JP2013144324A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device capable of removing burrs generated when a workpiece including a ductile material is cut without extending the processing time.
A cutting means having a holding means for holding a workpiece, a spindle that is rotationally driven, and a cutting blade that is attached to the tip of the spindle and that cuts the workpiece held by the holding means; A cutting apparatus comprising a cutting feed means for moving the cutting means and the holding means relative to each other in a cutting feed direction, wherein the cutting blade cuts a workpiece and forms a cutting groove in a machining progress direction. The cutting blade is disposed adjacent to the cutting blade on the rear side in the processing progress direction, and a fluid is ejected to face a cutting groove formed by cutting a workpiece with the cutting blade. It is characterized by comprising a deburring fluid ejection means having a fluid ejection port for removing burrs generated in the workpiece by cutting with a cutting blade.
[Selection] Figure 5

Description

  The present invention relates to a cutting apparatus suitable for cutting a workpiece including a ductile material.

  A plurality of device areas are formed by arranging a plurality of semiconductor chips on which circuits such as IC and LSI are formed in a rectangular metal frame, and the back surface is resin-sealed, and non-device areas between adjacent device areas A package substrate, such as a CSP (Chip Size Package) substrate, is cut along a planned division line by a cutting device, and is formed as a package having substantially the same size as a semiconductor chip.

  In order to reduce the occurrence of warpage due to resin sealing, the package substrate has a device region (a region where a semiconductor chip exists and is resin-sealed) and a non-device region (a region where no semiconductor chip exists and is not resin-sealed). ) And are alternately adjacent.

  A cutting apparatus that cuts a package substrate includes a holding table that holds the package substrate by suction, and a cutting unit that includes a cutting blade that cuts the package substrate held by the holding table.

  The package substrate is fixed to a fixing jig and mounted on a holding table of a cutting apparatus. The fixing jig has a plurality of suction ports corresponding to each package so that the package being cut does not scatter.

  However, when a workpiece including a ductile material such as a metal such as a package substrate or a resin is cut with a cutting blade, burrs are generated on the cutting surface. It is required to remove burrs during cutting because removal of burrs generated by cutting is complicated after the cutting.

  Japanese Patent Application Laid-Open No. 2001-77055 discloses a cutting method for removing burrs generated by cutting a workpiece including a ductile material. According to the cutting method disclosed in this publication, after cutting a workpiece to form a cutting groove, the cutting blade is passed through the cutting groove in the reverse direction to remove burrs.

JP 2001-77055 A

  In the cutting method disclosed in Patent Document 1, after cutting a workpiece to form a cutting groove, the cutting blade is again passed through the cutting groove in the reverse direction to remove burrs. There is a problem that it takes twice as long to cut.

  The present invention has been made in view of these points, and the object of the present invention is to remove burrs generated when a workpiece including a ductile material is cut without extending the processing time. It is to provide a cutting device.

  According to the present invention, a holding means for holding a workpiece, a cutting means having a spindle that is rotationally driven and a cutting blade that is attached to the tip of the spindle and that holds the workpiece held by the holding means; A cutting device comprising a cutting feed means for moving the cutting means and the holding means relative to each other in a cutting feed direction, wherein the cutting blade cuts a workpiece and forms a cutting groove in a machining progress direction. The cutting blade is disposed adjacent to the cutting blade on the rear side in the processing direction of the cutting blade, and ejects a fluid so as to face a cutting groove formed by cutting a workpiece with the cutting blade. There is provided a cutting apparatus comprising a burr removal fluid ejection means having a fluid ejection port for removing a burr generated in a workpiece by cutting of the cutting blade.

  Preferably, the fluid is composed of a fluid mixture of liquid and gas, the diameter of the fluid ejection port is φ0.5 to 2 mm, the flow rate of the liquid is 0.3 to 0.5 l / min, and the gas The jet pressure is 0.3 to 1.0 MPa, and the distance between the fluid jet port and the workpiece upper surface is 0.5 to 5 mm.

  Since the cutting apparatus of the present invention has the burr removal fluid jetting means disposed adjacent to the rear side of the cutting blade in the processing progress direction, the cutting groove is formed as the cutting groove is formed by cutting the workpiece. The fluid is ejected, and burrs generated by the pressure of the fluid are removed. Accordingly, the generated burrs can be effectively removed without extending the processing time.

It is a partially broken perspective view of the cutting device concerning an embodiment of the present invention. It is a disassembled perspective view which shows a mode that a blade mount is fixed to the front-end | tip of a spindle. It is a disassembled perspective view which shows a mode that a washer blade is mounted | worn with a blade mount. It is a front view of the cutting unit which concerns on this invention embodiment. It is a front view which shows a mode that the workpiece is cut with the cutting unit.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a partially broken perspective view of a cutting device 2 according to an embodiment of the present invention is shown. The cutting device 2 includes a suction table (holding means) 4, and a workpiece is placed on the suction table 4 and sucked and held.

  The cutting device 2 of the present embodiment is suitable for cutting a workpiece including a ductile material such as metal or resin, and in this specification, a case where the package substrate 6 is cut as a workpiece will be described. However, the workpiece including the ductile material is not limited to the package substrate 6 but includes a resin plate, a metal plate, a wafer with a TEG (Test Element Group), a wafer with a DAF (Die Attach Film), and the like.

  The package substrate 6 is mounted on the suction table 4 via a fixing jig 8 as disclosed in Japanese Patent Application Laid-Open No. 2006-261525. The fixing jig 8 has through holes 10 at four corners, and the fixing jig 8 is placed on the suction table 4 in a state where each through hole 10 is fitted to the protruding pin 12 of the suction table 4. The suction table 4 is movable in the X-axis direction and is rotatable, and is provided with a suction unit 14 that communicates with a suction source (not shown).

  Above the movement path in the X-axis direction of the suction table 4, an alignment unit 16 that detects a division line to be cut of the package substrate 6 sucked and held by the suction table 4 via the fixing jig 8 is disposed. ing.

  The alignment unit 16 includes an imaging unit 18 having a microscope and a CCD camera for imaging the surface of the package substrate 6, and detects a division line to be cut by image processing such as pattern matching based on an image acquired by imaging. can do.

  On the left side of the alignment unit 16, a cutting unit 20 that performs cutting on the package substrate 6 held on the suction table 4 is disposed. The cutting unit 20 is configured integrally with the alignment unit 16, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting unit 20 is configured by attaching a cutting blade 24 to the tip of a rotatable spindle 22 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 24 is located on the extension line of the imaging unit 18 in the X-axis direction.

  Referring to FIG. 2, an exploded perspective view showing how the blade mount 30 is attached to the tip of the spindle 22 is shown. In the spindle housing 26 of the cutting unit 20, a spindle 22 that is rotationally driven by a servo motor (not shown) is rotatably accommodated. The spindle 22 has a tapered portion 22a and a tip small diameter portion 22b, and a male screw 28 is formed on the tip small diameter portion 22b.

  A blade mount 30 includes a boss portion 32 and a fixed flange 34 formed integrally with the boss portion 32, and a male screw 36 is formed on the boss portion 32. Further, the blade mount 30 has a mounting hole 37.

  In the blade mount 30, the mounting hole 37 is inserted into the small diameter portion 22 b and the tapered portion 22 a of the spindle 22, and the nut 38 is screwed into the male screw 36 and tightened, whereby the small diameter of the tip of the spindle 22 is shown in FIG. 3. It is attached to the part 22b.

  Referring to FIG. 3, there is shown an exploded perspective view showing a state where the washer-like cutting blade 24 is mounted on the blade mount 30 fixed to the tip of the spindle 22. The cutting blade 24 is formed of a cutting blade (electroforming grindstone) electroformed entirely.

  The cutting blade 24 is inserted into the boss portion 32 of the blade mount 30, the detachable flange 40 is further inserted into the boss portion 32, and the fixing nut 42 is screwed into the male screw 38 and tightened, whereby the cutting blade 24 is fixed to the fixing flange 34. And is attached to the spindle 22 by being sandwiched from both sides by the detachable flange 40.

  Referring to FIG. 4, a perspective view of the cutting blade 24 mounted on the spindle 22 surrounded by a blade cover (wheel cover) 50 is shown. A blade breakage detector 52 is attached to the blade cover 50.

  The blade breakage detector 52 is positioned so that the tip of the light emitting unit 54 connected to the optical fiber 56 and the tip of the light receiving unit (not shown) connected to the optical fiber (not shown) face each other across the outer periphery of the cutting blade 24. Configured. 58 is an adjustment screw for adjusting the position of the blade breakage detector 52, and 60 is a fixing screw for fixing the blade breakage detector 52 at the adjusted position.

  An air cylinder (not shown) is accommodated in the blade cover 50, and a mounting plate (not shown) is fixed to the tip of the piston rod of the air cylinder. A cooling water nozzle assembly 62 is fastened to the mounting plate by screws 72.

  The cooling water nozzle assembly 62 includes a connection pipe 64 connected to the hose 68 and a pair of cooling water nozzles 66 branched from the connection pipe 64 and extending on both sides of the cutting blade 24. A splash cover 70 is provided outside each cooling water nozzle 66.

  A deburring fluid ejection unit 74 is attached to the cooling water nozzle assembly 62. The deburring fluid ejection unit 74 has a fluid ejection port 76 opened downward. The fluid jet 76 is connected to a liquid supply source 86 that supplies a liquid such as pure water via a connection pipe 78 and a hose 82, and a gas supply source 88 that supplies a gas such as air via a connection pipe 80 and a hose 84. Has been. Accordingly, a fluid mixture of liquid and gas is ejected from the fluid ejection port 76 of the deburring fluid ejection unit 74.

  A cutting water nozzle block 90 is fastened to the blade cover 50 by screws 92. The cutting water nozzle block 90 includes a connection pipe 94 connected to the hose 98 and a cutting water nozzle 96 connected to the connection pipe 94. The tip of the cutting water nozzle 96 opens toward the outer periphery of the cutting blade 24.

  Referring to FIG. 5, a front view of the state in which the package substrate 6 sucked and held by the suction table 4 is being cut by the cutting blade 24 is shown. In FIG. 5, the fixing jig 8 is omitted.

  When cutting the package substrate 6, the cutting blade 24 is rotated in the direction of arrow A at a high speed (for example, 30000 rpm) and cut into the package substrate 6, and the package substrate 6 is scheduled to be divided while the suction table 4 is processed and fed in the direction of arrow X1. And cutting grooves are formed in the package substrate. The arrow X2 is the processing progress direction, and the cutting groove of the package substrate 6 is formed in the processing progress direction indicated by the arrow X2.

  At the time of cutting, the package substrate 6 is cut while supplying cooling water from the cooling water nozzle 66 to the side surface of the cutting blade 24 and supplying cutting water from the cutting water nozzle 96 to the outer peripheral portion of the cutting blade 24.

  Furthermore, since the cutting unit 20 of the present embodiment includes the burr removal fluid ejection unit 74 on the rear side in the processing progress direction with respect to the cutting blade 24, the package substrate 6 is cut to form a cutting groove. Along with this, the mixed fluid 100 of liquid and gas is ejected from the fluid ejection port 76 to the cutting groove, and the whisker-like burrs formed in the cutting groove are removed by the ejection pressure of this mixed fluid.

  Preferably, the mixed fluid of liquid and gas is formed from a mixed fluid of pure water and air. The diameter of the fluid ejection port 76 is preferably in the range of φ0.5 to 2 mm. Further, the flow rate of the liquid supplied from the liquid supply source 86 is preferably 0.3 to 0.5 l / min, and the ejection pressure of the gas supplied from the gas supply source 88 is preferably 0.3 to 1.0 MPa. Furthermore, the distance between the fluid jet 76 and the upper surface of the package substrate (workpiece) 6 is preferably in the range of 0.5 to 5 mm.

2 Cutting device 4 Suction table 6 Package substrate 8 Fixing jig 20 Cutting unit 22 Spindle 24 Cutting blade 50 Blade cover 62 Cooling water nozzle assembly 66 Cooling water nozzle 74 Deburring fluid ejection unit 76 Fluid ejection port 90 Cutting water nozzle assembly 96 Cutting Water nozzle 100 Mixed fluid

Claims (2)

A cutting means having a holding means for holding the workpiece; a spindle that is rotationally driven; and a cutting blade that is mounted on the tip of the spindle and that holds the workpiece held by the holding means; the cutting means; A cutting device comprising a cutting feed means for moving the holding means relative to the cutting feed direction, wherein the cutting blade cuts the workpiece and forms a cutting groove in the machining progress direction,
The cutting blade is disposed adjacent to the cutting blade on the rear side in the processing advancing direction, and a fluid is ejected to face a cutting groove formed by cutting a workpiece with the cutting blade. A cutting apparatus comprising a deburring fluid ejection means having a fluid ejection port for removing burrs generated in a workpiece by cutting a blade. The fluid is composed of a fluid mixture of liquid and gas,
The diameter of the fluid ejection port is φ0.5 to 2 mm,
The flow rate of the liquid is 0.3-0.5 l / min;
The gas ejection pressure is 0.3 to 1.0 MPa,
The cutting apparatus according to claim 1, wherein a distance between the fluid jet port and the upper surface of the workpiece is 0.5 to 5 mm.

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