CN106341944B - A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad - Google Patents
A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad Download PDFInfo
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- CN106341944B CN106341944B CN201610862545.2A CN201610862545A CN106341944B CN 106341944 B CN106341944 B CN 106341944B CN 201610862545 A CN201610862545 A CN 201610862545A CN 106341944 B CN106341944 B CN 106341944B
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- internal layer
- dry film
- rigid
- successively
- pad
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention discloses a kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad.Production method includes step：A, first core material is exposed, developed and etched successively, produce inner figure, then paste internal layer dry film and printing anti-etching printing ink successively；B, core material, PP glue, copper foil are overlapped successively in sequence, laminate structure is：Copper foil+PP glue+core material+PP glue+copper foil, has overlapped and has been suppressed；C, it is drilled successively, heavy copper and plating；D, patch outer layer dry film, exposure, development and etching are carried out successively, produce outer graphics；E, it and then carries out taking off film, takes off in membrane process and internal layer dry film, anti-etching printing ink and outer layer dry film fade away.The present invention solves the problems, such as that ink sealing of hole is bad, has saved manpower, improve production efficiency, outer-layer circuit Yield lmproved 10% or more.
Description
Technical field
The present invention relates to rigid-flex combined board manufacture technology field more particularly to a kind of rigid-flexible combinations for protecting internal layer pad
Plate and preparation method thereof.
Background technology
Rigid-flex combined board is a kind of special wiring board being combined by flexible board and rigidity plate, special due to structure
Property, overlapped again with copper-clad plate so needing first to carry out the circuit of flexible board, drilled again after overlapping, heavy copper facing, outer layer line
The making in the later stages such as road.
After most of rigid-flex combined board lamination, it is exposed to have pad, finger etc. in internal layer flexible board part, if not into
Row is protected, and can sting erosion by liquid medicine in outer-layer circuit etching process causes pad to lack, product rejection.
The protected mode used in industry at present has adhesive tape, ink, dry film etc..Different modes has its respective excellent scarce
Point, ink protects sealing of hole energy force difference, for big edge PTH hole（Plated through-hole）Sealing of hole effect is not had with slot；Adhesive tape protection life
It is low to produce efficiency, easily falls glue；Dry film high temperature resistance is poor, and dry film cracking, outer layer erosion are susceptible to after curing by high-temperature laminating
Pad corrosion is protected when quarter and moves back film problem not to the utmost generates.And for the flexible board existing edge PTH hole of protection welding disking area and slot
The protected mode of rigid-flex combined board requires tightened up, difficulty bigger.Adhesive tape protection is typically chosen in industry, but for protective position
When irregular, it is big that adhesive tape is difficult to be molded and be bonded tolerance, while adhesive tape also needs to manually be bonded and tear off, low production efficiency.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of rigid-flexible knots for protecting internal layer pad
Plywood and preparation method thereof, it is intended to solve bad to internal layer pad protecting effect in rigid-flex combined board manufacturing process in the prior art
The problem of.
Technical scheme is as follows：
A kind of rigid-flex combined board production method for protecting internal layer pad, wherein including：
Step A, first core material is exposed, developed and etched successively, produce inner figure, then successively in patch
Layer dry film and printing anti-etching printing ink；
Step B, core material, PP glue, copper foil are overlapped successively in sequence, laminate structure is：Copper foil+PP glue+internal layer
Core plate+PP glue+copper foil, has overlapped and has been suppressed；
Step C, it is drilled successively, heavy copper and plating；
Step D, patch outer layer dry film, exposure, development and etching are carried out successively, produce outer graphics；
Step E, it and then carries out taking off film, takes off in membrane process and internal layer dry film, anti-etching printing ink and outer layer dry film fade away.
The rigid-flex combined board production method for protecting internal layer pad, wherein first dry with internal layer in the step A
Film by core material pad slot and edge PTH hole region be bonded, to be protected.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step A, internal layer dry film ratio
Slot and the unilateral big 0.5-1.0mm of edge PTH hole.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step A, anti-etching printing ink
Using screen painting.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step A, anti-etching printing ink
The position of printing include core material the pad of protection in need and the slot in respective pad and edge PTH hole region.
The rigid-flex combined board production method for protecting internal layer pad, wherein against corrosion in slot and edge PTH hole region
Carve ink big 0.5-1.0mm more unilateral than internal layer dry film.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step D, outer layer dry film
Thickness is 30-40 μm.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step E, take off film speed by
According to 1.8-2.4m/min.
The rigid-flex combined board production method for protecting internal layer pad, wherein in the step D, developing powder is pressed
According to 1.8-2.2m/min.
A kind of rigid-flex combined board for protecting internal layer pad, wherein be made of any one of them production method as above.
Advantageous effect：The present invention solves the problems, such as that ink sealing of hole is bad, protects welding disking area to have edge PTH hole and slot for internal layer
The making of the rigid-flex combined board in hole provides guarantee.Present invention eliminates torn after outer layer etching when individually being made of dry film protection
The step of copper sheet, has saved manpower, improves production efficiency.Present invention improves caused by dry film breakage pad corrosion it is bad
Phenomenon, outer-layer circuit Yield lmproved 10% or more.
Description of the drawings
Fig. 1 is a kind of flow chart for the rigid-flex combined board production method preferred embodiment for protecting internal layer pad of the present invention.
Fig. 2 is an a kind of specific production flow diagram of the rigid-flex combined board for protecting internal layer pad of the present invention.
Specific implementation mode
The present invention provides a kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad, to make the mesh of the present invention
, technical solution and effect it is clearer, clear, the present invention is described in more detail below.It should be appreciated that described herein
Specific embodiment be only used to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of rigid-flex combined board production method preferred embodiment for protecting internal layer pad of the present invention
Flow chart, as shown in the figure comprising：
Step S1, first core material is exposed, developed and etched successively, produced inner figure, then paste successively
Internal layer dry film and printing anti-etching printing ink；
Step S2, core material, PP glue, copper foil are overlapped successively in sequence, laminate structure is：Copper foil+PP glue+internal layer
Core plate+PP glue+copper foil, has overlapped and has been suppressed；
Step S3, it is drilled successively, heavy copper and plating；
Step S4, patch outer layer dry film, exposure, development and etching are carried out successively, produce outer graphics；
Step S5, it and then carries out taking off film, takes off in membrane process and internal layer dry film, anti-etching printing ink and outer layer dry film fade away.
The rigid-flex combined board is 4 laminates or 6 laminates.It is illustrated by taking 4 laminates as an example below.
Specifically, as shown in Fig. 2, in the step S1, first core material 100 is exposed successively, develop and
Etching, produces inner figure, then pastes internal layer dry film 110 and printing anti-etching printing ink 120 successively again.
Core material 100 is dual platen, and the internal layer dry film 110 being bonded can be GPM220, the thickness of internal layer dry film
Preferably 40 ~ 60 μm, such as 50 μm, first use internal layer dry film 110 by the slot and edge PTH hole region patch on 100 pad of core material
It closes, to be protected.In addition, internal layer dry film big 0.5-1.0mm more unilateral than slot and edge PTH hole, internal layer dry film is more unilateral than slot big
0.5-1.0mm, internal layer dry film big 0.5-1.0mm more unilateral than edge PTH hole.Series is exposed at 6-7 grades（21 grades of exposure guide rules）.GPM220 its
High temperature resistant, pressing effect is good, and it is good to take off film effect, it is ensured that internal layer dry film will not be denaturalized during high-temperature laminating, be fallen off, outer layer
Etching takes off that will not to take off film after film not clean.It has been required to the covering of internal layer dry film in edge PTH hole and slot on all internal layer pads, and has covered
Capping product is unilateral bigger 0.5-1.0mm than via hole and slot respectively.
Screen painting can be used in printing anti-etching printing ink 120, for example, by using 36-77T screen paintings, printing parameter control：
Scraper angle：30-45°（Such as 40 °）, print speed printing speed：3-4 lattice（Such as 4 lattice）, scraper hardness：70-75°（Such as 72 °）.Anti-etching oil
Ink 120 printing position include on core material 100 the pad of protection in need and the slot on pad and edge PTH hole area
Domain.Anti-etching printing ink 120 needs to select high temperature resistant pressing and takes off the good material of film effect, and the present invention selects AMW-303, it is ensured that
Dry film will not be denaturalized during high-temperature laminating, be fallen off, and outer layer etching takes off that will not to take off film after film not clean.
In addition, slot and 120 area coverage of the anti-etching printing ink in edge PTH hole region are needed than 110 big 0.5- of internal layer dry film
1.0mm, for reinforcing the protection of edge PTH hole and slot, it is ensured that internal layer dry film 110 is all covered by anti-etching printing ink.
That is, the present invention protects internal layer pad using the method for dry film+ink.I.e.：First internal layer dry film 110 is used to protect
Good edge PTH hole and slot, then in all areas of internal layer pad（Including on internal layer dry film）Anti-etching printing ink 120 is printed to protect.
That is, the present invention is that grooved hole and edge PTH hole region carry out printing anti-etching printing ink on core material 100
120 and 110 duplicate protection of patch internal layer dry film, the other regions of pad are only needed to protect using anti-etching printing ink 120, are not required to
Internal layer dry film 110 is used to protect.
In the step S2, the PP glue 130 used required for lamination and pure copper foil 140 are first provided, then by internal layer core
Plate 100, PP glue 130, copper foil 140 overlap successively in sequence, and laminate structure is：Copper foil 140+PP glue 130+ core materials 100+
PP glue 130+ copper foils 140, have overlapped and have been suppressed.
In the step S3, it is drilled successively, heavy copper and plating.
In the step S4, patch outer layer dry film, exposure, development and etching are carried out successively, produces outer graphics.
Wherein, the thickness of outer layer dry film is 30-40 μm, such as 35 μm.Series is exposed according to 6-7 grades（21 grades of exposure guide rules）It exposes
Light.Developing powder is according to 1.8-2.2m/min, such as 2.0m/min.Etching speed is adjusted according to copper thickness.It is carried out after etching
Film is taken off, takes off film speed according to 1.8-2.4m/min, such as 2.1 m/min.Film is taken off herein by outer layer dry film, it is anti-on internal layer pad
Etching ink 120 and internal layer dry film 110 all fade away, and finally leave the circuit and pad of internal layer and outer layer.Through the invention
Method finger and pad exposed on plate can be protected, to provide safeguard for the production of rigid-flex combined board, take off film and go out
The making of processing procedure after continuing according to the flow of rigid-flex combined board after coming.
The present invention also provides a kind of rigid-flex combined board preferred embodiment for protecting internal layer pad, the system is used
It is made as method.
The present invention solves the problems, such as that ink sealing of hole is bad, protects welding disking area to have the rigid-flexible of edge PTH hole and slot for internal layer
The making of board provides guarantee.Present invention eliminates the steps that copper sheet is torn after outer layer etching when individually being made of dry film protection
Suddenly, manpower has been saved, production efficiency is improved.Present invention improves the pad corrosion bad phenomenons caused by dry film breakage, outside
Sandwich circuit Yield lmproved 10% or more.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (8)
1. a kind of rigid-flex combined board production method for protecting internal layer pad, which is characterized in that including：
Step A, first core material is exposed, developed and etched successively, produce inner figure, then patch internal layer is dry successively
Film and printing anti-etching printing ink；
Step B, core material, PP glue, copper foil are overlapped successively in sequence, laminate structure is：Copper foil+PP glue+core material+
PP glue+copper foil, has overlapped and has been suppressed；
Step C, it is drilled successively, heavy copper and plating；
Step D, patch outer layer dry film, exposure, development and etching are carried out successively, produce outer graphics；
Step E, it and then carries out taking off film, takes off in membrane process and internal layer dry film, anti-etching printing ink and outer layer dry film fade away；
In the step A, first use internal layer dry film by core material pad slot and edge PTH hole region be bonded, to be protected；
In the step A, anti-etching printing ink printing position include core material institute protection in need pad, and accordingly weld
Slot on disk and edge PTH hole region.
2. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that the step
In rapid A, internal layer dry film big 0.5-1.0mm more unilateral than slot and edge PTH hole.
3. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that the step
In rapid A, anti-etching printing ink uses screen painting.
4. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that in slot
With edge PTH hole region, anti-etching printing ink big 0.5-1.0mm more unilateral than internal layer dry film.
5. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that the step
In rapid D, the thickness of outer layer dry film is 30-40 μm.
6. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that the step
In rapid E, film speed is taken off according to 1.8-2.4m/min.
7. the rigid-flex combined board production method according to claim 1 for protecting internal layer pad, which is characterized in that the step
In rapid D, developing powder is according to 1.8-2.2m/min.
8. a kind of rigid-flex combined board for protecting internal layer pad, which is characterized in that using such as claim 1 ~ 7 any one of them
Production method is made.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610862545.2A CN106341944B (en) | 2016-09-29 | 2016-09-29 | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad |
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| CN201610862545.2A CN106341944B (en) | 2016-09-29 | 2016-09-29 | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad |
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| CN106341944A CN106341944A (en) | 2017-01-18 |
| CN106341944B true CN106341944B (en) | 2018-09-07 |
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| CN109104824A (en) * | 2018-08-31 | 2018-12-28 | 广东成德电子科技股份有限公司 | A kind of production method of rigid-flexible combined circuit plate |
| EP3820258A1 (en) | 2019-11-08 | 2021-05-12 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with exposed layer |
| CN112243319B (en) * | 2020-10-28 | 2022-03-01 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN115087223B (en) * | 2022-07-01 | 2024-03-29 | 湖北龙腾电子科技股份有限公司 | Process method for solving PCB solder mask ghosting and PCB |
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| CN106341944A (en) | 2017-01-18 |
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