JP2000114681A - Printed wiring board and its manufacture - Google Patents
Printed wiring board and its manufactureInfo
- Publication number
- JP2000114681A JP2000114681A JP10279994A JP27999498A JP2000114681A JP 2000114681 A JP2000114681 A JP 2000114681A JP 10279994 A JP10279994 A JP 10279994A JP 27999498 A JP27999498 A JP 27999498A JP 2000114681 A JP2000114681 A JP 2000114681A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- hole
- metal layer
- pillar
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【技術分野】本発明は，プリント配線板及びその製造方
法に関し，特にビアホールの構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method of manufacturing the same, and more particularly, to a structure of a via hole.
【０００２】[0002]
【従来技術】プリント配線板は，複数層の金属層を有
し，各層の金属層の電気的導通をビアホールにより行っ
ている。ビアホールは，金属メッキ膜の形成により導通
性が付与される。しかし，金属メッキ膜を形成するには
メッキ処理を行う必要があり製造工程数が増加する。2. Description of the Related Art A printed wiring board has a plurality of metal layers, and electrical conduction between the metal layers is performed by via holes. The via holes are provided with conductivity by forming a metal plating film. However, forming a metal plating film requires plating, which increases the number of manufacturing steps.
【０００３】また，ビアホールに導通性を付与する方法
としては，図４（ａ）に示すごとく，ビアホールとなる
貫通穴９２の開口部に，半田及びフラックスからなる半
田ペースト９１を配置し，図４（ｂ）に示すごとく，半
田ペースト９１を加熱溶融させて貫通穴９２の中に流入
させる方法がある。これにより，絶縁基板９５の上面及
び下面に設けた上面金属層９６１と下面金属層９６２と
を電気的に接続するビアホール９３が形成される。しか
し，この方法では，半田ペーストの流入量及び粘度の調
整が必要とされる。As a method for imparting conductivity to a via hole, as shown in FIG. 4A, a solder paste 91 made of solder and flux is disposed in an opening of a through hole 92 serving as a via hole. As shown in (b), there is a method in which the solder paste 91 is heated and melted and flows into the through holes 92. As a result, a via hole 93 for electrically connecting the upper metal layer 961 and the lower metal layer 962 provided on the upper and lower surfaces of the insulating substrate 95 is formed. However, in this method, it is necessary to adjust the inflow amount and viscosity of the solder paste.
【０００４】本発明はかかる従来の問題点に鑑み，製造
容易で，上下金属層間の電気的導通信頼性に優れたビア
ホールを有するプリント配線板及びその製造方法を提供
しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a printed wiring board having via holes that are easy to manufacture and have excellent electrical conduction reliability between upper and lower metal layers, and a method of manufacturing the same.
【０００５】[0005]
【課題の解決手段】本発明は，絶縁基板の上面及び下面
に上面金属層及び下面金属層を形成する工程と，上記絶
縁基板のビアホール形成部分を穴明けして貫通穴を形成
する工程と，上記貫通穴の内部に金属柱を挿入して，上
面金属層と下面金属層との間の電気導通を行い得るビア
ホールを形成する工程とから構成されていることを特徴
とするプリント配線板の製造方法である。The present invention comprises a step of forming an upper metal layer and a lower metal layer on the upper and lower surfaces of an insulating substrate, a step of forming a through hole by drilling a via hole forming portion of the insulating substrate, Forming a via hole capable of providing electrical conduction between the upper metal layer and the lower metal layer by inserting a metal column into the through hole. Is the way.
【０００６】本発明において最も注目すべきことは，ビ
アホール形成用の貫通穴の内部に金属柱を挿入している
ことである。これにより，金属柱を通じて電気導通を行
うビアホールを形成することができる。金属柱の貫通穴
への挿入は容易な操作で行うことができ，また金属柱
は，ビアホールに確実に電気的導通を付与する。以上の
ように，本発明によれば，製造容易で，上下金属層間の
電気的導通信頼性に優れたビアホールを有するプリント
配線板を製造することができる。The most remarkable point in the present invention is that a metal pillar is inserted into a through hole for forming a via hole. Thereby, a via hole that conducts electricity through the metal pillar can be formed. The insertion of the metal pillar into the through hole can be performed by an easy operation, and the metal pillar reliably provides electrical continuity to the via hole. As described above, according to the present invention, a printed wiring board having via holes that are easy to manufacture and have excellent electrical conduction reliability between the upper and lower metal layers can be manufactured.
【０００７】次に，本発明の詳細について説明する。ま
ず，絶縁基板に上面金属層及び下面金属層を形成する。
上面金属層，下面金属層は，所望のパターンを有してい
てもよいし，また絶縁基板全体を被覆する被覆層であっ
てもよい。金属層がパターンを有する場合には，ビアホ
ール形成部分の周縁を囲むランドを有することが好まし
い。これにより，金属層とビアホールとの電気的接続性
が向上する。Next, details of the present invention will be described. First, an upper metal layer and a lower metal layer are formed on an insulating substrate.
The upper metal layer and the lower metal layer may have a desired pattern or may be a coating layer that covers the entire insulating substrate. When the metal layer has a pattern, it is preferable to have a land surrounding the periphery of the via hole forming portion. This improves the electrical connectivity between the metal layer and the via hole.
【０００８】また，被覆層の場合には，ビアホール形成
後に，必要に応じて，サブトラクト法などにてパターン
を形成する。上面金属層，下面金属層は，銅，ニッケ
ル，金などの，金属箔，又は金属めっきなどから形成す
る。上記絶縁基板としては，例えば，エポキシ基板，ポ
リイミド基板，ビスマレイミドトリアジン基板などの樹
脂基板，又はこれらの樹脂をガラスクロス又はガラスフ
ァイバーに含浸させた樹脂複合基板を用いることができ
る。In the case of a coating layer, a pattern is formed by a subtraction method or the like as necessary after the formation of the via hole. The upper surface metal layer and the lower surface metal layer are formed from a metal foil such as copper, nickel, or gold, or metal plating. As the insulating substrate, for example, a resin substrate such as an epoxy substrate, a polyimide substrate, a bismaleimide triazine substrate, or a resin composite substrate obtained by impregnating a glass cloth or a glass fiber with these resins can be used.
【０００９】上記絶縁基板のビアホール形成部分を穴明
けして貫通穴を形成する。穴明けは，例えば，打抜き，
ドリル，レーザ，感光法などにて行うことができる。上
記貫通穴の内部に挿入する金属柱は，挿入可能なよう
に，貫通穴とほぼ同様の形状を有している。但し，金属
柱を貫通穴内部に固定させるため，貫通穴よりも若干大
きいことが好ましい。A through hole is formed by drilling a via hole forming portion of the insulating substrate. Drilling is, for example, punching,
It can be performed by a drill, a laser, a photosensitive method, or the like. The metal pillar to be inserted into the through hole has substantially the same shape as that of the through hole so that it can be inserted. However, it is preferable that the metal column is slightly larger than the through hole in order to fix the metal column inside the through hole.
【００１０】具体的には，上記金属柱の直径は貫通穴の
直径よりも大きく，上記金属柱を貫通穴内部に圧入する
ことが好ましい。これにより，貫通穴からの金属柱の脱
落を防止でき，かつ上下の金属層間の確実な電気導通を
行うことができる。更には，金属柱の直径は，貫通穴の
直径よりも０％を超えて５％大きいことが好ましい。０
ｍｍでは脱落するおそれがあり，５％を超える場合には
貫通穴内部への挿入が困難になるおそれがあるからであ
る。Specifically, the diameter of the metal pillar is larger than the diameter of the through hole, and it is preferable that the metal pillar is press-fitted into the through hole. As a result, it is possible to prevent the metal pillar from dropping out of the through hole, and it is possible to perform reliable electrical conduction between the upper and lower metal layers. Further, it is preferable that the diameter of the metal pillar is more than 0% and 5% larger than the diameter of the through hole. 0
If it exceeds 5%, it may be difficult to insert it into the through hole.
【００１１】また，上記金属柱の長さは上記貫通穴の長
さよりも長く，上記貫通穴内部に挿入した後，上記金属
柱における貫通穴からの突出部分を押しつぶすことが好
ましい。これにより，貫通穴からの金属柱の脱落を防止
でき，かつ上下の金属層間の確実な電気導通を行うこと
ができる。更には，金属柱の長さは，貫通穴の長さより
も５〜２０％大きいことが好ましい。５％未満では脱落
するおそれがあり，２０％を超える場合には貫通穴から
の突出部分で電気導通不良が生じるおそれがあるからで
ある。Preferably, the length of the metal pillar is longer than the length of the through hole, and after the metal pillar is inserted into the through hole, a protruding portion of the metal pillar from the through hole is crushed. As a result, it is possible to prevent the metal pillar from dropping out of the through hole, and it is possible to perform reliable electrical conduction between the upper and lower metal layers. Further, it is preferable that the length of the metal pillar is 5 to 20% larger than the length of the through hole. If it is less than 5%, it may fall off, and if it exceeds 20%, poor electrical conduction may occur at the protruding portion from the through hole.
【００１２】上記金属柱は半田からなり，貫通穴に挿入
した後に加熱することが好ましい。これにより，金属柱
の周縁は上面金属層及び下面金属層に馴染んで強固に接
続する。そのため，貫通穴からの金属柱の脱落を防止で
き，かつ上下の金属層間の確実な電気導通を行うことが
できる。It is preferable that the metal pillar is made of solder and is heated after being inserted into the through hole. Thereby, the periphery of the metal pillar is adapted to the upper surface metal layer and the lower surface metal layer and is firmly connected. Therefore, it is possible to prevent the metal pillar from dropping out of the through hole, and it is possible to perform reliable electrical conduction between the upper and lower metal layers.
【００１３】また，上記金属柱は銀又は銅からなること
もあり，この場合には良好な電気導通を得ることができ
る。また，金属柱は，鉛，スズ，金若しくはニッケルの
群から選ばれる１種又は２種以上からなっていてもよ
い。金属柱を貫通穴内部に挿入した後には，金属柱の貫
通穴からの露出部分を金属メッキ膜で被覆することが好
ましい。湿気や衝撃力から金属柱を保護するためであ
る。Further, the metal pillar may be made of silver or copper, and in this case, good electrical conduction can be obtained. Further, the metal pillar may be made of one or more selected from the group consisting of lead, tin, gold and nickel. After the metal pillar is inserted into the through hole, it is preferable to cover the exposed portion of the metal pillar from the through hole with a metal plating film. This is to protect the metal columns from moisture and impact.
【００１４】上記の製造方法により得られるプリント配
線板としては，例えば，絶縁基板の上面及び下面に設け
た上面金属層及び下面金属層と，上面金属層と下面金属
層との間を電気的に接続するビアホールとからなり，上
記ビアホールの内部には，金属柱が挿入されていること
を特徴とするプリント配線板がある。The printed wiring board obtained by the above-mentioned manufacturing method includes, for example, an upper metal layer and a lower metal layer provided on the upper and lower surfaces of an insulating substrate, and an electrical connection between the upper metal layer and the lower metal layer. There is a printed wiring board comprising a via hole to be connected, wherein a metal pillar is inserted inside the via hole.
【００１５】上記ビアホール内部には金属柱が挿入され
ているため，良好な電気導通性を得ることができる。上
記金属柱の上端及び下端は，上記ビアホール周囲の上面
金属層及び下面金属層に対して押しつぶされてフランジ
部を構成していることが好ましい。これにより，金属柱
の脱落を防止することができる。また，金属柱と上面金
属層及び下面金属層との接触面積が大きくなり，導電性
が向上する。Since the metal pillar is inserted into the via hole, good electrical conductivity can be obtained. It is preferable that upper and lower ends of the metal column are crushed against upper and lower metal layers around the via hole to form a flange portion. This can prevent the metal pillar from falling off. In addition, the contact area between the metal pillar and the upper and lower metal layers is increased, and the conductivity is improved.
【００１６】また，上記金属柱は半田からなり，金属柱
の周縁は上面金属層及び下面金属層と接続し，中心部に
は窪み部が形成されていることが好ましい。これによ
り，金属柱と上面金属層及び下面金属層との接触面積が
大きくなり，導電性が向上する。また，上記金属柱は銀
又は銅からなっていてもよい。Preferably, the metal pillar is made of solder, the periphery of the metal pillar is connected to the upper metal layer and the lower metal layer, and a recess is formed at the center. Thereby, the contact area between the metal pillar and the upper and lower metal layers is increased, and the conductivity is improved. Further, the metal pillar may be made of silver or copper.
【００１７】[0017]
【発明の実施の形態】実施形態例１ 本発明の実施形態に係るプリント配線板について，図
１，図２を用いて説明する。本例のプリント配線板は，
図１に示すごとく，絶縁基板５の上面及び下面に設けた
上面金属層６１及び下面金属層６２と，上面金属層６１
と下面金属層６２との間を電気的に接続するビアホール
３とからなる。ビアホール３は，絶縁基板５を貫通する
貫通穴２の内部に金属柱１を挿入したものである。金属
柱１の上端及び下端は，ビアホール３周囲の上面金属層
６１及び下面金属層６２に対して押しつぶされてフラン
ジ部１１，１２を構成している。また，プリント配線板
は，電子部品を搭載するための搭載穴７を設けている。
搭載穴７は，放熱板８で被覆されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 A printed wiring board according to an embodiment of the present invention will be described with reference to FIGS. The printed wiring board of this example is
As shown in FIG. 1, an upper metal layer 61 and a lower metal layer 62 provided on the upper and lower surfaces of
And a via hole 3 for electrically connecting the lower metal layer 62 to the lower metal layer 62. The via hole 3 has a metal column 1 inserted into a through hole 2 penetrating the insulating substrate 5. The upper and lower ends of the metal pillar 1 are crushed against the upper metal layer 61 and the lower metal layer 62 around the via hole 3 to form the flange portions 11 and 12. The printed wiring board has mounting holes 7 for mounting electronic components.
The mounting hole 7 is covered with a heat sink 8.
【００１８】次に，本例のプリント配線板の製造方法に
ついて説明する。まず，図２（ａ）に示すごとく，絶縁
基板５の上面及び下面に銅箔を貼着して上面金属層６１
及び下面金属層６２を形成する。絶縁基板５としては，
ガラスエポキシ基板を用いる。上面金属層６１及び下面
金属層６２の厚みは５〜３５μｍである。Next, a method of manufacturing the printed wiring board of the present embodiment will be described. First, as shown in FIG. 2A, copper foil is adhered to the upper and lower surfaces of the insulating substrate 5 to form an upper metal layer 61.
And a lower metal layer 62 is formed. As the insulating substrate 5,
A glass epoxy substrate is used. The thickness of the upper metal layer 61 and the lower metal layer 62 is 5 to 35 μm.
【００１９】次に，絶縁基板５のビアホール形成部分を
打抜き加工にて穴明けして貫通穴２を形成する。貫通穴
２の直径は０．１〜０．３ｍｍである。また，図１に示
すごとく，絶縁基板５に電子部品搭載用の搭載穴７を打
抜き加工にて形成する。次に，図２（ｂ），（ｃ）に示
すごとく，貫通穴２の内部に，金属柱１を圧入する。金
属柱１は，銅からなる。金属柱１の長さＡは，貫通穴２
の長さａよりも５〜２０％大きく，また金属柱１の直径
は貫通穴の直径よりも０〜５％大きくする。Next, a through hole 2 is formed by punching a portion of the insulating substrate 5 where a via hole is formed by punching. The diameter of the through hole 2 is 0.1 to 0.3 mm. Further, as shown in FIG. 1, mounting holes 7 for mounting electronic components are formed in the insulating substrate 5 by punching. Next, as shown in FIGS. 2B and 2C, the metal column 1 is pressed into the through hole 2. The metal pillar 1 is made of copper. The length A of the metal column 1 is
Is larger than the length a by 5 to 20%, and the diameter of the metal column 1 is larger by 0 to 5% than the diameter of the through hole.
【００２０】次に，図２（ｄ）に示すごとく，金属柱１
における貫通穴２からの突出部分１０をプレス機によっ
て圧縮する。これにより，金属柱１の突出部分１０が貫
通穴２の周囲の上面金属層６１及び下面金属層６２に対
して押しつぶされ，フランジ部１１が形成される。以上
により，上面金属層６１と下面金属層６２との間の電気
導通を行い得るビアホール３が形成される。Next, as shown in FIG.
Is compressed by a press machine. Thereby, the protruding portion 10 of the metal column 1 is crushed against the upper metal layer 61 and the lower metal layer 62 around the through hole 2, and the flange portion 11 is formed. As described above, the via hole 3 capable of performing electrical conduction between the upper metal layer 61 and the lower metal layer 62 is formed.
【００２１】その後，図１に示すごとく，上面金属層６
１及び下面金属層６２についてサブトラクト法にてパタ
ーニングする。また，搭載穴７を覆うように放熱板８を
絶縁基板５に接着する。以上により，プリント配線板が
得られる。Thereafter, as shown in FIG.
The first and lower metal layers 62 are patterned by the subtract method. Further, a heat sink 8 is bonded to the insulating substrate 5 so as to cover the mounting hole 7. Thus, a printed wiring board is obtained.
【００２２】次に，本例の作用及び効果について説明す
る。本例のプリント配線板においては，ビアホール形成
用の貫通穴２の内部に金属柱１を挿入している。これに
より，金属柱１を通じて電気導通を行うことができるビ
アホール３を形成することができる。金属柱１の貫通穴
２への挿入は容易な操作で行うことができ，また金属柱
１は，ビアホール３に確実に電気的導通を付与する。Next, the operation and effect of this embodiment will be described. In the printed wiring board of this example, the metal pillar 1 is inserted into the through hole 2 for forming a via hole. As a result, the via holes 3 that can conduct electricity through the metal columns 1 can be formed. Insertion of the metal pillar 1 into the through hole 2 can be performed by an easy operation, and the metal pillar 1 reliably provides electrical continuity to the via hole 3.
【００２３】また，金属柱１の上端及び下端は，ビアホ
ール３周囲の上面金属層６１及び下面金属層６２に対し
て押しつぶされてフランジ部１１，１２を構成している
ため，金属柱１の脱落を防止することができる。また，
金属柱１と上面金属層６１及び下面金属層６２との接触
面積が大きくなり，導電性が向上する。The upper and lower ends of the metal column 1 are crushed against the upper metal layer 61 and the lower metal layer 62 around the via hole 3 to form the flange portions 11 and 12, so that the metal column 1 falls off. Can be prevented. Also,
The contact area between the metal column 1 and the upper metal layer 61 and the lower metal layer 62 is increased, and the conductivity is improved.
【００２４】実施形態例２ 本例においては，貫通穴内部に挿入する金属柱が半田か
らなる。図３（ａ）に示すごとく，金属柱１５の長さＡ
は貫通穴２の長さａと同じとし，直径Ｂは貫通穴２の直
径ｂよりも０〜５％大きい。Embodiment 2 In this embodiment, the metal pillar to be inserted into the through hole is made of solder. As shown in FIG. 3A, the length A of the metal pillar 15
Is the same as the length a of the through hole 2, and the diameter B is 0 to 5% larger than the diameter b of the through hole 2.
【００２５】上記金属柱１５を用いてビアホール３を形
成するにあたっては，まず，図３（ａ）に示すごとく，
実施形態例１と同様に絶縁基板５に貫通穴２を形成す
る。次いで，図３（ｂ）に示すごとく，プレス機によっ
て金属柱１５を貫通穴２の内部に圧入する。次いで，図
３（ｃ）に示すごとく，金属柱１５を加熱溶融して，金
属柱１５と上面金属層６１及び下面金属層６２と接触さ
せる。以上により，上面金属層６１及び下面金属層６２
との間の電気的接続を行うビアホール３が形成される。
その他は，実施形態例１と同様である。In forming the via hole 3 using the metal pillar 15, first, as shown in FIG.
The through hole 2 is formed in the insulating substrate 5 as in the first embodiment. Next, as shown in FIG. 3B, the metal columns 15 are pressed into the through holes 2 by a press machine. Next, as shown in FIG. 3C, the metal column 15 is heated and melted, and the metal column 15 is brought into contact with the upper metal layer 61 and the lower metal layer 62. As described above, the upper metal layer 61 and the lower metal layer 62
Via hole 3 for making an electrical connection between the via hole 3 is formed.
Other configurations are the same as those of the first embodiment.
【００２６】本例においては，金属柱１５は半田からな
り，金属柱１５の周縁は上面金属層６１及び下面金属層
６２に広がり，接着する。そして，金属柱１５の広がっ
た分だけ中心部の半田が減少し，中心部に窪み部１５０
が形成される。そのため，金属柱１５と上面金属層６１
及び下面金属層６２との接触面積が大きく，導電性が向
上する。In this embodiment, the metal pillars 15 are made of solder, and the periphery of the metal pillars 15 spreads and adheres to the upper metal layer 61 and the lower metal layer 62. Then, the amount of solder in the central portion is reduced by the extent that the metal column 15 is spread, and the concave portion 150 is formed in the central portion.
Is formed. Therefore, the metal pillar 15 and the upper metal layer 61
In addition, the contact area with the lower metal layer 62 is large, and the conductivity is improved.
【００２７】[0027]
【発明の効果】本発明によれば，製造容易で，上下金属
層間の電気的導通信頼性に優れたビアホールを有するプ
リント配線板及びその製造方法を提供することができ
る。According to the present invention, it is possible to provide a printed wiring board having via holes that are easy to manufacture and have excellent electrical conduction reliability between the upper and lower metal layers, and a method of manufacturing the same.
【図１】実施形態例１のプリント配線板の断面図。FIG. 1 is a cross-sectional view of a printed wiring board according to a first embodiment.
【図２】実施形態例１のプリント配線板の製造方法の説
明図。FIG. 2 is a diagram illustrating a method for manufacturing a printed wiring board according to the first embodiment.
【図３】実施形態例２のプリント配線板の製造方法の説
明図。FIG. 3 is a diagram illustrating a method for manufacturing a printed wiring board according to a second embodiment.
【図４】従来例のビアホールの形成方法の説明図。FIG. 4 is an explanatory view of a conventional method of forming a via hole.
１，１５．．．金属柱， １０．．．突出部分， １１，１２．．．フランジ部， １５０．．．窪み部， ２．．．貫通穴， ３．．．ビアホール， ５．．．絶縁基板， ６１．．．上面金属層， ６２．．．下面金属層， ７．．．搭載穴， ８．．．放熱板， 1,15. . . Metal pillar, 10. . . Projecting part, 11, 12. . . Flange part, 150. . . Depressions, 2. . . 2. through hole, . . Via hole, 5. . . Insulating substrate, 61. . . Top metal layer, 62. . . 6. lower metal layer; . . Mounting holes, 8. . . Heat sink,
Claims (9)
び下面金属層を形成する工程と，上記絶縁基板のビアホ
ール形成部分を穴明けして貫通穴を形成する工程と，上
記貫通穴の内部に金属柱を挿入して，上面金属層と下面
金属層との間の電気導通を行い得るビアホールを形成す
る工程とから構成されていることを特徴とするプリント
配線板の製造方法。A step of forming an upper metal layer and a lower metal layer on an upper surface and a lower surface of an insulating substrate; a step of forming a via hole forming portion of the insulating substrate to form a through hole; Forming a via hole capable of establishing electrical conduction between the upper metal layer and the lower metal layer by inserting metal pillars into the printed wiring board.
貫通穴の直径よりも大きく，上記金属柱を貫通穴内部に
圧入することを特徴とするプリント配線板の製造方法。2. The method according to claim 1, wherein the diameter of the metal pillar is larger than the diameter of the through hole, and the metal pillar is pressed into the through hole.
上記貫通穴の長さよりも長く，上記貫通穴内部に挿入し
た後，上記金属柱における貫通穴からの突出部分を押し
つぶすことを特徴とするプリント配線板の製造方法。3. The metal pillar according to claim 1, wherein a length of the metal pillar is longer than a length of the through hole, and after the metal pillar is inserted into the through hole, a protruding portion of the metal pillar from the through hole is crushed. Manufacturing method of a printed wiring board.
らなり，貫通穴に挿入した後に加熱することを特徴とす
るプリント配線板の製造方法。4. The method for manufacturing a printed wiring board according to claim 1, wherein the metal pillar is made of solder, and is heated after being inserted into the through hole.
銅からなることを特徴とするプリント配線板の製造方
法。5. The method according to claim 1, wherein the metal pillar is made of silver or copper.
属層及び下面金属層と，上面金属層と下面金属層との間
を電気的に接続するビアホールとからなり，上記ビアホ
ールの内部には金属柱が挿入されていることを特徴とす
るプリント配線板。6. An upper surface metal layer and a lower surface metal layer provided on an upper surface and a lower surface of an insulating substrate, and a via hole for electrically connecting the upper surface metal layer and the lower surface metal layer. A printed wiring board having metal pillars inserted therein.
び下端は，上記ビアホール周囲の上面金属層及び下面金
属層に対して押しつぶされてフランジ部を構成している
ことを特徴とするプリント配線板。7. The printed wiring according to claim 6, wherein the upper and lower ends of the metal pillar are crushed against an upper metal layer and a lower metal layer around the via hole to form a flange portion. Board.
らなり，金属柱の周縁は上面金属層及び下面金属層と接
続し，中心部には窪み部が形成されていることを特徴と
するプリント配線板。8. The metal column according to claim 6, wherein the metal column is made of solder, the periphery of the metal column is connected to the upper metal layer and the lower metal layer, and a recess is formed at the center. Printed wiring board.
銅からなることを特徴とするプリント配線板。9. The printed wiring board according to claim 6, wherein the metal pillar is made of silver or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10279994A JP2000114681A (en) | 1998-10-01 | 1998-10-01 | Printed wiring board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10279994A JP2000114681A (en) | 1998-10-01 | 1998-10-01 | Printed wiring board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000114681A true JP2000114681A (en) | 2000-04-21 |
Family
ID=17618837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10279994A Pending JP2000114681A (en) | 1998-10-01 | 1998-10-01 | Printed wiring board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000114681A (en) |
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| CN105338736A (en) * | 2014-08-08 | 2016-02-17 | 深南电路有限公司 | HDI (high density interconnect) circuit board and processing method thereof |
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