CN101695220B - Method for manufacturing PCB with stepped groove - Google Patents
Method for manufacturing PCB with stepped groove Download PDFInfo
- Publication number
- CN101695220B CN101695220B CN2009101974965A CN200910197496A CN101695220B CN 101695220 B CN101695220 B CN 101695220B CN 2009101974965 A CN2009101974965 A CN 2009101974965A CN 200910197496 A CN200910197496 A CN 200910197496A CN 101695220 B CN101695220 B CN 101695220B
- Authority
- CN
- China
- Prior art keywords
- prepreg
- central layer
- outer central
- pcb board
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for manufacturing a PCB with a stepped groove, and is characterized in that the method comprises the following steps: a. bonding an adhesive tape to the back of an inner-layer core board; b. bonding a first prepreg with a window to the back of the inner-layer core board so that the adhesive tape is positioned inside the window of the first prepreg; bonding a second prepreg to the front of the inner-layer core board; c. bonding a first outer-layer core board to the surface of the first prepreg; bonding a second outer-layer core board to the surface of the second prepreg; d. implementing lamination; and e. cutting with laser along the edge of the required stepped groove along the direction from the second outer-layer core board to the inner-layer core board,and taking out the adhesive tape as well as the inner-layer core board, the second prepreg and the second outer-layer core board which are cut off, thus forming the PCB with the stepped groove. The thickness of the said adhesive tape and the said first prepreg is equivalent. The method can ensure the integrity of the wall of the stepped groove without defects. The laminated board and the adhesive tape can be taken out easily subsequent to the cutting by laser, and no adhesion to the bottom of the groove occurs. The method is simple and effective and is convenient in implementation.
Description
Technical field
The present invention relates to a kind of pcb board production method that has step trough.
Background technology
As shown in Figure 1, be a kind of multi-layer PCB board 1, recessing 11 on it.Groove 11 is also referred to as step trough, and it is non-through slot.In the present invention this kind pcb board is called for short step ladder PCB plate.
The production method of multi-layer PCB board is between the core material more than two-layer, prepreg is set between Copper Foil and the core material, forms through the high temperature lamination.The plate that prepreg mainly is made up of thermoplastic resin is solid during normal temperature, is converted into half mobile liquid under the high temperature, and when returning to normal temperature behind the lamination, prepreg is bonded as one multilayer core material and core material and Copper Foil.When producing step ladder PCB plate, as shown in Figure 2, multi-layer PCB board is made through lamination by the second outer central layer 2, second prepreg 3, core material 4, first prepreg, 5, the first outer central layer 6, the 3rd prepreg 7, first Copper Foil or the 3rd outer central layer 8; Existing process using is windowed the second outer central layer 2 earlier, and 21, second prepreg 3 windows 31, core material 4 is windowed, and 41, first prepreg 5 windows 51, and the second outer central layer 2, second prepreg 3, core material 4, first prepreg, 5, the first outer central layer 6, the 3rd prepreg 7 the 3rd outer central layer 8 are adjacent to successively; Make window 21, window 31, window 41, window 51 alignment, then supplies 9 are inserted in window 21, window 31, window 41, the window 51, lamination takes out supplies 9 at last to realize step trough again.Use the method for supplies, when lamination, influence lamination for avoiding supplies, as shown in Figure 3, the height of supplies 9 is generally less than the degree of depth that desire is slotted, and also promptly has difference in height h between the degree of depth of the height of supplies 9 and groove.The varied in thickness of pcb board adapts when difference in height h and lamination.In this case, laminated sheet can't directly be pressed on the supplies 9, just supplies 9 can't be pressed on second core material 6 when lamination.Because prepreg can have certain fluidity when lamination, prepreg is subjected to flow between the supplies 9 and second core material 6 by the slit after the thermal softening, and the supplies 9 and second core material 6 are bonding, causes supplies 9 to take out.Owing to have two-layer prepreg (first prepreg 5, second prepreg 3) at least, prepreg thickness when lamination can change, and therefore, difference in height h is difficult to hold accurately, and the prepreg number of plies is many more, the difficult more assurance of difference in height h.Even if supplies can take out, but the step trough size and the degree of depth that form like this are difficult to accurate control, are difficult to guarantee the neat flawless problem of ladder cell wall.Most importantly, this method is cumbersome, needs customization supplies 9, to the size of supplies 9 and material performance requirement than higher.And make troubles to processing during pressing plate.
Summary of the invention
The objective of the invention is in order to overcome deficiency of the prior art, provide a kind of and can guarantee the neat flawless pcb board production method that has step trough of ladder cell wall.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Have the pcb board production method of step trough, it is characterized in that, may further comprise the steps:
A, at core material back side Continuous pressing device for stereo-pattern;
B, at first prepreg of core material back side pasting windowed, make adhesive tape be positioned at the window of first prepreg; Second prepreg is sticked in the core material front;
C, the first outer central layer is sticked on the first prepreg surface; The second outer central layer is sticked on the second prepreg surface;
D, lamination;
E, along from the second outer central layer to the core material direction, use the edge cuts of laser along required step trough, after the cutting adhesive tape and the core material that is cut off, second prepreg, the second outer central layer are taken out, promptly form the pcb board that has step trough; Described adhesive tape thickness is suitable with the first semi-solid preparation thickness.
Preferably, the 3rd prepreg that is sticked on the first outer central layer surface, the 3rd outer central layer is sticked on the 3rd prepreg surface.
Preferably, the described the 3rd outer central layer adopts first Copper Foil to replace.
Preferably, the described second outer central layer adopts second Copper Foil to replace.
Preferably, described laser is UV laser or CO
2Laser.
Preferably, described first prepreg, second prepreg, the 3rd prepreg are the lazy flow prepreg, and weight resin content is 60%～80%.
Preferably, described adhesive tape is that high pressure resistant 45 kgfs are more than every square centimeter more than high temperature resistant 230 ℃ of * 3H (230 ℃, 3 hours).
Employed adhesive tape also can be the shape of other step trough of desiring to offer for one side has close-burning rectangle or square among the present invention.Adhesive tape thickness is suitable with the first semi-solid preparation thickness, be as the criterion adhesive tape can be pressed on the first outer central layer when the lamination, adhesive tape is pressed on the first outer central layer, flows between the adhesive tape and the first outer central layer in the time of can preventing the first prepreg lamination adhesive tape is clung.During use, adhesive tape is bonded on the core material, adopts UV or CO
2Be laser-cut into required form.
Beneficial effect of the present invention is: adopt adhesive tape to be attached to the core material back side, be filled in the windowing of prepreg and can stop prepreg, prevent that prepreg from flowing between adhesive tape and the core material after at high temperature softening, take out easily the cutting back.And laser cutting depth controlled when guaranteeing laser cutting; Laser cutting can guarantee the neat zero defect of step trough cell wall.Force fit plate and adhesive tape can take out again easily after the laser cutting simultaneously, not sticking bottom land.And, only needing the prepreg uplifting window between two core materials, other plate need not to window, and operation is few.Effectively simple and convenient enforcement of the inventive method is applicable to the processing step ladder PCB plate.
Description of drawings
Fig. 1 is the step ladder PCB plate structural representation;
Fig. 2 is each layer of step ladder PCB plate structural representation of prior art processing;
Fig. 3 is the side sectional view of step ladder PCB plate of the prior art after each stacked adding;
Fig. 4 is a core material structure schematic diagram;
Fig. 5 is that the step ladder PCB plate structure among first embodiment splits schematic diagram;
Fig. 6 is that front side is cut to cutaway view in each the part stack back of pcb board among first embodiment;
Fig. 7 is the pcb board laser cutting position view among first embodiment;
Fig. 8 is the pcb board structural representation among second embodiment.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in detail:
Embodiment 1:
Have the pcb board production method of step trough, may further comprise the steps:
A, as shown in Figure 4, at core material 4 back sides 44 Continuous pressing device for stereo-pattern 42, described adhesive tape 42 is positioned at the position that need offer step trough;
As shown in Figure 5,
B, at first prepreg 5 of core material 4 back sides 44 pasting windowed, make adhesive tape 42 be positioned at the window 51 of first prepreg 5; Second prepreg 3 is sticked in core material 4 fronts 43; After this step was finished, core material 4 was sandwiched between first prepreg 5 and second prepreg 3;
C, the first outer central layer 6 is sticked on first prepreg, 5 surfaces; The second outer central layer 2 is sticked on second prepreg, 3 surfaces;
After this step was finished, the structural representation of pcb board was followed successively by the second outer central layer 2, second prepreg 3, core material 4, first prepreg, 5, the first outer central layer 6 from top to bottom and superposes successively as shown in Figure 6.
D, lamination;
E, along from the second outer central layer to the core material direction, the A direction among Fig. 6 just, use edge 12 cuttings of laser edge designed step trough as shown in Figure 7, along the degree of depth of A direction cutting for cutting to the adhesive tape place, after cutting is finished, core material, second prepreg, the second outer central layer and other parts in the zone that the edge 12 of step trough surrounds are cut open, adhesive tape and the core material that is cut open, second prepreg, the second outer central layer are taken out, promptly form the pcb board that has step trough as shown in Figure 1.
First prepreg that uses among the present invention, second prepreg, the 3rd prepreg are and are the lazy flow prepreg, and resin content is 60%～80%.The concrete content those skilled in that art of resin can select to determine in aforementioned range.
Described adhesive tape is that high pressure resistant 45 kgfs are more than every square centimeter more than high temperature resistant 230 ℃ of * 3H (230 ℃, 3 hours).
Embodiment 2:
As shown in Figure 8, its on the basis of embodiment 1, the 3rd prepreg 7 that is sticked on the first outer central layer, 6 surfaces, the 3rd outer central layer 8 is sticked on the 3rd prepreg 7 surfaces.Be sticked finish after, the 3rd prepreg 7 is sandwiched between the first outer central layer 6 and the 3rd outer central layer 8.
Embodiment 3:
The difference of itself and embodiment 2 is that the second outer central layer 2 is replaced by second Copper Foil, and the 3rd outer central layer is replaced by first Copper Foil, and all the other structures and step are identical with embodiment 2.
Embodiment among the present invention only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection range of the present invention.
Claims (7)
1. have the pcb board production method of step trough, it is characterized in that, may further comprise the steps:
A, at core material back side Continuous pressing device for stereo-pattern;
B, at first prepreg of core material back side pasting windowed, make adhesive tape be positioned at the window of first prepreg; Second prepreg is sticked in the core material front;
C, the first outer central layer is sticked on the first prepreg surface; The second outer central layer is sticked on the second prepreg surface;
D, lamination;
E, along from the second outer central layer to the core material direction, use the edge cuts of laser along required step trough, after the cutting adhesive tape and the core material that is cut off, second prepreg, the second outer central layer are taken out, promptly form the pcb board that has step trough; Described adhesive tape thickness is suitable with the first semi-solid preparation thickness.
2. the pcb board production method that has step trough according to claim 1 is characterized in that, the 3rd prepreg that is sticked on the first outer central layer surface, and the 3rd outer central layer is sticked on the 3rd prepreg surface.
3. the pcb board production method that has step trough according to claim 2 is characterized in that, the described the 3rd outer central layer adopts first Copper Foil to replace.
4. the pcb board production method that has step trough according to claim 3 is characterized in that, the described second outer central layer adopts second Copper Foil to replace.
5. the pcb board production method that has step trough according to claim 1 is characterized in that described laser is UV laser or CO
2Laser.
6. the pcb board production method that has step trough according to claim 2 is characterized in that described first prepreg, second prepreg, the 3rd prepreg are the lazy flow prepreg, and weight resin content is 60%～80%.
7. the pcb board production method that has step trough according to claim 1 is characterized in that, described adhesive tape is that high pressure resistant 45 kgfs are more than every square centimeter more than high temperature resistant 230 ℃ of * 3H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101974965A CN101695220B (en) | 2009-10-21 | 2009-10-21 | Method for manufacturing PCB with stepped groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101974965A CN101695220B (en) | 2009-10-21 | 2009-10-21 | Method for manufacturing PCB with stepped groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101695220A CN101695220A (en) | 2010-04-14 |
| CN101695220B true CN101695220B (en) | 2011-03-30 |
Family
ID=42094140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101974965A Active CN101695220B (en) | 2009-10-21 | 2009-10-21 | Method for manufacturing PCB with stepped groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101695220B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548258B (en) * | 2011-12-28 | 2014-11-05 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN103179792B (en) * | 2013-03-08 | 2015-08-19 | 深圳崇达多层线路板有限公司 | A kind of method improving step trough sidewall evenness |
| CN104202926A (en) * | 2014-08-21 | 2014-12-10 | 广州杰赛科技股份有限公司 | Printed circuit board manufacturing method |
| CN105228357B (en) * | 2015-09-24 | 2017-12-01 | 广州杰赛科技股份有限公司 | A kind of preparation method of ladder wiring board |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
| CN107683031B (en) * | 2017-11-07 | 2020-11-10 | 珠海杰赛科技有限公司 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
| CN108990319B (en) * | 2018-08-01 | 2023-12-05 | 广州美维电子有限公司 | Stepped plate pressing and stacking structure and manufacturing method thereof |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
-
2009
- 2009-10-21 CN CN2009101974965A patent/CN101695220B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101695220A (en) | 2010-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101695220B (en) | Method for manufacturing PCB with stepped groove | |
| CN101699937B (en) | Method for producing stepped PCB board | |
| CN108990319B (en) | Stepped plate pressing and stacking structure and manufacturing method thereof | |
| CN105228371B (en) | A kind of method for making ladder golden finger circuit board | |
| CN104735924B (en) | Technique of uncapping for multi-step shape Rigid Flex | |
| CN102595789A (en) | Production method of cavity PCB plate | |
| CN103687308B (en) | Blind hole crimping multilayer board and preparation method thereof | |
| CN102811567A (en) | Flexible and rigid combined plate process and uncapping method | |
| CN102946687A (en) | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof | |
| CN101626660B (en) | Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures | |
| CN102510679B (en) | The processing method of the pcb board that soft or hard combines | |
| CN103327756A (en) | Multilayer circuit board with partial mixed structure and manufacturing method thereof | |
| CN111565523A (en) | Manufacturing method of second-order copper block-buried circuit board | |
| WO2009016534A3 (en) | Cross directional zoned bicomponent films, film laminates, and systems and method for manufacture of the same | |
| CN103929899A (en) | Manufacturing method for circuit board blind hole | |
| CN104701443A (en) | LED substrate applicable to simple line COB package and method for preparing same | |
| CN107613674A (en) | The preparation method of one stepped PCB board | |
| CN112739072A (en) | Preparation method of rigid-flex board | |
| CN107683031A (en) | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film | |
| CN109152223B (en) | Manufacturing method of rigid-flex board | |
| CN104159394B (en) | A kind of PCB sections and preparation method thereof | |
| CN112584629B (en) | Printed circuit board and manufacturing method thereof | |
| CN106257971A (en) | Multilayer blind plate and manufacture method thereof | |
| CN113825326B (en) | Manufacturing method of printed circuit board capable of effectively improving glue overflow in cavity area of carrier-like board | |
| CN103732008B (en) | Connecting sheet circuit board and the manufacture method of connecting sheet circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |