JP2004158651A - Manufacturing method of resin substrate, resin multilayer substrate, and resin substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin substrate and a resin multilayer substrate, which reduces the connection resistance between a wiring pattern and a via conductor, and to provide a resin substrate having small connection resistance between the wiring pattern and the via conductor. <P>SOLUTION: The method comprises steps of forming the wiring pattern 302 on the principal planes of a resin sheet 301; arranging mask members 304a, 304b on the respective principal planes of the resin sheet 301; forming through holes 305 which pass through the resin sheet 301, the wiring patterns 302 and the mask members 304a, 304b; filling each through hole 305 with a conductor 306, forming a projection 306a at one end of each conductor 306 after removing the mask member 304 from the resin sheet 301, and forming one end of each conductor 306 into a shape of a nail head 306b by pressing the projection 306a in the direction of thickness of the resin sheet 301. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a resin substrate having wiring on a main surface or inside, a method for manufacturing a resin multilayer substrate, and a resin substrate.
[0002]
[Prior art]
In recent years, with the miniaturization of electronic devices, a wiring board on which semiconductor elements such as LSIs can be mounted at a high density has been demanded. For this reason, in a wiring board, it is an important subject to form a wiring at a high density with a fine wiring pitch.
[0003]
On the other hand, among wiring boards, resin boards are often used because of their light weight and low dielectric constant. As a method for realizing high-density wiring on this resin substrate, there is known a method of transferring a wiring pattern formed on a support such as a metal plate onto a resin prepreg sheet.
[0004]
FIG. 13 is a process sectional view showing a method of forming a wiring pattern in a conventional method of manufacturing a resin substrate. As shown in FIG. 13, conventionally, a support 707 on which a wiring pattern 702 is formed is pressure-bonded to a resin prepreg sheet 701 pre-filled with via conductors 706, thereby forming a wiring on the main surface of the resin prepreg sheet 701. The pattern 702 was transferred. (For example, refer to Patent Document 1.)
[0005]
[Patent Document 1]
JP-A-10-84186 (paragraph number 0026, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, in the above transfer method, the resin component of the resin prepreg sheet 701 may flow between the wiring pattern 702 and the via conductor 706 when the resin prepreg sheet 701 and the support 707 are pressed. Therefore, there is a problem that the connection resistance between the wiring pattern 702 and the via conductor 706 increases.
[0007]
The present invention solves the above problems and provides a method for manufacturing a resin substrate and a method for manufacturing a resin multilayer substrate which can reduce the connection resistance between a wiring pattern and a via conductor, and provides a method for connecting a wiring pattern and a via conductor. It is an object to provide a resin substrate having a small resistance.
[0008]
[Means for Solving the Problems]
A method for manufacturing a resin substrate according to the present invention includes the steps of preparing a resin sheet in a prepreg state, forming a wiring pattern on at least one main surface of the resin sheet, and forming the wiring pattern on the resin sheet. Arranging a mask member having a certain thickness on the main surface, forming a through hole penetrating the resin sheet, the wiring pattern, and the mask member; Filling a hole with a conductor, removing the mask member from the resin sheet, and projecting one end of the conductor from the main surface of the wiring pattern; and forming the conductive member protruding from the main surface of the wiring pattern. Pressing one end of the body in the thickness direction of the resin sheet to form a nail-shaped head at one end of the conductor.
[0009]
Further, it is preferable that, after the conductor is temporarily dried in a state where one end of the conductor protrudes from the main surface of the wiring pattern, one end of the conductor is pressed in a thickness direction of the resin sheet. After the resin sheet is cured, it is preferable that one end of the conductor is pressed in the thickness direction of the resin sheet.
[0010]
The method for producing a resin multilayer substrate according to the present invention includes the steps of producing a plurality of resin substrates, preparing an adhesive layer made of a resin sheet having a conductor embedded therein, A step of crimping the resin substrate and the adhesive layer so that the main surface of the substrate and the main surface of the adhesive layer are aligned and the adhesive layer is disposed between the two resin substrates. And the following.
[0011]
The resin substrate according to the present invention includes a resin layer, a wiring pattern formed on at least one main surface of the resin layer, and a via that penetrates the resin layer in a thickness direction and is electrically connected to the wiring pattern. And a conductor, on the one end of the via conductor connected to the wiring pattern, a nail-shaped head is formed, and the exposed main surface of the wiring pattern and the via conductor The nail-shaped head formed at one end is electrically connected to the back main surface by surface contact.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
Hereinafter, an embodiment of a method for manufacturing a resin substrate according to the present invention will be described. 1 to 5 are process cross-sectional views in the present embodiment.
[0013]
First, as shown in FIG. 1A, a resin sheet 101 in a prepreg state is prepared. Next, as shown in FIG. 1B, a wiring pattern 102 is formed on both main surfaces of the resin sheet 101.
[0014]
The resin sheet 101 is made of a mixture of an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al ₂ O ₃ , SiO ₂ , TiO _{2 and the} like can be used. By using these inorganic fillers, the heat dissipation of the resin substrate can be improved, and the fluidity of the resin substrate can be adjusted. In addition, as the thermosetting resin, for example, an epoxy resin, a phenol resin, a cyanate resin, or the like can be used. Among them, epoxy resins are preferable because of their excellent heat resistance and moisture resistance.
[0015]
The prepreg state means a state where the thermosetting resin is not cured, that is, a state where the resin sheet 101 has a certain fluidity. The resin sheet 101 finally forms a part of a resin substrate or a resin multilayer substrate in a cured state. However, in the process of manufacturing the resin substrate or the resin multilayer substrate, in which step the resin sheet 101 is cured is arbitrarily determined according to the purpose. Therefore, in the specification of the present application, the “resin sheet” means a prepreg state in an initial preparation stage, but does not necessarily mean a prepreg state in subsequent steps.
[0016]
In the wiring pattern 102, a laser passage hole 103 penetrating the wiring pattern 102 in the thickness direction is formed. By forming the laser passage hole 103, when a through hole is formed in the resin sheet 101 by a CO ₂ laser in a later step, reflection of the CO ₂ laser by the wiring pattern 102 can be prevented. As the wiring pattern 102, for example, a metal such as Cu, Ag, Au, Ag-Pt, and Ag-Pd can be used.
[0017]
As a method of forming the wiring pattern 102 on the main surface of the resin sheet 101, for example, the following method can be used.
[0018]
One is a method of forming the wiring pattern 102 on the main surface of the resin sheet 101 by plating. In this method, after the resin sheet 101 is pressurized and cured at a predetermined temperature, an adhesive layer is formed on the main surface of the resin sheet 101, and a Pd catalyst layer is further formed on the adhesive layer. Next, a resist layer is formed on the catalyst layer except for the position where the wiring pattern is to be formed, and the wiring pattern 102 is deposited on the main surface of the resin sheet 101 by electroless copper plating. Note that the resist layer remaining on the main surface of the resin sheet 101 may or may not be removed.
[0019]
Further, by forming a resist layer at a position corresponding to the laser passage hole 103 and removing the resist layer and the catalyst layer at that portion after forming the wiring pattern, the laser passage hole 103 can be formed simultaneously with the wiring pattern 102. .
[0020]
The other is a method of forming the wiring pattern 101 on the main surface of the resin sheet 101 by transfer. In this method, a copper foil is adhered to one main surface of a transfer support such as a PET (polyethylene terephthalate) film or a stainless steel plate, and the copper foil is subjected to an etching process to form a wiring pattern 102. Thereafter, the transfer support is thermocompression-bonded onto the main surface of the resin sheet 101, and the transfer support is removed from the resin sheet 101, whereby the wiring pattern 102 is transferred onto the main surface of the resin sheet 101.
[0021]
Further, when the etching process is performed on the copper foil, the laser passage hole 103 can be formed at the same time.
[0022]
When performing the transfer, the wiring pattern 102 may be buried in the resin sheet 101 in some cases. In the claims of the present specification, the definition of “the wiring pattern is formed on at least one main surface of the resin sheet” or “the wiring pattern formed on at least one main surface of the resin layer” is defined as follows. It also includes cases where
[0023]
Next, as shown in FIG. 2, a mask member 104 is arranged on one main surface of the resin sheet 101. The mask member 104 has a function of preventing the conductive material from adhering to the main surface of the resin sheet 101 in a conductive material filling step described later. As the mask member 104, for example, a PET (polyethylene terephthalate) film, a PEN (polyethylene naphthalate) film, or the like can be used.
[0024]
Next, a CO ₂ laser is irradiated through the laser passage hole 103 to form a through hole 105 penetrating the resin sheet 101, the wiring pattern 102, and the mask member 104, as shown in FIG. As a means for forming the through holes 105, a YAG laser, an excimer laser, or the like can be used in addition to the CO ₂ laser. Further, the through holes 105 may be formed using a mechanical puncher. If laser reflection by the wiring pattern 102 does not pose a problem when the through hole 105 is formed, it is not necessary to form the laser passage hole 103 in the wiring pattern 102.
[0025]
Next, as shown in FIG. 4, the conductor 106 is filled in the through hole 105 via the mask member 104. The conductor 106 functions as a via conductor that three-dimensionally connects wiring formed on the surface or inside of the resin substrate. As the conductor 106, for example, a conductive paste in which metal particles and a thermosetting resin are mixed can be used. Au, Ag, Cu, Ni or the like can be used as the metal particles. As the thermosetting resin, an epoxy resin, a phenol resin, a cyanate resin, or the like can be used. The conductor 106 is not limited to the conductive paste, and may be a metal body having a certain fluidity such as a solder ball or a gold ball.
[0026]
As a method of filling the inside of the through hole 105 with the conductor 106, for example, there is a method of pouring a conductive paste on the main surface of the mask member 104 and sliding a squeegee on the main surface of the mask member 104.
[0027]
Next, the mask member 104 is removed from the resin sheet 101. As a result, as shown in FIG. 5, one end of the conductor 106 protrudes from the main surface of the wiring pattern 102, and a protrusion 106a is formed.
[0028]
Next, in the state shown in FIG. 5, the protrusion 106a is pressed in the thickness direction of the resin sheet 101. At this time, the resin sheet 101 may be pressed simultaneously. As the pressing means, for example, a vacuum press machine or the like can be used. Further, at the time of pressurization, it is preferable to arrange a protective member such as a PET film on the resin sheet 101 so as to cover the projecting portion 106a. This can prevent the wiring pattern 102 and the conductor 106 from being damaged.
[0029]
As a result, the protruding portion 106a formed at one end of the conductor 106 is flattened, and a nail-shaped head 106b is formed at one end of the conductor 106 as shown in FIG. Thereby, the upper surface of the wiring pattern 102 and the lower surface of the nail-shaped head 106b are electrically connected by surface contact. In FIG. 6, 107 indicates one of the surface contact portions. Therefore, the connection area between the wiring pattern 102 and the conductor 106 increases, and the connection resistance between the wiring pattern 102 and the conductor 106 decreases.
[0030]
When the pitch of the wiring pattern 102 is narrow, if the protrusion 106 a is pressed while the fluidity of the conductor 106 is high, the nail-shaped head 106 b spreads in the main surface direction of the resin sheet 101, and the adjacent wiring There is a possibility that a short circuit may occur due to connection with the pattern 102. Therefore, when the protruding portion 106a is pressed, it is preferable that the conductor 106 be preliminarily dried in a state where the protruding portion 106a is formed, and the conductor 106 be cured to some extent. Thus, after the conductor 106 is preliminarily dried, by pressing the protruding portion 106a, it is possible to form the nail-shaped head 106b having an appropriate spread.
[0031]
Further, if the protruding portion 106a is pressed while the fluidity of the resin sheet 101 is high, the resin sheet 101 is deformed, the conductor 106 is enlarged in the lateral direction, and the volume resistance of the conductor 106 may increase. Therefore, when pressing the protruding portion 106a, it is preferable to previously cure the resin sheet 101 by heat treatment. As described above, by pressing the protruding portion 106a after the resin sheet 101 is cured, an increase in the volume resistance of the conductor 106 can be prevented.
[0032]
Note that the step of temporarily drying the conductor 106 and the step of curing the resin sheet 101 can be simultaneously performed by a single heat treatment.
[0033]
FIG. 7 is a cross-sectional view showing a resin substrate manufactured through the above steps. As shown in FIG. 7, the resin substrate 200 includes a resin layer 201 formed by curing a resin sheet in a prepreg state, a wiring pattern 202 formed on both main surfaces of the resin layer 201, and a resin layer 201 in a thickness direction. , And a via conductor 206 electrically connected to the wiring pattern 202.
[0034]
A nail-shaped head 206b is formed at one end of the via conductor 206. The exposed main surface of the wiring pattern 202 and the back main surface of the nail-shaped head portion 206b formed at one end of the via conductor 206 are electrically connected by surface contact. In FIG. 7, reference numeral 207 indicates one of the surface contact portions.
[0035]
When the resin substrate 200 is used as it is as a circuit component mounting substrate, a completely cured resin layer 201 is used. As will be described later, when a resin multilayer substrate is manufactured using the resin substrate 200, the resin layer 201 may be completely cured or may be partially cured.
[0036]
(Embodiment 2)
Hereinafter, other embodiments of the method for manufacturing a resin substrate according to the present invention will be described. FIG. 8 is a process sectional view in the present embodiment.
[0037]
First, as shown in FIG. 8A, a wiring pattern 302 is formed on both main surfaces of the resin sheet 301 in a prepreg state. In the wiring pattern 302, a laser passage hole 303 penetrating the wiring pattern 302 in the thickness direction is formed.
[0038]
Next, as shown in FIG. 8B, mask members 304a and 304b are arranged on both main surfaces of the resin sheet 301.
[0039]
Next, a CO ₂ laser is irradiated through the laser passage hole 303, and as shown in FIG. 8C, a through hole 305 penetrating the mask member 304a, the wiring pattern 302, the resin sheet 301, and the mask member 304b is formed. Form.
[0040]
Next, as shown in FIG. 8D, the conductor 306 is filled in the through hole 305 via the mask member 304a.
[0041]
Next, the mask members 304a and 304b are removed from the resin sheet 301. As a result, as shown in FIG. 8E, both ends of the conductor 306 protrude from the main surface of the wiring pattern 302, and a protruding portion 306a is formed.
[0042]
Next, in the state shown in FIG. 8E, the protrusion 306a is pressed in the thickness direction of the resin sheet 301. As a result, the protrusions 306a formed at both ends of the conductor 306 are flattened, and nail-shaped heads 306b are formed at both ends of the conductor 306, as shown in FIG.
[0043]
FIG. 9 is a cross-sectional view showing a resin substrate manufactured through the above steps. As shown in FIG. 9, a resin substrate 400 includes a resin layer 401 formed by curing a resin sheet in a prepreg state, a wiring pattern 402 formed on both main surfaces of the resin layer 401, and a resin layer 401 in a thickness direction. And a via conductor 406 for electrically connecting the wiring pattern 402.
[0044]
Nail-shaped heads 406b are formed at both ends of the via conductor 406. The exposed main surface of the wiring pattern 402 and the back main surface of the nail-shaped head 406b formed at both ends of the via conductor 406 are electrically connected by surface contact. In FIG. 9, reference numeral 407 indicates one of the surface contact portions.
[0045]
Note that each component in the present embodiment is the same as in the first embodiment, and a detailed description thereof will be omitted.
[0046]
(Embodiment 3)
Next, an embodiment of a method for manufacturing a resin multilayer substrate according to the present invention will be described. 10 to 12 are process cross-sectional views in the present embodiment.
[0047]
First, the resin substrate 200 shown in FIG. 6 is manufactured by the method for manufacturing a resin substrate according to the first embodiment.
[0048]
Next, as shown in FIG. 10, an adhesive layer 500 made of a resin sheet 501 in which a conductor 506 is embedded is prepared. As the resin sheet 501 and the conductor 506, those similar to the resin sheet 501 and the conductor 506 in Embodiment 1 can be used.
[0049]
The adhesive layer 500 is produced, for example, as follows. First, as shown in FIG. 11A, mask members 504 are attached to both main surfaces of the resin sheet 501 in a prepreg state. Next, as shown in FIG. 11B, a through hole 505 that penetrates the resin sheet 501 and the mask member 504 is formed by laser. Next, as shown in FIG. 11C, the inside of the through hole 505 is filled with a conductor 506 and dried at a predetermined temperature for a predetermined time. Next, as shown in FIG. 11D, the mask member 504 is removed from the resin sheet 501 to form the adhesive layer 500.
[0050]
Next, as shown in FIG. 12, the resin substrate 200 and the adhesive layer 500 are alternately laminated and pressure-bonded to produce the resin multilayer substrate 600. In the resin multilayer substrate 600, the conductor 506 embedded in the adhesive layer 500 is electrically connected to the wiring pattern 202 or the conductor 206 of the resin substrate 200.
[0051]
When the resin substrate 200 and the adhesive layer 500 are pressure-bonded, all of the resin substrate 200 and the adhesive layer 500 may be laminated and then pressure-bonded at once, or the resin substrate 200 and the adhesive layer 500 may be sequentially laminated. This may be repeated by crimping.
[0052]
In addition, when the resin substrate 200 and the adhesive layer 500 are pressed, thermocompression is basically performed. At this time, as described above, the resin sheet 201 constituting the resin substrate 200 may be a completely cured resin sheet, or may be a partially cured resin sheet. On the other hand, since the adhesive layer 500 plays a role of bonding the resin substrates 200 to each other, the resin sheet 501 constituting the adhesive layer 500 may not be hardened much and may have a certain fluidity until thermocompression bonding is performed. preferable. After the thermocompression bonding, the resin substrate 200 and the adhesive layer 500 are completely cured.
[0053]
【Example】
(Example 1)
First, a 400 μm thick sheet-like epoxy prepreg prepared by mixing silica and a liquid epoxy resin was prepared as a resin sheet. Next, the epoxy prepreg was pressed in the thickness direction under the conditions of 170 ° C., 0.2 MPa, and 5 minutes to produce an epoxy substrate having a thickness of 350 μm.
[0054]
Next, a Pd catalyst was applied on both main surfaces of the epoxy substrate to activate the epoxy substrate. Next, a photoresist material made of a novolak resin was spin-coated on the Pd catalyst layer to form a resist layer. Next, after the resist layer was pre-baked, a photomask on which a light-transmitting pattern having the same shape as the wiring pattern was formed was brought into contact with the resist layer and exposed. Next, after developing with a boric acid aqueous solution, post-baking was performed to pattern the resist layer. As a result, a resist layer was formed on the Pd catalyst layer except for the position where the wiring pattern was to be formed.
[0055]
Next, the epoxy substrate was immersed in an electroless copper plating solution to deposit a 15 μm-thick wiring pattern on the Pd catalyst layer not covered with the resist layer. Next, the resist layer and the Pd catalyst layer were removed with an aqueous solution of sodium hydroxide, and a laser passage hole having a diameter of 200 μm was formed at a predetermined position of the wiring pattern.
[0056]
Next, a PET film having a thickness of 20 μm is attached as a mask member on both main surfaces of the epoxy substrate, and a through hole penetrating the PET film, the wiring pattern, and the epoxy substrate by a CO ₂ laser through a laser passage hole. Was formed.
[0057]
Next, a conductive paste (AE1244, manufactured by Tatsuta Electric Wire Co., Ltd.) was filled into the through hole through one PET film with a squeegee.
[0058]
Next, the PET film was removed from the epoxy substrate. As a result, both ends of the conductive paste protruded from the main surface of the wiring pattern, and a protruding portion was formed. Next, in this state, the epoxy substrate was heat-treated at 100 ° C. for 30 minutes to temporarily dry the conductive paste.
[0059]
Next, PET films were arranged on both main surfaces of the epoxy substrate so as to cover the projecting portions of the conductive paste. Next, the protrusion was pressed in the thickness direction of the epoxy substrate under the conditions of 170 ° C., 1.0 MPa, and 60 minutes. As a result, the conductive paste was thermally cured to form a via conductor, and nail-shaped heads were formed at both ends of the via conductor. Finally, the PET film was removed from the epoxy substrate to obtain a resin substrate.
[0060]
(Example 2)
First, a 400 μm thick sheet-like epoxy prepreg prepared by mixing silica and a liquid epoxy resin was prepared as a resin sheet.
[0061]
Next, a PET film having a thickness of 80 μm is prepared as a transfer support, and an acrylic resin-based adhesive having a thickness of 20 μm is applied on one main surface of the PET film, and a PET film with an adhesive having a thickness of 100 μm is formed. Produced. Next, on the main surface of the PET film to which the adhesive was applied, a copper foil having a thickness of 18 μm, both surfaces of which were roughened, was bonded.
[0062]
Next, a resist material made of a novolak resin was spin-coated on the copper foil to form a resist layer. Next, after the resist layer was pre-baked, a photomask on which a light-transmitting pattern having the same shape as the wiring pattern was formed was brought into contact with the resist layer and exposed. Next, after development was performed using a boric acid aqueous solution, post-baking was performed to pattern the resist layer. Next, a portion of the copper foil that was not covered with the resist layer was etched using an aqueous ferric chloride solution. Next, the resist layer remaining on the wiring pattern was removed using an aqueous sodium hydroxide solution to form a wiring pattern having a laser passage hole having a diameter of 200 μm on the PET film.
[0063]
Next, the PET film on which the wiring pattern was formed was pressed on both main surfaces of the epoxy prepreg by a vacuum press machine. Pressing conditions were 120 ° C., 1.0 MPa, and 5 minutes.
[0064]
Next, a wiring pattern was formed on both principal surfaces of the epoxy prepreg by removing the PET film from the epoxy prepreg. The PET film was removed from the resin sheet.
[0065]
Next, the epoxy prepreg was heat-treated at 170 ° C. for 5 minutes to thermally cure the epoxy prepreg.
[0066]
Thereafter, in the same manner as in Example 1, via conductors having nail-shaped heads formed at both ends through the steps of mask member arrangement, through-hole formation, conductor filling, mask member removal, and resin sheet pressurization Was obtained.
[0067]
(Example 3)
First, as a resin sheet, a sheet-like epoxy prepreg having a thickness of 100 μm and prepared by mixing silica and a liquid epoxy resin was prepared.
[0068]
Next, a PET film having a thickness of 20 μm was attached as a mask member to both main surfaces of the epoxy prepreg. Next, a through hole having a diameter of 300 μm penetrating the epoxy prepreg and the PET film was formed by a CO ₂ laser.
[0069]
Next, a conductive paste (AE1244, manufactured by Tatsuta Electric Wire Co., Ltd.) was filled in the through hole, and the epoxy prepreg was heat-treated at 60 ° C. for 30 minutes to temporarily dry the conductive paste. Next, the PET film was removed from the epoxy prepreg to form an adhesive layer.
[0070]
Next, a resin substrate was manufactured in the same manner as in Example 1. Next, three resin substrates and two adhesive layers were alternately laminated and pressure-bonded such that the resin substrates were the uppermost layer and the lowermost layer. Pressing conditions were as follows: first, thermocompression bonding was performed at 80 ° C. and 1.0 MPa for 5 minutes, and after the adhesive layer was semi-cured, thermocompression bonding was performed at 170 ° C. and 2.0 MPa for 60 minutes. Thus, a resin multilayer substrate in which the resin substrate and the adhesive layer were laminated was obtained.
[0071]
【The invention's effect】
In the method for manufacturing a resin substrate according to the present invention, one end of a conductor functioning as a via conductor is projected from the main surface of the wiring pattern, one end of the conductor is pressed in the thickness direction of the resin sheet, and a nail is attached to one end of the conductor. Forming a head-like shape. As a result, the exposed main surface of the wiring pattern and the back main surface of the nail-shaped head are electrically connected by surface contact, so that the connection area between the wiring pattern and the conductor increases. Therefore, a resin substrate having a small connection resistance between the wiring pattern and the via conductor can be manufactured.
[0072]
In addition, when the conductor is temporarily dried and hardened to some extent in a state where one end of the conductor protrudes from the main surface of the wiring pattern, when the protrusion of the conductor is pressed, the conductor has an appropriate spread. A nail-shaped head can be formed.
[0073]
Further, by pressing the protruding portion of the conductor after curing the resin sheet in advance, it is possible to prevent the deformation of the resin sheet and prevent the volume resistance of the conductor from increasing.
[0074]
Further, in the resin substrate according to the present invention, the exposed main surface of the wiring pattern and the back main surface of the nail-shaped head formed at one end of the via conductor are electrically connected by surface contact. Therefore, the connection area between the wiring pattern and the via conductor increases. Therefore, the connection resistance between the wiring pattern and the via conductor can be reduced.
[Brief description of the drawings]
FIG. 1 is a process cross-sectional view illustrating a method for manufacturing a resin substrate in Embodiment 1 of the present invention.
FIG. 2 is a process sectional view illustrating the method for manufacturing the resin substrate according to the first embodiment of the present invention.
FIG. 3 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 4 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 5 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 6 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 7 is a sectional view showing a resin substrate according to the first embodiment of the present invention.
FIG. 8 is a process sectional view illustrating the method for manufacturing the resin substrate in the second embodiment of the present invention.
FIG. 9 is a cross-sectional view illustrating a resin substrate according to a second embodiment of the present invention.
FIG. 10 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in Embodiment 3 of the present invention.
FIG. 11 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in the third embodiment of the present invention.
FIG. 12 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in Embodiment 3 of the present invention.
FIG. 13 is a process sectional view showing a conventional method for manufacturing a resin substrate.
[Explanation of symbols]
101 Resin sheet 102 Wiring pattern 103 Laser passage hole 104 Mask member 105 Through hole 106 Conductor 106a Projection 106b Nail-shaped head 200 Resin substrate 201 Resin layer 202 Wiring pattern 206 Via conductor 206b Nail-shaped head 500 Adhesive layer 501 Resin sheet 506 Conductor 600 Resin multilayer board

Claims (5)

Preparing a resin sheet in a prepreg state, forming a wiring pattern on at least one main surface of the resin sheet,
Arranging a mask member having a certain thickness on one main surface of the resin sheet on which the wiring pattern is formed;
Forming a through hole penetrating the resin sheet, the wiring pattern, and the mask member;
Via the mask member, a step of filling the through-hole with a conductor,
Removing the mask member from the resin sheet and projecting one end of the conductor from the main surface of the wiring pattern;
A step of pressing one end of the conductor projecting from the main surface of the wiring pattern in a thickness direction of the resin sheet, and forming a nail-shaped head at one end of the conductor;
A method for manufacturing a resin substrate, comprising: In a state in which one end of the conductor protrudes from the main surface of the wiring pattern, the conductor is temporarily dried, and then one end of the conductor is pressed in a thickness direction of the resin sheet. Item 2. The method for manufacturing a resin substrate according to Item 1. 3. The method according to claim 1, wherein after the resin sheet is cured, one end of the conductor is pressed in a thickness direction of the resin sheet. 4. A step of producing a plurality of resin substrates by the method for producing a resin substrate according to any one of claims 1 to 3;
A step of preparing an adhesive layer made of a resin sheet in which the conductor is embedded,
The resin substrate and the adhesive layer are pressure-bonded so that the main surface of the resin substrate and the main surface of the adhesive layer match, and the adhesive layer is disposed between the two resin substrates. The process of
A method for manufacturing a resin multilayer substrate, comprising: A resin layer,
A wiring pattern formed on at least one main surface of the resin layer,
Via conductors penetrating the resin layer in the thickness direction, and electrically connected to the wiring pattern,
In the resin substrate having
A nail-shaped head is formed at one end of the via conductor connected to the wiring pattern,
A resin substrate, wherein a main surface on an exposed side of the wiring pattern and a back main surface of a nail-shaped head formed at one end of the via conductor are electrically connected by surface contact. .

Images