CN105904507A - Cutting device - Google Patents
Cutting device Download PDFInfo
- Publication number
- CN105904507A CN105904507A CN201610094653.XA CN201610094653A CN105904507A CN 105904507 A CN105904507 A CN 105904507A CN 201610094653 A CN201610094653 A CN 201610094653A CN 105904507 A CN105904507 A CN 105904507A
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- China
- Prior art keywords
- cutting
- unit
- plate workpiece
- chuck table
- burr removing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
- B26D3/065—On sheet material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Milling Processes (AREA)
Abstract
The invention provides a cutting device used for shortening the cutting, machining and deburring period. The cutting device (1) comprises a chuck workbench (4) used for holding a plate-like workpiece (W); a cutting unit (3) used for cutting the plate-like workpiece (W) by means of a cutting tool (31); a cutting feed unit (15) used for enabling the relative cutting feed between the chuck workbench and the cutting unit along the X-direction; and a deburring unit (5) used for removing burrs in the cutting groove (G) of the plate-like workpiece (W). The deburring unit is provided with a deburring nozzle (51) for spraying the high-pressure water onto the upper surface of the plate-like workpiece after being processed by the cutting tool. The deburring nozzle sprays the high-pressure water towards the cutting groove while moving together with the cutting tool relative to the chuck workbench.
Description
Technical field
The present invention relates to the use of the topping machanism that plate workpiece is cut by cutting tool, particularly relate to utilize cutting edge
The topping machanism that base plate for packaging is cut by tool.
Background technology
The plate workpieces such as base plate for packaging are to be formed by moulded resin on the base material being made up of resin substrate.In profit
The cutting slot cutting such plate workpiece with cutting tool and obtain can produce burr.In order to remove this burr, carry
Go out and the device (for example, referring to patent documentation 1) that topping machanism is separate, burr removing is special of cutting plate workpiece.
Further, other the method as burr removing also proposed following method: cuts plate workpiece utilizing cutting tool
And after forming cutting slot, make the direction of rotation of cutting tool overturn and depict this cutting slot and thus go Burr removal (such as,
With reference to patent documentation 2 or patent documentation 3).
Patent documentation 1: Japanese Unexamined Patent Publication 09-193099 publication
Patent documentation 2: No. 4394210 publications of Japanese Patent Publication No.
Patent documentation 3: No. 4540421 publications of Japanese Patent Publication No.
But, in the device for deburring described in patent documentation 1, owing to needs are utilizing topping machanism to tabular work
Plate workpiece is transported to device for deburring after carrying out machining by part, therefore exists up to consume till burr removing completes
Time-consuming such problem.Further, in the burr removing method described in patent documentation 2 and patent documentation 3, due to
Produce after plate workpiece is carried out machining for the operation of burr removing, therefore exist up to burr removing complete into
Only consuming time such problem.
Summary of the invention
The present invention completes in view of such point, its object is to provide a kind of topping machanism, it is possible to shorten cutting
Time required for processing and burr removing.
The topping machanism of the present invention has: chuck table, and it keeps plate workpiece；Cutting unit, it utilizes cutting
The plate workpiece that chuck table is kept by cutter cuts；Cutting feed unit, it is in X direction to chuck
Workbench and cutting unit relatively carry out cutting feed；Indexing feed unit, its along Y-direction to chuck table
Indexing feeding is relatively carried out with cutting unit；And burr removing unit, it is from utilizing cutting unit to chuck table
The cutting slot that the plate workpiece kept is cut will be formed in the burr of plate workpiece and removes, it is characterised in that
Cutting unit has: main shaft, and cutting tool is assembled into and can rotate by it；And cutter hood, it will be assemblied in main shaft
Cutting tool cover, burr removing unit has: burr removing nozzle, and it has jet, and this jet is to cutting edge
Have by after plate workpiece upper surface injection water under high pressure；And water under high pressure feed unit, burr removing nozzle is supplied by it
To water under high pressure, burr removing nozzle and cutting unit together relative to chuck table relative movement while from jet
Spray water under high pressure towards cutting slot, and will be formed in the burr removal of plate workpiece from cutting slot.
According to this structure, burr removing nozzle and cutting tool together carry out cutting feed, burr removing relative to plate workpiece
The upper surface injection water under high pressure of nozzle plate workpiece after cutting tool is passed through by jet.Thus, towards by cutting
The result of the cutting slot injection water under high pressure of Tool in Cutting is, it is possible to carries out machining and implements burr removing.By
This, it is no longer necessary to is for the time of burr removing, it is possible to shorten the time required for machining and burr removing.Its result
For the efficiency of machining can be improved.
Further, in the above-mentioned topping machanism of the present invention, burr removing nozzle is disposed in cutter hood.
According to the present invention, together burr removing nozzle is carried out with cutting tool cutting feed, and to cutting tool by it
After plate workpiece injection water under high pressure such that it is able to shorten the time required for machining and burr removing.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the topping machanism of present embodiment.
Fig. 2 is the side view of the topping machanism of present embodiment.
Fig. 3 is the side view of the processing action of the topping machanism illustrating present embodiment.
Fig. 4 is the side view of the processing action of the topping machanism illustrating present embodiment.
Fig. 5 is the top view of the processing action of the topping machanism illustrating present embodiment.
Label declaration
W: plate workpiece；G: cutting slot；1: topping machanism；15: cutting feed unit；20: indexing feeding
Unit；3: cutting unit；31: cutting tool；32: main shaft；33: cutter hood；4: chuck table；5:
Burr removing unit；51: burr removing nozzle；52: water under high pressure feed unit；53: jet.
Detailed description of the invention
Hereinafter, referring to the drawings the topping machanism of present embodiment is illustrated.Fig. 1 is the cutting dress of present embodiment
The axonometric chart put.Fig. 2 is the side view of the topping machanism of present embodiment.It addition, a following example to topping machanism
Illustrate, but the structure of the topping machanism of present embodiment is not limited to this.As long as plate workpiece can be cut, it is possible to
So that topping machanism uses arbitrary structure.Further, it is greatly exaggerated to show tabular work relative to chuck table in FIG
The size of part.
As depicted in figs. 1 and 2, topping machanism 1 is configured to by making chuck table 4 relative to cutting unit 3
Relative movement and the plate workpiece W that will remain on chuck table 4 is divided into each chip.Plate workpiece W by
Base plate for packaging is constituted, and in this base plate for packaging, sets the most side by side in the front of rectangular resin substrate 60
Put multiple (being 3 in the present embodiment) resinous protuberance 61.Resin substrate 60 e.g. PCB substrate.
Plate workpiece W is divided into and is configured with multiple protuberance 61 and is equipped with multiple devices of semiconductor device of electrode in inside
The remaining area A2 of the surrounding of part region A1 and device area A1.Each device area A1 is by cancellate segmentation
Preset lines L is divided into multiple region, is equipped with semiconductor device (not shown) in each region.
Being removed as leftover pieces as this plate workpiece W, remaining area A2, device area A1 is pre-along segmentation
Alignment L is divided into each chip.It addition, plate workpiece W is not limited to the substrate of semiconductor device, it is also possible to
It it is the metal basal board of LED component.Further, the substrate after chip carrying it is not limited to, it is also possible to before being chip carrying
Substrate.The protuberance 61 of plate workpiece W is such as formed by epoxy resin, silicones, but as long as can be at resin base
Forming protuberance 61 on plate 60 can also be arbitrary resin.
Upper surface at shell 11 is formed with the rectangular peristome extended along X-direction (cutting direction) (not
Diagram).X-axis workbench 12 that this peristome together can be moved with chuck table 4 and undulatory waterproof
Cover 13 covering.The ball-screw making chuck table 4 move it is provided with along X-direction in the lower section of bucker 13
The cutting feed unit 15 (with reference to Fig. 2) of formula.
On X-axis workbench 12, it is length via rotary unit 14 so that top view can be provided with in the way of rotating
Square chuck table 4.Chuck table 4 has the suction surface 41 keeping plate workpiece W.At chucking work
In the suction surface 41 of platform 4, formed the most side by side with multiple protuberances 61 of plate workpiece W
There is multiple recess 42.Each recess 42 of chuck table 4 has the height one of each protuberance 61 with plate workpiece W
The degree of depth caused, being formed as can the protuberance 61 of Ingathering board shape workpiece W.Each recess 42 be formed around supporting
Face 43, to support the remaining area A2 of the surrounding of the protuberance 61 of plate workpiece W.
In the suction surface 41 of chuck table 4, it is correspondingly formed confession with segmentation preset lines L of plate workpiece W
The entrance groove 44 (with reference to Fig. 2) that cutting tool 31 enters.(attract in the bottom surface of the recess 42 of chuck table 4
Face 41) on, by entering after groove 44 is divided in cancellate region and is formed with the segmentation to plate workpiece W
Each chip carries out multiple suction holes (not shown) of attracting holding.Further, the bearing-surface around recess 42
Multiple suction holes of the remaining area A2 being formed with attracting holding plate workpiece W in 43 (suction surface 41) (are not schemed
Show).Each suction hole is connected with attracting source (not shown) by the stream in chuck table 4 respectively.
Delivery position that chuck table 4 is entreated in a device and back and forth moving between the Working position of cutting unit 3
Dynamic.It addition, Fig. 1 shows that chuck table 4 is in the standby state of delivery position.In shell 11, with this
The inboard in the corner that delivery position is adjacent is provided with the most parallel pair of guide rails 16.Pair of guide rails
The location of 16 X-directions carrying out plate workpiece W.
Near pair of guide rails 16, it is provided with between guide rail 16 and chuck table 4 conveyance plate workpiece W's
First carrying arm 17.Plate is transported by making the top view of the first carrying arm 17 be the arm 17a rotation of L-shaped
Shape workpiece W.Further, the rear at the chuck table 4 of delivery position is provided with revolving wiper mechanism 18.
In wiper mechanism 18, towards the rotary table 18a jet cleaning water in rotation, plate workpiece W is being carried out
After cleaning, winding-up dry air and make plate workpiece W be dried.
Shell 11 is provided with the supporting station 19 of supporting cutting unit 3.Cutting unit 3 is positioned at Working position
The top of chuck table 4, is configured to make cutting tool 31 cut tabular work from the incision of the front of plate workpiece W
Part W.The cutting tool 31 of cutting plate workpiece W is assembled into and can rotate by cutting unit 3.Entered by indexing
Cutting unit 3 indexing feeding in the Y-axis direction is made to make cutting unit 3 and chuck table 4 at Y to unit 20
Relative movement on direction of principal axis.Further, cutting unit 3 is made to move in the Z-axis direction by lifting unit (not shown).
Indexing feed unit 20 and lifting unit are such as made up of the travel mechanism of ball screw type.
Cutting unit 3 is configured to assemble cutting tool 31 in the front end of main shaft 32, and to cover cutting tool 31
The mode of periphery arranges cutter hood 33.Cutting tool 31 is such as made up of, in conjunction with material ring-type packing ring cutter
The abrasive particles such as bonded diamond and formed.Cutter hood 33 is formed as covering the box of the substantially first half of cutting tool 31.
The cutting water nozzle 34 towards cutting tip injection cutting water it is provided with in cutter hood 33.Here, so that joining position
Put side to be front relative to Working position, make Working position side illustrate relative to the mode that delivery position is rear.
Cutting water nozzle 34 is formed as the substantially L-shaped that the lower end, rear from cutter hood 33 extends towards front, cutting
The front end of (operating) water nozzle 34 is positioned at the substantially lower half of cutting tool 31.It is formed in the front end of cutting water nozzle 34
Multiple seams 35 (with reference to Fig. 2).Cutting water sprays towards cutting tool 31 from this seam 35.While supply cutting water one
Plate workpiece W cut by the cutting tool 31 of lateral dominance high speed rotating, thus along segmentation preset lines L cutting tabular work
Part W.
Further, topping machanism 1 has the burr removing list that the burr on the upper surface that will be formed in plate workpiece W are removed
Unit 5.Burr removing unit 5 has towards the burr removing nozzle 51 of plate workpiece W injection water under high pressure and to burr removing
Nozzle 51 supplies the water under high pressure feed unit 52 of water under high pressure.Burr removing nozzle 51 is formed as along vertical extension
Cylindric.Be formed with jet 53 (with reference to Fig. 2) in the lower end of burr removing nozzle 51, this jet 53 is towards cutting
Cutting knife tool 31 pass through after plate workpiece W upper surface injection water under high pressure.
Details is described later, but jet 53 is for example formed as circle, has ratio by cutting tool 31
The diameter that the width (kerf width) of cutting slot that formed is big.Further, jet 53 be formed at burr nozzle 51
Inside stream (not shown) connection, water under high pressure feed unit 52 is connected with this stream via valve 54.Water under high pressure
Feed unit 52 supplies the fluid (water under high pressure) that improve pressure by compressor (not shown) to burr removing nozzle 51.
The burr removing nozzle 51 so constituted is disposed in the rear (on the left of the paper of Fig. 2) of cutter hood 33, is configured to
Burr removing nozzle 51 can be made to move integratedly with cutting unit 3.More specifically, burr removing nozzle 51 is in cutting
The upstream side in the cutting feed direction of plate workpiece W is arranged by unit 3 along the radial direction of cutting tool 31, in order to go
Except the burr being formed at cutting slot after cutting by cutting tool 31.And, it is also possible to cutting tool
The mode of 31 burr being formed at the cutting slot cut before for the cutting slot removal of current cutting arranges burr removing spray
Mouth 51.In this case, the side (front side (on the right side of the paper of Fig. 2)) by cutting at cutting tool 31 is joined
If burr removing nozzle 51, and can be in the way of preventing the resistance of cutting water rolled because of the rotation of cutting tool 31
Carry out burr removing.
Conveyance plate workpiece it is provided with between chuck table 4 and wiper mechanism 18 at the side 19a of supporting station 19
2nd carrying arm 21 of W.The arm 21a of the 2nd carrying arm 21 extends obliquely, by making this arm 21a at Y
Move on direction of principal axis and transport plate workpiece W.Further, with the movement of crosscutting chuck table 4 on supporting station 19
The mode of the top in path (X-direction) is provided with the cantilever support portion 23 of supporting shoot part 22.Shoot part 22
Prominent from the lower section in cantilever support portion 23, shoot plate workpiece W by shoot part 22.By based on shoot part 22
Shooting imagery exploitation being directed in cutting unit 3 and chuck table 4.
The input block 24 of the instruction accepting portion each to device it is provided with in the corner of shell 11.Further, at supporting station
Monitor 25 it is configured with on the upper surface of 19.Monitor 25 shows the image photographed by shoot part 22 and
The processing conditions etc. of plate workpiece W.Further, in topping machanism 1, it is provided with the control in each portion of same control device
Unit 26.Control unit 26 is made up of the processor performing various process or memorizer etc..Memorizer according to purposes by
ROM (Read Only Memory: read only memory), RAM (Random Access Memory: deposit at random
Reservoir) etc. one or more storage medium constitute.
In the topping machanism 1 so constituted, as in figure 2 it is shown, plate workpiece W loads with the state of face down
On chuck table 4, device area A1 is by bottom surface (suction surface 41) attracting holding of recess 42, remaining area
Territory A2 is by bearing-surface 43 (suction surface 41) attracting holding.Cutting unit 3 is being carried out relative to segmentation preset lines L
After para-position, drop to the height utilizing cutting tool 31 to cut plate workpiece W.Further, cutting edge is made
Having 31 high speed rotating while plate workpiece W to be carried out cutting feed, in plate workpiece W, thus forming cutting slot.
In machining, owing to forming cutting slot and spraying water under high pressure, therefore, it is possible to cut towards cutting slot
Processing is while implementing burr removing.
Then, with reference to Fig. 2 to Fig. 5, the processing action of the topping machanism of present embodiment is illustrated.Fig. 3 and Tu
4 is the side view of the processing action of the topping machanism illustrating present embodiment.Fig. 5 is the cutting illustrating present embodiment
The top view of the processing action of device.
First, the holding action to plate workpiece W illustrates.As illustrated in fig. 2, plate workpiece W
It is positioned on chuck table 4 being formed with the face side of multiple protuberance 61 state down.Now, plate workpiece
Each protuberance 61 of W is accommodated in each recess 42 of chuck table 4, device area A1 and the bottom surface of recess 42
Contact, on the other hand remaining area A2 contacts with bearing-surface 43.Further, negative by produce in suction surface 41
Press plate workpiece W attracting holding on chuck table 4 (suction surface 41).
Then, the action to segmentation preset lines L of the short side direction of cutting plate workpiece W illustrates.By card
Under the state of dish workbench 4 attracting holding plate workpiece W, chuck table 4 is made to rotate by rotary unit 14,
As it is shown on figure 3, the cutting feed direction (X-direction) of cutting feed unit 15 and the minor face side of plate workpiece W
To unanimously.Further, cutting unit 3 is made to move in the Y-axis direction by indexing feed unit 20 (Fig. 1 reference),
The position of cutting unit 3 is carried out in the way of being positioned in segmentation preset lines L of plate workpiece W by cutting tool 31
Adjust.
Then, cutting unit 3 is made to move in the Z-axis direction by not shown lifting unit, by cutting tool 31
Drop to height plate workpiece W can cut entirely.Further, from burr removing nozzle 51 towards tabular work
Part W sprays water under high pressure, makes the chuck table 4 cutting tool 31 relative to high speed rotating in X-direction
Upper movement (cutting feed).Cutting tool 31 invades entrance groove 44 and cuts tabular work along segmentation preset lines L
Part W.Thus, plate workpiece W forms the cutting slot G along segmentation preset lines L.Now, at cutting slot
The marginal portion of G (resin substrate 60) produces the burr (not shown) that the direction of rotation along cutting tool 31 is rolled.
As it has been described above, from the jet 53 of burr removing nozzle 51 to the rear of cutting tool 31 (relative to tabular work
The upstream side in the cutting feed direction of part W) and be plate workpiece W upper surface injection water under high pressure.This water under high pressure with
The upper surface of plate workpiece W collides and is pressed to chuck table 4 side by plate workpiece W, and because of with by cutting
The cutting slot G that cutter 31 is formed collides and is blown by the burr produced on cutting slot G and fly.
In such manner, it is possible to utilize cutting tool 31 to form cutting slot G on plate workpiece W while cutting towards this
Cut groove G injection water under high pressure and remove Burr removal, it is possible to carry out machining and implement burr removing.I.e., it is possible to
Cutting at one time feeding is utilized to implement to form cutting slot G and these both sides of burr removing.Thus, with defining cutting slot G
The structure needing the operation for burr removing afterwards is compared, it is possible to shorten process time, it is possible to increase working (machining) efficiency.
After the cutting of column split preset lines L terminates, make cutting unit 3 at Y by indexing feed unit 20
Move on direction of principal axis, po-sition 31 in adjacent segmentation preset lines L.Further, pre-along new segmentation
Alignment L implements machining.Finish in all of segmentation preset lines L along a direction (short side direction)
After machining, implement the segmentation of the other direction (length direction) vertical with segmentation preset lines L in a direction
The machining of preset lines L.
With reference to Fig. 4 and Fig. 5, the action of segmentation preset lines L of the length direction of cutting plate workpiece W is illustrated.
It addition, about Fig. 4 clipped explanation due to the action identical with Fig. 3, illustrate from top with utilizing Fig. 5 emphasis
Observe situation during machining action.Further, the most for convenience of description, cutter hood 33 and segmentation are predetermined
Line L is not shown, cutting slot G shown in broken lines.
As it has been described above, after the machining of short side direction terminates, make chuck table 4 by rotary unit 14
90-degree rotation, as shown in Figure 4 and Figure 5, make the cutting feed direction (X-direction) of cutting feed unit 15 with
The length direction of plate workpiece W is consistent.Further, make cutting unit 3 in Y-axis side by indexing feed unit 20
Move up, to carry out cutting unit in the way of po-sition 31 in segmentation preset lines L of plate workpiece W
The position adjustment of 3.
Further, as action illustrated in fig. 3, make cutting unit 3 move in the Z-axis direction, have adjusted and cut
After the height of cutting knife tool 31, spray water under high pressure from burr removing nozzle 51 towards plate workpiece W, while making
Chuck table 4 moves (cutting feed) in the X-axis direction relative to the cutting tool 31 of high speed rotating.Thus,
It also is able in the longitudinal direction while forming cutting slot G while removing Burr removal in segmentation preset lines L.
It addition, as it is shown in figure 5, with the width of the cutting slot G formed by cutting tool 31 (cutting tool 31
Thickness) to compare, the diameter of the jet 53 of burr removing nozzle 51 is formed bigger.Thus, spray from jet 53
The water under high pressure penetrated is also to have state and the tabular of the big width of the thickness of the width than cutting slot G and cutting tool 31
The upper surface of workpiece W collides.Thus, water under high pressure with not only with cutting slot G, also with the marginal portion of cutting slot G
And the mode overlapping for plate workpiece W of cutting slot G periphery collides.So, water under high pressure also with the outside of cutting slot G
Collide, thus plate workpiece W is pressed downwards towards chuck table 4.Further, at the edge of cutting slot G
It is formed in part with burr, can effectively remove Burr removal because the marginal portion of water under high pressure with cutting slot G is collided.
As it has been described above, according to the topping machanism 1 of present embodiment, burr removing nozzle 51 and cutting tool 31 1 homophase
For plate workpiece W cutting feed, the burr removing nozzle 51 tabular after cutting tool 31 is passed through by jet 53
The upper surface injection water under high pressure of workpiece W.Thus, high pressure is sprayed towards the cutting slot G cut by cutting tool 31
The result of water is, it is possible to carries out machining and implements burr removing.Thus, it is not necessary to for burr removing time
Between and the efficiency of machining can be improved.Further, by the upper surface of plate workpiece W being sprayed water under high pressure, no
It is only capable of the effect obtaining burr removing, additionally it is possible to obtain the cleaning of plate workpiece W and the effect of cooling.Therefore, exist
The most not there is in the topping machanism of revolving wiper mechanism the cleaning also being able to implement plate workpiece W.
It addition, the invention is not restricted to above-mentioned embodiment, it is possible to carry out various change and implement.At above-mentioned embodiment
In, it is not limited to this about the size illustrated in accompanying drawing or shape etc., can fit in the range of the effect playing the present invention
Work as change.It addition, implementing without departing from can suitably change in the range of the purpose of the present invention.
Such as, in the above-described embodiment, burr removing nozzle 51 uses and is disposed in the rear portion of cutter hood 33 and (cuts
Cut the upstream side in the unit 3 cutting feed direction relative to plate workpiece W) structure, but be not limited to this structure.
For example, it is also possible to employing following structure: burr removing nozzle 51 is disposed in the side of cutter hood 33, is cutting
Cut and add man-hour, towards adjacent cutting slot G (segmentation preset lines L) injection water under high pressure.In this case, it is possible to
Burr removing is not carried out by the case of the resistance of the cutting water rolled because of the rotation of cutting tool 31.
Further, in the above-described embodiment, use the structure that it is circular that jet 53 is formed as, but do not limit
In this structure.Jet 53 such as can also be formed as the rectangle that width ratio kerf width is wide.
Further, in the above-described embodiment, use by make cutting tool 31 to chuck table 4
Identical direction, cutting feed direction rotates and the so-called lower cutting that carries out cutting is to form the structure of cutting slot G,
But it is not limited to this structure.Can also be by making cutting tool 31 in opposite direction with the cutting feed of chuck table 4
Direction rotate and the upper cutting that carries out cutting is to form cutting slot G.
Industrial applicability
As discussed above, the present invention has can shorten the time required for machining and burr removing so
Effect, particularly with utilize cutting tool cutting base plate for packaging topping machanism for be useful.
Claims (2)
1. a topping machanism, this topping machanism has: chuck table, and it keeps plate workpiece；Cutting unit,
Its plate workpiece utilizing cutting tool to be kept this chuck table cuts；Cutting feed unit, it is along X
Direction relatively carries out cutting feed to this chuck table and this cutting unit；Indexing feed unit, it is along Y side
To this chuck table and this cutting unit relatively being carried out indexing feeding；And burr removing unit, it should from utilization
The cutting slot that the plate workpiece that this chuck table is kept by cutting unit is cut will be formed in plate workpiece
Burr remove, wherein,
This cutting unit has: main shaft, and this cutting tool is assembled into and can rotate by it；And cutter hood, it will dress
This cutting tool being assigned in this main shaft covers,
This burr removing unit has: burr removing nozzle, and it has jet, after this cutting tool is passed through by this jet
Plate workpiece upper surface injection water under high pressure；And water under high pressure feed unit, it supplies high pressure to this burr removing nozzle
Water,
This burr removing nozzle while with this cutting unit together relative to this chuck table relative movement while from this spray
Loophole sprays water under high pressure towards this cutting slot, and will be formed in the burr removal of plate workpiece from this cutting slot.
Topping machanism the most according to claim 1, wherein,
This burr removing nozzle is disposed in this cutter hood.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015032799A JP6486710B2 (en) | 2015-02-23 | 2015-02-23 | Cutting equipment |
| JP2015-032799 | 2015-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105904507A true CN105904507A (en) | 2016-08-31 |
Family
ID=56745032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610094653.XA Pending CN105904507A (en) | 2015-02-23 | 2016-02-19 | Cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6486710B2 (en) |
| KR (1) | KR102365978B1 (en) |
| CN (1) | CN105904507A (en) |
| TW (1) | TWI669201B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6909621B2 (en) * | 2017-04-24 | 2021-07-28 | 株式会社ディスコ | Water jet processing equipment |
| JP7169061B2 (en) * | 2017-11-29 | 2022-11-10 | 株式会社ディスコ | Cutting method |
| JP7072986B2 (en) * | 2018-05-29 | 2022-05-23 | 株式会社ディスコ | Water jet processing equipment |
| JP7340911B2 (en) | 2018-08-17 | 2023-09-08 | 株式会社ディスコ | Package substrate processing method |
| JP2023180400A (en) | 2022-06-09 | 2023-12-21 | 株式会社ディスコ | Burr removal device and cutting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0957692A (en) * | 1995-08-25 | 1997-03-04 | Toshiba Chem Corp | Cutting method and cutting device of semiconductor sealing resin sheet |
| CN101337400A (en) * | 2007-07-05 | 2009-01-07 | 株式会社迪思科 | Cutter |
| JP2013144324A (en) * | 2012-01-13 | 2013-07-25 | Disco Corp | Cutting device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57126139A (en) * | 1981-01-27 | 1982-08-05 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS6480506A (en) * | 1987-09-24 | 1989-03-27 | Hitachi Ltd | Dicer |
| JPH03149183A (en) * | 1989-11-02 | 1991-06-25 | Nec Yamaguchi Ltd | Method for cutting semiconductor substrate |
| JP3725226B2 (en) | 1996-01-22 | 2005-12-07 | リックス株式会社 | Water jet resin deburring device |
| JP4394210B2 (en) | 1999-09-08 | 2010-01-06 | 株式会社ディスコ | Cutting method |
| JP2001345287A (en) * | 2000-05-31 | 2001-12-14 | Hitachi Ltd | Method for manufacturing semiconductor device |
| JP4540421B2 (en) | 2004-07-28 | 2010-09-08 | 株式会社ディスコ | Dicing method |
| JP2007125667A (en) * | 2005-11-07 | 2007-05-24 | Disco Abrasive Syst Ltd | Cutting device of substrate |
| KR20090024408A (en) * | 2007-09-04 | 2009-03-09 | 삼성전자주식회사 | Appratus for sawing a wafer having a nozzle eliminating a metal burr in a scribe lane, method of sawing the wafer and semiconductor package fabricated thereby the same |
| JP2010123823A (en) * | 2008-11-21 | 2010-06-03 | Disco Abrasive Syst Ltd | Cutting device |
| JP5875331B2 (en) * | 2011-11-08 | 2016-03-02 | 株式会社ディスコ | Cutting equipment |
-
2015
- 2015-02-23 JP JP2015032799A patent/JP6486710B2/en active Active
-
2016
- 2016-01-08 TW TW105100544A patent/TWI669201B/en active
- 2016-02-15 KR KR1020160017234A patent/KR102365978B1/en active IP Right Grant
- 2016-02-19 CN CN201610094653.XA patent/CN105904507A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0957692A (en) * | 1995-08-25 | 1997-03-04 | Toshiba Chem Corp | Cutting method and cutting device of semiconductor sealing resin sheet |
| CN101337400A (en) * | 2007-07-05 | 2009-01-07 | 株式会社迪思科 | Cutter |
| JP2013144324A (en) * | 2012-01-13 | 2013-07-25 | Disco Corp | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160102888A (en) | 2016-08-31 |
| TW201641246A (en) | 2016-12-01 |
| JP6486710B2 (en) | 2019-03-20 |
| JP2016157722A (en) | 2016-09-01 |
| TWI669201B (en) | 2019-08-21 |
| KR102365978B1 (en) | 2022-02-22 |
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