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AU2003272912A1 - Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate - Google Patents

Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate

Info

Publication number
AU2003272912A1
AU2003272912A1 AU2003272912A AU2003272912A AU2003272912A1 AU 2003272912 A1 AU2003272912 A1 AU 2003272912A1 AU 2003272912 A AU2003272912 A AU 2003272912A AU 2003272912 A AU2003272912 A AU 2003272912A AU 2003272912 A1 AU2003272912 A1 AU 2003272912A1
Authority
AU
Australia
Prior art keywords
resin substrate
manufacturing
multilayer
manufacturing multilayer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003272912A
Inventor
Jun Harada
Hiroshi Takagi
Yuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of AU2003272912A1 publication Critical patent/AU2003272912A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AU2003272912A 2002-11-06 2003-10-02 Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate Abandoned AU2003272912A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-323032 2002-11-06
JP2002323032A JP2004158651A (en) 2002-11-06 2002-11-06 Manufacturing method of resin substrate, resin multilayer substrate, and resin substrate
PCT/JP2003/012625 WO2004043120A1 (en) 2002-11-06 2003-10-02 Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate

Publications (1)

Publication Number Publication Date
AU2003272912A1 true AU2003272912A1 (en) 2004-06-07

Family

ID=32310408

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003272912A Abandoned AU2003272912A1 (en) 2002-11-06 2003-10-02 Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate

Country Status (4)

Country Link
JP (1) JP2004158651A (en)
AU (1) AU2003272912A1 (en)
TW (1) TWI238687B (en)
WO (1) WO2004043120A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102369791B (en) * 2009-03-12 2013-11-13 大自达电线股份有限公司 Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
JP5287570B2 (en) * 2009-07-21 2013-09-11 ソニー株式会社 Method for manufacturing printed wiring board
CN102595799B (en) * 2011-12-30 2015-03-25 柏承科技(昆山)股份有限公司 Manufacturing method of high-density interconnected printed circuit board
TWI503057B (en) * 2012-01-04 2015-10-01 Inktec Co Ltd Manufacturing method of double-sided printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241605B2 (en) * 1996-09-06 2001-12-25 松下電器産業株式会社 Wiring board manufacturing method and wiring board
JP3738536B2 (en) * 1997-08-28 2006-01-25 松下電器産業株式会社 Method for manufacturing printed wiring board
JP2000114681A (en) * 1998-10-01 2000-04-21 Ibiden Co Ltd Printed wiring board and its manufacture
JP2002314222A (en) * 2001-04-10 2002-10-25 Matsushita Electric Ind Co Ltd Printed circuit board and its manufacturing method

Also Published As

Publication number Publication date
JP2004158651A (en) 2004-06-03
WO2004043120A1 (en) 2004-05-21
TW200421958A (en) 2004-10-16
TWI238687B (en) 2005-08-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase