AU9095798A
(en)
|
1997-09-19 |
1999-04-12 |
Nikon Corporation |
Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
|
AU1175799A
(en)
*
|
1997-11-21 |
1999-06-15 |
Nikon Corporation |
Projection aligner and projection exposure method
|
TW448487B
(en)
|
1997-11-22 |
2001-08-01 |
Nippon Kogaku Kk |
Exposure apparatus, exposure method and manufacturing method of device
|
US6897963B1
(en)
|
1997-12-18 |
2005-05-24 |
Nikon Corporation |
Stage device and exposure apparatus
|
US6370487B1
(en)
*
|
1998-04-23 |
2002-04-09 |
Micron Technology, Inc. |
Remote semiconductor microscopy
|
JP4365908B2
(ja)
|
1998-09-04 |
2009-11-18 |
キヤノン株式会社 |
面位置検出装置、露光装置およびデバイス製造方法
|
JP4134406B2
(ja)
|
1998-12-04 |
2008-08-20 |
株式会社ニコン |
平面モータ装置及び露光装置
|
EP1014199B1
(de)
|
1998-12-24 |
2011-03-30 |
Canon Kabushiki Kaisha |
Trägerplattesteuerungsvorrichtung, Belichtungsapparat und Verfahren zur Herstellung einer Halbleitervorrichtung
|
US7116401B2
(en)
|
1999-03-08 |
2006-10-03 |
Asml Netherlands B.V. |
Lithographic projection apparatus using catoptrics in an optical sensor system, optical arrangement, method of measuring, and device manufacturing method
|
US6924884B2
(en)
|
1999-03-08 |
2005-08-02 |
Asml Netherlands B.V. |
Off-axis leveling in lithographic projection apparatus
|
TW490596B
(en)
|
1999-03-08 |
2002-06-11 |
Asm Lithography Bv |
Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
|
US7023521B2
(en)
*
|
1999-04-13 |
2006-04-04 |
Nikon Corporation |
Exposure apparatus, exposure method and process for producing device
|
WO2001023933A1
(fr)
|
1999-09-29 |
2001-04-05 |
Nikon Corporation |
Systeme optique de projection
|
EP1139138A4
(de)
|
1999-09-29 |
2006-03-08 |
Nikon Corp |
Projektionsbelichtungsverfahren, vorrichtung und optisches projektionssystem
|
EP1093021A3
(de)
|
1999-10-15 |
2004-06-30 |
Nikon Corporation |
Projektionsbelichtungssystem sowie ein solches System benutzendes Gerät und Verfahren
|
WO2001040875A1
(en)
*
|
1999-11-30 |
2001-06-07 |
Silicon Valley Group, Inc. |
Dual-stage lithography apparatus and method
|
JP2001160530A
(ja)
|
1999-12-01 |
2001-06-12 |
Nikon Corp |
ステージ装置及び露光装置
|
EP1111471B1
(de)
*
|
1999-12-21 |
2005-11-23 |
ASML Netherlands B.V. |
Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung
|
TW538256B
(en)
|
2000-01-14 |
2003-06-21 |
Zeiss Stiftung |
Microlithographic reduction projection catadioptric objective
|
US6690450B2
(en)
|
2000-01-31 |
2004-02-10 |
Nikon Corporation |
Exposure method, exposure apparatus, method for producing exposure apparatus, and method for producing device
|
JP2001308003A
(ja)
|
2000-02-15 |
2001-11-02 |
Nikon Corp |
露光方法及び装置、並びにデバイス製造方法
|
US7301605B2
(en)
|
2000-03-03 |
2007-11-27 |
Nikon Corporation |
Projection exposure apparatus and method, catadioptric optical system and manufacturing method of devices
|
JP2001257143A
(ja)
|
2000-03-09 |
2001-09-21 |
Nikon Corp |
ステージ装置及び露光装置、並びにデバイス製造方法
|
JP2001332490A
(ja)
*
|
2000-03-14 |
2001-11-30 |
Nikon Corp |
位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
|
JP2001345250A
(ja)
*
|
2000-06-01 |
2001-12-14 |
Canon Inc |
位置合せ方法、位置合せ装置、プロファイラ、露光装置、半導体デバイス製造方法、半導体製造工場、および露光装置の保守方法
|
US7561270B2
(en)
|
2000-08-24 |
2009-07-14 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby
|
TW527526B
(en)
*
|
2000-08-24 |
2003-04-11 |
Asml Netherlands Bv |
Lithographic apparatus, device manufacturing method, and device manufactured thereby
|
US7289212B2
(en)
|
2000-08-24 |
2007-10-30 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufacturing thereby
|
EP1182509B1
(de)
*
|
2000-08-24 |
2009-04-08 |
ASML Netherlands B.V. |
Lithographischer Apparat, Verfahren zu dessen Kalibrierung und Verfahren zur Herstellung einer Vorrichtung
|
AU2001280175A1
(en)
*
|
2000-08-29 |
2002-03-13 |
Nikon Corporation |
Exposure method and device
|
US6708131B1
(en)
*
|
2000-08-30 |
2004-03-16 |
Micron Technology, Inc. |
Wafer alignment system
|
TW497013B
(en)
*
|
2000-09-07 |
2002-08-01 |
Asm Lithography Bv |
Method for calibrating a lithographic projection apparatus and apparatus capable of applying such a method
|
EP1186959B1
(de)
*
|
2000-09-07 |
2009-06-17 |
ASML Netherlands B.V. |
Verfahren zur Eichung eines lithographischen Projektionsapparats
|
JP2002231622A
(ja)
|
2000-11-29 |
2002-08-16 |
Nikon Corp |
ステージ装置及び露光装置
|
US6591160B2
(en)
*
|
2000-12-04 |
2003-07-08 |
Asyst Technologies, Inc. |
Self teaching robot
|
AU2002221049A1
(en)
*
|
2000-12-06 |
2002-06-18 |
Nikon Corporation |
X-ray projection exposure device, x-ray projection exposure method, and semiconductor device
|
JP2002289515A
(ja)
|
2000-12-28 |
2002-10-04 |
Nikon Corp |
製品の製造方法、露光装置の製造方法、露光装置、及びデバイス製造方法
|
US6628372B2
(en)
*
|
2001-02-16 |
2003-09-30 |
Mccullough Andrew W. |
Use of multiple reticles in lithographic printing tools
|
JP2002323652A
(ja)
|
2001-02-23 |
2002-11-08 |
Nikon Corp |
投影光学系,該投影光学系を備えた投影露光装置および投影露光方法
|
JP2002280283A
(ja)
*
|
2001-03-16 |
2002-09-27 |
Canon Inc |
基板処理装置
|
JP2002287023A
(ja)
|
2001-03-27 |
2002-10-03 |
Nikon Corp |
投影光学系、該投影光学系を備えた投影露光装置及び投影露光方法
|
JP2002305140A
(ja)
*
|
2001-04-06 |
2002-10-18 |
Nikon Corp |
露光装置及び基板処理システム
|
US6859260B2
(en)
*
|
2001-04-25 |
2005-02-22 |
Asml Holding N.V. |
Method and system for improving focus accuracy in a lithography system
|
JP2002353112A
(ja)
*
|
2001-05-25 |
2002-12-06 |
Riipuru:Kk |
電子ビーム近接露光装置における電子ビームの傾き測定方法及び傾き較正方法並びに電子ビーム近接露光装置
|
JP2002350128A
(ja)
*
|
2001-05-30 |
2002-12-04 |
Canon Inc |
立体形状計測装置並びに立体形状計測方法および位置合わせ方法
|
US6788385B2
(en)
*
|
2001-06-21 |
2004-09-07 |
Nikon Corporation |
Stage device, exposure apparatus and method
|
WO2003010802A1
(fr)
*
|
2001-07-26 |
2003-02-06 |
Nikon Corporation |
Appareil a etage, systeme et procede d'exposition et procede de production de dispositif
|
US6678038B2
(en)
|
2001-08-03 |
2004-01-13 |
Nikon Corporation |
Apparatus and methods for detecting tool-induced shift in microlithography apparatus
|
US6674512B2
(en)
|
2001-08-07 |
2004-01-06 |
Nikon Corporation |
Interferometer system for a semiconductor exposure system
|
JP2003086492A
(ja)
*
|
2001-09-12 |
2003-03-20 |
Canon Inc |
露光装置及びその制御方法並びにデバイスの製造方法
|
US6785005B2
(en)
|
2001-09-21 |
2004-08-31 |
Nikon Corporation |
Switching type dual wafer stage
|
TWI225665B
(en)
*
|
2001-10-17 |
2004-12-21 |
Canon Kk |
Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
|
US6813003B2
(en)
*
|
2002-06-11 |
2004-11-02 |
Mark Oskotsky |
Advanced illumination system for use in microlithography
|
US6665054B2
(en)
*
|
2001-10-22 |
2003-12-16 |
Nikon Corporation |
Two stage method
|
FR2832546B1
(fr)
*
|
2001-11-20 |
2008-04-04 |
Centre Nat Rech Scient |
Dispositif de reglage d'un appareil de generation d'un faisceau de particules chargees
|
CN101447438B
(zh)
*
|
2001-12-14 |
2010-12-01 |
瑞萨电子株式会社 |
半导体器件的制造方法
|
US7081945B2
(en)
|
2001-12-21 |
2006-07-25 |
Asml Netherlands B.V. |
Device manufacturing method, device manufactured thereby and lithographic apparatus therefor
|
TW516099B
(en)
*
|
2001-12-28 |
2003-01-01 |
Nanya Technology Corp |
Exposure method and system with self-feedback correction
|
US6777143B2
(en)
*
|
2002-01-28 |
2004-08-17 |
Taiwan Semiconductor Manufacturing Company |
Multiple mask step and scan aligner
|
EP1353229A1
(de)
*
|
2002-04-09 |
2003-10-15 |
ASML Netherlands B.V. |
Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergesteller Artikel
|
JPWO2003085708A1
(ja)
*
|
2002-04-09 |
2005-08-18 |
株式会社ニコン |
露光方法及び露光装置、並びにデバイス製造方法
|
EP1353233A3
(de)
*
|
2002-04-09 |
2007-10-03 |
ASML Netherlands B.V. |
Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
|
JP4472358B2
(ja)
*
|
2002-04-11 |
2010-06-02 |
ザイゴ コーポレーション |
ツインステージリソグラフィツールにおける干渉計システム誤差の補償
|
JP3966211B2
(ja)
*
|
2002-05-08 |
2007-08-29 |
株式会社ニコン |
露光方法、露光装置及びデバイス製造方法
|
US6757110B2
(en)
|
2002-05-29 |
2004-06-29 |
Asml Holding N.V. |
Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
|
DE60302388T2
(de)
|
2002-06-13 |
2006-07-27 |
Asml Netherlands B.V. |
Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
|
JP4546019B2
(ja)
*
|
2002-07-03 |
2010-09-15 |
株式会社日立製作所 |
露光装置
|
EP1383007A1
(de)
*
|
2002-07-16 |
2004-01-21 |
ASML Netherlands B.V. |
Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
|
JP3862639B2
(ja)
*
|
2002-08-30 |
2006-12-27 |
キヤノン株式会社 |
露光装置
|
US6841956B2
(en)
*
|
2002-09-17 |
2005-01-11 |
Nikon Corporation |
Actuator to correct for off center-of-gravity line of force
|
TWI246114B
(en)
*
|
2002-09-24 |
2005-12-21 |
Asml Netherlands Bv |
Lithographic apparatus, device manufacturing method, and device manufactured thereby
|
US20040081446A1
(en)
*
|
2002-10-28 |
2004-04-29 |
Eastman Kodak Company |
Electronic imaging system with row-wise or column-wise image sensor reset synchronized to a mechanical shutter
|
WO2004050266A1
(ja)
|
2002-12-03 |
2004-06-17 |
Nikon Corporation |
汚染物質除去方法及び装置、並びに露光方法及び装置
|
TW200412617A
(en)
*
|
2002-12-03 |
2004-07-16 |
Nikon Corp |
Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method
|
CN101852993A
(zh)
*
|
2002-12-10 |
2010-10-06 |
株式会社尼康 |
曝光装置和器件制造方法
|
AU2003289237A1
(en)
*
|
2002-12-10 |
2004-06-30 |
Nikon Corporation |
Exposure apparatus and method for manufacturing device
|
WO2004053952A1
(ja)
*
|
2002-12-10 |
2004-06-24 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
US7242455B2
(en)
*
|
2002-12-10 |
2007-07-10 |
Nikon Corporation |
Exposure apparatus and method for producing device
|
US6744058B1
(en)
*
|
2002-12-20 |
2004-06-01 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Geometric compensation method for charged particle beam irradiation
|
US7265881B2
(en)
*
|
2002-12-20 |
2007-09-04 |
Hewlett-Packard Development Company, L.P. |
Method and apparatus for measuring assembly and alignment errors in sensor assemblies
|
DE10261775A1
(de)
|
2002-12-20 |
2004-07-01 |
Carl Zeiss Smt Ag |
Vorrichtung zur optischen Vermessung eines Abbildungssystems
|
EP1439428A3
(de)
*
|
2003-01-14 |
2009-05-13 |
ASML Netherlands B.V. |
Niveausensor für einen lithographischen Apparat
|
CN100555086C
(zh)
*
|
2003-01-14 |
2009-10-28 |
Asml荷兰有限公司 |
用于光刻装置的水平传感器
|
CN100373409C
(zh)
*
|
2003-01-27 |
2008-03-05 |
富士通株式会社 |
注目物体出现位置显示装置
|
JP3689698B2
(ja)
|
2003-01-31 |
2005-08-31 |
キヤノン株式会社 |
投影露光装置、投影露光方法および被露光部材の製造方法
|
JP4101076B2
(ja)
*
|
2003-02-06 |
2008-06-11 |
キヤノン株式会社 |
位置検出方法及び装置
|
JP4652667B2
(ja)
*
|
2003-02-13 |
2011-03-16 |
キヤノン株式会社 |
面位置計測方法及び走査型露光装置
|
WO2004075268A1
(ja)
|
2003-02-19 |
2004-09-02 |
Nikon Corporation |
移動方法、露光方法及び露光装置、並びにデバイス製造方法
|
TW200500813A
(en)
|
2003-02-26 |
2005-01-01 |
Nikon Corp |
Exposure apparatus and method, and method of producing device
|
JP4001559B2
(ja)
*
|
2003-03-04 |
2007-10-31 |
東京エレクトロン株式会社 |
インライン接続設定方法および装置
|
SG123601A1
(en)
*
|
2003-03-10 |
2006-07-26 |
Asml Netherlands Bv |
Focus spot monitoring in a lithographic projectionapparatus
|
KR20110104084A
(ko)
*
|
2003-04-09 |
2011-09-21 |
가부시키가이샤 니콘 |
액침 리소그래피 유체 제어 시스템
|
KR101503992B1
(ko)
|
2003-04-09 |
2015-03-18 |
가부시키가이샤 니콘 |
노광 방법 및 장치, 그리고 디바이스 제조 방법
|
CN104597717B
(zh)
|
2003-04-10 |
2017-09-05 |
株式会社尼康 |
包括用于沉浸光刻装置的真空清除的环境系统
|
EP1611486B1
(de)
|
2003-04-10 |
2016-03-16 |
Nikon Corporation |
Umweltsystem mit einer transportregion für eine immersionslithographievorrichtung
|
KR101525335B1
(ko)
|
2003-04-11 |
2015-06-03 |
가부시키가이샤 니콘 |
액침 리소그래피에 의한 광학기기의 세정방법
|
KR101498405B1
(ko)
|
2003-04-11 |
2015-03-04 |
가부시키가이샤 니콘 |
액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
|
JP4315420B2
(ja)
*
|
2003-04-18 |
2009-08-19 |
キヤノン株式会社 |
露光装置及び露光方法
|
TWI237307B
(en)
*
|
2003-05-01 |
2005-08-01 |
Nikon Corp |
Optical projection system, light exposing apparatus and light exposing method
|
CN100437358C
(zh)
*
|
2003-05-15 |
2008-11-26 |
株式会社尼康 |
曝光装置及器件制造方法
|
TWI503865B
(zh)
|
2003-05-23 |
2015-10-11 |
尼康股份有限公司 |
A method of manufacturing an exposure apparatus and an element
|
TWI421911B
(zh)
|
2003-05-23 |
2014-01-01 |
尼康股份有限公司 |
An exposure method, an exposure apparatus, and an element manufacturing method
|
CN100541717C
(zh)
*
|
2003-05-28 |
2009-09-16 |
株式会社尼康 |
曝光方法、曝光装置以及器件制造方法
|
US6781674B1
(en)
*
|
2003-05-29 |
2004-08-24 |
Asml Holding N.V. |
System and method to increase throughput in a dual substrate stage double exposure lithography system
|
JP4376116B2
(ja)
*
|
2003-06-03 |
2009-12-02 |
東京エレクトロン株式会社 |
基板受け渡し位置の調整方法
|
US7598507B2
(en)
*
|
2003-06-11 |
2009-10-06 |
Texas Instruments Incorporated |
Adjustable lithography blocking device and method
|
TWI409853B
(zh)
|
2003-06-13 |
2013-09-21 |
尼康股份有限公司 |
An exposure method, a substrate stage, an exposure apparatus, and an element manufacturing method
|
EP1635382B1
(de)
|
2003-06-19 |
2009-12-23 |
Nikon Corporation |
Belichtungseinrichtung und bauelementeherstellungsverfahren
|
TWI246848B
(en)
*
|
2003-07-03 |
2006-01-01 |
Fuji Photo Film Co Ltd |
Image formation device
|
KR101211451B1
(ko)
*
|
2003-07-09 |
2012-12-12 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
EP2264531B1
(de)
|
2003-07-09 |
2013-01-16 |
Nikon Corporation |
Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung
|
EP1643543B1
(de)
*
|
2003-07-09 |
2010-11-24 |
Nikon Corporation |
Belichtungsvorrichtung und verfahren zur bauelementherstellung
|
WO2005006418A1
(ja)
*
|
2003-07-09 |
2005-01-20 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
EP1503244A1
(de)
|
2003-07-28 |
2005-02-02 |
ASML Netherlands B.V. |
Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung
|
KR101414896B1
(ko)
|
2003-07-28 |
2014-07-03 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법
|
US6952255B2
(en)
*
|
2003-08-06 |
2005-10-04 |
Lam Research Corporation |
System and method for integrated multi-use optical alignment
|
CN101504512B
(zh)
*
|
2003-08-07 |
2012-11-14 |
株式会社尼康 |
曝光方法及曝光装置、载置台装置、及设备制造方法
|
KR101239632B1
(ko)
|
2003-08-21 |
2013-03-11 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
JP4325622B2
(ja)
*
|
2003-08-29 |
2009-09-02 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
KR101748923B1
(ko)
|
2003-09-03 |
2017-06-19 |
가부시키가이샤 니콘 |
액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
|
JP3870182B2
(ja)
*
|
2003-09-09 |
2007-01-17 |
キヤノン株式会社 |
露光装置及びデバイス製造方法
|
WO2005029559A1
(ja)
*
|
2003-09-19 |
2005-03-31 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
US8208198B2
(en)
|
2004-01-14 |
2012-06-26 |
Carl Zeiss Smt Gmbh |
Catadioptric projection objective
|
JP4289961B2
(ja)
*
|
2003-09-26 |
2009-07-01 |
キヤノン株式会社 |
位置決め装置
|
WO2005031820A1
(ja)
*
|
2003-09-26 |
2005-04-07 |
Nikon Corporation |
投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法
|
TWI525660B
(zh)
|
2003-09-29 |
2016-03-11 |
尼康股份有限公司 |
An exposure apparatus and an exposure method, and an element manufacturing method
|
SG144907A1
(en)
*
|
2003-09-29 |
2008-08-28 |
Nikon Corp |
Liquid immersion type lens system, projection exposure apparatus, and device fabricating method
|
KR101319108B1
(ko)
*
|
2003-09-29 |
2013-10-17 |
가부시키가이샤 니콘 |
투영 노광 장치, 투영 노광 방법 및 디바이스 제조 방법
|
KR101361892B1
(ko)
|
2003-10-08 |
2014-02-12 |
가부시키가이샤 자오 니콘 |
기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광 방법, 디바이스 제조 방법
|
TW200514138A
(en)
|
2003-10-09 |
2005-04-16 |
Nippon Kogaku Kk |
Exposure equipment and exposure method, manufacture method of component
|
EP1524555B1
(de)
*
|
2003-10-16 |
2008-02-13 |
ASML Netherlands B.V. |
Lithographische Methode zur Herstellung einer Vorrichtung
|
EP1679738A4
(de)
*
|
2003-10-28 |
2008-08-06 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
|
TWI511179B
(zh)
|
2003-10-28 |
2015-12-01 |
尼康股份有限公司 |
照明光學裝置、曝光裝置、曝光方法以及元件製造方法
|
JP4513747B2
(ja)
|
2003-10-31 |
2010-07-28 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
EP1688988A1
(de)
*
|
2003-11-17 |
2006-08-09 |
Nikon Corporation |
Bühnenantriebsverfahren, bühnenvorrichtung und belichtungsvorrichtung
|
TWI519819B
(zh)
*
|
2003-11-20 |
2016-02-01 |
尼康股份有限公司 |
光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
|
KR101682884B1
(ko)
|
2003-12-03 |
2016-12-06 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법, 그리고 광학 부품
|
US7466489B2
(en)
|
2003-12-15 |
2008-12-16 |
Susanne Beder |
Projection objective having a high aperture and a planar end surface
|
JP5102492B2
(ja)
|
2003-12-19 |
2012-12-19 |
カール・ツァイス・エスエムティー・ゲーエムベーハー |
結晶素子を有するマイクロリソグラフィー投影用対物レンズ
|
KR100567622B1
(ko)
*
|
2003-12-29 |
2006-04-04 |
삼성전자주식회사 |
반도체 소자의 패턴 선폭 측정 방법 및 장치
|
KR101636632B1
(ko)
|
2004-01-05 |
2016-07-05 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
CN1902733A
(zh)
*
|
2004-01-06 |
2007-01-24 |
株式会社尼康 |
曝光方法和装置以及器件制造方法
|
US20080151364A1
(en)
|
2004-01-14 |
2008-06-26 |
Carl Zeiss Smt Ag |
Catadioptric projection objective
|
KR101204157B1
(ko)
|
2004-01-20 |
2012-11-22 |
칼 짜이스 에스엠테 게엠베하 |
마이크로 리소그래픽 투영 노광 장치 및 그 투영 렌즈를 위한 측정 장치
|
US7072024B2
(en)
|
2004-01-20 |
2006-07-04 |
Nikon Corporation |
Lithographic projection method and apparatus
|
US7053980B2
(en)
*
|
2004-01-23 |
2006-05-30 |
Asml Netherlands B.V. |
Lithographic alignment system
|
JP4319189B2
(ja)
*
|
2004-01-26 |
2009-08-26 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
TWI395068B
(zh)
*
|
2004-01-27 |
2013-05-01 |
尼康股份有限公司 |
光學系統、曝光裝置以及曝光方法
|
US7589822B2
(en)
|
2004-02-02 |
2009-09-15 |
Nikon Corporation |
Stage drive method and stage unit, exposure apparatus, and device manufacturing method
|
WO2005076321A1
(ja)
|
2004-02-03 |
2005-08-18 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
KR101942136B1
(ko)
|
2004-02-04 |
2019-01-24 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
WO2005076325A1
(ja)
*
|
2004-02-04 |
2005-08-18 |
Nikon Corporation |
露光装置及び方法、位置制御方法並びにデバイス製造方法
|
TWI614795B
(zh)
|
2004-02-06 |
2018-02-11 |
Nikon Corporation |
光學照明裝置、曝光裝置、曝光方法以及元件製造方法
|
WO2005076323A1
(ja)
|
2004-02-10 |
2005-08-18 |
Nikon Corporation |
露光装置及びデバイス製造方法、メンテナンス方法及び露光方法
|
JP4572896B2
(ja)
*
|
2004-02-19 |
2010-11-04 |
株式会社ニコン |
露光装置及びデバイスの製造方法
|
US20070030467A1
(en)
*
|
2004-02-19 |
2007-02-08 |
Nikon Corporation |
Exposure apparatus, exposure method, and device fabricating method
|
JP5076497B2
(ja)
*
|
2004-02-20 |
2012-11-21 |
株式会社ニコン |
露光装置、液体の供給方法及び回収方法、露光方法、並びにデバイス製造方法
|
DE102004013886A1
(de)
|
2004-03-16 |
2005-10-06 |
Carl Zeiss Smt Ag |
Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
|
US7615424B2
(en)
*
|
2004-03-25 |
2009-11-10 |
Semiconductor Energy Laboratory Co., Ltd. |
Laser irradiation apparatus and method for manufacturing semiconductor device using the laser irradiation apparatus
|
TWI486719B
(zh)
|
2004-03-25 |
2015-06-01 |
尼康股份有限公司 |
曝光方法
|
US7242475B2
(en)
*
|
2004-03-25 |
2007-07-10 |
Asml Netherlands B.V. |
Method of determining aberration of a projection system of a lithographic apparatus
|
US7034917B2
(en)
*
|
2004-04-01 |
2006-04-25 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby
|
US7712905B2
(en)
|
2004-04-08 |
2010-05-11 |
Carl Zeiss Smt Ag |
Imaging system with mirror group
|
JP2005303196A
(ja)
*
|
2004-04-15 |
2005-10-27 |
Canon Inc |
位置決め装置、露光装置、半導体デバイスの製造方法
|
EP1753016B1
(de)
*
|
2004-04-19 |
2012-06-20 |
Nikon Corporation |
Belichtungsvorrichtung und bauelemente-herstellungsverfahren
|
US8054448B2
(en)
*
|
2004-05-04 |
2011-11-08 |
Nikon Corporation |
Apparatus and method for providing fluid for immersion lithography
|
KR20140138350A
(ko)
|
2004-05-17 |
2014-12-03 |
칼 짜이스 에스엠티 게엠베하 |
중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
|
US7486381B2
(en)
*
|
2004-05-21 |
2009-02-03 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
US7385671B2
(en)
*
|
2004-05-28 |
2008-06-10 |
Azores Corporation |
High speed lithography machine and method
|
EP1768169B9
(de)
*
|
2004-06-04 |
2013-03-06 |
Nikon Corporation |
Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung eines bauelementes
|
WO2005119368A2
(en)
|
2004-06-04 |
2005-12-15 |
Carl Zeiss Smt Ag |
System for measuring the image quality of an optical imaging system
|
JP4760708B2
(ja)
|
2004-06-09 |
2011-08-31 |
株式会社ニコン |
露光装置、露光方法、及びデバイス製造方法、メンテナンス方法
|
EP3318928A1
(de)
|
2004-06-09 |
2018-05-09 |
Nikon Corporation |
Belichtungsvorrichtung und verfahren zur herstellung eines artikels
|
US8717533B2
(en)
*
|
2004-06-10 |
2014-05-06 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
KR20180072867A
(ko)
|
2004-06-10 |
2018-06-29 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
US8508713B2
(en)
*
|
2004-06-10 |
2013-08-13 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
US8373843B2
(en)
*
|
2004-06-10 |
2013-02-12 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
SG153820A1
(en)
|
2004-06-10 |
2009-07-29 |
Nikon Corp |
Exposure apparatus, exposure method, and device producing method
|
US20080266037A1
(en)
*
|
2004-06-17 |
2008-10-30 |
Mark Williams |
Magnetic Levitation Lithography Apparatus and Method
|
TWI372262B
(en)
*
|
2004-06-23 |
2012-09-11 |
Nikon Corp |
Optical projection system, exposuring device, and exposuring method
|
KR20070027704A
(ko)
*
|
2004-06-25 |
2007-03-09 |
가부시키가이샤 니콘 |
위치 결정 장치, 위치 결정 방법, 노광 장치, 노광 방법 및디바이스의 제조 방법
|
US7463330B2
(en)
|
2004-07-07 |
2008-12-09 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
JP4894515B2
(ja)
|
2004-07-12 |
2012-03-14 |
株式会社ニコン |
露光装置、デバイス製造方法、及び液体検出方法
|
EP1788694A4
(de)
*
|
2004-07-15 |
2014-07-02 |
Nikon Corp |
Planarmotorgerät, bühnengerät, belichtungsgerät und bauelementeherstellungsverfahren
|
WO2006009169A1
(ja)
*
|
2004-07-21 |
2006-01-26 |
Nikon Corporation |
露光方法及びデバイス製造方法
|
JPWO2006009254A1
(ja)
*
|
2004-07-23 |
2008-05-01 |
株式会社ニコン |
支持装置、ステージ装置、露光装置、及びデバイスの製造方法
|
US7256871B2
(en)
*
|
2004-07-27 |
2007-08-14 |
Asml Netherlands B.V. |
Lithographic apparatus and method for calibrating the same
|
EP3267257B1
(de)
|
2004-08-03 |
2019-02-13 |
Nikon Corporation |
Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
|
JP2006113533A
(ja)
|
2004-08-03 |
2006-04-27 |
Nikon Corp |
投影光学系、露光装置、および露光方法
|
TW200615716A
(en)
*
|
2004-08-05 |
2006-05-16 |
Nikon Corp |
Stage device and exposure device
|
KR20070048164A
(ko)
|
2004-08-18 |
2007-05-08 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
US7701550B2
(en)
|
2004-08-19 |
2010-04-20 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
CN101002128A
(zh)
*
|
2004-09-13 |
2007-07-18 |
尼康股份有限公司 |
投影光学系统及其制造方法、曝光装置及曝光方法
|
KR101618493B1
(ko)
*
|
2004-09-17 |
2016-05-04 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
JP4765937B2
(ja)
|
2004-10-01 |
2011-09-07 |
株式会社ニコン |
リニアモータ、ステージ装置、及び露光装置
|
EP1806771A4
(de)
*
|
2004-10-08 |
2008-06-18 |
Nikon Corp |
Belichtungseinrichtung und bauelementeherstellungsverfahren
|
US20090021709A1
(en)
*
|
2004-10-13 |
2009-01-22 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
CN101487981A
(zh)
*
|
2004-10-13 |
2009-07-22 |
株式会社尼康 |
曝光装置、曝光方法及组件制造方法
|
US7456929B2
(en)
*
|
2004-10-15 |
2008-11-25 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
CN100582509C
(zh)
*
|
2004-10-18 |
2010-01-20 |
株式会社尼康 |
轴承装置、载台装置及曝光装置
|
EP1814144B1
(de)
|
2004-10-26 |
2012-06-06 |
Nikon Corporation |
Substratverarbeitungsverfahren und system zur fertigung von bauelementen
|
EP2472332B1
(de)
*
|
2004-11-01 |
2014-03-12 |
Nikon Corporation |
Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung
|
US7749250B2
(en)
*
|
2006-02-03 |
2010-07-06 |
Biomet Sports Medicine, Llc |
Soft tissue repair assembly and associated method
|
KR101191056B1
(ko)
*
|
2004-11-19 |
2012-10-15 |
가부시키가이샤 니콘 |
메인터넌스 방법, 노광 방법, 노광 장치 및 디바이스 제조 방법
|
JP2006156554A
(ja)
*
|
2004-11-26 |
2006-06-15 |
Canon Inc |
ステージ装置およびそれを用いた露光装置、デバイス製造方法
|
JP4905135B2
(ja)
|
2004-12-01 |
2012-03-28 |
株式会社ニコン |
ステージ装置及び露光装置
|
KR101559621B1
(ko)
|
2004-12-06 |
2015-10-13 |
가부시키가이샤 니콘 |
메인터넌스 방법, 메인터넌스 기기, 노광 장치, 및 디바이스 제조 방법
|
EP1833082A4
(de)
*
|
2004-12-06 |
2010-03-24 |
Nikon Corp |
Substratverarbeitungsverfahren, belichtungsverfahren, belichtungsvorrichtung und verfahren zur herstellung von bauelementen
|
US7397533B2
(en)
*
|
2004-12-07 |
2008-07-08 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
JP4752473B2
(ja)
|
2004-12-09 |
2011-08-17 |
株式会社ニコン |
露光装置、露光方法及びデバイス製造方法
|
KR101939525B1
(ko)
|
2004-12-15 |
2019-01-16 |
가부시키가이샤 니콘 |
기판 유지 장치, 노광 장치 및 디바이스 제조방법
|
US7394080B2
(en)
*
|
2004-12-23 |
2008-07-01 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Mask superposition for multiple exposures
|
TWI423301B
(zh)
*
|
2005-01-21 |
2014-01-11 |
尼康股份有限公司 |
照明光學裝置、曝光裝置、曝光方法以及元件製造方法
|
KR101427056B1
(ko)
|
2005-01-31 |
2014-08-05 |
가부시키가이샤 니콘 |
노광 장치 및 디바이스 제조 방법
|
US8692973B2
(en)
*
|
2005-01-31 |
2014-04-08 |
Nikon Corporation |
Exposure apparatus and method for producing device
|
CN100361112C
(zh)
*
|
2005-02-05 |
2008-01-09 |
上海微电子装备有限公司 |
步进扫描投影光刻机同步总线控制方法
|
US20070258068A1
(en)
*
|
2005-02-17 |
2007-11-08 |
Hiroto Horikawa |
Exposure Apparatus, Exposure Method, and Device Fabricating Method
|
JP4844186B2
(ja)
|
2005-03-18 |
2011-12-28 |
株式会社ニコン |
プレート部材、基板保持装置、露光装置及び露光方法、並びにデバイス製造方法
|
KR20070115859A
(ko)
*
|
2005-03-18 |
2007-12-06 |
가부시키가이샤 니콘 |
노광 방법 및 노광 장치, 디바이스 제조 방법, 그리고 노광장치의 평가 방법
|
KR101197071B1
(ko)
*
|
2005-03-30 |
2012-11-06 |
가부시키가이샤 니콘 |
노광 조건의 결정 방법, 노광 방법 및 노광 장치, 그리고디바이스 제조 방법
|
EP1865540A4
(de)
*
|
2005-03-30 |
2010-03-17 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
|
US20090047607A1
(en)
*
|
2005-03-31 |
2009-02-19 |
Hiroyuki Nagasaka |
Exposure method, exposure apparatus and device fabricating methods
|
US20070132976A1
(en)
*
|
2005-03-31 |
2007-06-14 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
TW200644079A
(en)
*
|
2005-03-31 |
2006-12-16 |
Nikon Corp |
Exposure apparatus, exposure method, and device production method
|
US7515281B2
(en)
*
|
2005-04-08 |
2009-04-07 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
USRE43576E1
(en)
|
2005-04-08 |
2012-08-14 |
Asml Netherlands B.V. |
Dual stage lithographic apparatus and device manufacturing method
|
US7161659B2
(en)
|
2005-04-08 |
2007-01-09 |
Asml Netherlands B.V. |
Dual stage lithographic apparatus and device manufacturing method
|
US8089608B2
(en)
*
|
2005-04-18 |
2012-01-03 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
KR101344142B1
(ko)
*
|
2005-04-25 |
2013-12-23 |
가부시키가이샤 니콘 |
노광 방법, 노광 장치, 및 디바이스 제조 방법
|
JP5239337B2
(ja)
|
2005-04-28 |
2013-07-17 |
株式会社ニコン |
露光方法及び露光装置、並びにデバイス製造方法
|
US20090135382A1
(en)
*
|
2005-04-28 |
2009-05-28 |
Nikon Corporation |
Exposure method, exposure apparatus, and method for producing device
|
KR101762083B1
(ko)
|
2005-05-12 |
2017-07-26 |
가부시키가이샤 니콘 |
투영 광학계, 노광 장치 및 노광 방법
|
JP4410216B2
(ja)
*
|
2005-05-24 |
2010-02-03 |
エーエスエムエル ネザーランズ ビー.ブイ. |
2ステージ・リソグラフィ装置及びデバイス製造方法
|
JP4596191B2
(ja)
*
|
2005-05-24 |
2010-12-08 |
株式会社ニコン |
露光方法及び露光装置、並びにデバイス製造方法
|
US7512452B2
(en)
*
|
2005-06-13 |
2009-03-31 |
Mauro George E |
Positioning system for eliminating lost motion effect
|
US20070085989A1
(en)
*
|
2005-06-21 |
2007-04-19 |
Nikon Corporation |
Exposure apparatus and exposure method, maintenance method, and device manufacturing method
|
EP1895571A4
(de)
|
2005-06-21 |
2011-04-27 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren, wartungsverfahren und bauelemente-herstellungsverfahren
|
US7924416B2
(en)
*
|
2005-06-22 |
2011-04-12 |
Nikon Corporation |
Measurement apparatus, exposure apparatus, and device manufacturing method
|
US8693006B2
(en)
*
|
2005-06-28 |
2014-04-08 |
Nikon Corporation |
Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
|
US20090033896A1
(en)
*
|
2005-06-28 |
2009-02-05 |
Hiroyuki Nagasaka |
Exposure apparatus and method, and device manufacturing method
|
US20090033890A1
(en)
*
|
2005-06-29 |
2009-02-05 |
Nikon Corporation |
Exposure apparatus, substrate processing method, and device producing method
|
JP5194792B2
(ja)
*
|
2005-06-30 |
2013-05-08 |
株式会社ニコン |
露光装置及び方法、露光装置のメンテナンス方法、並びにデバイス製造方法
|
WO2007007549A1
(ja)
*
|
2005-07-08 |
2007-01-18 |
Nikon Corporation |
面位置検出装置、露光装置、および露光方法
|
WO2007007746A1
(ja)
|
2005-07-11 |
2007-01-18 |
Nikon Corporation |
露光装置及びデバイス製造方法
|
JPWO2007013140A1
(ja)
*
|
2005-07-26 |
2009-02-05 |
富士通マイクロエレクトロニクス株式会社 |
位置合わせ方法
|
EP1918983A4
(de)
*
|
2005-08-05 |
2010-03-31 |
Nikon Corp |
Bühnenvorrichtung und belichtungsvorrichtung
|
EP1926127A4
(de)
|
2005-08-23 |
2009-06-03 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
|
TWI450044B
(zh)
|
2005-08-31 |
2014-08-21 |
尼康股份有限公司 |
An optical element, an exposure apparatus using the same, an exposure method, and a manufacturing method of the micro-element
|
CN101258581B
(zh)
*
|
2005-09-09 |
2011-05-11 |
株式会社尼康 |
曝光装置及曝光方法以及设备制造方法
|
US8111374B2
(en)
*
|
2005-09-09 |
2012-02-07 |
Nikon Corporation |
Analysis method, exposure method, and device manufacturing method
|
US20070070323A1
(en)
*
|
2005-09-21 |
2007-03-29 |
Nikon Corporation |
Exposure apparatus, exposure method, and device fabricating method
|
EP1936665A4
(de)
|
2005-09-21 |
2010-03-31 |
Nikon Corp |
Belichtungseinrichtung, belichtungsverfahren und bauelement-herstellungsverfahren
|
US7948675B2
(en)
*
|
2005-10-11 |
2011-05-24 |
Nikon Corporation |
Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
|
US20070095739A1
(en)
*
|
2005-10-24 |
2007-05-03 |
Nikon Corporation |
Utility transfer apparatus, stage apparatus, exposure apparatus, and device manufacturing method
|
US8681314B2
(en)
*
|
2005-10-24 |
2014-03-25 |
Nikon Corporation |
Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
|
EP1950795A4
(de)
|
2005-11-01 |
2010-06-02 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
|
US20070127135A1
(en)
*
|
2005-11-01 |
2007-06-07 |
Nikon Corporation |
Exposure apparatus, exposure method and device manufacturing method
|
EP1950612A1
(de)
|
2005-11-09 |
2008-07-30 |
Nikon Corporation |
Belichtungsvorrichtung und verfahren und verfahren zur bauelementeherstellung
|
US20070127002A1
(en)
*
|
2005-11-09 |
2007-06-07 |
Nikon Corporation |
Exposure apparatus and method, and device manufacturing method
|
EP1947683A4
(de)
*
|
2005-11-09 |
2010-08-25 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
|
EP1962328B1
(de)
*
|
2005-11-14 |
2013-01-16 |
Nikon Corporation |
Belichtungsapparat, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
|
JPWO2007058188A1
(ja)
*
|
2005-11-15 |
2009-04-30 |
株式会社ニコン |
露光装置及び露光方法、並びにデバイス製造方法
|
EP1953806A1
(de)
|
2005-11-16 |
2008-08-06 |
Nikon Corporation |
Substratverarbeitungsverfahren, fotomasken-herstellungsverfahren, fotomaske und bauelemente-herstellungsverfahren
|
US7803516B2
(en)
*
|
2005-11-21 |
2010-09-28 |
Nikon Corporation |
Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
|
JP2007165869A
(ja)
|
2005-11-21 |
2007-06-28 |
Nikon Corp |
露光方法及びそれを用いたデバイス製造方法、露光装置、並びに基板処理方法及び装置
|
KR20080071552A
(ko)
*
|
2005-12-06 |
2008-08-04 |
가부시키가이샤 니콘 |
노광 방법, 노광 장치 및 디바이스 제조 방법
|
KR100768849B1
(ko)
*
|
2005-12-06 |
2007-10-22 |
엘지전자 주식회사 |
계통 연계형 연료전지 시스템의 전원공급장치 및 방법
|
TW200722935A
(en)
|
2005-12-06 |
2007-06-16 |
Nikon Corp |
Exposure apparatus, exposure method, projection optical system and device manufacturing method
|
US7782442B2
(en)
*
|
2005-12-06 |
2010-08-24 |
Nikon Corporation |
Exposure apparatus, exposure method, projection optical system and device producing method
|
TWI538014B
(zh)
|
2005-12-08 |
2016-06-11 |
尼康股份有限公司 |
A substrate holding device, an exposure apparatus, an exposure method, and an element manufacturing method
|
TWI409598B
(zh)
*
|
2005-12-28 |
2013-09-21 |
尼康股份有限公司 |
Pattern forming method and pattern forming apparatus, exposure method and exposure apparatus, and component manufacturing method
|
US8411271B2
(en)
*
|
2005-12-28 |
2013-04-02 |
Nikon Corporation |
Pattern forming method, pattern forming apparatus, and device manufacturing method
|
US8953148B2
(en)
*
|
2005-12-28 |
2015-02-10 |
Nikon Corporation |
Exposure apparatus and making method thereof
|
EP1978546A4
(de)
|
2005-12-28 |
2010-08-04 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
|
EP1975981A1
(de)
|
2005-12-28 |
2008-10-01 |
Nikon Corporation |
Strukturerzeugungsverfahren, strukturerzeugungseinrichtung und bauelementeherstellungsverfahren
|
KR101634894B1
(ko)
*
|
2006-01-19 |
2016-06-29 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
|
KR100741110B1
(ko)
*
|
2006-02-15 |
2007-07-19 |
삼성에스디아이 주식회사 |
광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법
|
EP1990828A4
(de)
*
|
2006-02-16 |
2010-09-15 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung von bauelementen
|
EP1986224A4
(de)
|
2006-02-16 |
2012-01-25 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
|
KR20080101865A
(ko)
|
2006-02-16 |
2008-11-21 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
EP1986223A4
(de)
|
2006-02-16 |
2010-08-25 |
Nikon Corp |
Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
|
US8134681B2
(en)
*
|
2006-02-17 |
2012-03-13 |
Nikon Corporation |
Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
|
US8908145B2
(en)
|
2006-02-21 |
2014-12-09 |
Nikon Corporation |
Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
|
KR20130057496A
(ko)
|
2006-02-21 |
2013-05-31 |
가부시키가이샤 니콘 |
패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
|
WO2007097466A1
(ja)
|
2006-02-21 |
2007-08-30 |
Nikon Corporation |
測定装置及び方法、処理装置及び方法、パターン形成装置及び方法、露光装置及び方法、並びにデバイス製造方法
|
JP4973652B2
(ja)
*
|
2006-03-03 |
2012-07-11 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
KR20080108226A
(ko)
|
2006-03-03 |
2008-12-12 |
가부시키가이샤 니콘 |
노광 방법 및 장치, 그리고 디바이스 제조 방법
|
JP5077770B2
(ja)
|
2006-03-07 |
2012-11-21 |
株式会社ニコン |
デバイス製造方法、デバイス製造システム及び測定検査装置
|
KR20080114691A
(ko)
*
|
2006-03-13 |
2008-12-31 |
가부시키가이샤 니콘 |
노광 장치, 메인터넌스 방법, 노광 방법 및 디바이스 제조 방법
|
US8982322B2
(en)
*
|
2006-03-17 |
2015-03-17 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
US20070242254A1
(en)
|
2006-03-17 |
2007-10-18 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
WO2007109682A2
(en)
*
|
2006-03-20 |
2007-09-27 |
Duetto Integrated Systems, Inc. |
Improved system and method for manufacturing laminated circuit boards
|
CN100590173C
(zh)
*
|
2006-03-24 |
2010-02-17 |
北京有色金属研究总院 |
一种荧光粉及其制造方法和所制成的电光源
|
US8055099B2
(en)
*
|
2006-04-05 |
2011-11-08 |
Sharp Kabushiki Kaisha |
Exposure method and exposure device
|
TW200746259A
(en)
|
2006-04-27 |
2007-12-16 |
Nikon Corp |
Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
|
US7483120B2
(en)
*
|
2006-05-09 |
2009-01-27 |
Asml Netherlands B.V. |
Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
|
DE102006021797A1
(de)
|
2006-05-09 |
2007-11-15 |
Carl Zeiss Smt Ag |
Optische Abbildungseinrichtung mit thermischer Dämpfung
|
US20080024749A1
(en)
*
|
2006-05-18 |
2008-01-31 |
Nikon Corporation |
Low mass six degree of freedom stage for lithography tools
|
US7728462B2
(en)
*
|
2006-05-18 |
2010-06-01 |
Nikon Corporation |
Monolithic stage devices providing motion in six degrees of freedom
|
US20070267995A1
(en)
*
|
2006-05-18 |
2007-11-22 |
Nikon Corporation |
Six Degree-of-Freedom Stage Apparatus
|
KR20090018024A
(ko)
|
2006-05-18 |
2009-02-19 |
가부시키가이샤 니콘 |
노광 방법 및 장치, 메인터넌스 방법, 그리고 디바이스 제조 방법
|
TW200818256A
(en)
|
2006-05-22 |
2008-04-16 |
Nikon Corp |
Exposure method and apparatus, maintenance method, and device manufacturing method
|
CN102156389A
(zh)
*
|
2006-05-23 |
2011-08-17 |
株式会社尼康 |
维修方法、曝光方法及装置、以及组件制造方法
|
WO2007139017A1
(ja)
*
|
2006-05-29 |
2007-12-06 |
Nikon Corporation |
液体回収部材、基板保持部材、露光装置、及びデバイス製造方法
|
WO2007138834A1
(ja)
|
2006-05-31 |
2007-12-06 |
Nikon Corporation |
露光装置及び露光方法
|
US7795601B2
(en)
|
2006-06-01 |
2010-09-14 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus to improve lithography throughput
|
CN101479832B
(zh)
|
2006-06-09 |
2011-05-11 |
株式会社尼康 |
移动体装置、曝光装置和曝光方法以及元件制造方法
|
WO2007142350A1
(ja)
|
2006-06-09 |
2007-12-13 |
Nikon Corporation |
パターン形成方法及びパターン形成装置、露光方法及び露光装置、並びにデバイス製造方法
|
JP5245825B2
(ja)
|
2006-06-30 |
2013-07-24 |
株式会社ニコン |
メンテナンス方法、露光方法及び装置、並びにデバイス製造方法
|
US20080073563A1
(en)
|
2006-07-01 |
2008-03-27 |
Nikon Corporation |
Exposure apparatus that includes a phase change circulation system for movers
|
JP2008021748A
(ja)
*
|
2006-07-11 |
2008-01-31 |
Canon Inc |
露光装置
|
JP5339056B2
(ja)
*
|
2006-07-14 |
2013-11-13 |
株式会社ニコン |
露光装置及びデバイス製造方法
|
DE102006034906A1
(de)
*
|
2006-07-28 |
2008-01-31 |
Carl Zeiss Microimaging Gmbh |
Laser-Scanning-Mikroskop und Verfahren zu seinem Betrieb
|
KR101523388B1
(ko)
*
|
2006-08-30 |
2015-05-27 |
가부시키가이샤 니콘 |
노광 장치, 디바이스 제조 방법, 클리닝 방법 및 클리닝용 부재
|
SG10201507251TA
(en)
|
2006-08-31 |
2015-10-29 |
Nikon Corp |
Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
|
CN101405840B
(zh)
|
2006-08-31 |
2012-01-18 |
株式会社尼康 |
移动体驱动方法和移动体驱动系统、图案形成方法和装置、曝光方法和装置、以及组件制造方法
|
US8675171B2
(en)
|
2006-08-31 |
2014-03-18 |
Nikon Corporation |
Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
|
KR20180085820A
(ko)
|
2006-09-01 |
2018-07-27 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법
|
TWI600979B
(zh)
|
2006-09-01 |
2017-10-01 |
Nippon Kogaku Kk |
Moving body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and device manufacturing method
|
WO2008029884A1
(fr)
*
|
2006-09-08 |
2008-03-13 |
Nikon Corporation |
Dispositif et procédé de nettoyage, et procédé de fabrication du dispositif
|
TWI457723B
(zh)
*
|
2006-09-08 |
2014-10-21 |
尼康股份有限公司 |
A mask, an exposure device, and an element manufacturing method
|
US7872730B2
(en)
*
|
2006-09-15 |
2011-01-18 |
Nikon Corporation |
Immersion exposure apparatus and immersion exposure method, and device manufacturing method
|
WO2008044612A1
(en)
|
2006-09-29 |
2008-04-17 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
JP4999415B2
(ja)
*
|
2006-09-29 |
2012-08-15 |
東京エレクトロン株式会社 |
基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
|
KR101391025B1
(ko)
*
|
2006-09-29 |
2014-04-30 |
가부시키가이샤 니콘 |
이동체 시스템, 패턴 형성 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
|
US20080100909A1
(en)
*
|
2006-10-30 |
2008-05-01 |
Nikon Corporation |
Optical element, liquid immersion exposure apparatus, liquid immersion exposure method, and method for producing microdevice
|
WO2008053918A1
(fr)
*
|
2006-10-31 |
2008-05-08 |
Nikon Corporation |
Appareil de maintien de liquide, procédé de maintien de liquide, appareil d'exposition, procédé d'exposition et procédé de fabrication du dispositif
|
KR101549709B1
(ko)
*
|
2006-11-09 |
2015-09-11 |
가부시키가이샤 니콘 |
유지 장치, 위치 검출 장치 및 노광 장치, 이동 방법, 위치검출 방법, 노광 방법, 검출계의 조정 방법, 그리고 디바이스 제조 방법
|
US20080156356A1
(en)
*
|
2006-12-05 |
2008-07-03 |
Nikon Corporation |
Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
|
US20080212047A1
(en)
*
|
2006-12-28 |
2008-09-04 |
Nikon Corporation |
Exposure apparatus, exposing method, and device fabricating method
|
US8004651B2
(en)
|
2007-01-23 |
2011-08-23 |
Nikon Corporation |
Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
|
TW200846838A
(en)
*
|
2007-01-26 |
2008-12-01 |
Nikon Corp |
Support structure and exposure apparatus
|
US9529275B2
(en)
*
|
2007-02-21 |
2016-12-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lithography scanner throughput
|
US20080204687A1
(en)
*
|
2007-02-23 |
2008-08-28 |
Nikon Corporation |
Exposing method, exposure apparatus, device fabricating method, and substrate for immersion exposure
|
JP5454136B2
(ja)
*
|
2007-03-01 |
2014-03-26 |
株式会社ニコン |
ペリクルフレーム装置、マスク、レチクル装置、露光方法及び露光装置並びにデバイスの製造方法
|
US20080225261A1
(en)
*
|
2007-03-13 |
2008-09-18 |
Noriyuki Hirayanagi |
Exposure apparatus and device manufacturing method
|
US8237911B2
(en)
*
|
2007-03-15 |
2012-08-07 |
Nikon Corporation |
Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
|
US20080225248A1
(en)
*
|
2007-03-15 |
2008-09-18 |
Nikon Corporation |
Apparatus, systems and methods for removing liquid from workpiece during workpiece processing
|
US7830046B2
(en)
*
|
2007-03-16 |
2010-11-09 |
Nikon Corporation |
Damper for a stage assembly
|
US8497980B2
(en)
*
|
2007-03-19 |
2013-07-30 |
Nikon Corporation |
Holding apparatus, exposure apparatus, exposure method, and device manufacturing method
|
US8134685B2
(en)
*
|
2007-03-23 |
2012-03-13 |
Nikon Corporation |
Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
|
US20080246941A1
(en)
*
|
2007-04-06 |
2008-10-09 |
Katsura Otaki |
Wavefront aberration measuring device, projection exposure apparatus, method for manufacturing projection optical system, and method for manufacturing device
|
US8194322B2
(en)
*
|
2007-04-23 |
2012-06-05 |
Nikon Corporation |
Multilayer-film reflective mirror, exposure apparatus, device manufacturing method, and manufacturing method of multilayer-film reflective mirror
|
US20080266651A1
(en)
*
|
2007-04-24 |
2008-10-30 |
Katsuhiko Murakami |
Optical apparatus, multilayer-film reflective mirror, exposure apparatus, and device
|
TW201107639A
(en)
*
|
2007-04-27 |
2011-03-01 |
Edwards Japan Ltd |
Plate rotating device, exhaust path opening degree changing device, exhausted device, transfer device, beam device, and gate valve
|
CN101086627B
(zh)
*
|
2007-04-29 |
2010-10-06 |
上海微电子装备有限公司 |
凸点光刻机的曝光方法
|
US7623941B2
(en)
*
|
2007-05-09 |
2009-11-24 |
Great Computer Corporation |
Method for adjusting the relative position of device of laser engraver
|
US8300207B2
(en)
|
2007-05-17 |
2012-10-30 |
Nikon Corporation |
Exposure apparatus, immersion system, exposing method, and device fabricating method
|
US20080285004A1
(en)
*
|
2007-05-18 |
2008-11-20 |
Nikon Corporation |
Monolithic, Non-Contact Six Degree-of-Freedom Stage Apparatus
|
US20090122282A1
(en)
*
|
2007-05-21 |
2009-05-14 |
Nikon Corporation |
Exposure apparatus, liquid immersion system, exposing method, and device fabricating method
|
KR20100031694A
(ko)
*
|
2007-05-28 |
2010-03-24 |
가부시키가이샤 니콘 |
노광 장치, 디바이스 제조 방법, 세정 장치, 및 클리닝 방법 그리고 노광 방법
|
US8164736B2
(en)
*
|
2007-05-29 |
2012-04-24 |
Nikon Corporation |
Exposure method, exposure apparatus, and method for producing device
|
US8098362B2
(en)
*
|
2007-05-30 |
2012-01-17 |
Nikon Corporation |
Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
|
TW200907597A
(en)
*
|
2007-06-04 |
2009-02-16 |
Nikon Corp |
Environmental control apparatus, stage apparatus, exposure apparatus and device manufacturing method
|
JP4968335B2
(ja)
*
|
2007-06-11 |
2012-07-04 |
株式会社ニコン |
計測部材、センサ、計測方法、露光装置、露光方法、及びデバイス製造方法
|
JP2009021555A
(ja)
*
|
2007-06-12 |
2009-01-29 |
Canon Inc |
露光装置
|
KR100865554B1
(ko)
|
2007-06-27 |
2008-10-29 |
주식회사 하이닉스반도체 |
노광 장치
|
JP5006122B2
(ja)
|
2007-06-29 |
2012-08-22 |
株式会社Sokudo |
基板処理装置
|
US8547527B2
(en)
*
|
2007-07-24 |
2013-10-01 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
|
KR101427071B1
(ko)
|
2007-07-24 |
2014-08-07 |
가부시키가이샤 니콘 |
이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
|
US8243257B2
(en)
|
2007-07-24 |
2012-08-14 |
Nikon Corporation |
Position measurement system, exposure apparatus, position measuring method, exposure method and device manufacturing method, and tool and measuring method
|
US8194232B2
(en)
|
2007-07-24 |
2012-06-05 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
|
US9025126B2
(en)
*
|
2007-07-31 |
2015-05-05 |
Nikon Corporation |
Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
|
US8218129B2
(en)
*
|
2007-08-24 |
2012-07-10 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
|
US20090051895A1
(en)
*
|
2007-08-24 |
2009-02-26 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system
|
US9304412B2
(en)
*
|
2007-08-24 |
2016-04-05 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
|
US8867022B2
(en)
*
|
2007-08-24 |
2014-10-21 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
|
US8023106B2
(en)
|
2007-08-24 |
2011-09-20 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
|
US8237919B2
(en)
*
|
2007-08-24 |
2012-08-07 |
Nikon Corporation |
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
|
WO2009028494A1
(ja)
|
2007-08-28 |
2009-03-05 |
Nikon Corporation |
位置検出装置、位置検出方法、露光装置、およびデバイス製造方法
|
CN101855705A
(zh)
*
|
2007-09-07 |
2010-10-06 |
国立大学法人横滨国立大学 |
驱动控制方法、驱动控制装置、载台控制方法、载台控制装置、曝光方法、曝光装置以及计测装置
|
TW200912560A
(en)
*
|
2007-09-07 |
2009-03-16 |
Nikon Corp |
Suspending apparatus and exposure apparatus
|
US8451427B2
(en)
|
2007-09-14 |
2013-05-28 |
Nikon Corporation |
Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
|
US8421994B2
(en)
*
|
2007-09-27 |
2013-04-16 |
Nikon Corporation |
Exposure apparatus
|
TW200916696A
(en)
*
|
2007-10-11 |
2009-04-16 |
Hannspree Inc |
Flat-panel display with illumination function
|
JP5267029B2
(ja)
|
2007-10-12 |
2013-08-21 |
株式会社ニコン |
照明光学装置、露光装置及びデバイスの製造方法
|
EP2179330A1
(de)
|
2007-10-16 |
2010-04-28 |
Nikon Corporation |
Optisches beleuchtungssystem, belichtungsvorrichtung und bauelementeherstellungsverfahren
|
WO2009050977A1
(en)
|
2007-10-16 |
2009-04-23 |
Nikon Corporation |
Illumination optical system, exposure apparatus, and device manufacturing method
|
JP2009099873A
(ja)
*
|
2007-10-18 |
2009-05-07 |
Canon Inc |
露光装置およびデバイス製造方法
|
US8379187B2
(en)
|
2007-10-24 |
2013-02-19 |
Nikon Corporation |
Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
|
US20090201484A1
(en)
*
|
2007-10-29 |
2009-08-13 |
Nikon Corporation |
Utilities supply member connection apparatus, stage apparatus, projection optical system support apparatus and exposure apparatus
|
US9116346B2
(en)
|
2007-11-06 |
2015-08-25 |
Nikon Corporation |
Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
|
US9013681B2
(en)
*
|
2007-11-06 |
2015-04-21 |
Nikon Corporation |
Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
|
US9256140B2
(en)
*
|
2007-11-07 |
2016-02-09 |
Nikon Corporation |
Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction
|
US8665455B2
(en)
*
|
2007-11-08 |
2014-03-04 |
Nikon Corporation |
Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
|
US8422015B2
(en)
|
2007-11-09 |
2013-04-16 |
Nikon Corporation |
Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
|
KR100922004B1
(ko)
*
|
2007-11-23 |
2009-10-14 |
세메스 주식회사 |
기판 노광 장치 및 방법
|
JP5160204B2
(ja)
*
|
2007-11-30 |
2013-03-13 |
株式会社Sokudo |
基板処理装置
|
JP5128918B2
(ja)
*
|
2007-11-30 |
2013-01-23 |
株式会社Sokudo |
基板処理装置
|
US20090147228A1
(en)
*
|
2007-12-11 |
2009-06-11 |
Nikon Corporation |
Exposure apparatus, manufacturing method thereof, and maintenance method of exposure apparatus
|
SG185261A1
(en)
*
|
2007-12-11 |
2012-11-29 |
Nikon Corp |
Movable body apparatus, exposure apparatus and pattern formation apparatus, and device manufacturing method
|
US8711327B2
(en)
*
|
2007-12-14 |
2014-04-29 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US20090153824A1
(en)
*
|
2007-12-17 |
2009-06-18 |
Kla-Tencor Corporation |
Multiple chuck scanning stage
|
KR20100102580A
(ko)
*
|
2007-12-17 |
2010-09-24 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법 및 디바이스 제조 방법
|
US8964166B2
(en)
*
|
2007-12-17 |
2015-02-24 |
Nikon Corporation |
Stage device, exposure apparatus and method of producing device
|
US20090174873A1
(en)
*
|
2007-12-17 |
2009-07-09 |
Nikon Corporation |
Exposure apparatus, exposure method and device manufacturing method
|
US8451425B2
(en)
*
|
2007-12-28 |
2013-05-28 |
Nikon Corporation |
Exposure apparatus, exposure method, cleaning apparatus, and device manufacturing method
|
JP5179170B2
(ja)
|
2007-12-28 |
2013-04-10 |
株式会社Sokudo |
基板処理装置
|
TWI454851B
(zh)
*
|
2007-12-28 |
2014-10-01 |
尼康股份有限公司 |
An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method
|
US8269945B2
(en)
|
2007-12-28 |
2012-09-18 |
Nikon Corporation |
Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method
|
JP5001828B2
(ja)
|
2007-12-28 |
2012-08-15 |
株式会社Sokudo |
基板処理装置
|
JPWO2009088003A1
(ja)
*
|
2008-01-10 |
2011-05-26 |
株式会社ニコン |
露光方法及び露光装置、並びにデバイス製造方法
|
JP5369443B2
(ja)
|
2008-02-05 |
2013-12-18 |
株式会社ニコン |
ステージ装置、露光装置、露光方法、及びデバイス製造方法
|
JP5344180B2
(ja)
*
|
2008-02-08 |
2013-11-20 |
株式会社ニコン |
位置計測システム及び位置計測方法、移動体装置、移動体駆動方法、露光装置及び露光方法、パターン形成装置、並びにデバイス製造方法
|
JP2009200122A
(ja)
*
|
2008-02-19 |
2009-09-03 |
Canon Inc |
露光装置およびデバイス製造方法
|
US20090218743A1
(en)
*
|
2008-02-29 |
2009-09-03 |
Nikon Corporation |
Substrate holding apparatus, exposure apparatus, exposing method, device fabricating method, plate member, and wall
|
US20100039628A1
(en)
*
|
2008-03-19 |
2010-02-18 |
Nikon Corporation |
Cleaning tool, cleaning method, and device fabricating method
|
US8233139B2
(en)
*
|
2008-03-27 |
2012-07-31 |
Nikon Corporation |
Immersion system, exposure apparatus, exposing method, and device fabricating method
|
JPWO2009125867A1
(ja)
*
|
2008-04-11 |
2011-08-04 |
株式会社ニコン |
ステージ装置、露光装置、及びデバイス製造方法
|
US8654306B2
(en)
*
|
2008-04-14 |
2014-02-18 |
Nikon Corporation |
Exposure apparatus, cleaning method, and device fabricating method
|
KR20100135215A
(ko)
*
|
2008-04-30 |
2010-12-24 |
가부시키가이샤 니콘 |
노광 장치 및 노광 방법과, 디바이스 제조 방법
|
US8786829B2
(en)
*
|
2008-05-13 |
2014-07-22 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US8228482B2
(en)
*
|
2008-05-13 |
2012-07-24 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US8817236B2
(en)
|
2008-05-13 |
2014-08-26 |
Nikon Corporation |
Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method
|
US9176393B2
(en)
|
2008-05-28 |
2015-11-03 |
Asml Netherlands B.V. |
Lithographic apparatus and a method of operating the apparatus
|
EP2282188B1
(de)
|
2008-05-28 |
2015-03-11 |
Nikon Corporation |
Optisches beleuchtungssystem und belichtungsgerät
|
EP2131244A3
(de)
*
|
2008-06-02 |
2012-04-11 |
ASML Netherlands BV |
Lithografische Vorrichtung und Verfahren zur Messung von Mustereigenschaften
|
JP2009302154A
(ja)
*
|
2008-06-10 |
2009-12-24 |
Canon Inc |
露光装置及びデバイス製造方法
|
TW201003053A
(en)
*
|
2008-07-10 |
2010-01-16 |
Nikon Corp |
Deformation measuring apparatus, exposure apparatus, jig for deformation measuring apparatus, position measuring method and device manufacturing method
|
WO2010013331A1
(ja)
*
|
2008-07-30 |
2010-02-04 |
パイオニア株式会社 |
電子ビーム装置
|
US20100045949A1
(en)
*
|
2008-08-11 |
2010-02-25 |
Nikon Corporation |
Exposure apparatus, maintaining method and device fabricating method
|
US20100053588A1
(en)
*
|
2008-08-29 |
2010-03-04 |
Nikon Corporation |
Substrate Stage movement patterns for high throughput While Imaging a Reticle to a pair of Imaging Locations
|
US8435723B2
(en)
*
|
2008-09-11 |
2013-05-07 |
Nikon Corporation |
Pattern forming method and device production method
|
US8384875B2
(en)
*
|
2008-09-29 |
2013-02-26 |
Nikon Corporation |
Exposure apparatus, exposure method, and method for producing device
|
US20100302526A1
(en)
*
|
2008-11-13 |
2010-12-02 |
Nikon Corporation |
Drive control method for moving body, exposure method, robot control method, drive control apparatus, exposure apparatus and robot apparatus
|
US8599359B2
(en)
|
2008-12-19 |
2013-12-03 |
Nikon Corporation |
Exposure apparatus, exposure method, device manufacturing method, and carrier method
|
US8902402B2
(en)
|
2008-12-19 |
2014-12-02 |
Nikon Corporation |
Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
|
US8760629B2
(en)
|
2008-12-19 |
2014-06-24 |
Nikon Corporation |
Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
|
US8773635B2
(en)
*
|
2008-12-19 |
2014-07-08 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US8896806B2
(en)
*
|
2008-12-29 |
2014-11-25 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
GB0900191D0
(en)
*
|
2009-01-07 |
2009-02-11 |
Ge Healthcare Uk Ltd |
Microscopy
|
US20100196832A1
(en)
|
2009-01-30 |
2010-08-05 |
Nikon Corporation |
Exposure apparatus, exposing method, liquid immersion member and device fabricating method
|
KR101712219B1
(ko)
|
2009-03-10 |
2017-03-03 |
가부시키가이샤 니콘 |
노광 장치, 노광 방법, 및 디바이스 제조 방법
|
US8143602B2
(en)
*
|
2009-03-25 |
2012-03-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High-volume manufacturing massive e-beam maskless lithography system
|
US8953143B2
(en)
*
|
2009-04-24 |
2015-02-10 |
Nikon Corporation |
Liquid immersion member
|
US8202671B2
(en)
|
2009-04-28 |
2012-06-19 |
Nikon Corporation |
Protective apparatus, mask, mask forming apparatus, mask forming method, exposure apparatus, device fabricating method, and foreign matter detecting apparatus
|
US20100296074A1
(en)
*
|
2009-04-30 |
2010-11-25 |
Nikon Corporation |
Exposure method, and device manufacturing method
|
US20110085152A1
(en)
*
|
2009-05-07 |
2011-04-14 |
Hideaki Nishino |
Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method
|
US20100323303A1
(en)
*
|
2009-05-15 |
2010-12-23 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, and device fabricating method
|
TW201115280A
(en)
*
|
2009-05-15 |
2011-05-01 |
Nikon Corp |
Exposure apparatus and device manufacturing method
|
US8970820B2
(en)
|
2009-05-20 |
2015-03-03 |
Nikon Corporation |
Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
|
US8792084B2
(en)
*
|
2009-05-20 |
2014-07-29 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US8553204B2
(en)
|
2009-05-20 |
2013-10-08 |
Nikon Corporation |
Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
|
US9312159B2
(en)
*
|
2009-06-09 |
2016-04-12 |
Nikon Corporation |
Transport apparatus and exposure apparatus
|
JP5667568B2
(ja)
*
|
2009-08-07 |
2015-02-12 |
株式会社ニコン |
移動体装置、露光装置、及びデバイス製造方法
|
US20110032495A1
(en)
|
2009-08-07 |
2011-02-10 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US20110037962A1
(en)
*
|
2009-08-17 |
2011-02-17 |
Nikon Corporation |
Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
|
US8514395B2
(en)
|
2009-08-25 |
2013-08-20 |
Nikon Corporation |
Exposure method, exposure apparatus, and device manufacturing method
|
US8488109B2
(en)
|
2009-08-25 |
2013-07-16 |
Nikon Corporation |
Exposure method, exposure apparatus, and device manufacturing method
|
US8493547B2
(en)
|
2009-08-25 |
2013-07-23 |
Nikon Corporation |
Exposure apparatus, exposure method, and device manufacturing method
|
US20110096306A1
(en)
*
|
2009-09-28 |
2011-04-28 |
Nikon Corporation |
Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
|
US20110199591A1
(en)
*
|
2009-10-14 |
2011-08-18 |
Nikon Corporation |
Exposure apparatus, exposing method, maintenance method and device fabricating method
|
WO2011052703A1
(en)
|
2009-10-30 |
2011-05-05 |
Nikon Corporation |
Exposure apparatus and device manufacturing method
|
WO2011055758A1
(ja)
*
|
2009-11-05 |
2011-05-12 |
株式会社ニコン |
フォーカステストマスク、フォーカス計測方法、露光装置、及び露光方法
|
TWI603155B
(zh)
|
2009-11-09 |
2017-10-21 |
尼康股份有限公司 |
曝光裝置、曝光方法、曝光裝置之維修方法、曝光裝置之調整方法、以及元件製造方法
|
US20110134400A1
(en)
|
2009-12-04 |
2011-06-09 |
Nikon Corporation |
Exposure apparatus, liquid immersion member, and device manufacturing method
|
JP5282979B2
(ja)
*
|
2009-12-22 |
2013-09-04 |
株式会社ブイ・テクノロジー |
露光装置
|
US8488106B2
(en)
*
|
2009-12-28 |
2013-07-16 |
Nikon Corporation |
Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
|
KR20120112615A
(ko)
|
2009-12-28 |
2012-10-11 |
가부시키가이샤 니콘 |
액침 부재, 액침 부재의 제조 방법, 노광 장치, 및 디바이스 제조 방법
|
US9223225B2
(en)
|
2010-01-08 |
2015-12-29 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposure method, and device manufacturing method
|
US8841065B2
(en)
*
|
2010-02-12 |
2014-09-23 |
Nikon Corporation |
Manufacturing method of exposure apparatus and device manufacturing method
|
WO2011101187A1
(en)
*
|
2010-02-19 |
2011-08-25 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
WO2011102109A1
(ja)
|
2010-02-20 |
2011-08-25 |
株式会社ニコン |
光源最適化方法、露光方法、デバイス製造方法、プログラム、露光装置、リソグラフィシステム、及び光源評価方法、並びに光源変調方法
|
US20110205519A1
(en)
*
|
2010-02-25 |
2011-08-25 |
Nikon Corporation |
Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
|
US20110222031A1
(en)
*
|
2010-03-12 |
2011-09-15 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
JP5583436B2
(ja)
*
|
2010-03-15 |
2014-09-03 |
住友重機械工業株式会社 |
ラインスキャニング装置
|
US20120013863A1
(en)
|
2010-07-14 |
2012-01-19 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120013864A1
(en)
|
2010-07-14 |
2012-01-19 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US8937703B2
(en)
|
2010-07-14 |
2015-01-20 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120012191A1
(en)
|
2010-07-16 |
2012-01-19 |
Nikon Corporation |
Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
|
US20120019803A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium
|
US20120019802A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium
|
US20120019804A1
(en)
|
2010-07-23 |
2012-01-26 |
Nikon Corporation |
Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium
|
JPWO2012035843A1
(ja)
*
|
2010-09-13 |
2014-02-03 |
株式会社オーク製作所 |
投影露光装置
|
CN102487030B
(zh)
*
|
2010-12-06 |
2013-12-18 |
上海微电子装备有限公司 |
双工件台夹持机构
|
US20120162619A1
(en)
|
2010-12-27 |
2012-06-28 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
|
US20120188521A1
(en)
|
2010-12-27 |
2012-07-26 |
Nikon Corporation |
Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
|
US9746787B2
(en)
|
2011-02-22 |
2017-08-29 |
Nikon Corporation |
Holding apparatus, exposure apparatus and manufacturing method of device
|
CN102141739B
(zh)
*
|
2011-04-01 |
2013-01-16 |
清华大学 |
光刻机硅片台双台交换系统
|
US20130016329A1
(en)
|
2011-07-12 |
2013-01-17 |
Nikon Corporation |
Exposure apparatus, exposure method, measurement method, and device manufacturing method
|
US9329496B2
(en)
|
2011-07-21 |
2016-05-03 |
Nikon Corporation |
Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
|
US8601407B2
(en)
|
2011-08-25 |
2013-12-03 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Geometric pattern data quality verification for maskless lithography
|
US9256137B2
(en)
|
2011-08-25 |
2016-02-09 |
Nikon Corporation |
Exposure apparatus, liquid holding method, and device manufacturing method
|
US20130050666A1
(en)
|
2011-08-26 |
2013-02-28 |
Nikon Corporation |
Exposure apparatus, liquid holding method, and device manufacturing method
|
US8473877B2
(en)
|
2011-09-06 |
2013-06-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Striping methodology for maskless lithography
|
NL2009345A
(en)
*
|
2011-09-28 |
2013-04-02 |
Asml Netherlands Bv |
Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
|
CN102378494B
(zh)
*
|
2011-10-31 |
2014-03-26 |
深南电路有限公司 |
一种电路板阻焊加工方法
|
WO2013073538A1
(ja)
|
2011-11-17 |
2013-05-23 |
株式会社ニコン |
エンコーダ装置、移動量計測方法、光学装置、並びに露光方法及び装置
|
US20130135594A1
(en)
|
2011-11-25 |
2013-05-30 |
Nikon Corporation |
Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
|
US20130169944A1
(en)
|
2011-12-28 |
2013-07-04 |
Nikon Corporation |
Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
|
US9207549B2
(en)
|
2011-12-29 |
2015-12-08 |
Nikon Corporation |
Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
|
US9360772B2
(en)
|
2011-12-29 |
2016-06-07 |
Nikon Corporation |
Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
|
EP2620976B1
(de)
*
|
2012-01-25 |
2016-07-20 |
Qoniac GmbH |
Überlagerungsmodell zur Ausrichtung und Belichtung von Halbleiterscheiben
|
US9543223B2
(en)
|
2013-01-25 |
2017-01-10 |
Qoniac Gmbh |
Method and apparatus for fabricating wafer by calculating process correction parameters
|
CN103246170B
(zh)
*
|
2012-02-09 |
2015-07-08 |
中芯国际集成电路制造(上海)有限公司 |
曝光装置及曝光方法
|
WO2013132081A2
(en)
|
2012-03-08 |
2013-09-12 |
Mapper Lithography Ip B.V. |
Lithography system and method for processing a target, such as a wafer
|
US9323160B2
(en)
|
2012-04-10 |
2016-04-26 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
|
US9268231B2
(en)
|
2012-04-10 |
2016-02-23 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
|
US10679883B2
(en)
*
|
2012-04-19 |
2020-06-09 |
Intevac, Inc. |
Wafer plate and mask arrangement for substrate fabrication
|
US9606447B2
(en)
|
2012-05-21 |
2017-03-28 |
Nikon Corporation |
Reflective mirror, projection optical system, exposure apparatus, and device manufacturing method
|
RU2525152C2
(ru)
*
|
2012-06-25 |
2014-08-10 |
Общество с ограниченной ответственностью "ВЕСТТРЭЙД ЛТД" |
Способ формирования изображения микрообъекта (варианты) и устройство для его осуществления (варианты)
|
US9823580B2
(en)
|
2012-07-20 |
2017-11-21 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
|
CN103676494B
(zh)
*
|
2012-09-25 |
2015-11-18 |
上海微电子装备有限公司 |
用于扫描光刻机的逐场调焦调平方法
|
US9568828B2
(en)
|
2012-10-12 |
2017-02-14 |
Nikon Corporation |
Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
|
US9494870B2
(en)
|
2012-10-12 |
2016-11-15 |
Nikon Corporation |
Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
|
US9798252B2
(en)
|
2012-11-20 |
2017-10-24 |
Nikon Corporation |
Exposure apparatus, movable body apparatus, and device manufacturing method
|
JP6358564B2
(ja)
|
2012-11-30 |
2018-07-18 |
株式会社ニコン |
搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置
|
KR102169388B1
(ko)
|
2012-11-30 |
2020-10-23 |
가부시키가이샤 니콘 |
흡인 장치, 반입 방법, 반송 시스템 및 노광 장치, 그리고 디바이스 제조 방법
|
DE102012223128B4
(de)
*
|
2012-12-13 |
2022-09-01 |
Carl Zeiss Microscopy Gmbh |
Autofokusverfahren für Mikroskop und Mikroskop mit Autofokuseinrichtung
|
US9651873B2
(en)
|
2012-12-27 |
2017-05-16 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
|
JP6119242B2
(ja)
|
2012-12-27 |
2017-04-26 |
株式会社ニコン |
露光装置、露光方法、及びデバイス製造方法
|
US9720331B2
(en)
|
2012-12-27 |
2017-08-01 |
Nikon Corporation |
Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
|
US9352073B2
(en)
|
2013-01-22 |
2016-05-31 |
Niko Corporation |
Functional film
|
US9057955B2
(en)
|
2013-01-22 |
2015-06-16 |
Nikon Corporation |
Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
|
WO2014132923A1
(ja)
|
2013-02-28 |
2014-09-04 |
株式会社ニコン |
摺動膜、摺動膜が形成された部材、及びその製造方法
|
JP5344105B1
(ja)
*
|
2013-03-08 |
2013-11-20 |
ウシオ電機株式会社 |
光配向用偏光光照射装置及び光配向用偏光光照射方法
|
KR20160003140A
(ko)
|
2013-05-09 |
2016-01-08 |
가부시키가이샤 니콘 |
광학 소자, 투영 광학계, 노광 장치 및 디바이스 제조 방법
|
CN106896651B
(zh)
*
|
2013-06-14 |
2018-06-12 |
株式会社尼康 |
曝光方法
|
WO2015001805A1
(ja)
|
2013-07-05 |
2015-01-08 |
株式会社ニコン |
多層膜反射鏡、多層膜反射鏡の製造方法、投影光学系、露光装置、デバイスの製造方法
|
JP2015041094A
(ja)
*
|
2013-08-23 |
2015-03-02 |
株式会社東芝 |
露光装置、露光方法および露光プログラム
|
WO2015052781A1
(ja)
|
2013-10-08 |
2015-04-16 |
株式会社ニコン |
液浸部材、露光装置及び露光方法、並びにデバイス製造方法
|
EP4145226A3
(de)
|
2013-10-30 |
2023-06-21 |
Nikon Corporation |
Substrathaltevorrichtung, belichtungsvorrichtung und vorrichtungsherstellungsverfahren
|
US9766559B2
(en)
*
|
2013-10-30 |
2017-09-19 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Edge-dominant alignment method in exposure scanner system
|
JP6380412B2
(ja)
|
2014-01-16 |
2018-08-29 |
株式会社ニコン |
露光装置及び露光方法、並びにデバイス製造方法
|
TWI749514B
(zh)
|
2015-02-23 |
2021-12-11 |
日商尼康股份有限公司 |
測量裝置、微影系統、以及元件製造方法
|
JP6719729B2
(ja)
|
2015-02-23 |
2020-07-08 |
株式会社ニコン |
基板処理システム及び基板処理方法、並びにデバイス製造方法
|
TW202343158A
(zh)
|
2015-02-23 |
2023-11-01 |
日商尼康股份有限公司 |
測量裝置、曝光裝置、微影系統、測量方法以及曝光方法
|
JP6774031B2
(ja)
|
2015-03-25 |
2020-10-21 |
株式会社ニコン |
レイアウト方法、マーク検出方法、露光方法、計測装置、露光装置、並びにデバイス製造方法
|
DE102015211941A1
(de)
*
|
2015-06-26 |
2016-12-29 |
Zf Friedrichshafen Ag |
Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
|
US10031427B2
(en)
*
|
2015-09-30 |
2018-07-24 |
Applied Materials, Inc. |
Methods and apparatus for vibration damping stage
|
JP6925783B2
(ja)
*
|
2016-05-26 |
2021-08-25 |
株式会社アドテックエンジニアリング |
パターン描画装置及びパターン描画方法
|
CN109863457A
(zh)
|
2016-08-24 |
2019-06-07 |
株式会社尼康 |
测量系统及基板处理系统、以及元件制造方法
|
CN109791368B
(zh)
|
2016-09-27 |
2021-11-26 |
株式会社尼康 |
决定方法及装置、程序、信息记录媒体、曝光装置、布局信息提供方法、布局方法、标记检测方法、曝光方法、以及器件制造方法
|
KR102625369B1
(ko)
|
2016-09-30 |
2024-01-15 |
가부시키가이샤 니콘 |
계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
|
EP3598236A4
(de)
|
2017-03-16 |
2021-01-20 |
Nikon Corporation |
Steuerungsvorrichtung und steuerungsverfahren, belichtungsvorrichtung und belichtungsverfahren, vorrichtungsherstellungsverfahren, datenerzeugungsverfahren und programm
|
CN106842830B
(zh)
*
|
2017-04-19 |
2018-05-18 |
广东工业大学 |
一种焦点探测侧面式光刻焦面位置的检测装置及方法
|
JP6591482B2
(ja)
*
|
2017-05-22 |
2019-10-16 |
株式会社東海理化電機製作所 |
露光方法
|
US10585360B2
(en)
*
|
2017-08-25 |
2020-03-10 |
Applied Materials, Inc. |
Exposure system alignment and calibration method
|
CN109581823B
(zh)
|
2017-09-29 |
2022-11-08 |
鲁道夫科技股份有限公司 |
用于最佳化微影曝光制程的系统和方法
|
CN109671106B
(zh)
|
2017-10-13 |
2023-09-05 |
华为技术有限公司 |
一种图像处理方法、装置与设备
|
CN111123667B
(zh)
*
|
2018-10-31 |
2021-09-24 |
上海微电子装备(集团)股份有限公司 |
光刻装置、光刻装置的垂向控制方法及曝光方法
|
DE102018132001A1
(de)
|
2018-12-12 |
2020-06-18 |
Laser Imaging Systems Gmbh |
Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
|
CN112099315B
(zh)
*
|
2019-06-17 |
2021-10-22 |
上海微电子装备(集团)股份有限公司 |
一种光刻设备及其控制方法、装置和存储介质
|
CN112099317B
(zh)
*
|
2019-06-18 |
2022-03-11 |
上海微电子装备(集团)股份有限公司 |
一种光刻设备及其控制方法、装置和存储介质
|
NO20190876A1
(en)
*
|
2019-07-11 |
2021-01-12 |
Visitech As |
Real time Registration Lithography system
|
CN114391125A
(zh)
|
2019-09-09 |
2022-04-22 |
Asml控股股份有限公司 |
具有远心转换器的放大率恒定的多级光学装置
|
CN113125109B
(zh)
*
|
2019-12-30 |
2023-11-24 |
魔门塔(苏州)科技有限公司 |
一种图像曝光时间量测系统及标板设备
|
WO2021168359A1
(en)
|
2020-02-21 |
2021-08-26 |
Onto Innovation, Inc. |
System and method for correcting overlay errors in a lithographic process
|
CN115605576A
(zh)
*
|
2020-06-10 |
2023-01-13 |
深圳华大生命科学研究院(Cn) |
生物样本图像采集装置及基因测序仪
|
DE102020124006B3
(de)
|
2020-09-15 |
2022-01-05 |
Laser Imaging Systems Gmbh |
Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
|
US20230369012A1
(en)
*
|
2020-09-30 |
2023-11-16 |
Hitachi High-Tech Corporation |
Charged Particle Beam Apparatus
|
DE102020127981B3
(de)
|
2020-10-23 |
2021-12-16 |
Laser Imaging Systems Gmbh |
Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
|
EP4080265A1
(de)
*
|
2021-04-20 |
2022-10-26 |
Leica Instruments (Singapore) Pte Ltd |
Mikroskopisches system und entsprechendes steuerungssystem, verfahren und computerprogramm
|
US20240145281A1
(en)
*
|
2022-10-27 |
2024-05-02 |
Applied Materials, Inc. |
Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging
|
CN118444536B
(zh)
*
|
2024-07-04 |
2024-10-11 |
广州市艾佛光通科技有限公司 |
一种曝光设备及其控制方法
|