TWI238687B - Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate - Google Patents
Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate Download PDFInfo
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- TWI238687B TWI238687B TW92129565A TW92129565A TWI238687B TW I238687 B TWI238687 B TW I238687B TW 92129565 A TW92129565 A TW 92129565A TW 92129565 A TW92129565 A TW 92129565A TW I238687 B TWI238687 B TW I238687B
- Authority
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- Taiwan
- Prior art keywords
- resin
- wiring pattern
- conductor
- resin sheet
- main surface
- Prior art date
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- 239000011347 resin Substances 0.000 title claims abstract description 213
- 229920005989 resin Polymers 0.000 title claims abstract description 213
- 239000000758 substrate Substances 0.000 title claims description 118
- 238000000034 method Methods 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 40
- 239000004020 conductor Substances 0.000 claims abstract description 84
- 238000010030 laminating Methods 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- 241000587161 Gomphocarpus Species 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 41
- 239000012790 adhesive layer Substances 0.000 description 22
- 239000004593 Epoxy Substances 0.000 description 18
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 229920002799 BoPET Polymers 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- -1 for example Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- LRLYTJCVZKVBIH-UHFFFAOYSA-N 3,10-dioxatricyclo[10.2.2.25,8]octadeca-1(15),5,7,12(16),13,17-hexaene-2,11-dione Chemical compound C1OC(=O)C(C=C2)=CC=C2C(=O)OCC2=CC=C1C=C2 LRLYTJCVZKVBIH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
1238687 玖、發明說明： 【發明所屬之技術領域】 本發明係關於主面上或内部具有佈線之樹脂基板之製造 方法、樹脂多層基板製造方法以及樹脂基板。 【先前技術】 近年，隨著電子機器之小型化，正謀求一種可高密度安 裝LSI等半導體元件、疊層陶瓷電容器等被動元件的佈線基 板。因此’就佈線基板而言，以微細的佈線間距形成高密 度佈線成為一個重要的課題。 另一方面，佈線基板中，也常常由輕量、低介電常數這 一點考慮而採用樹脂基板。就這種樹脂基板而言，吾人已 知實現高密度的佈線方法係：將在金屬板等支持體上所形 成的佈線圖案轉印到樹脂預成形體薄板上。 圖13顯示先前之樹脂基板製造方法中佈線圖案的形成方 法之工序剖面圖。如圖13(a)〜（c)所示，以往係在事先充填 有通道孔導體706的樹脂預成形體薄板7〇1上，通過壓接形 成佈線圖案702之支持體707,並自支持體7〇7將佈線圖案 702轉印到701之主面上（例如：特開平」〇-84186號公報⑻％ 段落或參照圖1)。 但，上述轉印方法，在將樹脂預成形體薄板7〇 1及支持體 707進行壓接時，因壓接時之加熱而導致樹脂預成形體薄板 701之樹脂成分流動化，造成佈線圖案7〇2與通道孔導體7〇6 之間流入樹脂預成形體薄板701的樹脂成分。因此，存在佈 線圖案702與通道孔導體706之連接電阻增大的問題。1238687 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a resin substrate having wiring on the main surface or inside, a method for manufacturing a resin multilayer substrate, and a resin substrate. [Prior Art] In recent years, with the miniaturization of electronic devices, a wiring substrate capable of mounting semiconductor elements such as LSIs and passive elements such as laminated ceramic capacitors with high density has been sought. Therefore, as for a wiring substrate, it is an important issue to form a high-density wiring with a fine wiring pitch. On the other hand, resin substrates are often used for wiring substrates in consideration of light weight and low dielectric constant. As for such a resin substrate, I have known a method for achieving high-density wiring: transferring a wiring pattern formed on a support such as a metal plate to a resin preform sheet. Fig. 13 is a process cross-sectional view showing a method of forming a wiring pattern in a conventional resin substrate manufacturing method. As shown in FIGS. 13 (a) to (c), conventionally, a support 707 of a wiring pattern 702 was formed on a resin preform sheet 701 filled with a via hole conductor 706 in advance, and the support 707 was self-supported. 708 transfers the wiring pattern 702 to the main surface of 701 (for example, Japanese Patent Application Laid-Open No. 0-84186 ⑻% paragraph or refer to FIG. 1). However, in the above-mentioned transfer method, when the resin preform sheet 701 and the support 707 are pressure-bonded, the resin component of the resin preform sheet 701 is fluidized due to the heating during the pressure bonding, causing the wiring pattern 7 The resin component of the resin preform sheet 701 flows between 〇2 and the via hole conductor 706. Therefore, there is a problem that the connection resistance between the wiring pattern 702 and the via hole conductor 706 increases.
O:\88\88535 DOC 1238687 本發明係為解決上述問題開發而成，盆一 ^ 脂基板之製造方法、樹脂多層基板 勺係提供树 \衣万法，苴可、、或 佈線圖案與通道孔導體的連接電阻。 、錢低 進a之’本發明之另 一目的還提供一種佈線圖案與通道 基板。 l孔之連接電阻小的樹脂 【發明内容】 即，本發明提供一種樹脂基板製 令丁广·> 衣乂方法，其包含如下 之工序.在預成形體狀態之樹月旨薄板的至少_個主面上， 形成佈線圖案；在形成有該樹脂薄板之佈線圖案的一個主 面上配置一定厚度之遮罩部件 嫂同安 早丨仵，形成貫通該樹脂薄膜、佈 線圖案以及遮罩部件之貫通孔；藉由 佈 充填於該貫通孔，·自樹脂薄板之主面除:=;=電體 使該導電體之一端自佈線圖案主面突出來· v 以 ，洚士人 大出來，沿該樹脂薄板 ί向’將自該佈線圖案主面突起的導電體之-端加 i，以使該導電體之一端形成釘狀頭部。 根據本發明之樹脂基板剪 而起導電體作用之二作為通道孔導體 脂薄板㈠佈線圖案主面突出來，並沿樹 一 知加壓，以使該導電體之 而形成釘狀頭部，佈線圖案主 通過面接觸，〜〃 釘狀頭部之内側主面 仔以電氣性連接，佈線圖案盘導 面積得以掸如〜 口系一 v電體之接觸 曰加。-而，可以製作出佈線圖案與通道孔導體 之連接電阻小的樹脂基板。 自=纟本發明之樹脂基板製造方法中，最好在導電體 自佈線圖案主面突 大起的狀怨下，在導電體被臨時乾燥後，O: \ 88 \ 88535 DOC 1238687 The present invention was developed to solve the above problems. A method for manufacturing a grease substrate, a resin multilayer substrate spoon, and a tree pattern are provided, which can be used, or wiring patterns and channel holes. Connection resistance of the conductor. A further object of the present invention is to provide a wiring pattern and a channel substrate. Resin with a small connection resistance of the hole [Abstract] That is, the present invention provides a resin substrate manufacturing method Ding Guang > clothing and garment method, which includes the following steps. At least _ A wiring pattern is formed on each of the main surfaces; a mask member having a certain thickness is arranged on one of the main surfaces on which the wiring pattern of the resin sheet is formed, as in the morning, to form a penetration through the resin film, the wiring pattern, and the mask member. Holes are filled with cloth through the cloth, and the main surface of the resin sheet is divided: =; = the electric body makes one end of the conductor protrude from the main surface of the wiring pattern. The thin plate 加 adds i to the-end of the conductor protruding from the main surface of the wiring pattern, so that one end of the conductor forms a nail-like head. The resin substrate according to the present invention cuts out and acts as a conductor. The main surface of the wiring pattern is protruded as a thin plate of the channel hole conductor grease and pressurized along the tree, so that the conductor forms a nail-like head and wiring. The main pattern contacts through the surface, ~ 〃 The inner main surface of the nail-shaped head is electrically connected, and the conducting area of the wiring pattern disk can be as small as ~ The contact of a v-electric body is added. -Furthermore, a resin substrate having a small connection resistance between the wiring pattern and the via hole conductor can be produced. Since the manufacturing method of the resin substrate of the present invention, it is preferable that the conductor is temporarily dried after the conductor is raised from the main surface of the wiring pattern.
O:\88\88535.DOC 1238687 再沿樹脂薄板厚度方向將該導電體之一端加壓。又，較佳 的是在樹脂薄板硬化後，再沿該樹脂薄板之厚度方向將導 電體之一端加壓。 在導電體一端自佈線圖案之主面突起的狀態下，藉由將 導電體臨時乾燥，得到某種程度之硬化，在對導電體突起 部加壓時，可形成具有適度擴張之釘狀頭部。而且，藉由 事先使樹脂薄板硬化後，向導電體突起部加壓，可防止樹 脂薄板之變形及導電體體積電阻之增加。 又，本發明提供一種樹脂多層基板的製造方法，其包含： 採用本發明之樹脂基板製造方法，製作複數個樹脂基板之 工序；包括預埋有導電體之樹脂薄板的黏接層之準備工 序；將樹脂基板主面及黏接層主面合二為一，且以在前述 兩層基板間配置前述黏接層的方式壓接前述樹脂基板與前 述黏接層之工序。 根據本發明之樹脂多層基板之製造方&，因其採用佈線 圖案與通道孔導體之連接電阻小的樹脂基板作為多層基板 之一個構成層，故而能藉由通道孔，以低電阻使佈設於多 層基板上的佈線圖案相互連接，形成電氣特性優良之樹脂 多層基板。 此外，本發明係提供一種樹脂基板，其包含：樹脂層、 在丽述樹脂層之至少一個主面上所形成的佈線圖案、沿厚 度方向貝通該樹脂層而與該佈線圖案電氣性連接之通道孔 導體·’其特徵為：在該通道孔導體與該佈線圖案之連接側 的一端有釘狀頭部，該佈線圖案主面藉由面接觸而與形成O: \ 88 \ 88535.DOC 1238687 Press one end of the conductor along the thickness of the resin sheet. It is also preferable that after the resin sheet is hardened, one end of the conductor is pressed in the thickness direction of the resin sheet. In the state where one end of the conductor protrudes from the main surface of the wiring pattern, the conductor is temporarily dried to obtain a certain degree of hardening. When the conductor protrusion is pressed, a nail-shaped head with a moderate expansion can be formed. . In addition, by hardening the resin sheet in advance and applying pressure to the conductor protrusions, it is possible to prevent deformation of the resin sheet and increase in the volume resistance of the conductor. In addition, the present invention provides a method for manufacturing a resin multilayer substrate, which includes: a process of manufacturing a plurality of resin substrates by using the resin substrate manufacturing method of the present invention; a preparation process including an adhesive layer of a resin sheet in which a conductor is embedded; The process of combining the main surface of the resin substrate and the main surface of the adhesive layer into one, and crimping the resin substrate and the adhesive layer in such a manner that the adhesive layer is arranged between the two substrates. According to the manufacturing method of the resin multilayer substrate according to the present invention, because it uses a resin substrate with a small connection resistance between the wiring pattern and the via hole conductor as a constituent layer of the multilayer substrate, it can be arranged at a low resistance through the via hole. The wiring patterns on the multilayer substrate are connected to each other to form a resin multilayer substrate having excellent electrical characteristics. In addition, the present invention provides a resin substrate including a resin layer, a wiring pattern formed on at least one main surface of the resin layer, and a resin layer which is electrically connected to the wiring pattern in a thickness direction. A via hole conductor is characterized in that a nail-like head is provided at one end of the side of the connection hole conductor and the wiring pattern, and the main surface of the wiring pattern is formed by surface contact.
O:\88\88535.DOC 1238687 主面進行電氣性連 ;x l道孔‘體一端之釘狀頭部的内側 接0 、月之树月曰基板’因其佈線圖案之露出側主面藉由面 帝# 、形成於通道孔導體之一端的釘狀頭部内側主面進行 U生連接’佈線圖案及通道孔導體的接觸面積增大，從 而減低佈線圖案與通道孔導體之接觸電阻。 【實施方式】 ’基於所期之實施形態，說明本發明之樹脂基板製 造方法以及樹脂多層基板製造方法。 (實施形態1) 以圖1〜圖7說明本發明之樹脂基板製造方法之一種實施 形態。 :先，如圖1(a)所示，準備預成形體之狀態樹脂薄板101。 接著，如圖1(b)所示，在樹脂薄板1G1之兩主面上形成佈線 圖案102。 樹脂薄板HH包含例如將無機填充料與熱硬化樹脂之混 合。可採用例如：Al2〇3、Si〇2、Ti〇2等作為無機填充料。 採用這些無機填充料，在提高樹脂基板散熱性之同時，還 可以調節樹脂基板之流動性。此外，可採用如：環氧樹脂、 酚醛樹脂、氰酸酯樹脂等作為熱硬化樹脂。最佳者係耐熱 性、对濕性好的環氧樹脂。 再者，所謂預成形體狀態，係指熱硬化樹脂未硬化之狀 態。意即，樹脂薄板101具有一定流動性之狀態。樹脂薄板 101，最終以硬化狀態構成樹脂基板或樹脂多層基板之一部 O:\88\88535.DOC -9- 1238687 分。但，在樹脂基板或樹脂多層基板之製造過程中，在何 一工序中使樹脂薄板1 0 1硬化，則根據目的而任意決定。扩 而，本發明所述之”樹脂薄板"，意指最初準備階段時為2 成形體狀態，但並不一定意味在其後工序中必為預成形體 狀態者。 此外，圖1(b)中，於佈線圖案102上，事先形成了貫通於 厚度方向之雷射通過用孔1〇3。由於雷射通過用孔1〇3之形 成，在後道工序中由雷射於樹脂薄板1〇1上形成貫通孔時， 可防止由佈線圖案102造成的雷射光之反射。可採用如：O: \ 88 \ 88535.DOC 1238687 The main surface is electrically connected; the inner side of the nail-like head at the end of the xl channel is connected to 0, and the tree is called the substrate, because of the wiring pattern on the exposed side.面 帝 # The main surface of the inner side of the nail-shaped head formed at one end of the channel hole conductor is connected to the wiring pattern and the contact area of the channel hole conductor is increased, thereby reducing the contact resistance between the wiring pattern and the channel hole conductor. [Embodiment] The method of manufacturing a resin substrate and the method of manufacturing a resin multilayer substrate according to the present invention will be described based on a desired embodiment. (Embodiment 1) An embodiment of a resin substrate manufacturing method according to the present invention will be described with reference to Figs. 1 to 7. : First, as shown in FIG. 1 (a), a resin sheet 101 in a state of a preform is prepared. Next, as shown in Fig. 1 (b), a wiring pattern 102 is formed on both main surfaces of the resin sheet 1G1. The resin sheet HH includes, for example, a mixture of an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al203, Si02, Ti02 and the like can be used. With these inorganic fillers, while improving the heat dissipation of the resin substrate, the fluidity of the resin substrate can also be adjusted. In addition, for example, an epoxy resin, a phenol resin, a cyanate resin, or the like can be used as the thermosetting resin. The best is epoxy resin with good heat resistance and moisture resistance. The preform state refers to a state where the thermosetting resin is not cured. In other words, the resin sheet 101 has a certain fluidity. The resin sheet 101 finally forms a part of a resin substrate or a resin multilayer substrate in a hardened state. O: \ 88 \ 88535.DOC -9-1238687 points. However, in the manufacturing process of the resin substrate or the resin multilayer substrate, in which step the resin sheet 10 1 is hardened, it is determined arbitrarily according to the purpose. Further, the "resin sheet" according to the present invention means a state of 2 shaped bodies in the initial preparation stage, but it does not necessarily mean that the state of the preformed body is necessarily in the subsequent steps. In addition, FIG. 1 (b ), A laser passing hole 103 is formed in the wiring pattern 102 through the thickness direction in advance. Since the laser passing hole 10 is formed, the laser is applied to the resin sheet 1 in a later step. When a through-hole is formed in the 〇1, the reflection of laser light caused by the wiring pattern 102 can be prevented. For example, the following can be used:
Cu、Ag、Au、Ag-Pt、Ag_Pd等金屬作為佈線圖案1〇2。 樹脂薄板101主面上之佈線圖案1〇2之形成，例如可採用 以下幾種方法： 第一種方法：藉由電鍍的方式，在樹脂薄板1〇1之主面上 形成佈線圖案102。此方式係以一定之溫度向樹脂薄板ι〇ι 加壓亚使之硬化|，在樹脂薄板1〇1主面上形成黏接劑層； 例如，欲形成銅的佈線圖案時，係進一步在黏接劑上J成Metals such as Cu, Ag, Au, Ag-Pt, and Ag_Pd are used as the wiring pattern 102. For forming the wiring pattern 102 on the main surface of the resin sheet 101, for example, the following methods can be adopted: The first method: forming a wiring pattern 102 on the main surface of the resin sheet 101 by electroplating. This method is to apply pressure to the resin sheet at a certain temperature to harden it to form an adhesive layer on the main surface of the resin sheet 101. For example, when a copper wiring pattern is to be formed, it is further adhered to the adhesive. J into the contact
Pd之觸媒層。然後，除了佈線圖案形成預定位i，在觸媒 層上形成光阻層，藉由無電解銅電鍍法以於樹脂薄板101主 面上析出佈線圖案102。此外，殘留於樹脂薄板101主面上 的光P層除去與否均無妨。又，在對應於雷射通過用孔103 處形成光阻層，並在形成該佈線圖案後，除去該部分之光 阻層及觸媒層，藉此在形成佈線圖案1 G2的同時，亦可形成 雷射通過用孔。 务為·藉由轉印方式在樹脂薄板10 1主面上形成Catalyst layer of Pd. Then, in addition to the predetermined pattern i of the wiring pattern, a photoresist layer is formed on the catalyst layer, and the wiring pattern 102 is deposited on the main surface of the resin sheet 101 by an electroless copper plating method. In addition, the optical P layer remaining on the main surface of the resin sheet 101 may be removed or not. In addition, a photoresist layer is formed at a position corresponding to the laser passing hole 103, and after forming the wiring pattern, the photoresist layer and the catalyst layer are removed from the portion, so that the wiring pattern 1 G2 can be formed at the same time as the wiring pattern 1 G2. Form a laser through hole. To be formed on the main surface of the resin sheet 101 by a transfer method
O:\88\88535 DOC -10 - 1238687 泉圖案101。此方法係在PET(聚對苯二甲冑乙二酿）薄膜 或不錄鋼板等轉印用支持體的—個主面上黏接金屬笛（如 =箱），並對金屬箱施之以钱刻處理而形成佈線圖案丨02。 :後’在樹脂薄板1〇1上熱壓接轉印用支持體，再自該樹脂 薄板ιοί除去該轉印用支持體，藉此將佈線圖案iq2轉印到 树月曰薄板1G1上。又’在對金屬進行㈣處理時，還可同 時形成雷射通過孔103。再者，在進行轉印時，佈線圖案ι〇2 有時會被埋沒於樹脂薄板1〇1。本發明所定義之，，在樹脂薄 板之至少一個主面上形成的佈線圖案，，或π在樹脂層之至少 一個主面上形成的佈線圖案"，也包含以上所說之情形。 其次，如圖2所示，在樹脂薄板1〇1的一個主面上配置遮 罩邛件104。遮罩部件1〇4在下述導電體充填工序中，具有 防止導電體附著於樹脂薄板1〇1之主面上的功能。遮罩部件 1〇4可採用如：ΡΕΤ(聚對苯二甲酸乙二酯）、ρΕΝ(聚二甲酸 乙二S旨）等。 繼之，以雷射藉由雷射通過用孔103照射於樹脂薄板101 的預定之處的方式照射雷射，形成貫通樹脂基板ι〇ι、佈線 圖案102以及遮罩部件1〇4之貫通孔1〇5，即如圖3所示。而 作為形成貫通孔105之手段，除c〇2雷射以外，可採用yag 雷射或準分子雷射。也可以用機械穿孔機形成貫通孔丨〇5。 此外，在形成貫通孔105時，如沒有因佈線圖案1〇2產生的 雷射反射之問題，則無需在佈線圖案102上形成雷射通過孔 103。 然後，如圖4所示，藉由遮罩部件1 04，填充導電體丨06O: \ 88 \ 88535 DOC -10-1238687 Spring pattern 101. This method involves attaching a metal flute (such as a box) to one of the main surfaces of a transfer support such as a PET (poly (p-xylylene terephthalate)) film or a non-recorded steel plate, and applying money to the metal box The etch process is performed to form a wiring pattern. : After ', the support for transfer is thermocompression-bonded to the resin sheet 101, and the support for transfer is removed from the resin sheet, thereby transferring the wiring pattern iq2 to the sheet 1G1. Also, when the metal is subjected to a hafnium treatment, a laser passing hole 103 may be formed at the same time. In addition, the wiring pattern ι02 may be buried in the resin sheet 101 during the transfer. As defined in the present invention, a wiring pattern formed on at least one main surface of a resin sheet, or a wiring pattern formed by π on at least one main surface of a resin layer also includes the above-mentioned cases. Next, as shown in Fig. 2, a mask member 104 is disposed on one main surface of the resin sheet 101. The mask member 104 has a function of preventing the conductor from adhering to the main surface of the resin sheet 101 in the conductor filling step described below. The masking component 104 can be used, for example, PET (polyethylene terephthalate), ρENE (polyethylene dicarboxylate), and the like. Next, the laser is irradiated so that the laser is irradiated to the predetermined position of the resin sheet 101 through the laser passing hole 103 to form a through hole penetrating the resin substrate ι, the wiring pattern 102, and the cover member 104. 105, as shown in Figure 3. As a means for forming the through hole 105, in addition to the CO2 laser, a yag laser or an excimer laser can be used. It is also possible to form a through hole with a mechanical punch. In addition, when the through-hole 105 is formed, if there is no problem of laser reflection caused by the wiring pattern 102, it is not necessary to form a laser passing hole 103 in the wiring pattern 102. Then, as shown in FIG. 4, the conductive member is filled with the shielding member 104.
O:\88\88535 DOC -11- 1238687 ⑼。W6，作為立體性連接樹脂基板表面 兩内賴形成之佈線圖案的通道孔導體而發揮其功能。導 電體1 0 6可採用如··由全眉 田孟屬粒子與熱硬化性樹脂混合而成之 導電性糊料。金屬粒子可採用Au、Ag、cu、奶等。熱硬化 1·生树月日可知用環氧樹脂、苯紛樹脂、氰酸酯樹脂等。此外， 導電體1G6則不限於導電性糊料，錫球或金球等具有-定流 動性的金屬材料亦可。 再者’貫通孔105内部之導電體106填充方法，包括如： 使導電性糊料流至遮罩部件104之主面上，再在遮罩部件 1 04之主面上使刮漿板滑動的方法。 其次，自樹脂薄板1〇1除去遮罩部件104。結果係如圖5 所不，導電體1G6之-端自佈線圖案1()2主面突起而形成突 起部106a。 再後在圖5所不之狀恶，沿樹脂薄板厚度方向將突起部 l〇6a加壓。此時，也可同時給樹脂薄板ι〇ι加壓。加壓手段 如：可用真空加|機#。又，加壓時最好覆蓋突起部1〇6&， 在樹脂薄板上配置PET薄膜等保護材料，此舉可防止佈 線圖案102或導電體1〇6之損傷。 上述結果將使導電體106之一端所形成的突起部⑽時 坦化，並如圖6所示，在導電體1〇6之一端形成釘狀（τ字狀） 頭部106b。如此，佈線圖案1G2之上面藉由面接觸而與釘狀 頭部i 0 6 b之下部進行電氣性接觸。再者，由於佈線圖案丨〇 2 被夾在樹脂薄板101與導電體1〇6之釘狀體頭部1〇补之間， 因此佈線圖案的連接強度被提高。圖6所示之1〇7為其面接 O:\88\88535.DOC -12- 1238687 觸之一部分。所以，佈線圖案102與導電體1〇6之接觸面積 增加，佈線圖案102與導電體106之的連接電阻被減低。 此外，在佈線圖案1〇2間的間距狹窄的情況下，若在導電 體106之流動性高的狀態下給突起部1〇6a加壓，則釘狀頭部 106b在樹脂薄板1〇1主面方向過於擴張，而導致與相鄰佈線 圖案102連接而造成短路之弊端。所以，在將突起部1〇以加 壓時，隶好事先在已形成突起部丨〇6a的狀態下，對導電體 106進行臨時乾燥，以使導電體1〇6得以作某種程度的硬 化。如此，在使導電體i 06被臨時乾燥後，藉由將突起部丨〇心 加壓’即可形成具有適度擴張之釘狀頭部1 〇6b。 再者，如在樹脂薄板1 〇丨之流動性高的狀態下將突起部 1 06a加壓，則會導致樹脂薄板1 〇 1變形，使導電體1 橫向 肥大而產生導電體106的體積電阻增大之弊端。所以，在給 突起部106a加壓之時，較佳的是藉由熱處理事先使樹脂薄 板101硬化。這樣，在樹脂薄板1 〇 1被硬化後，再向突起部 106a加壓，可以防止導電體1〇6之體積電阻的增加。 亦可藉由一次熱處理同時進行使導電體丨〇6臨時乾燥的 工序及使樹脂薄板1 〇 1硬化的工序。 圖7所示為經過以上工序製造而成的樹脂基板之剖面 圖。如圖7所示，樹脂基板200，其含有：預成形體狀態之 樹脂薄板硬化成之樹脂層201、樹脂層201之兩主面上所形 成的佈線圖案202、沿厚度方向貫通樹脂層2〇 1並電氣性連 接分別設置於樹脂層20 1兩主面之佈線圖案202的通道孔導 體 206 〇O: \ 88 \ 88535 DOC -11- 1238687 ⑼. W6 functions as a via hole conductor for three-dimensionally connecting the wiring pattern formed on the surface of the resin substrate. The conductive material 106 can be made of, for example, a conductive paste obtained by mixing a full-field genus particle with a thermosetting resin. The metal particles may be Au, Ag, cu, milk, or the like. Thermal hardening 1. It is known that the use of epoxy resins, benzene resins, cyanate resins, etc. can be found on the tree. In addition, the conductor 1G6 is not limited to a conductive paste, and a metal material having a constant flow property such as a tin ball or a gold ball may be used. Furthermore, the method for filling the conductive body 106 inside the through hole 105 includes, for example, flowing conductive paste to the main surface of the masking member 104, and sliding the scraper on the main surface of the masking member 104. method. Next, the mask member 104 is removed from the resin sheet 101. As a result, as shown in Fig. 5, the-end of the conductor 1G6 protrudes from the main surface of the wiring pattern 1 () 2 to form a protruding portion 106a. Then, as shown in FIG. 5, the protrusion 106a is pressed in the thickness direction of the resin sheet. At this time, the resin sheet can be pressed at the same time. Pressurizing means such as: available vacuum plus | 机 #. In addition, it is preferable to cover the protrusions 106 and a protective material such as a PET film on the resin sheet during pressing, so as to prevent damage to the wiring pattern 102 or the conductor 106. As a result, the protrusions formed on one end of the conductive body 106 are tanned, and as shown in FIG. 6, a nail-shaped (τ-shaped) head portion 106b is formed on one end of the conductive body 106. In this way, the upper surface of the wiring pattern 1G2 is brought into electrical contact with the lower portion of the nail-shaped head portion i 0 6 b through surface contact. Furthermore, since the wiring pattern 〇2 is sandwiched between the resin sheet 101 and the nail-shaped body head 10 of the conductive body 106, the connection strength of the wiring pattern is improved. The 107 shown in Fig. 6 is part of the contact O: \ 88 \ 88535.DOC -12-1238687. Therefore, the contact area between the wiring pattern 102 and the conductor 106 is increased, and the connection resistance between the wiring pattern 102 and the conductor 106 is reduced. In addition, when the distance between the wiring patterns 102 is narrow, if the protrusion 106a is pressurized in a state where the fluidity of the conductor 106 is high, the nail-shaped head 106b is mainly formed on the resin sheet 101. The plane direction is too wide, which causes the short circuit due to the connection with the adjacent wiring pattern 102. Therefore, when the protrusion 10 is pressurized, the conductor 106 is temporarily dried in a state where the protrusion 106a has been formed in advance, so that the conductor 106 can be hardened to a certain degree. . In this way, after the conductive body i 06 is temporarily dried, by pressing the protruding portion 109, the nail-shaped head portion 106b having a moderate expansion can be formed. In addition, if the protruding portion 106a is pressurized in a state where the resin sheet 10 is highly fluid, the resin sheet 100 will be deformed, the conductor 1 will be enlarged laterally, and the volume resistance of the conductor 106 will increase. Big disadvantage. Therefore, when pressing the protrusions 106a, it is preferable to harden the resin sheet 101 in advance by heat treatment. In this way, after the resin sheet 101 is hardened, the projection 106a is pressurized to prevent an increase in the volume resistance of the conductive body 106. The step of temporarily drying the conductive body 106 and the step of hardening the resin sheet 101 may be performed by one heat treatment. Fig. 7 is a cross-sectional view of a resin substrate manufactured through the above steps. As shown in FIG. 7, a resin substrate 200 includes a resin layer 201 formed by curing a resin sheet in a preformed state, a wiring pattern 202 formed on both main surfaces of the resin layer 201, and a resin layer 2 penetrating in the thickness direction. 1 and electrically connect the via hole conductors 206 of the wiring pattern 202 provided on the two main surfaces of the resin layer 20 respectively.
〇A88\88535 DOC 13- 1238687 在通道孔導體206之一端形成有釘狀頭部2〇6b。又，佈線 圖案202之露出來一侧之主面藉由面接觸而與通道孔導體 206之一端所形成的釘狀頭部2〇6}3之内側主面進行電氣性 連接。圖7中，符號207所示之處係其面接觸之一部分。 再者’在將樹脂基板200直接用作電路元件安裝用基板 時’作為樹脂層20 1使用完全硬化者。如後所述，在採用樹 脂基板200製造樹脂多層基板時，樹脂層既可係完全硬化 者，也可係某種程度硬化者。 (實施形態2) 在本實施形態中，基於圖8〜圖9，說明根據本發明之樹脂 基板製造方法之其他實施形態。 首先’如圖8(a)所示，在預成形體狀態之樹脂薄板3〇1兩 主面上，形成佈線圖案3〇2。在佈線圖案3〇2上，形成沿厚 度方向貫通於佈線圖案302之雷射通過用孔303。 其次’如圖8(b)所示，在樹脂薄板3〇1兩主面上，配置遮 罩部件 304a、304b。 再者’如圖8(c)所示，介由雷射通過用孔303照射匚〇2雷 射’形成貫通遮罩部件304a、佈線圖案302、樹脂薄板301 以及遮罩部件304b之貫通孔305。 然後，如圖8(d)所示，藉由遮罩部件3〇4a，充填導電體3〇6 於貫通孔305。 繼之，從樹脂薄板301除去遮罩部件3〇4a、3〇4b。結果係 如圖8(e)所示’導電體306之兩端自佈線圖案3 〇2主面突出， 突起部306a分別形成於樹脂薄板301之兩主面上。〇A88 \ 88535 DOC 13-1238687 A nail-shaped head 206b is formed at one end of the channel hole conductor 206. In addition, the main surface of the exposed side of the wiring pattern 202 is electrically connected to the inner main surface of the nail-shaped head portion 206} 3 formed at one end of the via hole conductor 206 through surface contact. In FIG. 7, a portion indicated by a reference numeral 207 is a part of the surface contact. Furthermore, when the resin substrate 200 is directly used as a circuit element mounting substrate, a fully cured resin is used as the resin layer 201. As described later, when the resin multilayer substrate is manufactured using the resin substrate 200, the resin layer may be either fully cured or cured to some extent. (Embodiment 2) In this embodiment, another embodiment of the method for manufacturing a resin substrate according to the present invention will be described based on Figs. 8 to 9. First, as shown in FIG. 8 (a), a wiring pattern 302 is formed on both main surfaces of a resin sheet 3101 in a preformed state. A laser passing hole 303 is formed in the wiring pattern 302 and penetrates the wiring pattern 302 in the thickness direction. Next, as shown in Fig. 8 (b), mask members 304a and 304b are arranged on both main surfaces of the resin sheet 301. In addition, as shown in FIG. 8 (c), the through-hole 305 is irradiated with the laser passing through the hole 303 to form a through-hole 305 through the mask member 304a, the wiring pattern 302, the resin sheet 301, and the shield member 304b . Then, as shown in FIG. 8 (d), the through-holes 305 are filled with the conductive material 306 through the mask member 304a. Then, the mask members 304a and 304b are removed from the resin sheet 301. As a result, as shown in FIG. 8 (e), both ends of the 'conductor 306 protrude from the main surface of the wiring pattern 302, and the protrusions 306a are formed on both main surfaces of the resin sheet 301, respectively.
O:\88\88535.DOC -14- 1238687 最後’在SI 8⑷所示之狀態了，沿樹脂薄板3〇1之厚度方 向加i大起部3G6a。該結果使導電體鳩兩端所形成的突起 邻〇06a平坦化，並如圖8的所示，在導電體之兩端形成 釘狀頭部306b。 圖9所不為經以上工序而製得的樹脂基板之剖面圖。如圖 9所不，樹脂基板400包| :預成形體狀態之樹脂薄板被硬 化而成的樹脂層401、形成於樹脂層4〇1兩主面上之佈線圖 案402、在厚度方向上貫通樹脂層4〇1並電氣性連接佈線圖 案402之通道孔導體406。 通道孔導體406之兩端上形成有釘狀頭部4〇讣，且佈線圖 案402露出來一側之主面藉由面接觸而與通道孔導體4〇6兩 端所形成之釘狀頭部4〇6b内側主面進行電氣性連接。圖9 中，符號407所示之處為其面接觸之一部分。 此外’本貫施形恶中各構成要件，與實施形態1相同，因 此省略詳細說明。 (實施形態3) 下面基於圖10〜圖12,說明根據本發明之樹脂多層基板之 製造方法。 首先’藉由實施形態1所示之樹脂基板製造方法，製造複 數個圖6所示之樹脂基板200。 又，如圖10所示，準備包括埋有導電體5〇6的樹脂薄板5〇1 之黏接層500。樹脂薄板501及導電體506，可用與實施形態 1中相同的樹脂薄板50 1及導電體506。 黏接層500，例如可按以下方式製成。首先，如圖u (a)O: \ 88 \ 88535.DOC -14- 1238687 Finally, it is in the state shown in SI 8⑷, and the large rising portion 3G6a is added along the thickness direction of the resin sheet 3001. As a result, the protrusions formed at both ends of the conductive dove were flattened, and as shown in FIG. 8, nail-shaped heads 306b were formed at both ends of the conductive body. FIG. 9 is not a cross-sectional view of a resin substrate obtained through the above steps. As shown in FIG. 9, the resin substrate 400 is packaged: a resin layer 401 obtained by curing a resin sheet in a preform state, a wiring pattern 402 formed on both main surfaces of the resin layer 401, and penetrating the resin in a thickness direction The layer 401 is electrically connected to the via hole conductor 406 of the wiring pattern 402. Nail-shaped heads 40 ° are formed on both ends of the via-hole conductor 406, and the main surface of the side where the wiring pattern 402 is exposed is in contact with the nail-shaped heads formed on both ends of the via-hole conductor 406 by surface contact. 406b is electrically connected to the inner main surface. In FIG. 9, a portion indicated by a symbol 407 is a part of the surface contact. In addition, each constituent element in the conventional practice is the same as that of the first embodiment, so detailed description is omitted. (Embodiment 3) A method for manufacturing a resin multilayer substrate according to the present invention will be described below based on Figs. 10 to 12. First, a plurality of resin substrates 200 shown in FIG. 6 are manufactured by the resin substrate manufacturing method shown in the first embodiment. As shown in FIG. 10, an adhesive layer 500 including a resin sheet 501 in which a conductor 506 is buried is prepared. As the resin sheet 501 and the conductor 506, the same resin sheet 501 and the conductor 506 as those in the first embodiment can be used. The adhesive layer 500 can be formed in the following manner, for example. First, as shown in figure u (a)
O:\88\88535.DOC -15 - 1238687 斤示在預成开）體狀態之樹脂薄板5 Ο 1的兩主面上，貼附遮 罩邛件504。其次，再如圖！丨化）所示，藉由雷射形成貫通樹 脂薄板501及遮罩部件5〇4的貫通孔5〇5。繼之，如圖11(c) 所示’將導電體506充填於貫通孔5〇5内部，以一定時間、 疋/凰度使之乾燥。爾後’如圖11 (d)所示，自樹脂薄板5 〇 i 除去遮罩部件5〇4，來製成黏接層500。 其後’如圖12所示，將樹脂基板2〇〇及黏接層5〇〇相互層 疊並進行壓接，藉此製成樹脂多層基板6〇〇。在樹脂多層基 板600中埋入黏接層5〇〇之導電體5〇6，係與樹脂基板2〇〇的 佈線圖案202或導電體206進行電氣性連接。 又’樹脂基板200與黏接層500在被壓接時，既可將所有 的树脂基板200與黏接層5〇〇層疊後一併壓接，也可以將樹 脂基板200與黏接層500依次進行層疊、壓接而反復之。 再者’樹脂基板200與黏接層500之壓接，基本採用熱壓 接方式。此時’如上所述，構成樹脂基板2〇〇之樹脂薄板 2〇 1 ’既可係完全硬化者，也可係某種程度硬化者。另一方 面’為使黏接層500在樹脂基板2〇〇之間起黏接作用，宜在 進行熱壓接之前’勿使構成黏接層之樹脂薄板5〇丨過於硬 化’較佳使之保持一定的流動性。熱壓接後，樹脂基板2〇〇 及黏接層500完全硬化。 如此，根據本發明相關之樹脂基板之製造方法以及多層 樹脂基板之製造方法，可在樹脂基板或多層樹脂基板上形 成低電阻電路圖案。其特徵為：使作為通道孔導體起導電 作用之導電體的一端，自佈線圖案之主面突出，並沿樹脂 O:\88\88535 DOC -16- 1238687 薄板厚度方向將導電體之一端加壓，在導電體之一端形成 釘狀頭部。因此，佈線圖案之主面與釘狀頭部的内側面藉 由面接觸得以電氣性連接，佈線圖案與導電體的接觸面積 被增加。從而能夠可靠且以低電阻連接該佈線圖案及該通 道孔導體。 又，因為佈線圖案被夾在樹脂薄板與導電體的釘狀頭部 之間，故而，佈線圖案與樹脂薄板間的結合強度得以提高。 因此，這一構造對提高具有用於與主基板連接的表面佈線 圖案、或用於安裝表面組裝元件之表面佈線圖案的樹脂基 板，以及樹脂多層基板的結合強度之提高大有益處。 再者，在導電體之一端自佈線圖案的主面突出之狀態 下，藉由使導電體臨時乾燥作某種程度的硬化，可在將導 電體突起部加壓時，形成具有適度擴張之釘狀頭部。又， 使樹脂薄板事先硬化，再向導電體突起部加壓，藉此可防 止樹脂薄板的變形及導電體之體積電阻的增加。 實施例 以下就具體實施例對本發明加以說明。 (實施例1) 首先，準備了二氧化矽（Si〇2粉末）及液態環氧樹脂混合而 成、厚度為400 μιη的預成形體環氧薄板，用作樹脂薄板。 然後將預成形體環氧薄板以17(rc、〇·2 Mpa的條件沿厚度 方向加壓5分鐘，形成厚度為35〇 μιη的環氧基板。 其次，在環氧基板之兩主面上敷以以觸媒以使之活性 化，接著在Pd觸媒層上附加含有酴醛清漆樹脂的光敏保護O: \ 88 \ 88535.DOC -15-1238687 The mask sheet 504 is attached to the two main surfaces of the resin sheet 5 0 1 in a pre-opened state. Second, look at the picture again! As shown in the figure, a through hole 505 that penetrates the resin sheet 501 and the shielding member 504 is formed by laser. Next, as shown in FIG. 11 (c), the conductive body 506 is filled in the through hole 505, and is dried for a certain period of time. Thereafter, as shown in FIG. 11 (d), the masking member 504 is removed from the resin sheet 50i to form an adhesive layer 500. Thereafter, as shown in FIG. 12, a resin substrate 200 and an adhesive layer 500 are laminated on each other and subjected to pressure bonding, thereby forming a resin multilayer substrate 600. The conductive body 506 of the adhesive layer 500 is embedded in the resin multilayer substrate 600, and is electrically connected to the wiring pattern 202 or the conductive body 206 of the resin substrate 2000. Also, when the resin substrate 200 and the adhesive layer 500 are pressure-bonded, all the resin substrates 200 and the adhesive layer 500 may be laminated and pressed together, or the resin substrate 200 and the adhesive layer 500 may be sequentially pressed. Lamination and pressure bonding are repeated. Furthermore, the pressure bonding of the resin substrate 200 and the adhesive layer 500 is basically performed by a thermal compression bonding method. At this time, as described above, the resin sheet 2001 constituting the resin substrate 2000 may be either fully cured or cured to some extent. On the other hand, in order to make the adhesive layer 500 adhere to the resin substrate 2000, it is better to 'don't make the resin sheet 50 constituting the adhesive layer too hard' before performing thermocompression bonding. Maintain some liquidity. After thermocompression bonding, the resin substrate 200 and the adhesive layer 500 are completely hardened. Thus, according to the method for manufacturing a resin substrate and the method for manufacturing a multilayer resin substrate according to the present invention, a low-resistance circuit pattern can be formed on the resin substrate or the multilayer resin substrate. It is characterized in that one end of a conductor that functions as a conductive conductor of a channel hole protrudes from the main surface of the wiring pattern, and presses one end of the conductor along the thickness direction of the resin O: \ 88 \ 88535 DOC -16-1238687 A nail-shaped head is formed at one end of the conductor. Therefore, the main surface of the wiring pattern is electrically connected to the inner side surface of the nail-shaped head by surface contact, and the contact area between the wiring pattern and the conductor is increased. Therefore, the wiring pattern and the via hole conductor can be connected reliably and with low resistance. In addition, since the wiring pattern is sandwiched between the resin sheet and the nail-like head of the conductor, the bonding strength between the wiring pattern and the resin sheet is improved. Therefore, this configuration is very useful for improving the bonding strength of a resin substrate having a surface wiring pattern for connection to a main substrate or a surface wiring pattern for mounting a surface mount component, and a resin multilayer substrate. Furthermore, in a state where one end of the conductor protrudes from the main surface of the wiring pattern, by temporarily drying the conductor to a certain degree of hardening, a pin with a moderate expansion can be formed when the conductor protrusion is pressed. Like head. In addition, the resin sheet is hardened in advance, and then the conductor projection is pressed, thereby preventing the resin sheet from being deformed and increasing the volume resistance of the conductor. Examples The present invention will be described below with reference to specific examples. (Example 1) First, a pre-formed epoxy sheet having a thickness of 400 μm, prepared by mixing silicon dioxide (SiO 2 powder) and a liquid epoxy resin, was prepared and used as a resin sheet. Then, the preform epoxy sheet was pressed in the thickness direction for 5 minutes under the conditions of 17 (rc, 0.2 Mpa) to form an epoxy substrate having a thickness of 35 μm. Next, the two main surfaces of the epoxy substrate were coated with A catalyst is used to activate it, and then a photosensitive protection containing a formaldehyde varnish resin is added to the Pd catalyst layer.
O:\88\88535.DOC -17- 1238687 材料，形成光阻層。繼而，將光阻層預烘烤後，在光阻層 上抵接形成有與佈線圖案同形狀的透光圖案之光罩，並進 行曝光。然後，利用硼酸溶液顯像後，再進行後烘烤，將 光阻層圖案化。藉此，除了佈線形成預定位置，在pd觸媒 層上形成光阻層。 爾後，將環氧基板浸潰於無電解銅鍍液中，在未被光阻 層覆蓋之Pd觸媒層上，析出厚度為15 μιη的佈線圖案。然 後’藉由氫氧化鈉水溶液除去光阻層及Pd觸媒層，而在佈 線圖案預定位置形成直徑為20〇 μιη的雷射通過用孔。 繼而，在環氧基板之兩主面上，貼附厚度為2〇μη]^ρΕτ 薄膜，介以雷射通過孔並藉由c〇2雷射，形成貫通奸丁薄 膜、佈線圖案以及環氧基板之貫通孔。 然後，藉由刮漿板，介以另一 ΡΕΤ薄膜在貫通孔内部充填 導電漿料（TATSUTA電線公司製ΑΕ1244)。 再後，從環氧基板除去ΡΕΤ薄膜。其結果為：導電糊料之 兩端從佈線圖案主面突出來而形成突出部。然後，在此狀 怨下，以lOOt進行3〇分鐘熱處理，使導電糊料被臨時乾燥。 最後，以覆蓋導電漿料之突出部之方式，在環氧基板兩 主面上配置PET薄膜。然後，以17〇。〇、1〇MPa的條件，沪 環氧基板厚度方向，將突出部加壓60分鐘。其結果係導電 才月料熱硬化、形成通道孔導體，而且於通道孔導體的兩端 上形成釘狀頭部。最後，除去環氧基板上的pET薄膜而 樹脂基板。 f (實施例2)O: \ 88 \ 88535.DOC -17- 1238687 material to form a photoresist layer. Then, after pre-baking the photoresist layer, a photomask having a light-transmitting pattern having the same shape as the wiring pattern is contacted on the photoresist layer and exposed. After developing with a boric acid solution, post-baking is performed to pattern the photoresist layer. Thereby, in addition to the wiring formation predetermined position, a photoresist layer is formed on the pd catalyst layer. Then, the epoxy substrate was immersed in an electroless copper plating solution, and a wiring pattern having a thickness of 15 μm was deposited on the Pd catalyst layer not covered by the photoresist layer. Then, the photoresist layer and the Pd catalyst layer are removed by an aqueous sodium hydroxide solution, and a laser passing hole having a diameter of 20 μm is formed at a predetermined position of the wiring pattern. Then, on both main surfaces of the epoxy substrate, a film having a thickness of 20 μη] ^ ρΕτ is attached, and a through-hole film is formed through the laser through the laser to form a through film, a wiring pattern, and epoxy. Through hole of the substrate. Then, a conductive paste (TAESUTA Electric Wire Co., Ltd. AE1244) was filled in the through-holes with another PET film through a doctor blade. Then, the PET film was removed from the epoxy substrate. As a result, both ends of the conductive paste protrude from the main surface of the wiring pattern to form a protruding portion. Then, under this condition, heat treatment was performed at 100 t for 30 minutes, so that the conductive paste was temporarily dried. Finally, PET films are arranged on both main surfaces of the epoxy substrate so as to cover the protruding portions of the conductive paste. Then, go to 170. Under the conditions of 0 and 10 MPa, the protruding portion was pressed in the thickness direction of the epoxy substrate for 60 minutes. As a result, the conductive material is thermally hardened to form a via hole conductor, and a nail-like head is formed on both ends of the via hole conductor. Finally, the pET film on the epoxy substrate is removed and the resin substrate is removed. f (Example 2)
O:\88\88535.DOC -18- 1238687 τ先，準備混合有二氧化矽及液態環氧樹脂、厚度為4⑽ Mm的預成形體狀環氧薄膜，用作樹脂薄板。 其次，準備厚度為80 μπι之PET薄膜，並在pE 丁薄膜的一 主面上塗布厚度為20㈣的壓克力樹脂系黏接劑，製作成厚 度為1〇〇 μπι之帶黏接劑的PE丁薄膜，用作轉印用支持體。 然後，在塗布有黏接劑的PE 丁薄膜主面±，黏接兩面被粗面 化處理之厚度為18 μπι的銅箔。 、麄而在銅$上旋塗含有酚醛清漆樹脂之保護材料，形 成了光阻層。然後，將光阻層預烘烤後，在光阻層上抵接 形成有與佈線圖案同形狀的透光圖案之光罩，並進行曝 光。然後，藉由硼酸溶液顯像後，進行後烘烤，將光阻層 作成圖案。接著，藉由氯化鐵水溶液來蝕刻銅箔中未被光 阻層覆蓋的部分，然後藉由氫氧化鈉水溶液除去殘留於佈 線圖案上的光阻層，在ΡΕΤ薄膜上，形成具有直徑為2〇〇μιη 的雷射通過孔之佈線圖案。 爾後，藉由真空加壓機，將形成有佈線圖案之ρΕΤ薄膜壓 接於壞氧預成形體的兩主面上。加壓條件為：12〇它、 MPa、5分鐘。 其-人，預成形體藉由自預成形體環氧板除去pET薄膜，在 壞氧預成形體兩主面上形成預成形體佈線圖案。自樹脂薄 板上除去PET薄膜。 然後，以1 70 C之溫度對環氧預成形體進行熱處理5分 鐘’預成形體使環氧預成形體被熱硬化。 最後，與實施例1 一樣，經由配置遮罩部件、形成貫通孔、O: \ 88 \ 88535.DOC -18- 1238687 τ First, a preformed epoxy film with a thickness of 4⑽ Mm mixed with silicon dioxide and liquid epoxy resin is prepared for use as a resin sheet. Next, a PET film with a thickness of 80 μm was prepared, and an acrylic resin-based adhesive with a thickness of 20 涂布 was coated on one main surface of the pE film to produce a PE with a thickness of 100 μm. Ding film, used as a support for transfer. Then, a copper foil with a thickness of 18 μm was formed on the main surface of the PE-coated film coated with the adhesive, and the two surfaces were roughened. Then, a protective material containing novolac resin was spin-coated on the copper to form a photoresist layer. Then, after pre-baking the photoresist layer, a photomask having a light-transmitting pattern having the same shape as the wiring pattern is contacted on the photoresist layer and exposed. Then, after development with a boric acid solution, post-baking is performed to pattern the photoresist layer. Next, the portion of the copper foil that is not covered by the photoresist layer is etched by an aqueous solution of ferric chloride, and then the photoresist layer remaining on the wiring pattern is removed by an aqueous solution of sodium hydroxide, and a diameter of 2 is formed on the PET film. 〇〇μιη laser through the wiring pattern of the hole. Thereafter, the ρET film having the wiring pattern formed thereon was crimped onto both main surfaces of the bad oxygen preform by a vacuum press. The pressurization conditions were 120 MPa, MPa, and 5 minutes. In this case, a preform is formed by removing a pET film from an epoxy plate of the preform, and forming a preform wiring pattern on both main surfaces of the bad oxygen preform. The PET film was removed from the resin sheet. Then, the epoxy preform was heat-treated at a temperature of 1 70 C for 5 minutes to preform the epoxy preform to be heat-hardened. Finally, as in the first embodiment, by placing a mask member, forming a through hole,
O:\88\88535.DOC -19- 1238687 V兒it⑨去遮罩部件、樹脂薄板加壓之該等工序， ;亍八有@ 形成釘狀頭部的」通道孔導體之樹脂基板。 (實施例3) 、百先’準備由二氧化矽及液態環氧樹脂混合而成之厚度 為⑽㈣的賴狀環氧職形㈣板，用作樹脂薄板。 /、人在％氧預成形體薄板之兩主面上，貼附了厚度為 2〇 μπι的PET薄膜以用作遮罩部件。然後，藉由咖雷射形 成貫通環氧預成形體薄板及PE 丁薄膜的直徑為3〇〇 μιη之貫 通孔。 、·塵之’在貝通孔中充填導電糊料（龍田電線（股）製αει244) 以用作V電體’並以6〇°c的溫度熱處理3〇分鐘，使導電糊 料被臨呀乾燥。然後，從環氧預成形體除去ρΕτ薄膜，製得 黏接層。 取後，與實施例1 一樣製作該樹脂基板，然後，將三個樹 脂基板與兩個黏、.接層交互層疊並壓接，使樹脂基板成為最 上層及最下層。加壓條件為··首先以8〇t：、1〇MPa、進行 5分鐘的熱壓接，使黏接層半硬化之後，再以i7〇r、2〇MPa 進行60刀釦的熱壓接。藉此，製成由樹脂基板與黏接層層 疊而成之樹脂多層基板。 產業上之可利用性 上所述’根據本發明之樹脂基板之製造方法，適用於 具有低電阻電路圖案之樹脂基板或樹脂多層基板的製造。 其可而密度安裝如LSI之半導體元件或層疊陶瓷電容器等 的被動元件。O: \ 88 \ 88535.DOC -19- 1238687 V 儿 It is necessary to remove the cover parts and press the resin sheet, and so on; 亍 There is a resin substrate with a channel via conductor that forms the head of the nail-shaped head. (Example 3), Baixian 'prepared a lyre-shaped epoxy sheet with a thickness of ⑽㈣, which was a mixture of silicon dioxide and a liquid epoxy resin, and used it as a resin sheet. /. A PET film with a thickness of 20 μm was attached to both main surfaces of the% oxygen preformed sheet for use as a masking member. Then, a through hole having a diameter of 300 μm was formed through the laser to penetrate the epoxy preform sheet and the PE butyl film. ". Dust of the" filled with conductive paste (αει244 made by Longtian Electric Wire Co., Ltd.) to be used as a V electric body "and heat-treated at 60 ° C for 30 minutes, so that the conductive paste is applied. dry. Then, the pEτ film was removed from the epoxy preform to prepare an adhesive layer. After the removal, the resin substrate was produced in the same manner as in Example 1. Then, three resin substrates and two adhesive layers were alternately laminated and pressure-bonded to make the resin substrate the uppermost layer and the lowermost layer. Pressing conditions: First, heat compression bonding was performed at 80 t: 10 MPa for 5 minutes to semi-harden the adhesive layer, and then 60 knives were thermally bonded at 70 rpm and 20 MPa. . Thereby, a resin multilayer substrate in which a resin substrate and an adhesive layer are laminated is manufactured. Industrial Applicability As described above, the method for manufacturing a resin substrate according to the present invention is suitable for manufacturing a resin substrate or a resin multilayer substrate having a low-resistance circuit pattern. It is possible to densely mount passive components such as LSI semiconductor components or multilayer ceramic capacitors.
O:\88\88535.DOC -20- 1238687 【圖式簡單說明】 圖l(a)、（b)為本發明之實施形態1所示的樹脂基板製造方 法之工序剖面圖。 圖2為本發明之實施形態1所示的樹脂基板製造方法之工 序剖面圖。 圖3為本發明之實施形態1所示的樹脂基板製造方法之工 序剖面圖。 圖4為本發明之實施形態1所示的樹脂基板製造方法之工 序剖面圖。 — 圖5為本發明之實施形態1所示的樹脂基板製造方法之工 序剖面圖。 圖6為本發明之實施形態1所示的樹脂基板製造方法之工 序剖面圖。 圖7為本發明之實施形態1所示的樹脂基板之剖面圖。 圖8(a)-8(f)為本發明之實施形態2所示的樹脂基板製造方 法之工序剖面圖。 圖9為本發明之實施形態2所示的樹脂基板之剖面圖。 圖10為本發明之實施形態3所示的樹脂多層基板製造方 法之工序剖面圖。 圖11(a)-11(d)為本發明之實施形態3所示的樹脂多層基板 製造方法之工序剖面圖。 圖12為本發明之實施形態3所示的樹脂多層基板製造方 法之工序剖面圖。 圖13(a)-13(c)為先前樹脂基板製造方法之工序剖面圖。 O:\88\88535.DOC -21 - 1238687 圖式代表符號說明】 101 、 301 、 501 樹脂薄板 102 、 202 、 302 、 402 、 702 佈線圖案 103 、 303 雷射通過用孔 104、304a ' 304b、504 遮罩部件 105 、 305 、 505 貫通孔 106 、 206 、 306 、 406 、 506 導電體 106a 突起部 106b 、 206b 、 306a 、 406b 釘狀頭部 200 、 400 樹脂基板 201 、 401 樹脂層 500 黏接層 600 多層基板 701 樹脂預成形體薄板 706 通道孔導體 707 支持體 O:\88\88535.DOC - 22 -O: \ 88 \ 88535.DOC -20-1238687 [Brief description of the drawings] Figs. 1 (a) and (b) are cross-sectional views showing the steps of the method for manufacturing a resin substrate according to the first embodiment of the present invention. Fig. 2 is a process sectional view of a resin substrate manufacturing method shown in the first embodiment of the present invention. Fig. 3 is a process sectional view of a resin substrate manufacturing method shown in the first embodiment of the present invention. Fig. 4 is a process sectional view of a method for manufacturing a resin substrate according to the first embodiment of the present invention. — FIG. 5 is a process sectional view of the resin substrate manufacturing method shown in the first embodiment of the present invention. Fig. 6 is a process sectional view of a resin substrate manufacturing method shown in the first embodiment of the present invention. Fig. 7 is a sectional view of a resin substrate shown in the first embodiment of the present invention. 8 (a) to 8 (f) are cross-sectional views showing the steps of the method for manufacturing a resin substrate according to the second embodiment of the present invention. Fig. 9 is a sectional view of a resin substrate shown in a second embodiment of the present invention. Fig. 10 is a process sectional view of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. 11 (a) -11 (d) are cross-sectional views showing the steps of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. Fig. 12 is a process sectional view of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. 13 (a) -13 (c) are process cross-sectional views of a conventional resin substrate manufacturing method. O: \ 88 \ 88535.DOC -21-1238687 Illustrations of Symbols on the Drawings] 101, 301, 501 Resin Sheets 102, 202, 302, 402, 702 Wiring Patterns 103, 303 Laser Passing Holes 104, 304a '304b, 504 Masking members 105, 305, 505 Through holes 106, 206, 306, 406, 506 Conductor 106a Protrusions 106b, 206b, 306a, 406b Nail-shaped head 200, 400 Resin substrate 201, 401 Resin layer 500 Adhesive layer 600 multilayer substrate 701 resin preform sheet 706 channel hole conductor 707 support O: \ 88 \ 88535.DOC-22-
Claims (1)
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| JP2002323032A JP2004158651A (en) | 2002-11-06 | 2002-11-06 | Manufacturing method of resin substrate, resin multilayer substrate, and resin substrate |
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| TWI238687B true TWI238687B (en) | 2005-08-21 |
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| JP (1) | JP2004158651A (en) |
| AU (1) | AU2003272912A1 (en) |
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| JP4778114B2 (en) * | 2009-03-12 | 2011-09-21 | タツタ電線株式会社 | Multilayer wiring board manufacturing method and multilayer wiring board obtained thereby |
| JP5287570B2 (en) * | 2009-07-21 | 2013-09-11 | ソニー株式会社 | Method for manufacturing printed wiring board |
| CN102595799B (en) * | 2011-12-30 | 2015-03-25 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| KR101505049B1 (en) * | 2012-01-04 | 2015-04-07 | 주식회사 잉크테크 | Manufacturing method of double-sided printed circuit board |
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| JP3241605B2 (en) * | 1996-09-06 | 2001-12-25 | 松下電器産業株式会社 | Wiring board manufacturing method and wiring board |
| JP3738536B2 (en) * | 1997-08-28 | 2006-01-25 | 松下電器産業株式会社 | Method for manufacturing printed wiring board |
| JP2000114681A (en) * | 1998-10-01 | 2000-04-21 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| JP2002314222A (en) * | 2001-04-10 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Printed wiring board and method of manufacturing the same |
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| JP2004158651A (en) | 2004-06-03 |
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