JP5901773B2 - 直列接続部を含む薄膜ソーラーモジュール、及び、複数の薄膜ソーラーセルを直列接続する方法 - Google Patents
直列接続部を含む薄膜ソーラーモジュール、及び、複数の薄膜ソーラーセルを直列接続する方法 Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims description 113
- 238000000034 method Methods 0.000 title claims description 16
- 238000000059 patterning Methods 0.000 claims description 172
- 239000004065 semiconductor Substances 0.000 claims description 90
- 239000000758 substrate Substances 0.000 claims description 51
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical group [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 44
- 230000002829 reductive effect Effects 0.000 claims description 25
- 239000011787 zinc oxide Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 9
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 8
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052951 chalcopyrite Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 230000001154 acute effect Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- -1 for example Substances 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 229
- 210000004027 cell Anatomy 0.000 description 79
- 239000000463 material Substances 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229910052711 selenium Inorganic materials 0.000 description 6
- 239000011669 selenium Substances 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 229910004613 CdTe Inorganic materials 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 150000003346 selenoethers Chemical class 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
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- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
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- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010447 natron Substances 0.000 description 1
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- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 230000003595 spectral effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Description
・複数のパターニング線PRによって分割された後部電極層と、
・後部電極層上に配置され、複数のパターニング線PAによって分割された光活性半導体層と、
・後部電極層とは反対側の光活性半導体層上に配置され、複数のパターニング線PFによって分割された前部電極層と
を含む。
・基板上に配置され、複数のパターニング線PRによって分割された後部電極層と、
・後部電極層上に配置され、複数のパターニング線PAによって分割された光活性半導体層と、
・光活性半導体層上に配置され、複数のパターニング線PFによって複数の領域へ分割された前部電極層と
を含み、ここで、第1の領域の前部電極層が第2の領域の後部電極層に直列に電気的に接続され、複数の切欠及び複数のエッジを含むパターニング線PRと複数の切欠及び複数のエッジを含むパターニング線PAとが、光活性半導体層で形成された電流の、前部電極層を通る流路の平均距離が低下するような相互関係で、形成される。
・透明基板上に配置され、複数のパターニング線PFによって分割された前部電極層と、
・前部電極層上に配置され、複数のパターニング線PAによって分割された光活性半導体層と、
・光活性半導体層上に配置され、少なくとも複数のパターニング線PRによって複数の領域へ分割された後部電極層と
を含み、ここで、第1の領域の後部電極層が第2の領域の前部電極層へ直列に接続され、複数の切欠及び複数のエッジを含むパターニング線PRと複数の切欠及び複数のエッジを含むパターニング線PAとが、光活性半導体層で形成される電流の、前部電極層を通る流路の平均距離が低減されるような相互関係で、形成される。
図1には、全体として参照番号1で薄膜ソーラーモジュールが示されている。薄膜ソーラーモジュール1は集積された形態で直列接続された複数のソーラーセル1.1,1.2を含んでおり、そのうち2つのセルのみが示されている。図2には図1のモジュールを切断線A−A’に沿って切断した断面図が示されている。方向Lは長手方向又はパターニング線に対して平行な方向を表しており、方向Qは薄膜ソーラーモジュール1のパターニング線に対して垂直な横断方向を表している。
Claims (14)
- 直列接続部を含む薄膜ソーラーモジュール(1)であって、少なくとも、
・複数のパターニング線PRによって複数の領域BRへ分割されている後部電極層(3)と、
・前記後部電極層(3)上に配置されており、複数のパターニング線PAによって分割されている光活性半導体層(4)と、
・前記後部電極層(3)とは反対側の前記光活性半導体層(4)上に配置されており、複数のパターニング線PFによって複数の領域BFへ分割されている前部電極層(5)と、
を含んでおり、
前記薄膜ソーラーモジュール(1)は、長手方向(L)と横断方向(Q)を有しており、前記パターニング線PR,PA及びPFは、前記長手方向(L)に沿って延在しており、
前記前部電極層(5)の各領域BFは隣の前記後部電極層(3)の各領域BRに前記複数のパターニング線PAを介して直列に電気的に接続されており、
前記パターニング線PRにはそれぞれ、該パターニング線PRの延在方向に対して垂直な方向に切り欠かれた複数の切欠(7.10)と、該複数の切欠(7.10)間において前記パターニング線PRの延在方向に延びている複数の直線部(7.11)と、が設けられており、
前記パターニング線PAにはそれぞれ、該パターニング線PAの延在方向に対して垂直な方向に切り欠かれた複数の切欠(7.20)と、該複数の切欠(7.20)間において前記パターニング線PAの延在方向に延びている複数の直線部(7.21)と、が設けられており、
前記複数の切欠(7.10)及び前記複数の直線部(7.11)を含む前記パターニング線PRと、前記複数の切欠(7.20)及び前記複数の直線部(7.21)を含む前記パターニング線PAとは、前記光活性半導体層(4)で形成された電流の、前記前部電極層(5)を通る流路の平均距離が低減されて抵抗損失が低下するような相互関係で、形成されている
ことを特徴とする薄膜ソーラーモジュール(1)。 - 前記パターニング線PFはそれぞれ、前記パターニング線PFの延在方向に対して垂直な方向に切り欠かれた複数の切欠(7.30)と、該複数の切欠(7.30)間において前記パターニング線PFの延在方向に延びている複数の直線部(7.31)と、を含むように構成されている、
請求項1記載の薄膜ソーラーモジュール(1)。 - 前記パターニング線PR,又は前記パターニング線PR及びPA,又は前記パターニング線PR及びPA及びPFのいずれかの各切欠(7.10,7.20,7.30)は、鋭角的に切れ込むように形成されている、
請求項1又は2記載の薄膜ソーラーモジュール(1)。 - 前記パターニング線PR又はPA又はPFの少なくとも1つの各切欠(7.10又は7.20又は7.30)は、三角形状に形成されている、
請求項1から3までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 前記パターニング線PAの各切欠(7.20)は線状もしくは四角形状に形成されている、
請求項1から4までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 隣り合うパターニング線PR,PA,PFの各切欠(7,10,7.20,7.30)は少なくとも近似的に相互に並列に形成されている、
請求項1から5までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 前記後部電極層(3)は、前記前部電極層(5)に比べて、有利には係数10、特に有利には係数100、低い面電気抵抗を有する、
請求項1から6までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 前記パターニング線PRの切欠(7.10)から隣の領域の前記パターニング線PFまでの最小間隔dは、5mmから15mmの最適セル幅wopt以下である、
請求項1から7までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 前記パターニング線PRの各切欠(7.10)間の間隔aは、5mmから15mmの最適セル幅wopt以下である、
請求項8記載の薄膜ソーラーモジュール(1)。 - 前記後部電極層(3)は金属を含み、例えば前記金属はモリブデン(Mo)又はアルミニウム(Al)又は銅(Cu)又はチタン(Ti)であり、及び/又は、前記前部電極層(5)は透明導電性金属酸化物の層を含み、例えば前記透明導電性金属酸化物は亜鉛酸化物(ZnO)又はアルミニウムがドープされた亜鉛酸化物(ZnO:Al)又はホウ素がドープされた亜鉛酸化物(ZnO:B)又はインジウムがドープされた亜鉛酸化物(ZnO:In)又はガリウムがドープされた亜鉛酸化物(ZnO:Ga)又はフッ素がドープされた錫酸化物(SnO2:F)又はアンチモンがドープされた錫酸化物(SnO2:Sb)又はインジウム錫酸化物(ITO)である、
請求項1から9までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 前記光活性半導体層(4)は、アモルファスもしくはマイクロアモルファスもしくは多結晶のケイ素、又は、カドミウムテルル化物(CdTe)、又は、有機半導体、又は、ガリウムヒ化物(GaAs)、又は、黄銅鉱ベースの半導体もしくは黄錫亜鉛鉱ベースの半導体を含む、
請求項1から10までのいずれか1項記載の薄膜ソーラーモジュール(1)。 - 請求項1記載の薄膜ソーラーモジュール(1)の製造及び直列接続方法であって、
a)基板(2)上に後部電極層(3)を堆積し、該後部電極層(3)を複数のパターニング線PRによって分割し、
b)前記後部電極層(3)上に光活性半導体層(4)を堆積し、該光活性半導体層(4)を複数のパターニング線PAによって分割し、
c)前記光活性半導体層(4)上に前部電極層(5)を堆積し、該前部電極層(5)と前記光活性半導体層(4)とを複数のパターニング線PFによって複数の領域(6)へ分割し、第1の領域(6)の前記前部電極層(5)と第2の領域(6)の前記後部電極層(3)とを直列に接続し、
複数の切欠(7.10)及び複数の直線部(7.11)を含む前記パターニング線PRと複数の切欠(7.20)及び複数の直線部(7.21)を含む前記パターニング線PAとを、前記光活性半導体層(4)で形成された電流の、前記前部電極層(5)を通る流路の平均距離が低減されて抵抗損失が低下するような相互関係で、形成する、
ことを特徴とする直列接続部を含む薄膜ソーラーモジュールの製造方法。 - 請求項1記載の薄膜ソーラーモジュール(1)の製造及び直列接続方法であって、
a)透明基板(9)上に前部電極層(5)を堆積し、該前部電極層(5)を複数のパターニング線PFによって分割し、
b)前記前部電極層(5)上に光活性半導体層(4)を堆積し、該光活性半導体層(4)を複数のパターニング線PAによって分割し、
c)前記光活性半導体層(4)上に後部電極層(3)を堆積し、該後部電極層(3)と前記光活性半導体層(4)とを複数のパターニング線PRによって複数の領域(6)へ分割し、第1の領域(6)の前記後部電極層(3)と第2の領域(6)の前記前部電極層(5)とを直列に接続し、
複数の切欠(7.10)及び複数の直線部(7.11)を含む前記パターニング線PRと複数の切欠(7.20)及び複数の直線部(7.21)を含む前記パターニング線PAとを、前記光活性半導体層(4)で形成された電流の、前記前部電極層(5)を通る流路の平均距離が低減されて抵抗損失が低下するような相互関係で、形成する、
ことを特徴とする直列接続による薄膜ソーラーモジュールの製造方法。 - 請求項12又は13記載の薄膜ソーラーモジュールの製造及び直列接続方法を、例えば、アモルファスもしくはマイクロアモルファスもしくは多結晶のケイ素、又は、カドミウムテルル化物(CdTe)、又は、ガリウムヒ化物(GaAs)、又は、黄銅鉱ベースの半導体、又は、黄錫亜鉛鉱ベースの半導体、又は、有機半導体から成る薄膜ソーラーモジュールの製造に用いる使用。
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |