CN105931990A - Cutting Apparatus - Google Patents
Cutting Apparatus Download PDFInfo
- Publication number
- CN105931990A CN105931990A CN201610103906.5A CN201610103906A CN105931990A CN 105931990 A CN105931990 A CN 105931990A CN 201610103906 A CN201610103906 A CN 201610103906A CN 105931990 A CN105931990 A CN 105931990A
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- Prior art keywords
- cutting
- unit
- jet
- plate workpiece
- chuck table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A cutting apparatus provided by the present invention is used to remove the fine cutting chippings attached to a cutting groove of a plate-like workpiece, and comprises a chuck table 20 for keeping the plate-like workpiece W, a cutting unit 30 for cutting the plate-like workpiece via a cutting knife 33; and a cleaning nozzle 41 possessing a spraying port 45 for spraying a mixed liquid formed by mixing the cleaning water and the high-pressure air to the cutting groove 64 of the plate-like workpiece cut by the cutting unit, wherein the mixed liquid sprayed from the spraying port of the cleaning nozzle becomes the atomizing liquid drops to remove the fine cutting chippings attached to the wall surface of the cutting groove.
Description
Technical field
The present invention relates to while cleaning plate workpiece by rinse water, by cutting of cutting tool cutting plate workpiece
Turning device.
Background technology
About topping machanism, cutting swarf (pollutant) can be produced when plate workpiece is cut by cutting tool, cut
In swarf can be attached to the upper surface of plate workpiece or be formed at the cutting slot of plate workpiece.Although being attached to plate workpiece
On cutting swarf can be cleaned by assembly and wash, if but become at plate workpiece during the transfer of cleaning assembly
It is dried, then cannot remove cutting swarf from plate workpiece by cleaning assembly.Therefore, it has been proposed that at chuck table supernatant
Wash plate workpiece topping machanism (with reference to patent documentation 1), supply when the upper surface of plate workpiece is normal cutting water with
Prevent the topping machanism (with reference to patent documentation 2,3) that cutting swarf is attached on the upper surface of plate workpiece or cutting slot.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2003-234308 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2002-329685 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2006-231474 publication
But, in the topping machanism described in patent documentation 1-3, although rinse water can be utilized to remove and be attached to tabular
Bigger cutting swarf on the surface of workpiece, however cannot fully remove in the cutting slot being attached to plate workpiece trickle
Cutting swarf.
Summary of the invention
The present invention is exactly to complete in view of the foregoing, its object is to provide one to possess to remove and be attached to plate
The topping machanism of the cleaning function of the trickle cutting swarf of the cutting slot of shape workpiece.
The topping machanism of the present invention has: chuck table, and it keeps plate workpiece；Cutting unit, it passes through cutting tool
The plate workpiece keeping this chuck table cuts；Cutting feed unit, it makes this chuck table and this cutting unit exist
Relative cutting feed is carried out in X-direction；Index feed unit, it makes this chuck table and this cutting unit in Y side
Upwards carry out relative index feed；And cleaning unit, cutting slot is carried out by it, and this cutting slot is that utilize should
The plate workpiece that this chuck table keeps is cut and is formed by cutting unit, and wherein, this cutting unit has: main
Axle, it is can install this cutting tool in the way of rotating；And cutter hood, its make to be installed on this main shaft this cut
A part for cutting knife tool is prominent and is covered, and this cleaning unit has: washer jet, and it has jet, this spray
Loophole is to this cutting slot injection mixed liquor cut by this cutting unit, and this mixed liquor is by empty to rinse water and high pressure
Gas mixes；Rinse water feed unit, it supplies this rinse water to this washer jet；And pressure-air supply
Unit, it supplies this pressure-air to this washer jet, by this mixing sprayed from this jet of this washer jet
Liquid cleans this cutting slot.
According to this structure, rinse water mixes with pressure-air so that mixed liquor become spray form drop and from
Jet sprays to cutting slot.The drop of spray form is injected on the wall of cutting slot, so that trickle cutting swarf
It is stripped from the wall of cutting slot and removes.In such manner, it is possible to the surface of alignment cutting slot rather than plate workpiece is sprayed
Penetrate the drop of spray form, so that the trickle cutting swarf that the droplet impact of spray form is attached in cutting slot, it is easy to from
Trickle cutting swarf is removed on plate workpiece.
The effect of invention
According to the present invention, by the drop to cutting slot spraying shape such that it is able to effectively remove and be attached to cutting
Trickle cutting swarf in groove.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the topping machanism of present embodiment.
Fig. 2 A and Fig. 2 B is the top view of the plate workpiece of present embodiment.
Fig. 3 A and Fig. 3 B is the figure of an example of the stock removal action of the topping machanism representing present embodiment.
Fig. 4 A and Fig. 4 B is the figure of the cleaning state of the cutting slot of the washer jet representing present embodiment.
Fig. 5 A and Fig. 5 B is the figure of an example of the adjustment action of the guiding mechanism representing variation.
Label declaration
1: topping machanism, 20: chuck table, 21: cutting feed unit, 30: cutting unit, 31: index feed
Unit, 32: main shaft, 33: cutting tool, 34: cutter hood, 40: cleaning unit, 41: washer jet, 42:
Rinse water supply source (rinse water feed unit), 43: pressure-air supply source (pressure-air feed unit), 45:
The jet of washer jet, 49: guiding mechanism, 50: gas curtain nozzle, 51: the jet of gas curtain nozzle, 64: cut
Cut groove, 71: drop, 75: cutting swarf, W: plate workpiece.
Detailed description of the invention
Hereinafter, referring to the drawings, the topping machanism of present embodiment is described.Fig. 1 is the topping machanism of present embodiment
Axonometric chart.Fig. 2 is the top view of the plate workpiece of present embodiment.It addition, in the following description, exemplified
Cutting base plate for packaging illustrates using the topping machanism as plate workpiece, but is not limited to this structure.Cutting dress
Put the device that can be to cut semiconductor wafer and optical device wafer as plate workpiece.
As it is shown in figure 1, topping machanism 1 is configured to be held in the plate in chuck table 20 by cutting tool 33 cutting
Shape workpiece W, and the cutting swarf (pollutant) produced when cleaning cutting in chuck table 20.Such as Fig. 2 A and figure
Shown in 2B, plate workpiece W is in generally rectangular base material (such as, the resin plate of semiconductor device, LED
The metallic plate of device) 61 the position, many places (being 3 positions in present embodiment) of length direction be provided with device
Part region A1, and it is provided with remaining area A2 in the way of surrounding each device area A1.Table at base material 61
On face, each device area A1 is covered by resin die (such as, epoxy resin, silicones), thus is formed with tree
The protuberance 62 of fat.
Additionally, plate workpiece W is divided into multiple region by cancellate segmentation preset lines 63.By along lattice
The segmentation preset lines 63 of sub-shape cuts plate workpiece W, thus remaining area A2 as end material from plate workpiece W
On cut separation, device area A1 is divided into each chip.It addition, plate workpiece W is not limited to CSP (Chip
Size Package: chip-size package) substrate, (Quad Flat Non-leaded package: four side is without drawing for QFN
Foot flat package) base plate for packaging being equipped with after device of substrate etc., it is also possible to it is the substrate before carrying device.Additionally,
Device area A1 can also arrange any one party in semiconductor device and LED component.
Returning Fig. 1, the upper surface at shell 10 is formed with the rectangular-shaped opening extended in the X direction, this opening
The movable plate 11 that can be moved together with chuck table 20 and the bucker 12 of Serpentis abdomen shape cover.At bucker 12
Lower section is provided with the cutting feed unit 21 (reference of the ball screw type making chuck table 20 cutting feed in the X direction
Fig. 3).Across θ workbench 22, chuck table 20 is supported as rotating about the z axis on movable plate 11.Chuck table
The position corresponding with each protuberance 62 of plate workpiece W of the upper surface of 20, is formed and can receive plate workpiece
Multiple recesses 23 of each protuberance 62 of W.
Additionally, be correspondingly formed for cutting in the upper surface of chuck table 20 and the segmentation preset lines 63 of plate workpiece W
The entrance groove 24 that cutting knife tool 33 enters.The groove 24 that is entered on the bottom surface 25 of the recess 23 of chuck table 20 divides
Multiple suction holes 27 of each chip after the segmentation of attracting holding plate workpiece W it are formed with for cancellate region.
Additionally, on bearing-surface 26 around recess 23, be formed with the remaining area A2 of attracting holding plate workpiece W
Multiple suction holes 28.Each suction hole 27,28 (is not schemed with attracting source by the stream in chuck table 20 respectively
Show) connect.
Cutting unit 30 is located in the top of chuck table 20, by the index feed unit 31 (ginseng of ball screw type
According to Fig. 3) and it is indexed feeding in the Y direction, and by the lifting unit (not shown) of ball screw type at Z
Direction lifts.Cutting unit 30 at the end of main shaft 32 so that cutting tool 33 can be installed in the way of rotating,
And it is configured to be provided with the box that makes the part (substantially lower half) of cutting tool 33 prominent and to be covered
Cutter hood 34.The abrasive particle of diamond etc. is combined by bond material and is formed as ring-type by cutting tool 33.?
Cutter hood 34 arranges oriented cutting tool 33 and sprays a pair cutting water nozzle 35 (only illustrating) of cutting water.
A pair cutting water nozzle 35 is formed as the substantially L-shaped that the lower end, rear from cutter hood 34 forwards extends, respectively
The end of cutting water nozzle 35 is located in the substantially lower half of cutting tool 33.End at cutting water nozzle 35
It is formed with multiple seam 36 (with reference to Fig. 3), ejects cutting water from this seam 36 to the incision position of cutting tool 33.
Utilize the cutting water ejected from cutting water nozzle 35 that the incision position of cutting tool 33 is carried out and is cooled down, with
The cutting tool 33 of Shi Liyong high speed rotating and cut plate workpiece W along segmentation preset lines 63.
It addition, when being formed with cutting slot by cutting tool 33 on plate workpiece W, can be at the wall of cutting slot
Trickle cutting swarf it is attached with on face.Now, from the cutting water nozzle 35 of L-shaped to the cutting portion of cutting tool 33
Cutting water is ejected in position, and the particle diameter yet with the drop of the cutting water ejected from cutting water nozzle 35 is relatively big, because of
This is suitable to remove bigger processing bits, but is unsuitable for removing trickle cutting swarf.Additionally, from cutting water nozzle 35
The major part of the drop of the cutting water ejected will not impact the trickle cutting swarf being attached in cutting slot, and can impact
The outside of plate workpiece is flowed out in cutting tool 33 and the upper surface of plate workpiece W.
Then, in the topping machanism 1 of present embodiment, it is provided with the tabular work utilizing cutting unit 30 to cut
The cleaning unit 40 that the cutting slot of part W is carried out, with by using the mixed liquor that rinse water and pressure-air mix
2 kinds of fluids clean the cutting slot of plate workpiece W.By the jet 45 from the washer jet 41 of cleaning unit 40
(with reference to Fig. 3) injection mixed liquor, thus mixed liquor becomes the drop of spray form and sprays to cutting slot.Now, spray
Vaporific drop is by high velocity jet, thus makes cutting swarf from cutting slot by drop with trickle conflicting of cutting swarf
Wall on be stripped, thus the jet water course utilizing droplet impact to produce in the wall of cutting slot rinses out cutting
Bits.
Additionally, the abutment wall 13 in the front of cutting unit 30 is provided with in abutment wall 13 being held in chuck
The gas curtain nozzle 50 of the whole surface jet cleaning water of the plate workpiece W on platform 20.Gas curtain nozzle 50 with conduct
Extend in the Y-direction that the X-direction of the moving direction of chuck table 20 is orthogonal, and be formed as than plate workpiece W's
The long length of side.Alternately form multiple jet 51 (with reference to Fig. 3), by from multiple sprays gas curtain nozzle 50 is first-class
The rinse water of loophole 51 injection is formed with cascade.Plate workpiece W passes through in cascade, thus utilizes rinse water to clean
Plate workpiece W is overall.
By being formed at the cascade of gas curtain nozzle 50, can prevent from being cleaned by cutting swarf that nozzle 41 removes from cutting slot again
Secondary attachment.Additionally, connect rinse water supply source (the rinse water supply having as cleaning unit 40 at washer jet 41
Unit) 42 and pressure-air supply source (pressure-air feed unit) 43, and connect at gas curtain nozzle 50 and have cleaning
Water supply source 37.Washer jet 41 is supplied to rinse water from rinse water supply source 42, and supplies from pressure-air
Source 43 is supplied to pressure-air.Additionally, gas curtain nozzle 50 is supplied to rinse water from rinse water supply source 37.
It addition, in the present embodiment, spray from different 42,37 pairs of washer jets 41 of rinse water supply source and gas curtain
Mouth 50 supplies rinse water, it is also possible to from same rinse water supply source 42 to washer jet 41 and gas curtain nozzle 50
Supply rinse water.And then, abutment wall 13 is provided with the shooting for cutting unit 30 with the calibration of chuck table 20
Unit 55.The photographed images obtained by image unit 55, calibrates cutting tool 33 for segmentation preset lines 63.
This image unit 55 can be used for the washer jet 41 calibration in cutting slot (segmentation preset lines 63).Below
Narration washer jet 41 is relative to the position adjustment of cutting slot.
With reference to Fig. 3 and Fig. 4, the stock removal action of topping machanism is described.Fig. 3 is the topping machanism representing present embodiment
The figure of an example of stock removal action.Fig. 4 is that cutting slot is cleaned state by the washer jet representing present embodiment
Figure.It addition, in the present embodiment, the cleaning of stock removal action and the washer jet simultaneously implementing cutting tool is illustrated
The structure of action, it is also possible to implement the cleaning action of washer jet after the stock removal action carrying out cutting tool.
As shown in Figure 3 A and Figure 3 B, the rear portion (on the left of diagram) in the cutter hood 34 of cutting unit 30 is provided with
The washer jet 41 being connected with rinse water supply source 42 and pressure-air supply source 43 by valve 46,47.Clean
Nozzle 41 has to spray to the cutting slot 64 being cut unit 30 cutting and rinse water and pressure-air is mixed
The jet 45 of mixed liquor.Supply with from pressure-air supply source 43 from the rinse water of rinse water supply source 42 supply
Pressure-air mixing stream 48 in washer jet 41 in mix, mixed mixed liquor becomes the liquid of spray form
Drip and spray from jet 45.
In this case, control rinse water and the quantity delivered of pressure-air by valve 46,47, to adjust from injection
The particle diameter of the drops of mouth 45 injection.Such as, it is being attached to cutting swarf a diameter of of cutting slot 64 from 0.5 μm to 2 μm
In the case of, it is adjusted to 1 μm to 4 μm from the diameter of the drop of jet 45 injection.Additionally, so that clean
The center of the jet 45 of nozzle 41 is located in the blade widths to cutting tool 33 and carries out the centrage of 2 deciles
Mode on C, and washer jet 41 is installed in cutter hood 34.Therefore, by the segmentation at plate workpiece W
It is directed at the position of cutting tool 33 in preset lines 63, thus is directed at spray in segmentation preset lines 63 (cutting slot 64)
The position of loophole 45.That is, the diameter of cutting swarf it is set to be greater than from the diameter of the drop of jet 45 injection,
Conflict with cutting swarf generation at drop, when the kinetic energy of drop is more than the position energy of cutting swarf, it is possible to carry out clear efficiently
Wash.But, when drop is excessive, drop can produce with multiple cutting swarfs and conflict, and cleaning performance reduces, thus preferably liquid
Drip slightly larger than cutting swarf.
As topping machanism 1 as constructed as above, when making the face down of plate workpiece W, it is placed on
The upper surface of chuck table 20.Now, the protuberance 62 of the face side of plate workpiece W is located in the recessed of chuck table 20
Portion 23.The protuberance 62 of plate workpiece W is held in the bottom surface of the recess 23 of chuck table 20, and plate workpiece W
Remaining area A2 be held in the bearing-surface 26 of chuck table 20.Chuck table 20 maintains plate workpiece W
State under, the position alignment of topping machanism 1 is in being formed with cancellate segmentation preset lines 63 in chuck table 20
Cancellate entrance groove 24.
And, make cutting tool 33 be indexed feeding position in the Y direction by index feed unit 31
In alignment with segmentation preset lines 63, being made cutting tool 33 be moved into by lifting unit can be the most cutting plate-shaped
The height of workpiece W.Now, the position of the jet 45 of washer jet 41 also in alignment with segmentation preset lines 63, and
And make jet 45 move the height near plate workpiece W.In this condition, spray from cutting water nozzle 35
Injection cutting water, ejects mixed liquor from washer jet 41, makes chuck table 20 cutting relative to high speed rotating simultaneously
Cutting knife tool 33 and be cut feeding in the X direction.
Thus, cutting tool 33 enters the entrance groove 24 of chuck table 20 and makes plate workpiece W predetermined along segmentation
Line 63 and be cut.Thus, the rear at cutting tool 33 is formed with the cutting slot 64 along segmentation preset lines 63.
When cutting plate workpiece W, trickle cutting swarf can be attached with on the wall of cutting slot 64, and from being located in
The jet 45 of the washer jet 41 of the surface of cutting slot 64 ejects rinse water and pressure-air to cutting slot 64
Mixed liquor.Mixed liquor becomes the drop of spray form and impacts on the wall of cutting slot 64, thus from cutting slot 64
Wall on remove trickle cutting swarf.
In this case, as shown in Figure 4 A, the jet 45 of washer jet 41 is formed as wide with cutting slot 64
Spend identical.The drop 71 of spray form extends downwards from jet 45 and comes, thus jet 45 can infinite approach
Plate workpiece W, thus the drop 71 of spray form is ejected towards cutting with the some footpath roughly the same with the groove width of cutting slot 64
Cut groove 64.Thus, the momentum of drop of the spray form sprayed from the jet 45 of narrower width is strengthened to improve
Cleaning force, and the drop of spray form can spray along the wall 65 of cutting slot 64, so that drop easily impacts
The trickle cutting swarf 75 being attached on the wall 65 of cutting slot 64.
When the drop 71 of spray form has impacted trickle cutting swarf 75, by the shock wave produced in drop 71
The pressure oscillation that causes with dilatational wave and cutting swarf 75 is stripped from the wall 65 of cutting slot 64.Additionally,
When drop 71 at spray form does not impact trickle cutting swarf 75 and impacts in the wall 65 of cutting slot 64, can cut
Cut and form jet water course on the wall 65 of groove 64 and rinse out cutting swarf 75.Now, in the cutting of plate workpiece W
There is the entrance groove 24 of chuck table 20 location, lower section of groove 64, therefore, it is possible to the drop 71 of spray form from cutting slot 64
The interior mode blown off, is directed at cutting slot 64 strength from jet 45 and ejects the drop 71 of spray form.
And, as shown in Figure 4 B, make trickle cutting swarf 75 from cutting slot at the drop 71 by spray form
When being stripped on the wall 65 of 64, make cutting swarf by the current of flowing in the entrance groove 24 of chuck table 20
75 are discharged to outside.So, the drop 71 of spray form is injected into the position, cutting slot 64 local of plate workpiece W
Put place, thus remove the trickle cutting swarf 75 being attached on the wall 65 of cutting slot 64.
Return Fig. 3, in the way of crossing plate workpiece W, be provided with gas curtain nozzle 50 in the front of cutting unit 30,
Cascade is formed by the rinse water sprayed from the jet 51 of gas curtain nozzle 50.In this case, from gas curtain nozzle
50 eject rinse water to rear ramp, are therefore formed from gas curtain nozzle 50 towards rear at the back side of plate workpiece W
The current of rinse water.Utilize the current of rinse water, it is possible to effectively clean whole plate workpiece W, and can
Prevent from being cleaned by the cutting swarf that nozzle 41 removes from cutting slot 64 and be again attached to plate workpiece W.
So, the trickle cutting in the cutting slot 64 being attached to plate workpiece W is removed by washer jet 41
Consider 75 to be worth doing, and plate workpiece W entirety is carried out by the lower section of gas curtain nozzle 50 by plate workpiece W.Cause
This, in the topping machanism 1 of present embodiment, it is not necessary to carry out the rotary-cleaning to the plate workpiece W after cutting.
It addition, in the present embodiment, it is configured to there is washer jet 41 in location, the rear of cutting tool 33, is cutting
Cutting knife tool 33 has passed through the cutting slot 64 inner position washer jet 41 after plate workpiece W.For example, it is possible in cutting
Location, the side washer jet 41 of cutter 33, cleans the cutting slot 64 of adjacent lines by washer jet 41.Cleaning
In the case of the cutting slot 64 of adjacent lines, the resistance of the cutting water rearward risen at cutting tool 33 will not be subject to,
Cutting slot 64 can be cleaned well by the drop of spray form.
If it addition, the position of the jet 45 of washer jet 41 fails to be directed at cutting of plate workpiece W accurately
Cut groove 64, then cannot obtain sufficient cleaning performance.In the examples described above, the position alignment of cutting tool 33 is divided
Cut preset lines 63, thus in segmentation preset lines 63, implement the position alignment of washer jet 41, if but cleaned
Nozzle 41 produces position deviation, the then jet of washer jet 41 with the center of cutting tool 33 in index direction
45 can depart from cutting slot 64.Can be to washer jet 41 thus it is possible to be configured on cutting unit 30 setting
The guiding mechanism adjusted at index direction (Y-direction) enterprising line position relative to cutting tool 33.
Hereinafter, with reference to Fig. 5, guiding mechanism is described.Fig. 5 is an example of the adjustment action of the guiding mechanism representing variation
Figure.It addition, in Figure 5, segmentation preset lines has been calibrated cutting tool.
As shown in Figure 5A, by the guiding mechanism 49 of motor-driven in the cutter hood 34 of cutting unit 30
So that washer jet 41 can be installed in the way of index direction (Y-direction) is the most mobile.Right splitting in preset lines 63
Under the state of the position of accurate cutting tool 33, before the beginning of machining, from the jet of washer jet 41
45 spray mixed liquor to plate workpiece W point.Then, by the image unit 55 (with reference to Fig. 1) spray to mixed liquor
Point position P images, and calculates the center of specking position P and the indexing side of segmentation preset lines 63 according to photographed images
To bias Δ L.And, make washer jet 41 move according to bias Δ L by guiding mechanism 49 and make
The position alignment segmentation preset lines 63 of the jet 45 of washer jet 41.
Additionally, as shown in Figure 5 B, can be right in the adjacent lines of segmentation preset lines being positioned cutting tool 33
The position of the jet 45 of quasi-washer jet 41.In this case, as it has been described above, have cutting tool in location
After targeted by the position of jet 45 of washer jet 41 in 33 segmentation preset lines 63, made by guiding mechanism 49
Obtain washer jet 41 mobile, with the position alignment adjacent lines by the jet 45 of washer jet 41 according to 1 indexing.
It addition, 1 indexing represents the interval splitting preset lines 63.By this structure, cut by cutting tool 33
During the segmentation preset lines 63 of plate workpiece W, it is possible to cleaned the phase completing cutting by washer jet 41
The cutting slot 64 (with reference to Fig. 4) of adjacent line.It addition, be not limited to use the guiding mechanism 49 of motor-driven, it is also possible to
Use the guiding mechanism 49 of manual type.
As it has been described above, in the topping machanism 1 of present embodiment, rinse water mixes with pressure-air, so that mixed
Close liquid to become the drop 71 of spray form and spray to cutting slot 64 from jet 45.The drop 71 of spray form is injected
On the wall 65 of cutting slot 64, thus trickle cutting swarf 75 is peeled off and quilt from the wall 65 of cutting slot 64
Remove.So, by alignment cutting slot 64 rather than the drop of the surface spraying shape of alignment plate workpiece W
71, so that the drop 71 of spray form impacts the trickle cutting swarf 75 being attached in cutting slot 64, it is easy to from plate
Trickle cutting swarf 75 is removed on shape workpiece W.
It addition, the invention is not restricted to above-mentioned embodiment, it is possible to carry out various change and implement.At above-mentioned embodiment
In, the size and shape shown in accompanying drawing etc. is not limited to foregoing, it is possible to carry out in the range of effect of the present invention playing
Suitably change.Additionally, can suitably change without departing from the range of the object of the invention and implement.
Such as, in present embodiment and variation, the card of the exemplified base plate for packaging as plate workpiece W
Dish platform 20 and be illustrated, but be not limited to this structure.It is semiconductor wafer and optical device at plate workpiece W
In the case of wafer, it is possible to use there is the chuck table of the wafer of the porous surface of circle.
Additionally, in present embodiment and variation, be configured to set in the abutment wall 13 in the front of cutting unit 30
It is equipped with gas curtain nozzle 50, but is not limited to this structure.Gas curtain nozzle 50 is configured to together with chuck table 20
Mobile.Such as, gas curtain nozzle 50 is arranged on movable plate 11 in the way of adjacent with chuck table 20.By this
Kind of structure, gas curtain nozzle 50 also with together with chuck table 20 be cut feeding, therefore, it is possible to plate workpiece W normal time
Jet cleaning water.Therefore, plate workpiece W can become be dried and cutting swarf will not be attached to plate workpiece W.
Additionally, in present embodiment and variation, be configured to cutting unit 30 is provided with single washer jet
41, but it is not limited to this structure.Multiple washer jet 41 can be provided with on cutting unit 30.Additionally, not
It is limited to the structure being formed with 1 jet 45 at washer jet 41, it is also possible to form multiple spray at washer jet 41
Loophole 45.
Additionally, in present embodiment and variation, be configured to washer jet 41 and be arranged at the cutter of cutting unit 30
On cover 34, but it is not limited to this structure.As long as washer jet 41 can be relative to card together with cutting unit 30
Dish platform 20 carries out relative movement, such as, be configured to washer jet 41 and be arranged at main shaft 32.
Probability is utilized in industry
As it has been described above, the present invention possesses the effect that can remove the trickle cutting swarf being attached in cutting slot, the most right
In carrying out in the topping machanism cut being useful while cleaning the base plate for packaging of csp substrate, QFN substrate etc..
Claims (1)
1. a topping machanism, it has: chuck table, it keeps plate workpiece；Cutting unit, it is by cutting
The plate workpiece that this chuck table is kept by cutter cuts；Cutting feed unit, it makes this chuck table and this cutting list
Unit carries out relative cutting feed in the X direction；Index feed unit, it makes this chuck table and this cutting unit at Y
Relative index feed is carried out on direction；And cleaning unit, cutting slot is carried out by it, and this cutting slot is to utilize
The plate workpiece that this chuck table keeps is cut and is formed by this cutting unit, wherein,
This cutting unit has: main shaft, and it is can install this cutting tool in the way of rotating；And cutter hood, its
Make the part being installed on this cutting tool on this main shaft prominent and covered,
This cleaning unit has: washer jet, and it has jet, and this jet cuts directed through this cutting unit
This cutting slot injection mixed liquor gone out, rinse water and pressure-air are mixed by this mixed liquor；Rinse water supplies
Unit, it supplies this rinse water to this washer jet；And pressure-air feed unit, this washer jet is supplied by it
This pressure-air,
This cutting slot is cleaned by this mixed liquor sprayed from this jet of this washer jet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015037965A JP2016159376A (en) | 2015-02-27 | 2015-02-27 | Cutting device |
| JP2015-037965 | 2015-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105931990A true CN105931990A (en) | 2016-09-07 |
Family
ID=56840028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610103906.5A Pending CN105931990A (en) | 2015-02-27 | 2016-02-25 | Cutting Apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016159376A (en) |
| KR (1) | KR20160105298A (en) |
| CN (1) | CN105931990A (en) |
| TW (1) | TW201709259A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834518A (en) * | 2017-11-29 | 2019-06-04 | 株式会社迪思科 | Cutting process |
| CN110340800A (en) * | 2018-04-05 | 2019-10-18 | 株式会社迪思科 | Grinding device |
| TWI766110B (en) * | 2017-10-13 | 2022-06-01 | 日商迪思科股份有限公司 | Cutting tool cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6800520B2 (en) * | 2016-09-13 | 2020-12-16 | 株式会社ディスコ | Cutting equipment |
| JP6837859B2 (en) * | 2017-02-14 | 2021-03-03 | 株式会社ディスコ | Wafer processing method |
| JP6955971B2 (en) * | 2017-11-10 | 2021-10-27 | 株式会社ディスコ | Cleaning nozzle |
| JP7300842B2 (en) * | 2019-02-07 | 2023-06-30 | 株式会社ディスコ | Cleaning method of the object to be cleaned |
| JP6870132B1 (en) * | 2020-03-09 | 2021-05-12 | 株式会社スギノマシン | Cleaning method and washing machine for objects |
| KR102685963B1 (en) * | 2021-07-13 | 2024-07-17 | 한미반도체 주식회사 | Sawing method of semiconductor materials |
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| CN101590655A (en) * | 2008-05-28 | 2009-12-02 | 株式会社迪思科 | Topping machanism |
| CN101653971A (en) * | 2008-08-19 | 2010-02-24 | 株式会社迪思科 | A cutting apparatus |
| CN104241143A (en) * | 2013-06-18 | 2014-12-24 | 株式会社迪思科 | Cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI766110B (en) * | 2017-10-13 | 2022-06-01 | 日商迪思科股份有限公司 | Cutting tool cutting device |
| CN109834518A (en) * | 2017-11-29 | 2019-06-04 | 株式会社迪思科 | Cutting process |
| CN110340800A (en) * | 2018-04-05 | 2019-10-18 | 株式会社迪思科 | Grinding device |
| CN110340800B (en) * | 2018-04-05 | 2022-07-12 | 株式会社迪思科 | Grinding device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201709259A (en) | 2017-03-01 |
| KR20160105298A (en) | 2016-09-06 |
| JP2016159376A (en) | 2016-09-05 |
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Application publication date: 20160907 |