CN107683031A - A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film - Google Patents
A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film Download PDFInfo
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- CN107683031A CN107683031A CN201711085795.0A CN201711085795A CN107683031A CN 107683031 A CN107683031 A CN 107683031A CN 201711085795 A CN201711085795 A CN 201711085795A CN 107683031 A CN107683031 A CN 107683031A
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- adhesive tape
- rigid
- prepreg
- combined board
- flex combined
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of processing method for solving rigid-flex combined board outer-layer circuit and making film, it is related to printed circuit board production field, adhesive tape is filled in the prepreg windowed regions of rigid-flex combined board, the rigid-flex combined board for filling adhesive tape is pressed, specifically include adhesive tape gluing, adhesive tape is cut, the step such as adhesive tape trimming and the pressing of adhesive tape filling block, this method makes PP windowed regions be filled with the adhesive tape of uniform thickness, plate face is smooth after pressing, it is normal to make outer-layer circuit, the present invention uses new filling manufacture craft, it is difficult can to solve the contraposition of FR4 filling blocks, the problems such as pressing displacement, with cost-effective, it is simple to operate, the advantages that operating efficiency is high.
Description
Technical field
The present invention relates to PCB production fields, more particularly to a kind of rigid-flex combined board outer-layer circuit that solves to make adding for film
Work method.
Background technology
With PCB (Printed Circuit Board, printed circuit board) to small volume, it is in light weight, it is three-dimensional installation and
The direction of high connecting reliability is developed, flexible printed-circuit board hair Zhang Xunmeng, and starts to develop to printed board combining rigidness and flexibleness direction,
Printed board combining rigidness and flexibleness is one of main growth factor of PCB industry futures.
At present, the preparation method of printed board combining rigidness and flexibleness mainly takes rigid core plate, prepreg, flexible core in industry
The structure fabrication of plate, prepreg and rigid core plate, flexible core plate is in centre under normal circumstances, rigid core plate on both sides, wherein
Rigid core plate can use multiple, and flexible core plate can also use multiple, i.e., level can be 3-N layers, and general minimum layer is three
One layer of layer, i.e. one layer of rigidity, prepreg, flexible one layer, prepreg and rigidity.
The mode that generally use control is uncapped deeply in industry at present makes, i.e., preceding pure with the pressing of flexible core plate in rigid core plate
The prepreg gong of flexure region falls, then the rigid core plate pre-control depth certain depth in flexible layers, anti-when being finally molded
Face is uncapped deeply from top bottom control, exposes pure flexure region, rigid-flex combined board is obtained after shaping.
Above Normal practice, the prepreg of the first pure flexure region of gong before lamination, than remaining position when causing this to be in pressing
Set low, herein because prepreg is fallen by gong, the thickness of the thin prepreg in remaining position of thickness ratio is pressed, if multiple flexible cores
The plank that plate combines with multiple prepregs, herein position pressing when can multiple prepregs thinner than remaining position thickness,
The number of plies is higher, and the more rigid-flex combined board of flexible layers is more obvious.The out-of-flatness of plate face during because of pressing, can not be effectively and uniformly
Pressing pressure is born, therefore needs to cover type, silica gel or PE films in lamination height using silica gel or PE films during rigid-flex combined board pressing
It can soften and melt under temperature state, in the case where pressure is certain, plate face compares when silica gel or PE films can flow directly into pressing
Low position, plate face is filled, plate face uniform-compression when making pressing, complete the pressing of rigid-flex combined board.Because have herein after pressing
Silica gel or PE films cover type, in the timing of pressure one, receive the extruding of silica gel or PE films herein, rigid core plate and flexible core plate it
Between supported without prepreg, rigid core plate can be toward being recessed at flexible core plate, and recessed position is since rigid-flexible junction towards semi-solid preparation
Piece windowing intermediate region extension, the number of plies is higher, and flexible core plate is thicker, more obvious when prepreg is more.
Recessed position is when outer photoimaging makes outer-layer circuit herein, because of plate face out-of-flatness, on depression side after dry film laminating
Edge position is pasted loosely, is recessed middle hanging, and because dry film pastes loosely, outer-layer circuit makes for depression intersection (rigid-flexible junction) position
When, after exposure aligning development, the developed liquid medicine of dry film washes out herein, after plating copper and tin makes, is not required here on the position of tin
Tin, residual copper herein after etching, causes short circuit.
Such a situation is run into industry at present, when generally suggesting Customer design, is not designed away in 5mm regions nearby here
Line, but the method major part plate client will not agree to, designing wiring space wretched insufficiency, and the method is infeasible.The opposing party
Method, i.e., most of producer are made using completion method, and in pressing, gong falls prepreg region and puts filling block (logical window uses FR4 light
Plate) filling prepreg windowed regions, but the FR4 tabula rasas suitably with prepreg consistency of thickness are difficult to find that, work it out
Or effect is that filling block is too high, ruptured after plank pressing, otherwise it is too low, equally exist depression after plank pressing.The method is also
Having one disadvantage in that, filling block needs milling to open when making, either milling profile is consistent with prepreg windowing, or milling profile is more solid than half
It is small to change piece windowed regions.When filling block size is consistent with prepreg windowed regions, because of reasons such as itself plank harmomegathus, cause to fill out
Fill block and prepreg windowed regions size is variant, be difficult often that filling is entered during pressing.Filling block opens a window than prepreg
Region hour, filling block has displacement after pressing, be recessed and equally exists after causing pressing, simply by integrally becoming for part, equally
Can not solve development and fall film exception.
The content of the invention
In view of this, the invention discloses a kind of processing method for solving rigid-flex combined board outer-layer circuit and making film, adopt
With new filling manufacture craft, can solve the problems such as difficult FR4 filling blocks contraposition, pressing displacement, there is cost-effective, operation
Simply, the advantages that operating efficiency is high.
The present invention is solved the above problems by following technological means：
A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film, it is characterised in that in rigid-flex combined board
Prepreg windowed regions in filling adhesive tape, by fill adhesive tape rigid-flex combined board pressed.
Further, specifically comprise the following steps：
A1) adhesive tape gluing：Rigid-flex combined board sticks adhesive tape close to the rigid plate face whole plate of prepreg；
A2) adhesive tape is cut：According to the positions and dimensions of prepreg windowed regions, formed using the adhesive tape is cut by laser
The adhesive tape filling block of prepreg windowed regions can be filled；
A3) adhesive tape trimming：Adhesive tape edge is torn along the track of laser cutting, retains adhesive tape filling block；
A4) adhesive tape filling block presses：The rigid-flex combined board for posting adhesive tape filling block is pressed.
Further, the adhesive tape cutting step specifically includes：According to the positions and dimensions of prepreg windowed regions, make
The adhesive tape filling block that can be filled prepreg with the adhesive tape formation is cut by laser and be opened a window, the side ratio half of the adhesive tape filling block
The short 0.04-0.06mm of the corresponding length of side of cured sheets windowed regions.Four length of sides of adhesive tape filling block are shorter than prepreg and opened
It is easy to adhesive tape filling block being directly pressed into prepreg windowed regions in window region.
Further, the adhesive tape selects high temperature resistant PI glue band.
Further, the thickness of the high temperature resistant PI glue band is 0.05-0.3mm.
The processing method that a kind of solution rigid-flex combined board outer-layer circuit of the present invention makes film has the advantages that：
The present invention uses new filling manufacture craft, before rigid-flex combined board pressing, is filled using the adhesive tape of excision forming
The windowed regions of prepreg, adhesive tape is filled in the prepreg windowed regions of rigid-flex combined board, the rigid-flexible of adhesive tape will be filled
Board is pressed, and specifically includes the steps such as adhesive tape gluing, adhesive tape cutting, adhesive tape trimming and the pressing of adhesive tape filling block, the party
Method makes PP windowed regions be filled with the adhesive tape of uniform thickness, and plate face is smooth after pressing, normal to make outer-layer circuit, and the present invention uses
New filling manufacture craft, can solve the problems such as difficult FR4 filling blocks contraposition, pressing displacement, have the following advantages that：
1st, FR4 fillings block cost is higher, and needs to etch away surface copper sheet, and the gong by way of gong profile before pressing
Go out, PI glue band can be placed directly against in the rigid plate for needing to press, and by the way of laser, cut out the position for needing also to retain adhesive tape
Figure is put, remaining position removes, and high temperature resistant PI glue band cost is lower, and processing cost is also minimum.
2nd, prepreg windowed regions are filled using high temperature resistant PI glue band, laser direct forming can be used, it is not necessary to adopt
Aligned with FR4 filling blocks, without considering that plank harmomegathus problem, operating process are put into and fixed repeatedly the steps such as filling block, flow
It is simple to operate, it is more efficient.
3rd, because of plank harmomegathus, contraposition to be also present difficult in bonding processes for traditional FR4 filling blocks, can not effectively fill with
Displacement etc. is abnormal, can there is local dent after filling, can not effectively solve the problems, such as to fall film after outer photoimaging development, yield rate compared with
It is low, can effectively it be filled using high temperature resistant PI glue band, falling film can prevent completely extremely.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in embodiment will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of embodiment.
In figure：1- rigid plates, 2- prepregs, 3- flex plates, 4- high temperature resistant PI glues band, 5- cover layers, 6- through holes.
Embodiment
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "front", "rear", " left side ",
The orientation or position relationship of the instruction such as " right side ", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are based on shown in the drawings
Orientation or position relationship, be for only for ease of the description present invention and simplify description, rather than instruction or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.Art
Language " first ", " second " are only used for describing purpose, and it is not intended that instruction or implying relative importance or implicit indicating institute
The quantity of the technical characteristic of instruction.Thus, " first " is defined, one can be expressed or be implicitly included to the feature of " second "
Or more this feature.In the description of the invention, unless otherwise indicated, " multiple " are meant that two or more.
Below with reference to accompanying drawing, the present invention is described in detail.
Structure shown in Fig. 1 is six veneer structures, and rigid-flex combined board is both needed to examine by IPC grade III Standards more than six layers, it is desirable to
Need to meet dielectric layer >=90um after lamination, national military standard (GJB-3062A) is regardless of level, all types plate, dielectric thickness pressing
After be both needed to >=90um.Therefore general producer usual lamination when designing rigid-flex combined board can use two prepregs to be laminated, in order to
Excessive glue is controlled, most of producer is made using 1080+106 models prepreg, gross thickness about 0.13mm,
Technical scheme provided by the invention uses a kind of high temperature resistant PI glue band 4, is resistant to 250 degree of temperature, at this temperature not
Fall glue, deform, and thickness is optional in 0.05-0.3mmmm, and according to conventional lamination, 0.13mm glue is used in the present embodiment
Band makes, and above-mentioned thickness should match with prepreg windowing thickness, can effectively fill.And the viscosity of glue can be utilized, pressing
Adhesive tape whole plate is attached to before closing in the rigid plate 1 for needing to press, does laser data, prepreg is opened a window by way of laser
Need to fill the position adhesive tape shaping of adhesive tape, adhesive tape profile small 0.05mm more unilateral than windowed regions profile, after laser, tear remaining
Regional location adhesive tape, prepreg windowed regions adhesive tape retain, then normal lamination, and outer-layer circuit is normally made after pressing and is
Can, adhesive tape filling production effect is good and without exception.
The effect of through hole 6 is conducting internal layer in Fig. 1, turns on each level, that is, needs to insert device above on wiring board,
Pin is inserted in this hole, then welds tin cream, is finally formed the performance of circuit.Device can be inserted on through hole.
It should be noted that traditional FR4 materials can effectively be substituted as packing material using high temperature resistant PI glue band 4,
Simultaneously using pressing stacked system, prepreg windowed regions, the visible Fig. 1 of lamination, specific production stream are filled by high temperature gummed tape
Journey is as follows：
Flex plate 3：Sawing sheet-interior photoimaging-internal layer etching inspection-supporting center-flow.
Cover layer 5：Sawing sheet-cutting/laser cutting-auxiliary material is supporting.
Prepreg 2：Sawing sheet-hole milling-auxiliary material is supporting, it is necessary to which explanation is：Hole milling is that flexure region is unwanted
Prepreg is emptied.
High temperature resistant PI glue band 4：Sawing sheet-cutting/laser cutting-auxiliary material is supporting.
The Making programme of rigid plate 1 can be divided into two kinds：One kind is that the one side of flex plate 3 is 1-2 layers rigidity or is that multilayer is firm
Property plate 1, the number of plies of multilayer rigid plate is generally higher than equal to 2 layers, and the Making programme of 1-2 layers rigid plate 1 is as follows：
Rigid plate 1 (1-2 layers)：Sawing sheet-interior photoimaging-punching-internal layer etching inspection-milling blind slot-is taped-matched somebody with somebody
Set center-flow.It should be noted that above-mentioned tape refers to local patch high temperature resistant PI glue band 4, above-mentioned flow, which refers to use, is
The mode that adhesive tape locally pastes makes.Adhesive tape production method can be divided into two kinds, and a kind of a kind of whole plate patch, part is pasted.It is if whole
Plate pastes, then the flow of high temperature resistant PI glue band 4 need not.
Rigid plate 1 (1-2 layers)：Sawing sheet-interior photoimaging-punching-internal layer etching examine-tape-is cut by laser-milling
Blind slot-supporting center-flow.Refer to whole plate patch high temperature resistant PI glue band 4 it should be noted that taping, laser cutting refers to
Make laser data cutting high temperature resistant PI glue band 4.
Rigid plate 1 (>=2 layers)：
1-2 laminar flow journeys：Sawing sheet-interior photoimaging-punching-internal layer etching inspection -- supporting center-flow
3-4 laminar flow journeys：Sawing sheet-interior photoimaging-punching-internal layer etching inspection -- supporting center-flow
Rigid plate 1-4 laminar flow journeys, refer to and 1-2 layers and 3-4 laminations are closed：Pressing-drilling-interior photoimaging -- internal layer etches
It examine-tape-is cut by laser the supporting center-flow of-milling blind slot-.It should be noted that：Tape and refer to that whole plate patch is resistance to
High temperature PI glue band 4, laser cutting refer to do laser data cutting high temperature resistant PI glue band 4, and this flow is that whole plate is taped flow.
1-4 laminar flow journeys, refer to 1-2 layers and 3-4 laminations to close：Pressing-drilling-interior photoimaging-internal layer etching inspection-milling
Blind slot-tape-supporting center-flow.Adhesive tape production method can be divided into two kinds, and a kind of a kind of whole plate patch, part is pasted.
If whole plate is pasted, then the flow of high temperature resistant PI glue band 4 need not.Refer to local patch high temperature resistant PI it should be noted that taping
Adhesive tape 4, the mode that above-mentioned flow refers to locally paste using adhesive tape make.
CS-SS flows, i.e., the flow that final all core plates all press together：Pressing-drilling-heavy copper-plate face electricity
Plating-outer photoimaging-plating copper and tin-alkali etching-outer layer etching inspection-welding resistance-character-surface treatment-milling side-survey
Examination-final inspection-packaging-finished product delivery.
Technical scheme provided by the invention uses a kind of high temperature resistant PI glue band 4, is resistant to 250 degree of temperature, at this temperature not
Fall glue, deform, and thickness is optional in 0.05-0.3mm, and according to conventional lamination, 0.13mm adhesive tape is used in the present embodiment
Make, above-mentioned thickness should match with prepreg windowing thickness, can effectively fill.And the viscosity of glue can be utilized, pressing
It is preceding that adhesive tape whole plate is attached in the rigid plate 1 for needing to press, laser data is done, prepreg, which is opened a window, by way of laser needs
The position adhesive tape for filling adhesive tape is molded, adhesive tape profile small 0.05mm more unilateral than windowed regions profile, and after laser, tear remaining area
Domain position adhesive tape, prepreg windowed regions adhesive tape retain, and then normal lamination, normally makes outer-layer circuit after pressing,
Adhesive tape filling production effect is good and without exception.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (5)
1. a kind of processing method for solving rigid-flex combined board outer-layer circuit and making film, it is characterised in that in rigid-flex combined board
Filling adhesive tape in prepreg windowed regions, the rigid-flex combined board for filling adhesive tape is pressed.
2. solves the processing method that rigid-flex combined board outer-layer circuit makes film as claimed in claim 1, it is characterised in that tool
Body comprises the following steps：
A1) adhesive tape gluing：In rigid-flex combined board adhesive tape is sticked close to the rigid plate face whole plate of prepreg；
A2) adhesive tape is cut：According to the positions and dimensions of prepreg windowed regions, formed and can filled out using the adhesive tape is cut by laser
Fill the adhesive tape filling block of prepreg windowed regions；
A3) adhesive tape trimming：Adhesive tape edge is torn along the track of laser cutting, retains adhesive tape filling block；
A4) adhesive tape filling block presses：The rigid-flex combined board for posting adhesive tape filling block is pressed.
3. solves the processing method that rigid-flex combined board outer-layer circuit makes film as claimed in claim 2, it is characterised in that institute
Adhesive tape cutting step is stated to specifically include：According to the positions and dimensions of prepreg windowed regions, the laser cutting adhesive tape is used
The adhesive tape filling block of prepreg windowing, pair of the side ratio prepreg windowed regions of the adhesive tape filling block can be filled by being formed
Answer the short 0.04-0.06mm of the length of side.
4. the processing method for solving rigid-flex combined board outer-layer circuit and making film as described in claim 1-3 any one, its
It is characterised by, the adhesive tape selects high temperature resistant PI glue band.
5. solves the processing method that rigid-flex combined board outer-layer circuit makes film as claimed in claim 4, it is characterised in that institute
The thickness for stating high temperature resistant PI glue band is 0.05-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085795.0A CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085795.0A CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN107683031A true CN107683031A (en) | 2018-02-09 |
| CN107683031B CN107683031B (en) | 2020-11-10 |
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| CN201711085795.0A Active CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654175A (en) * | 2020-11-12 | 2021-04-13 | 安徽四创电子股份有限公司 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
| CN112888172A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Adhesive tape-assisted processing method and device for realizing blind slot of multilayer printed circuit board |
| CN112911809A (en) * | 2021-01-19 | 2021-06-04 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind slot structure of multilayer printed circuit board |
| CN113891583A (en) * | 2021-09-27 | 2022-01-04 | 九江明阳电路科技有限公司 | Anti-layering laminating method for PCB cover plate |
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| CN112654175A (en) * | 2020-11-12 | 2021-04-13 | 安徽四创电子股份有限公司 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
| CN112888172A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Adhesive tape-assisted processing method and device for realizing blind slot of multilayer printed circuit board |
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| CN113891583A (en) * | 2021-09-27 | 2022-01-04 | 九江明阳电路科技有限公司 | Anti-layering laminating method for PCB cover plate |
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| Publication number | Publication date |
|---|---|
| CN107683031B (en) | 2020-11-10 |
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