JP2016181569A - Method for cutting package substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately reduce burrs formed in a recess in a package substrate having the recess.SOLUTION: A cutting method for dividing a package substrate (W1) having a recess (12) formed so as to be orthogonal to a dividing schedule line(L) and having a predetermined depth, into individual chips, comprises a first cutting step for forming a cut groove (G) along the dividing schedule line at a depth being larger than that of the recess and not exceeding the thickness of the package substrate; a burr reducing step for injecting high pressure water along the cut groove; and a second cutting step for further cutting the package substrate along the cut groove to fully cut the package substrate.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a method for cutting a package substrate.

  When cutting is performed with a cutting blade along the planned division line of the plate-shaped workpiece and divided into individual chips, burrs are formed on the cut surfaces of the chips. This burr not only becomes a defect in a later process, but also causes a defect as a product, and thus is preferably removed. Therefore, in order to remove the burrs, a method has been proposed in which a cutting groove cut with a cutting blade is traced again with the cutting blade (see, for example, Patent Document 1 and Patent Document 2). In the methods described in Patent Document 1 and Patent Document 2, the cutting blade is rotated in a direction opposite to the rotating direction of the blade at the time of the first cutting process, and the previously formed cutting groove is traced by the cutting blade, so that the burr is changed. Is removed.

Japanese Patent No. 4394210 Japanese Patent No. 4540421

  By the way, a concave portion (cavity) is formed on the upper surface of a package substrate such as a QFN (Quad Flat Non-leaded package) substrate so as to intersect the planned division line. When such a package substrate is cut by the cutting blade, the recesses are divided along the division lines, and the recesses are exposed on the cut surfaces (side surfaces) of the individually divided chips. As a result, a beard-like burr is formed along the inner surface of the recess at the edge portion of the recess.

  Here, it is also conceivable to apply the cutting methods described in Patent Document 1 and Patent Document 2 to the package substrate described above. However, although the burr on the cutting groove is removed by tracing the same cutting groove with a cutting blade, there is a problem that even the burr formed along the inner surface of the recess cannot be removed properly.

  The present invention has been made in view of this point, and an object of the present invention is to provide a cutting method of a package substrate that can appropriately remove burrs formed in the recess in the package substrate having the recess.

  The cutting method of a package substrate according to the present invention is a cutting method of a package substrate in which a package substrate in which an electrode is formed in a recess having a predetermined depth across a planned division line is cut with a cutting blade along the planned division line. A holding step of holding the package substrate with the holding table, and a first step of forming a cutting groove at a depth that does not completely cut the recess by completely cutting the recess along the planned dividing line of the package substrate held by the holding table. High pressure water is injected from the high pressure water injection nozzle into the cutting groove formed in the first cutting process and the high pressure water injection nozzle and the holding table holding the package substrate are relatively extended to the line to be divided. A burr removing step for removing the burr formed in the cutting groove and the concave portion by moving in the present direction, and a first cutting step with a cutting blade after the burr removing step A second cutting step of completely cutting the cutting package substrate along the formed cut grooves, characterized in that it consists of.

  According to this configuration, after the cutting groove is formed to such an extent that the package substrate is not completely cut in the first cutting step, the high pressure water is sprayed along the cutting groove in the burr removing step, whereby the cutting groove and the recess are formed. The burrs that are formed are removed. Then, in the second cutting process, the package substrate is completely cut along the cutting grooves, whereby the package substrate is divided into individual chips. In this way, high-pressure water is sprayed along the cutting groove, and as a result, high-pressure water is also sprayed into the recess, so that even a package substrate having a recess can properly remove burrs formed in the recess. can do. In addition, since the high pressure water is injected into the cutting groove without completely cutting the package substrate, there is no need to worry about the chip falling off the holding table due to the high pressure water, and the pressure of the high pressure water is increased. A deburring process can be performed.

  Moreover, in the cutting method of the package substrate of the present invention, in the burr removing step, high pressure water is ejected from the high pressure water ejection nozzle for each side surface of the cutting groove to remove the burr.

  Further, in the cutting method of the package substrate of the present invention, after the work set forming step of attaching the adhesive tape to the annular frame and attaching the package substrate to the adhesive tape in the center opening of the annular frame to form the work set. The holding table holds the package substrate via the adhesive tape.

  According to the present invention, the high-pressure water is sprayed along the cutting groove, whereby the burr formed in the recess can be appropriately removed in the package substrate having the recess.

It is a mimetic diagram of a cutting device concerning this embodiment. It is a figure which shows an example of the work set formation process of the package board | substrate which concerns on this Embodiment. It is a figure which shows an example of the holding process which concerns on this Embodiment. It is a figure which shows an example of the 1st cutting process which concerns on this Embodiment. It is a figure which shows an example of the burr | flash removal process which concerns on this Embodiment. It is a figure which shows an example of the 2nd cutting process which concerns on this Embodiment.

  Hereinafter, with reference to the accompanying drawings, a cutting apparatus used in the cutting method of the package substrate according to the present embodiment will be described. FIG. 1 is a schematic diagram of a cutting apparatus according to the present embodiment. FIG. 1A shows a perspective view of a cutting apparatus according to the present embodiment, and FIG. 1B is a partially enlarged view of a package substrate according to the present embodiment. Note that the cutting apparatus according to the present embodiment is not limited to the configuration shown in FIG. The present invention is applicable to any cutting device as long as it can cut the package substrate.

  As shown in FIG. 1, the cutting apparatus 1 divides the package substrate W1 held on the holding table 3 into individual chips C (see FIG. 6) by moving the holding table 3 relative to the cutting means 2. Is configured to do. Further, the cutting device 1 is configured to remove burrs formed around the cutting groove by injecting high-pressure water from the high-pressure water injection nozzle 4 toward the cutting groove formed in the package substrate W1. Yes.

  The package substrate W1 according to the present embodiment is a package substrate W1 such as a CSP (Chip Size Package), a QFN (Quad Flat Non-leaded Package), etc., and a plurality of semiconductor chips in which circuits such as IC and LSI are built. Are arranged and sealed with a mold resin or the like to form a substantially rectangular plate. More specifically, the package substrate W1 includes a plurality of (two in FIG. 1) resin convex portions 11 arranged in the longitudinal direction on the surface of a rectangular resin substrate 10 formed of a PCB substrate or the like. Is done. Further, the package substrate W1 is divided into a plurality of device regions for semiconductor devices formed on the convex portion 11 and a surplus region around the device region.

  Each device region is divided into a plurality of regions by grid-like division lines L, and semiconductor devices (not shown) are arranged in each region. Further, as shown in FIG. 1B, a concave portion 12 (cavity) having a predetermined depth is formed on the surface of the device region (convex portion 11) across the planned division line L (not shown in FIG. 1A). (Illustrated). The concave portion 12 has an elongated hole shape extending in a direction orthogonal to the planned division line L, and the center line in the short direction of the concave portion 12 and the planned division line L are orthogonal to each other. For example, the recess 12 is formed to have a predetermined depth with a width of 400 μm in the longitudinal direction and a width of 100 μm in the short direction.

  The package substrate W1 is attached to the annular frame F via a circular adhesive tape T to form one work set W. In this package substrate W1 (work set W), the surplus region is removed as an end material, and the device region is divided into individual chips along the division line L. The package substrate W1 is not limited to a semiconductor device substrate, but may be a metal substrate for an LED device. Further, the substrate is not limited to the substrate after mounting the chip, but may be a substrate before mounting the chip. The convex portion 11 of the package substrate W1 is formed of, for example, an epoxy resin or a silicone resin, but any resin may be used as long as the convex portion 11 can be formed on the resin substrate 10.

  The holding table 3 is formed in a circular shape, and a holding surface is formed on the surface by a porous ceramic material. The package substrate W1 is sucked and held by the negative pressure generated on the holding surface. Around the holding table 3, four air-driven clamp portions 30 are provided, and the annular frame F around the package substrate W1 is sandwiched and fixed by each clamp portion 30. The holding table 3 is configured to be rotatable by a rotating means (not shown), and is movable in the X-axis direction (cutting feed direction) by a ball screw type moving means (not shown).

  The cutting means 2 is provided above the holding table 3 and is configured by attaching a cutting blade 21 to the tip of the spindle 20. By cutting the package substrate W1 by cutting the cutting blade 21 from the surface of the package substrate W1, a cutting groove having a width corresponding to the thickness of the cutting blade 21 is formed in the package substrate W1. The cutting means 2 is configured to be indexed and fed in the Y-axis direction by an index feed means (not shown), and is configured to be movable in the Z-axis direction by an elevating means (not shown).

  The high-pressure water injection nozzle 4 is constituted by, for example, a water jet nozzle used for a water jet saw, and is fixed to the cutting means 2 by a fixing portion (not shown). Thereby, the high pressure water injection nozzle 4 is configured to be movable integrally with the cutting means 2. The high-pressure water injection nozzle 4 has a cylindrical shape extending in the vertical direction, and an injection port (not shown) for injecting high-pressure water toward the package substrate W1 is formed at the lower end.

  The injection port communicates with a flow path (not shown) formed inside the high pressure water injection nozzle 4, and a high pressure water supply source (not shown) is connected to the flow path via a pipe 40. Yes. The high-pressure water supply source supplies high-pressure water whose pressure has been increased by a compressor (not shown) to the high-pressure water injection nozzle 4. The injection port is formed larger than the width of the recess 12 and has, for example, an outer diameter of 300 μm. In addition, it is preferable that the pressure of the high pressure water injected from the high pressure water injection nozzle 4 is adjusted to such an extent that the recess 12 of the package substrate W1 is not destroyed.

  By the way, as described above, the concave portion 12 (cavity) is formed on the surface of the convex portion 11 of the package substrate W <b> 1 to be processed so as to intersect on the planned division line L. An electrode is formed in the recess 12 after the package substrate W1 is divided into individual chips, and the electrode functions as a recess electrode serving as a connection terminal with a circuit formed in the chip. When the package substrate W1 is cut along the planned division line L and divided into individual chips, the concave portion 12 is divided along the planned division line L, and the concave portion 12 is exposed on the cut surface (side surface) of the chip. . At this time, burrs are formed at the edge portion of the recess 12 along the inner surface of the recess 12 (see FIG. 4). As described above, since the electrode is formed in the recess 12 in the subsequent manufacturing process, if the manufacturing process proceeds with the burr formed, the electrode cannot be appropriately formed. For this reason, it is preferable that the burr | flash of the recessed part 12 periphery is removed.

  Here, in order to remove burrs, it is conceivable that the rotation direction of the cutting blade 21 is opposite to that at the time of cutting, and the previously cut cutting groove is traced again, but it is formed along the inner surface of the recess 12. It is not possible to remove the burrs. In addition, it is conceivable to wash away burrs by spraying washing water from above the chips after the division, but the chips may fall off the holding table 3 (adhesive tape T) due to the force of the washing water, and the burrs are sufficiently removed. There is a problem that it cannot be removed.

  Therefore, in the cutting method of the package substrate W1 according to the present embodiment, the cutting groove is formed to such an extent that the package substrate W1 is not completely cut in the first cutting process, and high-pressure water is jetted along the cutting groove in the burr removing process. After that, the package substrate W1 is completely cut in the second cutting step. Thereby, in the burr removing process, since the high-pressure water is injected into the cutting groove in a state where the package substrate W1 is not completely cut, it is necessary to be concerned about the chip being dropped from the holding table 3 (adhesive tape T) by the high-pressure water. There is no. As a result, unlike a generally used high-pressure water washing nozzle (for example, water pressure is 1 MPa), a higher-pressure type water jet nozzle (for example, water pressure is 20 to 60 MPa) can be used. It is possible to appropriately remove the burrs around the cutting groove and the recess 12 in the raised state.

  Next, a method for cutting the package substrate according to the present embodiment will be described with reference to FIGS. FIG. 2 is a diagram illustrating an example of a work set forming process of the package substrate according to the present embodiment. FIG. 3 is a diagram illustrating an example of a holding process according to the present embodiment. FIG. 4 is a diagram illustrating an example of a first cutting process according to the present embodiment. 4A is a side view of the first cutting process, FIG. 4B is a partially enlarged view of a top view of the first cutting process, and FIG. 4C is a cross-sectional view taken along line AA of FIG. 4B. FIG. 5 is a diagram illustrating an example of a burr removing process according to the present embodiment. 5A is a side view of the deburring process, FIG. 5B is a partially enlarged view of a top view of the deburring process, and FIG. 5C is a partial perspective view of the deburring process. FIG. 6 is a diagram illustrating an example of a second cutting process according to the present embodiment. 6A is a side view of the second cutting process, and FIG. 6B is a partial perspective view of the package substrate after division and an enlarged view of the chip. Note that the cutting method of the package substrate according to the present embodiment is not limited to the configuration described below, and can be changed as appropriate.

  The package substrate cutting method according to the present embodiment includes a work set forming process (see FIG. 2), a holding process (see FIG. 3), a first cutting process (see FIG. 4), and a burr removing process (see FIG. 5) and the second cutting step (see FIG. 6) are performed in this order, so that the package substrate W1 is divided into individual chips C.

  In the work set forming step, the work set W is formed by attaching the package substrate W1 to the annular frame F via the adhesive tape T. In the holding step, the work set W (package substrate W1) is held on the holding table 3. In the first cutting process, the package substrate W1 is cut along the division line L, and the cutting groove G is formed with a predetermined depth. In the deburring process, high-pressure water is jetted along the cutting groove G. In the second cutting step, cutting is performed along the cutting groove G until the package substrate W1 is completely cut. Hereinafter, each process of the cutting method of the package substrate W1 will be described.

  First, a work set forming process is performed. As shown in FIG. 2, in the work set forming process, an adhesive tape T with an adhesive surface facing upward is attached to the lower surface of the annular frame F. Then, the package substrate W1 is stuck on the adhesive tape T in the center opening of the annular frame F. Thereby, one work set W in which the annular frame F, the adhesive tape T, and the package substrate W1 are integrated is formed.

  Next, a holding process is performed. As shown in FIG. 3, in the holding step, the work set W is placed on the holding table 3 so that the package substrate W1 is positioned at the center of the holding table 3 by a conveyance unit (not shown). The annular frame F around the package substrate W1 is sandwiched and fixed by the clamp portions 30 and the package substrate W1 is sucked and held on the holding table 3 via the adhesive tape T by the negative pressure generated on the holding surface.

  Next, a 1st cutting process is implemented. As shown in FIG. 4A, in the first cutting process, the holding table 3 is rotated in a state where the package substrate W1 is held by the holding table 3, and the dividing line L of the package substrate W1 and the cutting feed of the holding table 3 are cut. The direction (X-axis direction) is adjusted in parallel. Then, the cutting means 2 is indexed and fed in the Y-axis direction, and the position of the cutting means 2 is adjusted so that the cutting blade 21 is positioned on the division line L of the package substrate W1.

  Next, the cutting means 2 is moved in the Z-axis direction by an elevating means (not shown), and the cutting blade 21 is lowered to a height at which the recess 12 can be completely cut and the package substrate W1 is not completely cut. Then, while the cutting water is supplied to the cutting blade 21 and the processing position, the holding table 3 is moved (cutting feed) in the X-axis direction with respect to the cutting blade 21 that rotates at a high speed. Thereby, the package substrate W1 is cut (half cut) along the planned division line L, and the cutting groove G along the planned division line L is formed in the package substrate W1 with a predetermined kerf width (for example, 300 μm). . At this time, the cutting groove G is formed with a depth D2 larger than the depth D1 of the recess 12 and not exceeding the thickness T1 of the package substrate W1 (see FIG. 4C).

  As a result of the formation of the cutting groove G, as shown in FIG. 4B, the concave portion 12 is divided into a semicircular shape when viewed from above by the cutting groove G, and the concave portion 12 is exposed on the cut surfaces 13a and 13b of the package substrate W1. At this time, a plurality of burrs B are formed on the cut surfaces 13a and 13b (particularly the edge portions of the recess 12). The burr B extends in the cutting feed direction of the cutting blade 21 with respect to the holding table 3 (the traveling direction of the cutting blade 21). More specifically, the burr B is formed so as to be wound along the inner surface of the concave portion 12 with the edge portion of the concave portion 12 on the front side in the cutting feed direction as a base end, and has a shape spirally swirled. ing.

  In FIG. 4, the recess 12 has a depth of about one third of the thickness of the package substrate W1, but the present invention is not limited to this configuration. The depth of the recess 12 can be appropriately changed according to the shape of the electrode formed in a later manufacturing process. Further, in the first cutting step, it is only necessary that the package substrate W1 can be half-cut (the cutting groove G is formed) at a depth D2 at which the recess 12 can be completely cut.

  When the cutting of the division line L in one row is completed, the cutting means 2 is indexed and fed in the Y-axis direction, and the cutting blade 21 is positioned on the adjacent division line L. Then, cutting is performed along the new division line L. This operation is performed along all the planned division lines L in one direction (longitudinal direction). As a result, a cutting groove G having a predetermined depth along the planned division line L in the longitudinal direction is formed.

  Next, a burr removal process is performed. As shown in FIG. 5, in the deburring process, the cutting means 2 (see FIG. 1) Y is positioned so that the tip of the high-pressure water spray nozzle 4 is positioned above the cutting groove G formed in the first cutting process. Axial alignment is performed (see FIG. 5A). More specifically, as shown in FIG. 5B, the high-pressure water injection nozzle 4 is positioned above one recess 12 side (right side) of the recesses 12 divided into the left and right in the first cutting step.

  At this time, as shown in FIG. 5B, the top surface of the package substrate W1 is on a straight line 14 that connects the side surface positions of the respective recesses 12 having the largest recess amount in the longitudinal direction of the recess 12 (short direction of the package substrate W1). The center of the high-pressure water injection nozzle 4 is positioned (see the two-dot chain line in FIG. 5B). That is, the center of the high-pressure water injection nozzle 4 is positioned on a straight line 14 that connects the side surfaces of the recesses 12 that are separated from the cut surface 13a by a distance X1 (for example, 50 μm).

  The holding table 3 is cut and fed while jetting high-pressure water vertically from the tip of the high-pressure water jet nozzle 4 toward the upper surface of the package substrate W1, so that the high-pressure water jet nozzle 4 and the package substrate W1 are in a straight line 14. Are moved relative to each other. In the burr removal process, the high pressure water injection nozzle 4 is cut and fed so that the traveling direction of the high pressure water jet nozzle 4 is opposite to the traveling direction of the cutting blade 21 in the first cutting process. At this time, the high-pressure water ejected from the high-pressure water spray nozzle 4 needs to have a pressure that does not damage the upper surface of the package substrate W1 and a pressure that can remove the burrs B formed in the recesses 12.

  When the high-pressure water spray nozzle 4 is not located directly above the recess 12, the high-pressure water is sprayed on the upper surface of the package substrate W1 (projection 11). On the other hand, when the high-pressure water spray nozzle 4 is positioned directly above the recess 12, the high-pressure water is sprayed linearly toward the vicinity of the apex position of the semicircular portion of the recess 12 when viewed from above. The high-pressure water sprayed on the recess 12 collides with the bottom surface or inner surface of the recess 12 and flows toward the cutting groove G along the bottom surface or inner surface of the recess 12 while bouncing back. At this time, since the high-pressure water injection nozzle 4 is cut and fed in the direction opposite to the direction in which the burrs B are formed (the traveling direction of the cutting blade 21 during the first cutting process), the high-pressure water flows along the inner surface of the recess 12. Therefore, it is easy to flow from the front end of the burr B toward the base end. Thereby, the burr B can be moved from the recess 12 toward the cutting groove G while removing the burr B with high-pressure water.

  When the high-pressure water spray nozzle 4 is relatively cut and fed to the end of the package substrate W1, the high-pressure water spray nozzle 4 (cutting means 2) is indexed and fed in the Y-axis direction so that the center of the high-pressure water spray nozzle 4 is It is aligned on a straight line passing through the bottom surface of the concave portion 12 that is semicircular in top view. More specifically, the center of the high-pressure water injection nozzle 4 is positioned on a straight line 15 between the cut surface 13a and the straight line 14 and separated from the cut surface 13a by a distance X2 (see FIG. 5B). The straight line 15 is preferably, for example, a straight line that connects the centers of gravity of the concave portions 12 that are semicircular when viewed from above.

  The holding table 3 cuts in the direction opposite to the traveling direction of the cutting blade 21 during the first cutting process while high-pressure water is jetted vertically from the tip of the high-pressure water jet nozzle 4 toward the upper surface of the package substrate W1. Sent. As described above, when the high-pressure water injection nozzle 4 is located directly above the recess 12, the high-pressure water is injected linearly into the semicircular portion of the recess 12 when viewed from above. The high-pressure water sprayed into the recess 12 collides with the bottom surface or inner surface of the recess 12 and flows toward the cutting groove G along the bottom surface or inner surface of the recess 12 while rebounding.

  Further, by relatively moving the center of the high-pressure water jet nozzle 4 on a straight line 15 connecting the centers of gravity of the recesses 12, the high-pressure water is concentrated on the tip of the burr B instead of the base end of the burr B spiraling. Can be injected. When the high-pressure water collides with the tip of the burr B, the burr B is acted on by the lever force with the base end as a fulcrum, and the burr B is easily separated from the recess 12. The burr B can be easily separated from the recess 12 by the high-pressure water flowing along the inner side surface of the recess 12 toward the base end of the burr B in an arc shape when viewed from above. In this way, high-pressure water can be effectively removed while destroying the burrs B by intensively jetting (striking) the high-pressure water toward the burrs B one by one (cut surface 13a) of the cutting groove G. Become. After the burrs B are removed from the recesses 12, they flow into the cutting grooves G together with high-pressure water and are washed away from the package substrate W1.

  After the package substrate W1 is cut and fed while spraying high-pressure water onto one side surface (cut surface 13a) of the cutting groove G, the cutting means 2 (high-pressure water spray nozzle) is approximately the length of the concave portion 12 in the longitudinal direction. 4) is indexed and fed again, and the package substrate W1 is cut and fed while spraying high-pressure water into the cutting groove G again. As a result, the burrs B are also removed from the other side surface (cut surface 13b) of the cutting groove G. As a result, a burr removing step is performed on both side surfaces (both cut surfaces 13a, 13b) of the row of cutting grooves G. The Then, the cutting means 2 (high-pressure water injection nozzle 4) is indexed and fed by the pitch of the planned division line L, and high-pressure water injection and cutting feed are repeated for the adjacent division planned line L. As a result, the deburring process is performed on all the division lines L in the longitudinal direction of the package substrate W1.

  Next, a second cutting process is performed. As shown in FIG. 6, in the second cutting step, the cutting groove G after the burr B is removed is cut again to a depth at which the package substrate W1 is divided. Specifically, the cutting blade 21 is aligned in the Y-axis direction with respect to the above-described cutting groove G, and the cutting blade 21 is lowered to a height at which it can be cut halfway through the thickness of the adhesive tape T. Then, the holding table 3 (package substrate W1) is cut and fed, whereby the package substrate W1 is further cut and the depth of the cutting groove G is expanded, so that the package substrate W1 is divided.

  As described above, in the first cutting process, the cutting groove G is formed at a depth D2 larger than the depth D1 of the recess 12, and the burr B formed in the recess 12 is removed in the burr removing process. For this reason, even if the cutting groove G is cut again in the second cutting step and the depth is expanded, a new burr B is not formed in the recess 12. Then, the cutting means 2 is indexed and fed by the pitch of the planned division line L, and the cutting feed of the holding table 3 with respect to the cutting blade 21 is repeated also for the adjacent division planned line L, whereby the package substrate W1. The package substrate W1 is divided along all the division lines L in the longitudinal direction.

  After the second cutting process is finished, the holding table 3 is rotated by 90 °, and all the planned dividing lines L in the short direction of the package substrate W1 are also packaged at a depth that cuts in the middle of the thickness of the adhesive tape T. By cutting the substrate W1, the package substrate W1 can be divided into individual chips C as shown in FIG. 6B.

  As described above, according to the method for cutting the package substrate W1 according to the present embodiment, after the cutting groove G is formed to the extent that the package substrate W1 is not completely cut in the first cutting step, the cutting is performed in the burr removing step. By spraying high-pressure water along the groove G, the burrs B formed in the cutting groove G and the recess 12 are removed. Then, the package substrate W1 is completely cut along the cutting grooves G in the second cutting step, whereby the package substrate W1 is divided into individual chips C. As described above, the high-pressure water is sprayed along the cutting groove G, so that the high-pressure water is also sprayed into the recess 12. As a result, even the package substrate W1 having the recess 12 is formed in the recess 12. The burr B can be appropriately removed. Further, since the high-pressure water is injected into the cutting groove G in a state where the package substrate W1 is not completely cut, there is no need to worry about the chip dropping off from the holding table 3 due to the high-pressure water, and the pressure of the high-pressure water is further increased. In this state, the burr removal process can be performed.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the concave portion 12 is formed in the shape of a long hole when viewed from above, but is not limited to this configuration. For example, the recess 12 may be formed in a rectangular shape in a top view.

  In the above-described embodiment, the high-pressure water injection nozzle 4 (injection port) has an outer diameter larger than the width of the concave portion 12 in the short direction, but is not limited to this configuration. The outer diameter of the high-pressure water spray nozzle 4 may be equal to the width of the recess 12 in the short direction, or may be smaller than the width of the recess 12 in the short direction.

  In the above-described embodiment, in the burr removing step, the high pressure water nozzle 4 is relatively cut and fed along the straight line 14 and then relatively cut and fed along the straight line 15. It is not limited to. In the deburring process, the high pressure water nozzle 4 may be relatively cut and fed along the straight line 14 after being relatively cut and fed along the straight line 15. In this case, after removing the burrs B while effectively destroying them, the burrs B can be washed cleanly from the inner surface of the recess 12.

  In the above-described embodiment, the cutting is performed along the planned division line L in the short direction after cutting along the planned division line L in the longitudinal direction of the package substrate W1. It is not limited. It is good also as a structure which cuts along the dividing line L of the transversal direction previously.

  As described above, the present invention has an effect that a burr formed in a recess can be appropriately removed in a package substrate having a recess, and in particular, a QFN (Quad Flat Non-leaded package) substrate. It is useful for a cutting method for cutting a package substrate.

W Work set W1 Package substrate L Scheduled division line G Cutting groove B Burr F Ring frame T Adhesive tape 12 Recess 13a, 13b Cut surface (one side)
21 Cutting blade 3 Holding table 4 High pressure water injection nozzle

Claims (3)

A method for cutting a package substrate, in which a package substrate, in which an electrode is formed in a recess having a predetermined depth across the planned division line, is cut with a cutting blade along the predetermined division line,
A holding step for holding the package substrate on a holding table;
A first cutting step in which the recess is completely cut along the division line of the package substrate held by the holding table to form a cutting groove at a depth that does not completely cut the package substrate;
High-pressure water is injected from the high-pressure water injection nozzle into the cutting groove formed in the first cutting process, and the high-pressure water injection nozzle and the holding table for holding the package substrate are relatively extended in the division line. A burr removing step for removing the burr formed in the cutting groove and the concave portion by moving in a present direction;
A package substrate cutting method comprising: a second cutting step of cutting the package substrate completely by cutting along the cutting grooves formed in the first cutting step by the cutting blade after the burr removing step.   The package substrate cutting method according to claim 1, wherein in the burr removing step, high pressure water is jetted from the high pressure water jet nozzle for each side surface of the cutting groove to remove the burr.   The holding table is packaged via the adhesive tape after the work set forming step in which an adhesive tape is attached to the annular frame and a package substrate is attached to the adhesive tape in the center opening of the annular frame to form a work set. 3. The package substrate cutting method according to claim 1, wherein the holding step of holding the substrate is performed.

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