797643A (en) Manufacture of semiconductor device