JP2009027179A - ユニバーサル配線ラインを含む半導体チップ、半導体パッケージ、カード及びシステム - Google Patents
ユニバーサル配線ラインを含む半導体チップ、半導体パッケージ、カード及びシステム Download PDFInfo
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- JP2009027179A JP2009027179A JP2008190314A JP2008190314A JP2009027179A JP 2009027179 A JP2009027179 A JP 2009027179A JP 2008190314 A JP2008190314 A JP 2008190314A JP 2008190314 A JP2008190314 A JP 2008190314A JP 2009027179 A JP2009027179 A JP 2009027179A
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- semiconductor chip
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 339
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000010410 layer Substances 0.000 claims description 66
- 238000002161 passivation Methods 0.000 claims description 23
- 239000011229 interlayer Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 230000010354 integration Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
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- 239000000853 adhesive Substances 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
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Abstract
【解決手段】半導体基板上の集積回路部と、半導体基板上に集積回路部と電気的に連結されるように配された一つ以上の導電性パッドと、半導体基板上に一つ以上の導電性パッドと離隔されて配され、集積回路部と電気的に絶縁された複数のユニバーサル配線ラインと、を備える半導体チップである。
【選択図】図6
Description
36,78 第2奇数ライン
100c’ 半導体チップ
120c1,120c2 導電性パッド
125c1 第1ユニバーサル配線ライン
125c2 第2ユニバーサル配線ライン
Claims (31)
- 半導体基板上の集積回路部と、
前記半導体基板上に前記集積回路部と電気的に連結されるように配された一つ以上の導電性パッドと、
前記半導体基板上に前記一つ以上の導電性パッドと離隔されて配され、前記集積回路部と電気的に絶縁された複数のユニバーサル配線ラインと、を備えることを特徴とする半導体チップ。 - 前記集積回路部を覆う前記半導体基板上の層間絶縁層をさらに備え、前記一つ以上の導電性パッド及び前記複数のユニバーサル配線ラインは、前記層間絶縁層上に配されることを特徴とする請求項1に記載の半導体チップ。
- 前記層間絶縁層上のパッシベーション層をさらに備えることを特徴とする請求項2に記載の半導体チップ。
- 前記パッシベーション層は、前記一つ以上の導電性パッドを露出する一つ以上の第1ホール及び前記複数のユニバーサル配線ラインの一部を露出する一つ以上の第2ホールを備えることを特徴とする請求項3に記載の半導体チップ。
- 前記パッシベーション層上の絶縁樹脂層をさらに備え、前記一つ以上の導電性パッドは、前記パッシベーション層内に配され、前記複数のユニバーサル配線ラインは、前記絶縁樹脂層内に配されたことを特徴とする請求項3に記載の半導体チップ。
- 前記絶縁樹脂層は、前記一つ以上の導電性パッドを露出するように前記パッシベーション層の内部に延びた第3ホール及び前記複数のユニバーサル配線ラインの一部を露出する第4ホールを備えることを特徴とする請求項5に記載の半導体チップ。
- 前記絶縁樹脂層は、ポリイミドを含むことを特徴とする請求項6に記載の半導体チップ。
- 前記複数のユニバーサル配線ラインは、ライン及びスペースパターンで配されたことを特徴とする請求項1に記載の半導体チップ。
- 前記複数のユニバーサルラインは、異なるカラムに配された第1ユニバーサルライン及び第2ユニバーサルラインを含むことを特徴とする請求項1に記載の半導体チップ。
- 前記半導体基板を貫通して前記導電性パッドまたは前記複数のユニバーサル配線ラインに連結されたビア電極をさらに備えることを特徴とする請求項1に記載の半導体チップ。
- パッケージ基板と、前記パッケージ基板上の第1半導体チップと、を備え、
前記第1半導体チップは、
半導体基板上の集積回路部と、
前記半導体基板上に前記集積回路部と電気的に連結されるように配された一つ以上の導電性パッドと、
前記半導体基板上に前記一つ以上の導電性パッドと離隔されて配され、前記集積回路部と絶縁された複数のユニバーサル配線ラインと、を備えることを特徴とする半導体パッケージ。 - 前記パッケージ基板は、前記一つ以上の導電性パッドと電気的に連結された一つ以上の第1ターミナル及び前記複数のユニバーサル配線ラインの一部と電気的に連結された一つ以上の第2ターミナルを備えることを特徴とする請求項11に記載の半導体パッケージ。
- 前記一つ以上の導電性パッド及び前記一つ以上の第1ターミナル、並びに前記複数のユニバーサル配線ラインの一部及び前記一つ以上の第2ターミナルは、ボンディングワイヤを利用して連結されたことを特徴とする請求項12に記載の半導体パッケージ。
- 前記第1半導体チップ上の第2半導体チップをさらに備えることを特徴とする請求項12に記載の半導体パッケージ。
- 前記第2半導体チップは、前記複数のユニバーサル配線ラインの一部を利用して、前記一つ以上の第2ターミナルに電気的に連結されたことを特徴とする請求項14に記載の半導体パッケージ。
- 前記第2半導体チップ及び前記複数のユニバーサル配線ラインの一部は、ボンディングワイヤを利用して連結されたことを特徴とする請求項15に記載の半導体パッケージ。
- 前記第2半導体チップ及び前記複数のユニバーサル配線ラインの一部は、導電性バンプを利用して連結されたことを特徴とする請求項15に記載の半導体パッケージ。
- 前記第2半導体チップ及び前記複数のユニバーサル配線ラインの一部は、前記第2半導体チップを貫通するビア電極を利用して連結されたことを特徴とする請求項15に記載の半導体パッケージ。
- 前記第1半導体チップ上に前記第2半導体チップと離隔されて配された第3半導体チップをさらに備えることを特徴とする請求項14に記載の半導体パッケージ。
- 前記パッケージ基板は、前記第3半導体チップと電気的に連結された一つ以上の第3ターミナルをさらに備えることを特徴とする請求項19に記載の半導体パッケージ。
- 前記第2半導体チップは、前記複数のユニバーサル配線ラインの一部を利用して前記一つ以上の第2ターミナルに電気的に連結され、前記第3半導体チップは、前記複数のユニバーサル配線ラインの他の一部を利用して、前記第3ターミナルに連結されたことを特徴とする請求項20に記載の半導体パッケージ。
- 前記第2半導体チップ及び前記第3半導体チップは、前記複数のユニバーサル配線ラインを横切って配されたことを特徴とする請求項21に記載の半導体パッケージ。
- 前記第2半導体チップ及び前記複数のユニバーサル配線ラインの一部、前記第3半導体チップ及び前記複数のユニバーサル配線ラインの他の一部は、ボンディングワイヤを利用して連結されたことを特徴とする請求項21に記載の半導体パッケージ。
- 前記複数のユニバーサル配線ラインの一部及び前記複数のユニバーサル配線ラインの他の一部は、前記複数のユニバーサル配線ラインのうち、奇数ラインまたは偶数ラインの異なる一つであることを特徴とする請求項21に記載の半導体パッケージ。
- 前記複数のユニバーサル配線ラインは、異なるカラムに離隔配置された第1ユニバーサル配線ライン及び第2ユニバーサル配線ラインを含むことを特徴とする請求項11に記載の半導体パッケージ。
- 前記パッケージ基板は、前記一つ以上の導電性パッドと電気的に連結された一つ以上の第1ターミナル、前記第1ユニバーサル配線ラインの一部と電気的に連結された一つ以上の第2ターミナル及び前記第2ユニバーサル配線ラインの一部と電気的に連結された一つ以上の第3ターミナルを備えることを特徴とする請求項25に記載の半導体パッケージ。
- 前記第1半導体チップ上に配された第2半導体チップをさらに備え、前記第2半導体チップは、前記第1ユニバーサル配線ラインを通じて前記第2ターミナルに電気的に連結されたことを特徴とする請求項26に記載の半導体パッケージ。
- 前記第2半導体チップは、前記第2ユニバーサル配線ラインを通じて、前記第3ターミナルに電気的にさらに連結されたことを特徴とする請求項27に記載の半導体パッケージ。
- 前記第1半導体チップ上に配され、前記第1ユニバーサル配線ラインを通じて前記第2ターミナルに電気的に連結された第2半導体チップと、前記第1半導体チップ上に配され、前記第2ユニバーサル配線ラインを通じて前記第3ターミナルに電気的に連結された第3半導体チップとをさらに備えることを特徴とする請求項26に記載の半導体パッケージ。
- パッケージ基板と、
前記パッケージ基板上に搭載され、請求項1ないし10のうち何れか1項に記載の半導体チップで構成されたメモリと、
前記メモリ上に搭載され、前記メモリを通じて前記パッケージ基板に接続されて前記メモリを制御する制御器と、を備えることを特徴とするカード。 - パッケージ基板と、
前記パッケージ基板上に搭載され、請求項1ないし10のうち何れか1項に記載の半導体チップで構成されたメモリと、
前記メモリ上に搭載され、前記メモリを通じて前記パッケージ基板に接続されて前記メモリ及びバスを通じて通信するプロセッサと、
前記バスと通信する入出力装置と、を備えることを特徴とするシステム。
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US8217519B2 (en) | 2012-07-10 |
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