CN104735924A - Uncovering process for multi-layer ladder-like soft and hard combination plate - Google Patents
Uncovering process for multi-layer ladder-like soft and hard combination plate Download PDFInfo
- Publication number
- CN104735924A CN104735924A CN201510152866.9A CN201510152866A CN104735924A CN 104735924 A CN104735924 A CN 104735924A CN 201510152866 A CN201510152866 A CN 201510152866A CN 104735924 A CN104735924 A CN 104735924A
- Authority
- CN
- China
- Prior art keywords
- soft board
- coverlay
- uncapping
- diaphragm
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000003698 laser cutting Methods 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 19
- 238000007373 indentation Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 7
- 239000011265 semifinished product Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an uncovering process for a multi-layer ladder-like soft and hard combination plate. The uncovering process comprises the following steps that 1, a, electroplating, graph manufacturing and coverage film laminating are sequentially carried out on a two-sided soft plate; b, one-sided soft plates are bonded to the two sides of the two-sided soft plate, and electroplating and graph manufacturing are sequentially carried out on the one-sided soft plates; 2, a CO2 laser cutting machine is adopted for carrying out grooving on preset regions of the one-sided soft plates, and then coverage films laminated in the step 1 are uncovered and exposed; 3, coverage films are laminated on the regions, grooved, uncovered and exposed in the step 2, of the one-sided soft plates; 4, protecting films are stacked and laminated on the coverage films; 5, copper foil and prepreg are stacked and laminated on the one-sided soft plates, and then plate arranging is carried out, so that a hard plate is formed; 6, a UV machine is adopted for cutting a hard plate region corresponding to the protecting films, and the protecting films and the hard plate region corresponding to the protecting films are uncovered to expose the coverage films. The uncovering process can avoid the layering defect and the base material residual defect in the glue overflowing and uncovering processes.
Description
Technical field
The present invention relates to circuit board to uncap technique, particularly relate to the technique of uncapping for multi-step shape Rigid Flex.
Background technology
For the Rigid Flex of multi-step shape, such as, triple stepped constructions containing 6L hardboard, 4L and 2L soft board layer, it has 6 laminates, needs segmentation to uncap to it, and wherein, in circuit-board industry, L refers to layer, uncaps also referred to as taking off lid; Two laminate/2 laminates, refer to the soft board with two-layer copper foil layer, and such as a double surface soft board is two layers of soft board/bis-laminate, and an one side soft board is one deck soft board/mono-laminate.Existingly uncap technological process as shown in Figure 1, in the production process by the technological process shown in Fig. 1, technique and quality face following problem:
1) 2L-4L and 2L-6L joins position layering
Join position at 2L-4L and 2L-6L when making by this kind of technique to occur occurring in the lamination defect between FCCL (flexible copper foil base material, one side soft board) and pure glue, defective proportion on average about 9.5%, this kind of lamination defect may aggravate further in follow-up paster process, reduces the electric conductivity of the conductor near reliability or impact.
Occur that this kind of layering reason is, when uncapping for avoiding laser, cutting hurts soft board, the safety that need retain about 40um is remaining thick, and the thickness of the PI layer of FCCL is wherein 25um, like this will have most PI by laser cutting, can not do not result in this kind of layering by pliable and tough PI the pullling in the process of uncapping of laser cutting.
2) 2L-4L join position overflow glue/base material remain
Joining at 2L-4L to overflow after uncapping has appearred in position glue or base material remains excessive, and reason is, for avoiding laser cut wound soft board, PI need retain the residual thickness of about 10um, and this residual thickness can cause rupturing when uncapping and irregularly cause the residual or excessive glue of base material.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide the technique of uncapping for multi-step shape Rigid Flex, avoiding excessive glue and the lamination defect of uncapping in process and base material residual defects.
Object of the present invention realizes by the following technical solutions:
For the technique of uncapping of multi-step shape Rigid Flex, comprise the following steps:
S1, a. electroplate successively to double surface soft board, graphic making and pressing coverlay; B. be bonded in double surface soft board two sides with one side soft board, form four layers of soft board, then one side soft board is electroplated successively, graphic making;
S2, employing CO
2laser cutting machine carries out grooving to the predeterminable area of one side soft board, then uncaps and exposes the coverlay of institute's pressing in step S1;
S3, in step S2 by grooving and the one side soft board region pressing coverlay exposed of uncapping;
S4, on all coverlays stacked pressing diaphragm;
S5, one side soft board laminate Copper Foil and prepreg and carries out row's plate, forming hardboard;
S6, adopt the hardboard region that UV machine cutting diaphragm is corresponding, remove related for the hardboard region of diaphragm and correspondence thereof simultaneously, expose all coverlays.
Preferably, in described step S2, with the predeterminable area boundary line of one side soft board inside indentation 0.2mm ~ 0.4mm, one side soft board grooving is uncapped; In described step S3, pressing coverlay overlaps with predeterminable area boundary line to make coverlay.
Preferably, in step s 6, UV machine cutting zone forms closed region.
Preferably, in described step S4, after all coverlays attach diaphragm, adopt fast press pressing diaphragm.
Preferably, the brown process to soft board surface, all coverlay surfaces is also comprised between described step S3 and step S4.
Compared to existing technology, beneficial effect of the present invention is:
(1) the present invention uses CO before laminated rigid board
2laser cutting machine carries out grooving to soft board, uncaps, because laser directly acts on soft board surface, can control within 0 ~ 5um by thick more than soft board, the lamination problem that double surface soft board in stepped Rigid Flex and four layers of soft board binding site cause because of one side soft board (FCCL) undercut can be improved;
(2) the present invention passes through CO
2the predeterminable area of laser cutting machine to one side soft board inside contracts grooving, make the inside indentation 0.2mm ~ 0.4mm in predeterminable area boundary line between the double surface soft board four layers of soft board in stepped Rigid Flex, follow-up coverlay is made to be labelled to default rigid-flex line of demarcation, coverlay overlaps with predeterminable area boundary line, gummosis after uncapping can be covered, prevent excessive glue or base material from remaining;
(3) the present invention passes through CO
2the predeterminable area of laser cutting machine to one side soft board inside contracts grooving, uncap (step S2), make the inside indentation 0.2mm ~ 0.4mm in the predeterminable area boundary line of the double surface soft board in stepped Rigid Flex and six laminates, expose double surface soft board region, position, soft or hard line of demarcation coverlay (coverlay 3) can directly be combined with the prepreg of second time pressing plate (step S5), (step S6) in process is uncapped in the cutting of UV machine, only need cutting prepregs, do not need again to cut one side soft board, the lamination problem pullling double surface soft board in the stepped Rigid Flex caused and six laminate binding sites of uncapping because of one side soft board undercut can be improved.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet that prior art takes off cover process;
Fig. 2 is the schematic flow sheet of the present invention for the technique of uncapping of multi-step shape Rigid Flex;
Fig. 3 is the Rigid Flex semi-finished product structure schematic diagram of step 1 correspondence of the present invention;
Fig. 4 is the structural representation of step 2 of the present invention corresponding Rigid Flex semi-finished product grooving;
Fig. 5 is the structural representation that step 2 of the present invention corresponding Rigid Flex semi-finished product soft board is uncapped;
Fig. 6 is the half-finished structural representation of the corresponding Rigid Flex of step 3 of the present invention;
Fig. 7 is the half-finished structural representation of the corresponding Rigid Flex of step 4 of the present invention;
Fig. 8 is the half-finished structural representation of the corresponding Rigid Flex of step 5 of the present invention;
Fig. 9 is the structural representation of the pre-gong of step 6 of the present invention corresponding Rigid Flex semi-finished product;
The corresponding Rigid Flex of Figure 10 step 6 of the present invention takes off the structural representation covered.
In figure: 1. double surface soft board; 2. one side soft board; 3,3 ＇. coverlay; 4. diaphragm; 5. prepreg.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the present invention is described further:
The technique of uncapping for multi-step shape Rigid Flex as shown in Figure 2, comprises the following steps:
S1, a. electroplate successively to double surface soft board 1, graphic making and pressing coverlay 3, coverlay 3 needs the part exposed for the protection of double surface soft board 1 region in finished product Rigid Flex, b. one side soft board (FCCL) is used to be bonded in double surface soft board two sides, generally bondd by pure glue, form four layers of soft board, again one side soft board 2 is electroplated successively, graphic making, as shown in Figure 3;
S2, employing CO
2laser cutting machine carries out grooving to the predeterminable area of one side soft board 2, and as shown in Figure 4, then uncap (windowing) exposes the coverlay 3 of institute's pressing in step S1, as shown in Figure 5; Wherein, the CO of use
2its laser width of laser cutting machine is large, and breakage rate is low;
S3, in step S2 by grooving and one side soft board 2 region pressing coverlay 3 ＇ exposed that uncaps, as shown in Figure 6, this coverlay 3 ＇ for the protection of four layers of soft board of predeterminable area, and can cover cutting and the residual excessive glue produced with step S1 (b) manufacturing process of the base material after taking off lid;
S4, on all coverlay 3,3 ＇ stacked pressing diaphragm 4, as shown in Figure 7, diaphragm 4 for isolating sticker effect, isolation prepreg and coverlay 3,3 ＇;
S5, one side soft board 2 laminates prepreg 5 and Copper Foil and carries out row pressure plate, the general prepreg 5 that adopts carries out lamination as binding agent, forms hardboard, as shown in Figure 8;
The hardboard region of S6, employing UV machine cutting diaphragm 4 correspondence; remove related for the hardboard region of diaphragm 4 and correspondence thereof simultaneously; expose all coverlay 3,3 ＇; after removing the hardboard region on diaphragm 4; two laminates (double surface soft board 1) and four laminates (one side soft board 2) will be outputed; complete uncapping of multi-step shape Rigid Flex, as shown in Figure 10.
For coordinating involved rigid-flex boundary line, in described step S2, carrying out grooving with the inside indentation 0.2mm ~ 0.4mm in the predeterminable area boundary line of one side soft board 2 and uncapping, being convenient to control depth of cut and remaining thick, solving the lamination problem of uncapping.In described step S3, pressing coverlay 3 ＇ overlaps with predeterminable area boundary line to make coverlay 3 ＇, can cover the gummosis after uncapping, and prevent excessive glue or base material from remaining, soft board region can reach the requirement of design size boundary line again simultaneously.
At use CO
2when laser cutting machine grooving is uncapped, paving copper can be set up under the regional boundary line of uncapping preset, avoid burning in soft board gong dead slot.Meanwhile, this CO
2the mode that laser cutting machine superposes with blind hole is cut, and diverse location designs different blind hole aperture, by adjustment different pore size parameter, meets the different depth requirement of diverse location.
For the benefit of bend peel-off hd, in step s 6, UV machine cutting zone forms closed region, is more conducive to normally take off lid, and further, take off lid operation for convenience, sectional controls depth of cut.Certainly, first can carry out pre-gong before the cutting of UV machine, as shown in Figure 9, uncap to facilitate.
In described step S4, after coverlay 3,3 ＇ attaches diaphragm 4, adopt fast press pressing diaphragm 4.Coverlay 3,3 ＇ thickness is about 37um, and diaphragm 4 thickness is about 27.5um.Use diaphragm 4 prepreg 5 to be isolated with coverlay 3,3 ＇, cut and remove diaphragm 4 process by UV machine and complete and uncap.
Further, between described step S3 and step S4, also comprise the brown process to soft board 2 surface, all coverlay 3,3 ＇ surfaces, be beneficial to increase adhesion.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection range of the claims in the present invention.
Claims (5)
1., for the technique of uncapping of multi-step shape Rigid Flex, it is characterized in that comprising the following steps:
S1, a. electroplate successively to double surface soft board, graphic making and pressing coverlay; B. be bonded in double surface soft board two sides with one side soft board, form four layers of soft board, then one side soft board is electroplated successively, graphic making;
S2, employing CO
2laser cutting machine carries out grooving to the predeterminable area of one side soft board, then uncaps and exposes the coverlay of institute's pressing in step S1;
S3, in step S2 by grooving and the one side soft board region pressing coverlay exposed of uncapping;
S4, on all coverlays stacked pressing diaphragm;
S5, one side soft board laminate Copper Foil and prepreg and carries out row's plate, forming hardboard;
S6, adopt the hardboard region that UV machine cutting diaphragm is corresponding, remove related for the hardboard region of diaphragm and correspondence thereof simultaneously, expose all coverlays.
2. the technique of uncapping for multi-step shape Rigid Flex according to claim 1, is characterized in that: in described step S2, uncaps to one side soft board grooving with the predeterminable area boundary line of one side soft board inside indentation 0.2mm ~ 0.4mm; In described step S3, pressing coverlay overlaps with predeterminable area boundary line to make coverlay.
3. the technique of uncapping for multi-step shape Rigid Flex according to claim 1, is characterized in that: in step s 6, and UV machine cutting zone forms closed region.
4. the technique of uncapping for multi-step shape Rigid Flex according to any one of claims 1 to 3, is characterized in that: in described step S4, after all coverlays attach diaphragm, adopts fast press pressing diaphragm.
5. the technique of uncapping for multi-step shape Rigid Flex according to any one of claims 1 to 3, is characterized in that: also comprise the brown process to soft board surface, all coverlay surfaces between described step S3 and step S4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510152866.9A CN104735924B (en) | 2015-03-31 | 2015-03-31 | Technique of uncapping for multi-step shape Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510152866.9A CN104735924B (en) | 2015-03-31 | 2015-03-31 | Technique of uncapping for multi-step shape Rigid Flex |
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| Publication Number | Publication Date |
|---|---|
| CN104735924A true CN104735924A (en) | 2015-06-24 |
| CN104735924B CN104735924B (en) | 2018-01-12 |
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| CN201510152866.9A Active CN104735924B (en) | 2015-03-31 | 2015-03-31 | Technique of uncapping for multi-step shape Rigid Flex |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105576A (en) * | 2017-06-20 | 2017-08-29 | 广州兴森快捷电路科技有限公司 | The preparation method of ladder boss printed board |
| CN107580412A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | Stepped circuit board and preparation method thereof |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN110572958A (en) * | 2019-09-26 | 2019-12-13 | 九江明阳电路科技有限公司 | Rigid-flex printed circuit board pressing structure and manufacturing method |
| CN111295056A (en) * | 2020-03-16 | 2020-06-16 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible plate of step circuit |
| CN114189998A (en) * | 2021-12-23 | 2022-03-15 | 江西荣晖电子有限公司 | Manufacturing method of zero-glue-overflow rigid-flex board product |
| CN114585154A (en) * | 2020-12-02 | 2022-06-03 | 上海美维科技有限公司 | Circuit board manufacturing structure and circuit board manufacturing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107580412A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | Stepped circuit board and preparation method thereof |
| CN107105576A (en) * | 2017-06-20 | 2017-08-29 | 广州兴森快捷电路科技有限公司 | The preparation method of ladder boss printed board |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN109688704B (en) * | 2018-12-03 | 2021-04-30 | 上海展华电子有限公司 | Method for controlling glue overflow and soldering tin performance of rigid-flex board |
| CN110572958A (en) * | 2019-09-26 | 2019-12-13 | 九江明阳电路科技有限公司 | Rigid-flex printed circuit board pressing structure and manufacturing method |
| CN111295056A (en) * | 2020-03-16 | 2020-06-16 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible plate of step circuit |
| CN111295056B (en) * | 2020-03-16 | 2024-03-15 | 深圳市实锐泰科技有限公司 | Manufacturing method of ladder circuit flexible board |
| CN114585154A (en) * | 2020-12-02 | 2022-06-03 | 上海美维科技有限公司 | Circuit board manufacturing structure and circuit board manufacturing method |
| CN114189998A (en) * | 2021-12-23 | 2022-03-15 | 江西荣晖电子有限公司 | Manufacturing method of zero-glue-overflow rigid-flex board product |
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Denomination of invention: Cover opening process for multi-layer stepped soft and hard bonding plate Effective date of registration: 20221213 Granted publication date: 20180112 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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Date of cancellation: 20230425 Granted publication date: 20180112 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Cover opening process for multi-layer stepped soft and hard bonding boards Effective date of registration: 20230512 Granted publication date: 20180112 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180112 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Opening process for multi-layer stepped soft hard bonding board Granted publication date: 20180112 Pledgee: Industrial and Commercial Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2024980046188 |