JP2006187834A - Cutting equipment - Google Patents

Abstract

Kind Code: A1 The present invention prevents contamination of a workpiece by making it possible to completely eliminate cutting waste generated by cutting the workpiece.
In a cutting means with a cutting blade attached to the tip of a spindle, cleaning water is ejected from a washing water ejection portion by high-pressure air to form a cutting groove formed in a workpiece. By providing the two-fluid cleaning means 99 for cleaning the region to be included and the water flow forming means 100 for forcibly flowing away the accumulated cutting water to the side where the cutting water is scattered due to the rotation of the cutting blade 80, the cutting water To improve the quality of the workpiece.
[Selection] Figure 3

Description

  The present invention relates to a cutting apparatus that performs cutting while supplying cutting water to a workpiece.

  In a semiconductor device manufacturing process, an integrated circuit such as an IC or LSI is formed in a rectangular area defined by streets formed in a lattice shape on a substantially circular wafer surface. And by cutting a street using a cutting device, it divides | segments into the device for every integrated circuit, and each device is utilized for various electronic devices.

  In a cutting device, cutting is performed by cutting a high-speed rotating cutting blade into the street and dividing into individual devices. Therefore, heat generated by friction is generated at a portion where the cutting blade and the wafer are in contact with each other, and this heat is generated. This may cause a decrease in cutting quality or wear of the cutting blade portion of the cutting blade. Therefore, in the cutting apparatus, a nozzle that ejects cutting water is provided in the vicinity of the contact portion where the cutting blade and the wafer come into contact, and the contact portion is cooled by the cutting water ejected from the nozzle. .

  However, cutting scraps are generated when the cutting blade that rotates at high speed cuts the streets of the wafer, so that the cutting scraps are mixed with the cutting water to become muddy water, and the cutting water stays on the wafer surface. There is a problem of being contaminated.

  Thus, cleaning water and cutting waste are removed by jetting cleaning water onto the wafer surface. For example, a technique has been proposed in which cutting is performed while using a nozzle from which cleaning water is ejected by high-pressure air and removing the remaining cutting water by spraying the cleaning water from the nozzle (see, for example, Patent Document 1).

JP 2000-306878 A

  However, even if the cleaning water accelerated by the high-pressure air is jetted onto the wafer surface, the cutting waste may not be completely eliminated, and the cleaning effect is not sufficient. On the other hand, in a device that does not allow slight contamination, such as a CCD device, it is necessary to completely remove cutting waste.

  Therefore, the problem to be solved by the present invention is to prevent the workpiece from being contaminated by completely eliminating the cutting waste generated by cutting the workpiece.

  The present invention relates to a chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, a cutting feed means for cutting and feeding the chuck table relative to the cutting means, and a cutting The present invention relates to a cutting apparatus comprising at least indexing and feeding means for indexing and feeding means relative to the chuck table. The cutting means includes a spindle, a spindle housing that rotatably supports the spindle, and a tip of the spindle. A cutting blade to be mounted; a cutting water supply nozzle that supplies cutting water to the cutting blade; a blade cover that is fixed to the spindle housing and covers the cutting blade; Two-fluid cleaning hand that cleans the area including the cutting groove formed on the workpiece by jetting If, cutting water cutting water staying by ejection of cutting water due to the rotation of the cutting blade and a leaving water flow forming means forcibly flowed in side scatter.

  The cleaning water ejection part is composed of a first cleaning water nozzle disposed on one surface side of the cutting blade and a second cleaning water nozzle disposed on the other surface side of the cutting blade. Is desirable. In this case, it is desirable that the two-fluid cleaning unit includes a selection unit that selects so that the cleaning water is ejected from only one of the first cleaning water nozzle and the second cleaning water nozzle.

  It is desirable that the washing water jetting part is disposed on the side opposite to the side where the cutting water is scattered due to the cutting by the cutting blade.

  In the cutting device according to the present invention, the two-fluid cleaning means for cleaning the region including the cutting groove formed in the workpiece by jetting the cleaning water from the cleaning water jetting portion with the high-pressure air and the cutting water stayed by the jetting of the cutting water By providing the water flow forming means for forcibly flowing the cutting water to the side where the cutting water is scattered due to the rotation of the cutting blade, the cutting waste is reliably removed and the quality of the workpiece is improved.

  Further, the cleaning water jetting part is composed of a first cleaning water nozzle disposed on one surface side of the cutting blade and a second cleaning water nozzle disposed on the other surface side of the cutting blade. In the case where the cutting means is indexed and fed in any direction at the time of cutting, the cleaning water can be jetted into the cutting groove formed by the cutting. Furthermore, in the case where selection means for selecting so that the cleaning water is ejected from only one of the first cleaning water nozzle and the second cleaning water nozzle is provided, either one is selected according to the direction of index feed. Since cleaning water can be ejected only from the cleaning water nozzle, the amount of cleaning water used can be minimized.

  When the cleaning water jetting part is arranged on the side opposite to the side where the cutting water scatters due to cutting by the cutting blade, the cutting groove should be smoothly cleaned without being affected by the scattered cutting water. Can do.

  A cutting apparatus 1 shown in FIG. 1 is an apparatus for cutting various plate-like objects. For example, when dicing a wafer W, a plurality of wafers W held on a frame F via a holding tape T are stored in a cassette 2. Be contained. As shown in FIG. 2, there are a plurality of streets S arranged in a lattice at predetermined intervals on the surface of the wafer W, and circuit patterns are applied to a number of rectangular areas partitioned by the streets S. ing. Then, by cutting the street S, the device D for each rectangular area is obtained.

  Returning to FIG. 1 and continuing the description, when the wafer W is accommodated in the cassette 2 in a state of being integrated with the frame F, the loading / unloading means 3 moves in the + Y direction to sandwich the frame F, and the −Y direction. The wafer W is placed in the temporary placement region 4 by releasing the clamping after moving to.

  The wafer W placed in the temporary placement region 4 is sucked by the suction unit 50 that constitutes the transfer unit 5, and the suction unit 50 rotates to be positioned immediately above the chuck table 6. Then, the suction unit 50 is lowered and the wafer W is placed on the chuck table 6 and is held on the chuck table 6 by releasing the suction.

  The chuck table 6 is rotatable and movable in the X-axis direction, and an alignment means 7 is disposed above the movement path in the X-axis direction. The alignment unit 7 includes an imaging unit 70 that can move in the Y-axis direction. The surface of the wafer W is imaged in advance by moving the chuck table 6 in the + X direction and moving the imaging unit 70 in the Y-axis direction. A street to be cut can be detected by performing a pattern matching process between the key pattern image stored in the memory and the captured image.

  The cutting means 8 provided with the rotating blade 80 is formed integrally with the imaging unit 70 and is movable in the Y-axis direction together with the imaging unit 70. Further, since the rotary blade 80 has the same Y coordinate as that of the imaging unit 70 and both are located on a straight line in the X-axis direction, when the street to be cut is detected by the alignment means 7, the street and the rotary blade 80 Is automatically aligned in the Y-axis direction. Then, the chuck table 6 holding the wafer W further moves in the + X direction, the cutting means 8 descends while the rotating blade 80 rotates at a high speed, and cuts into the detected street, whereby the street is cut.

  Further, when the chuck table 6 is reciprocated in the X-axis direction and cutting is performed while the cutting means 8 is indexed and fed in the Y-axis direction at intervals of streets, all streets in the same direction are cut. Further, when the chuck table 6 is rotated 90 degrees and then cut in the same manner as described above, all the streets are cut and diced and divided into individual semiconductor chips.

  As shown in FIG. 3, the chuck table 6 is movable in the X-axis direction by the cutting feed means 60, and is thereby cut and fed relative to the cutting means 8. Further, the cutting means 80 can be moved in the Y-axis direction by the index feeding means 81, and is thereby indexed and fed relative to the chuck table 6.

  The cutting blade 80 is attached to the tip of a spindle 83 that is rotatably supported by a spindle housing 82, and the cutting blade 80 supplies cutting water to the cutting blade 80 on the + Y direction side and the −Y direction side. Water supply nozzles 84a and 84b are disposed (in FIG. 3, only the cutting water supply nozzle 84a on the + Y direction side is shown. In FIG. 4, the cutting water supply nozzle 84b is also shown). The cutting blade 80 is covered from above by a blade cover 85 fixed to the spindle housing 82, and cutting water inlets 86 a and 86 b communicating with the cutting water supply nozzles 84 a and 84 b are provided on the upper portion of the blade cover 85, respectively. It has been. The cutting water inlets 86a and 86b communicate with the cutting water supply source 87 through a valve 86c.

  On the side of the blade cover 85, a cleaning water ejection portion 88 for ejecting cleaning water is disposed. In the illustrated example, the cleaning water ejection portion 88 is disposed on the side opposite to the side where the cutting water scatters due to the rotation of the cutting blade 80, and is disposed on one surface side of the cutting blade 80. The first cleaning water nozzle 88 a and the second cleaning water nozzle 88 b disposed on the other surface side of the cutting blade 80 are configured. The first washing water nozzle 88a includes a first high-pressure air inlet 89a and a first washing water inlet 90a. Similarly, the second washing water nozzle 88b has a second high-pressure air flow. An inlet 89b and a second washing water inlet 90b are provided.

  The first high-pressure air inlet 89a is connected to the high-pressure air supply source 92 via the first air flow passage 91a and the valve 91, and the second high-pressure air inlet 89b is connected to the second air flow passage 91b and A high-pressure air supply source 92 is connected via a valve 91. In the middle of the first air flow passage 91a and the second air flow passage 91b, a first switching portion 93 that connects or blocks each air flow passage is disposed. The first washing water inlet 90a is connected to the washing water supply source 96 via the first washing water flow passage 94a and the valve 95, and the second washing water inlet 90b is connected to the second washing water flow passage 94b and The cleaning water supply source 96 is connected via a valve 95. In the middle of the first wash water flow passage 94a and the second wash water flow passage 94b, a second switching portion 97 for connecting or blocking each wash water flow passage is disposed. The first switching unit 93 and the second switching unit 97 constitute a selection unit 98, and the two-fluid cleaning unit 99 includes the cleaning water ejection unit 88, the selection unit 98, the high-pressure air supply source 92, and the cleaning water supply source 96. Configure.

  When the first air flow passage 91a is opened by the first switching unit 93, the high pressure air supply source 92 and the first high pressure air inflow port 89a communicate with each other, and the high pressure air supply source 92 and the second air flow source 92 are in communication with each other. Is disconnected from the high-pressure air inlet 89b. On the other hand, when the second air flow passage 91b is opened, the high-pressure air supply source 92 and the second high-pressure air inlet 89b communicate with each other, and the high-pressure air supply source 92 and the first high-pressure air inlet 92 The connection with 89a is interrupted. Similarly, when the first washing water flow passage 94a is opened by the second switching unit 97, the washing water supply source 96 and the first washing water inlet 90a communicate with each other. The second washing water inlet 90b is blocked. On the other hand, when the second washing water flow passage 94b is opened, the washing water supply source 96 and the second washing water inlet 90b communicate with each other, and the washing water supply source 96 and the first washing water inlet 90a Is blocked. The first switching unit 93 and the second switching unit 97 are preferably interlocked, but each may be operated independently.

  Below the blade cover 85, in the illustrated example, a water flow forming means 100 that is long in the axial direction of the spindle 83 is disposed. The water flow forming means 100 communicates with the cutting water supply source 87 via the valve 86c, and can eject the cutting water supplied from the cutting water supply source 87 in the + X direction. That is, the accumulated cutting water can be forced to flow away to the side where the cutting water scatters due to the rotation of the cutting blade 80.

  When the street S of the wafer W is cut, the chuck table 6 holding the wafer W is cut and fed in the + X direction by the cutting feed means 60 and the cutting blade 80 cuts into the street S while rotating at high speed. In order to cool the blade 80 and the wafer W, cutting water is ejected from the cutting water supply nozzles 84a and 84b. Then, the cutting water is mixed with cutting waste generated by cutting and becomes muddy water. Therefore, in order to prevent the cutting water from becoming muddy water from staying and preventing the wafer W from being contaminated, the cutting water is ejected from the water flow forming means 100 to forcibly remove the cutting water.

  When cutting is performed while the cutting means 8 is indexed and fed in the + Y direction, as shown in FIG. 3, cutting is performed from the street on the −Y direction side to form a cutting groove G. Also, cleaning water is ejected from the second cleaning water nozzle 88b on the −Y direction side. By doing so, cleaning water is ejected into the cutting groove G formed by cutting, and the cutting waste adhering to the cutting groove G is removed.

  On the other hand, when the cutting means 8 is indexed and fed in the -Y direction, cutting is performed from the street on the + Y direction side to form a cutting groove, so that the first cleaning on the + Y direction side from the cutting blade 80 is performed. Washing water is ejected from the water nozzle 88a, and the cutting waste adhering to the cutting groove is removed.

  For example, in the example of FIG. 3, the first switching unit 93 and the second switching unit 98 are configured to be interlocked, and the first air flow passage 91 a is blocked in the first switching unit 93. The second air flow passage 91b communicates. On the other hand, in the 2nd switching part 98, the 1st washing water flow path 94a is interrupted | blocked and the 2nd washing water flow path 94b is connecting. In this state, the cleaning water supplied to the second cleaning water nozzle 88b through the second cleaning water flow passage 94b is accelerated by the high-pressure air supplied to the second cleaning water nozzle 88b through the second air flow passage 91b. Then, as shown in FIG. 4, wash water is ejected from the second wash water nozzle 88b. At this time, no wash water is ejected from the first wash water nozzle 88a.

  On the other hand, when the 1st switching part 93 and the 2nd switching part 98 move rightward, in the 1st switching part 93, the 1st air flow path 91a is connected, and the 2nd air circulation In the second switching unit 98, the first washing water flow passage 94a is communicated and the second washing water flow passage 94b is cut off. In this state, the first washing water flow passage 94a is blocked. The wash water supplied to the second wash water nozzle 88a through the first air flow passage 91a is accelerated by the high-pressure air supplied to the second wash water nozzle 88a and washed from the second wash water nozzle 88a. Water is spouted out. At this time, no wash water is ejected from the second wash water nozzle 88b. That is, the selection unit 98 has a function of selecting so that the cleaning water is ejected from only one of the first cleaning water nozzle 88a and the second cleaning water nozzle 88b.

  As described above, the first cleaning water nozzle 88a and the second cleaning water nozzle 88b are arranged on both sides of the cutting blade 80, so that the cutting means 8 can be cut in any direction. The cutting groove formed by the above can be cleaned, and the amount of cleaning water used can be suppressed to the minimum necessary by ejecting the cleaning water from only one of the cleaning water nozzles.

  Further, the cutting water ejected from the water flow forming means 100 causes the cutting water and cleaning water staying on the surface of the wafer W to flow in the + X direction and be eliminated, thereby reliably preventing the wafer W from being contaminated. can do.

As shown in FIG. 3, the wafer W is held on the chuck table 6, and the wafer W is actually cut using the cutting means 8 in the following three environments (1) to (3). The number of contamination (contamination) and the number of contamination after cutting were measured.
(1) The cutting water is ejected from the water flow forming means 100 and the cleaning water is not ejected from the cleaning water ejecting portion 88.
(2) The cutting water is not ejected from the water flow forming means 100, and the washing water is ejected from the washing water ejection portion 88.
(3) The cutting water is ejected from the water flow forming means 100 and the cleaning water is ejected from the cleaning water ejection part 88.

  In each of the above environments (1), (2), and (3), the surface of the wafer W is imaged before and after cutting using the imaging unit 70 shown in FIG. As a result of measurement, the result shown in FIG. 5 was obtained. In each of the results shown in FIG. 5, the contamination was measured before cutting because the contamination such as grinding dust adhered to the surface of the wafer W in the process before cutting.

  First, in the case (1), the number of contaminants before cutting was one, whereas the number of contaminants after cutting was four. Since the cutting water was ejected from the water flow forming means 100, the retention of contamination could be relatively reduced, but since the cleaning water was not ejected from the cleaning water ejection portion 88, the contamination could not be completely eliminated. Probably not.

  In the case (2), the number of contaminants before cutting was four, whereas the number of contaminants after cutting was seven. Although cleaning water was ejected from the cleaning water ejection portion 88, it is considered that a relatively large amount of contamination remained because the water flow from the water flow forming means 100 was not used.

  In the case (3), the number of contaminants before cutting was 7, whereas the number of contaminants after cutting was zero. Since cutting water is ejected from the water flow forming means 100 and cleaning water is ejected from the cleaning water ejection portion 88, it is presumed that contamination has been completely eliminated.

  From the above results, it was confirmed that the contamination cleaning effect is increased by performing both the ejection of the cutting water from the water flow forming means 100 and the ejection of the cleaning water from the cleaning water ejection portion 88.

It is a perspective view which shows an example of a cutting device. It is a perspective view which shows an example of a wafer. It is a perspective view which shows the state which cuts a wafer. It is a top view which shows the state which sprays cutting water from a water flow formation means while washing water from a washing water ejection part. It is a graph which shows an experimental result.

Explanation of symbols

W: Wafer S: Street D: Device G: Cutting groove 1: Cutting device 2: Cassette 3: Loading / unloading means 4: Temporary placement area 5: Transfer means 6: Chuck table 60: Cutting feeding means 7: Alignment means 70: Imaging Part 8: Cutting means 80: Cutting blade 81: Index feed means 82: Spindle housing 83: Spindle 84a, 84b: Cutting water supply nozzle 85: Blade cover 86a, 86b: Cutting water inlet 87: Cutting water supply source 88: Washing water Eruption
88a: first wash water nozzle 88b: second wash water nozzle 89a: first high pressure air inlet 89b: second high pressure air inlet 90a: first wash water inlet 90b: second wash water inlet 91a: first air flow passage 91b: second air flow passage 86a, 91, 95: valve 92: high pressure air supply source 93: first switching section 94a: first washing water flow passage 94b: second washing Water flow passage 96: Wash water supply source 97: Second switching unit 98: Selection means 99: Two-fluid washing means 100: Water flow formation means

Claims (4)

A chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, a cutting feed means for cutting and feeding the chuck table relative to the cutting means, and the cutting A cutting apparatus comprising at least indexing feeding means for indexing and feeding means relative to the chuck table,
The cutting means includes a spindle, a spindle housing that rotatably supports the spindle, a cutting blade that is attached to a tip of the spindle, and a cutting water supply nozzle that supplies cutting water to the cutting blade and the spindle. A blade cover fixed to the housing and covering the cutting blade;
Furthermore, the two-fluid cleaning means for cleaning the region including the cutting groove formed in the workpiece by jetting the cleaning water from the cleaning water jetting portion with high-pressure air, and the cutting water retained by the jetting of the cutting water to the cutting blade Cutting device comprising water flow forming means forcibly flowing away to the side where the cutting water scatters due to the rotation of.   The washing water ejection part is composed of a first washing water nozzle disposed on one surface side of the cutting blade and a second washing water nozzle disposed on the other surface side of the cutting blade. The cutting device according to claim 1.   The said 2 fluid washing | cleaning means was equipped with the selection means to select so that washing water may be ejected from either one of said 1st washing water nozzle or said 2nd washing water nozzle. Cutting equipment.   The cutting apparatus according to claim 1, 2 or 3, wherein the cleaning water jetting part is disposed on a side opposite to a side where cutting water scatters due to cutting by the cutting blade.

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