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WO2021200820A1 - Tableau de connexions imprimé et son procédé de fabrication - Google Patents

Tableau de connexions imprimé et son procédé de fabrication Download PDF

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Publication number
WO2021200820A1
WO2021200820A1 PCT/JP2021/013285 JP2021013285W WO2021200820A1 WO 2021200820 A1 WO2021200820 A1 WO 2021200820A1 JP 2021013285 W JP2021013285 W JP 2021013285W WO 2021200820 A1 WO2021200820 A1 WO 2021200820A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
hole
printed wiring
layer
wiring board
Prior art date
Application number
PCT/JP2021/013285
Other languages
English (en)
Japanese (ja)
Inventor
啓作 松本
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2022512209A priority Critical patent/JPWO2021200820A1/ja
Publication of WO2021200820A1 publication Critical patent/WO2021200820A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • This disclosure relates to a printed wiring board and a method for manufacturing the printed wiring board.
  • the printed wiring board of the present disclosure has an insulating substrate and a conductor portion arranged at least inside the insulating substrate.
  • the insulating substrate has a plurality of laminated insulating layers and through holes penetrating from the first opening to the second opening in the thickness direction.
  • the conductor portion has a plurality of conductor layers and a through-hole conductor.
  • the plurality of conductor layers are located along the plane direction in each of the insulating layers.
  • the through-hole conductor has a cylindrical shape extending from the first opening toward the second opening.
  • the through-hole conductor is electrically connected to a part of the plurality of conductor layers at the existing position.
  • the plurality of conductor layers have at least one non-connecting conductor layer that is not in contact with the through-hole conductor near the second opening of the through-hole conductor.
  • the through-hole conductors have different positions in the thickness direction of the first end portion and the second end portion, which are two end portions close to the second opening, in a cross-sectional view along the central axis of the through hole.
  • the printed wiring board of the present disclosure has an insulating substrate and a conductor portion arranged at least inside the insulating substrate.
  • the insulating substrate has a plurality of laminated insulating layers and through holes penetrating from the first opening to the second opening in the thickness direction.
  • the conductor portion has a plurality of conductor layers and a through-hole conductor.
  • the plurality of conductor layers are located along the plane direction in each of the insulating layers.
  • the through-hole conductor has a cylindrical shape extending from the first opening toward the second opening.
  • the through-hole conductor is electrically connected to a part of the plurality of conductor layers at the existing position.
  • the plurality of conductor layers have at least one non-connecting conductor layer that is not in contact with the through-hole conductor near the second opening of the through-hole conductor.
  • the end face of the through-hole conductor near the second opening is inclined with respect to the central axis of the through-hole.
  • the method for manufacturing a printed wiring board of the present disclosure includes an insulating substrate in which a plurality of insulating layers are laminated, a conductor layer provided along the surface of the insulating layer, and a through hole penetrating the insulating substrate in the thickness direction. Including a step of preparing a multilayer substrate having a copper through-hole conductor original body covering the inner wall of the material. The manufacturing method includes a step of forming a protective layer which is not dissolved by the copper etching solution on the entire inner wall of the through-hole conductor raw material provided on the multilayer substrate.
  • the manufacturing method uses a cutting jig having a diameter larger than the inner diameter of the through-hole conductor original body and having a tapered tip portion, and the axial center of the through hole is the through hole.
  • the through-hole conductor original body and the protective layer are cut from one surface side of the multilayer substrate to a position in the middle of the thickness direction of the multilayer substrate by arranging the through-hole conductor original body and the protective layer at a position deviated from the central axis of the multilayer substrate.
  • the step of making the through-hole conductor original body electrically connected to at least two conductor layers is included.
  • FIG. 5 is a cross-sectional view showing a state in which a portion of a through-hole conductor bulk material provided in the printed wiring board processed body shown in FIG. 5 is machined.
  • FIG. 5 is a cross-sectional view showing a state after etching the printed wiring board processed body shown in FIG. 7. It is sectional drawing which shows the state after removing the protective layer from the printed wiring board processed body shown in FIG. It shows the manufacturing method of the printed wiring board of another aspect, and is sectional drawing which shows the state which cuts the part of the through-hole conductor original body with respect to the printed wiring board processed body which formed the protective layer. It is sectional drawing which shows the state of the printed wiring board processed body after partially cutting a through-hole conductor raw material. It is sectional drawing which shows the state after performing the etching process on the printed wiring board processed body shown in FIG. It is sectional drawing which shows the state after removing the protective layer from the printed wiring board processed body shown in FIG. It is a top view of the produced printed wiring board.
  • the printed wiring board disclosed in Patent Document 1 is required to have the ability to mount electric elements at a high density in order to realize high functionality and high performance of electronic devices.
  • FIG. 1 is a cross-sectional view showing a part of a printed wiring board shown as an example of an embodiment.
  • the printed wiring board A of the embodiment has an insulating substrate 1 and a conductor portion 3 arranged at least inside the insulating substrate 1.
  • the insulating substrate 1 has a structure in which a plurality of insulating layers 5 are laminated. Here, for convenience, each insulating layer 5 is designated by a different reference numeral.
  • the insulating substrate 1 has a structure in which a first insulating layer 5a, a second insulating layer 5b, and a third insulating layer 5c are laminated from an upper layer.
  • FIG. 1 shows a case where the insulating layer 5 has three layers, but the present invention is not limited to this.
  • the insulating substrate 1 also includes those having more than three insulating layers 5.
  • the number of layers of the insulating layer 5 constituting the insulating substrate 1 may be 3 or more.
  • the number of layers is 30 or more.
  • the upper limit of the number of layers of the insulating layer 5 is not particularly set, but 50 layers or less may be used as a guide.
  • the insulating substrate 1 has a through hole 7.
  • the through hole 7 penetrates the insulating substrate 1 in the thickness direction.
  • the through hole 7 has a first opening 8a on one surface side of the insulating substrate 1.
  • the other surface side of the insulating substrate 1 is the second opening 8b.
  • the first opening 8a and the second opening 8b are arranged so as to face each other in the insulating substrate 1.
  • the inner wall on the left side of the through hole 7 is designated by reference numeral 7L
  • the inner wall on the right side of the through hole 7 is designated by reference numeral 7R.
  • reference numeral 3 representing the conductor portion is used as a code for grouping the conductor layers 9 (9a, 9b, 9c, 9d, 9e, 9f, 9g, 9h) and the through-hole conductor 11.
  • the conductor portion 3 has a plurality of conductor layers 9 and a through-hole conductor 11.
  • the plurality of conductor layers 9 are located along the plane direction of each of the insulating layers 5.
  • FIG. 1 for convenience, the names and symbols of the conductor layers 9 arranged in each layer are changed. This is to make it possible to distinguish the conductor layers 9 arranged in each layer of the insulating layer 5 in FIG.
  • the arrangement of each conductor layer 9 is shown in FIG.
  • the first conductor layer 9a, the second conductor layer 9b, the third conductor layer 9c, and the third conductor layer 9c are arranged on the left side via the insulating layer 5, respectively, from the upper side in the stacking direction.
  • a four-conductor layer 9d is arranged.
  • the fifth conductor layer 9e, the sixth conductor layer 9f, the seventh conductor layer 9g, and the eighth conductor layer 9h are arranged from the upper side in the stacking direction via the insulating layer 5, respectively.
  • the first conductor layer 9a and the fifth conductor layer 9e arranged on the left side and the right side of one insulating layer are electrically connected. Notation of 1st conductor layer 9a, 2nd conductor layer 9b, 3rd conductor layer 9c, 4th conductor layer 9d, 5th conductor layer 9e, 6th conductor layer 9f, 7th conductor layer 9g and 8th conductor layer 9h. Is used for convenience when the printed wiring board A is viewed in the vertical sectional view shown in FIG.
  • reference numeral 11 representing a through-hole conductor is a reference numeral that combines reference numeral 11L and reference numeral 11R.
  • the through-hole conductor 11 has a cylindrical shape.
  • the through-hole conductor 11 extends from the first opening 8a toward the second opening 8b.
  • the through-hole conductor 11 extends from the second opening 8b side in the direction of the first opening 8a.
  • the through-hole conductor 11 in contact with the inner wall 7L of the through-hole 7 is the first through-hole conductor 11L.
  • the through-hole conductor 11 in contact with the inner wall 7R of the through-hole 7 is the second through-hole conductor 11R.
  • the first through-hole conductor 11L and the second through-hole conductor 11R are used for convenience when the printed wiring board A is viewed based on a vertical cross-sectional view as shown in FIG.
  • the through-hole conductor 11 has a first through-hole conductor 11L and a second through-hole conductor 11R. In this case, the first through-hole conductor 11L and the second through-hole conductor 11R are electrically connected.
  • the via hole conductor 11 may be arranged so that one via hole conductor 11 is vertically divided, and the two are separately insulated and arranged.
  • the through-hole conductor 11 has an end portion 11t in the middle of the insulating substrate 1 in the thickness direction.
  • the end portion of the first through-hole conductor 11L located on the left side of the through-hole conductor 11 is designated by reference numeral 11 tL.
  • the end portion of the second through-hole conductor 11R located on the right side of the through-hole conductor 11 is designated by reference numeral 11 tR.
  • reference numeral 11t is used when the reference numeral 11tL at the end of the first through-hole conductor 11L and the reference numeral 11tR at the end located on the right side of the second through-hole conductor 11 are collectively indicated.
  • the through-hole conductor 11 reaches the surface 1a of the insulating substrate 1 on the surface 1a side of one side of the insulating substrate 1.
  • the through-hole conductor 11 does not reach the front surface (back surface) 1b of the insulating substrate 1 on the other side surface 1b side of the insulating substrate 1.
  • the surface 1a on one side of the insulating substrate 1 is positioned on the upper surface side (first opening 8a side) of the insulating substrate 1 in FIG.
  • the front surface (back surface) 1b on the other side of the insulating substrate 1 is positioned on the lower surface side (second opening 8b side) of the insulating substrate 1 in FIG.
  • the through-hole conductor 11 may reach the surface 1b on the lower surface side of the insulating substrate 1 and may not reach the surface 1a on the upper surface side.
  • the through-hole conductor 11 is provided so as to partially cover the inner wall 7L and the inner wall 7R of the through-hole 7 in the thickness direction.
  • the through-hole conductor 11 is electrically connected to a plurality of conductor layers at a position where the through-hole conductor 11 exists.
  • the plurality of conductor layers 9 have at least one non-connecting conductor layer that is not in contact with the through-hole conductor 11 closer to the second opening 8b than the through-hole conductor 11.
  • the first through-hole conductor 11L excludes at least one conductor layer 9 from the plurality of conductor layers (first conductor layer 9a, second conductor layer 9b, third conductor layer 9c, and fourth conductor layer 9d). It is electrically connected to another conductor layer 9. In this case, the first through-hole conductor 11L is electrically connected to the first conductor layer 9a and the second conductor layer 9b. The first through-hole conductor 11L is not connected to the third conductor layer 9c and the fourth conductor layer 9d.
  • the through-hole conductor 11 is the other conductor layer 9 except for at least one of the plurality of conductor layers (fifth conductor layer 9e, sixth conductor layer 9f, seventh conductor layer 9g, and eighth conductor layer 9h). It is electrically connected to the conductor layer 9.
  • the second through-hole conductor 11R is electrically connected to the fifth conductor layer 9e and the sixth conductor layer 9f.
  • the second through-hole conductor 11R is not connected to the seventh conductor layer 9g and the eighth conductor layer 9h.
  • the conductor layer 9 excluding at least one conductor layer 9 is the third conductor layer 9c, the fourth conductor layer 9d, the seventh conductor layer 9g, and the eighth conductor layer 9h.
  • the non-connecting conductor layer refers to the third conductor layer 9c, the fourth conductor layer 9d, the seventh conductor layer 9g, and the eighth conductor layer 9h.
  • the position of the end portion 11t of the through-hole conductor 11 in the thickness direction is different between the inner walls 7L and 7R of the through-hole 7 when the insulating substrate 1 is viewed in a vertical cross section.
  • the end portion 11tL of the first through-hole conductor 11L and the end portion 11tR of the second through-hole conductor 11R are located between the inner walls 7L and 7R of the through-hole 7 when the insulating substrate 1 is viewed in a vertical cross section.
  • the position in the thickness direction is different.
  • the end portion 11tL of the first through-hole conductor 11L is hereinafter referred to as the first end portion 11tL.
  • the end portion 11tR of the second through-hole conductor 11R is hereinafter referred to as the second end portion 11tR.
  • the through-hole conductor 11 has different positions of the first end portion 11tL and the second end portion 11tR, which are two end portions close to the second opening 8b, in a cross-sectional view along the central axis Z of the through hole 7.
  • the central axis Z is shown separately on the upper side and the lower side of the printed wiring board A, but if it is described in the through hole 7, it may overlap with the display of other symbols or the like. This is because it came.
  • the central axis Z is linearly connected to the upper side and the lower side of the printed wiring board A.
  • the positions of the first end portion 11tL and the second end portion 11tR are different is evaluated from the shape of the through-hole conductor 11 seen when the printed wiring board A or the insulating substrate 1 is viewed in cross section. That is, in the printed wiring board A shown in FIG. 1, the length LL of the first through-hole conductor 11L is longer than the length LR of the second through-hole conductor 11R. In other words, in the printed wiring board A shown in FIG. 1, the end portion 11tL of the first through-hole conductor 11L is located at a position deeper than the end portion 11tR of the second through-hole conductor 11R.
  • the printed wiring board A has a dimensional difference ⁇ L between the length LL of the first through-hole conductor 11L and the length LR of the second through-hole conductor 11R.
  • the dimensional difference ⁇ L is the difference in length between the length LL of the first through-hole conductor 11L and the length LR of the second through-hole conductor 11R.
  • ⁇ L may have a different capacitance component that contributes to impedance in the printed wiring board A.
  • ⁇ L depends on the thickness of the insulating layer 5 (here, the second insulating layer 5b), but may be 1 ⁇ m or more.
  • the maximum value of ⁇ L is not particularly provided, but it may be within twice the thickness t of the one-layer insulating layer 5, and in particular, within a length corresponding to the thickness of the one-layer insulating layer 5. For example, it is preferably within 100 ⁇ m, particularly within 50 ⁇ m.
  • the printed wiring board A shown in FIG. 1 has different lengths of facing portions of the through-hole conductors 11 arranged in the through-hole 7 in this way.
  • the opposing portions in the through-hole 7 are portions arranged on both sides when the through-hole conductor 11 is vertically divided, as shown in FIG.
  • the cross section of the through-hole conductor 11 has a cylindrical shape, the cross section is not limited to the cross section arranged on both sides when the place having the maximum diameter (the place having the diameter) is vertically divided. Even if the through-hole conductor 11 is vertically divided at an arbitrary location, both the portion that becomes the first through-hole conductor 11L and the portion that becomes the second through-hole conductor 11R may be visible.
  • the distance dL in the thickness direction from the end portion 11tL of the first through-hole conductor 11L to the third conductor layer 9c is the distance in the thickness direction from the end portion 11tR of the second through-hole conductor 11R to the seventh conductor layer 9g. Shorter than dR.
  • the distance dL in the thickness direction is a perpendicular line from the end portion 11tL of the first through-hole conductor 11L to the surface where the position of the upper surface of the third conductor layer 9c is translated in the horizontal direction, as shown in FIG. It is the length when it is lowered.
  • the distance dR in the thickness direction is when a perpendicular line is drawn from the end portion 11tR of the second through-hole conductor 11R to the surface where the position of the upper surface of the seventh conductor layer 9g is translated in the horizontal direction. Is the length of.
  • the insulating layer 5b is arranged between the layers of the second conductor layer 9b and the third conductor layer 9c. In the region on the right side of the printed wiring board A, the insulating layer 5b is similarly arranged between the layers of the 7th conductor layer 9g and the 8th conductor layer 9h. In this case, the thickness t of the insulating layer 5b is the same between the region on the left side of the printed wiring board A and the region on the right side of the printed wiring board A.
  • the fact that the thickness t of the insulating layer 5b is the same means that the difference between the maximum thickness and the minimum thickness is within 10% when the thickness t of the insulating layer 5b is measured at a plurality of locations in the plane direction of the insulating layer 5b.
  • the absolute value of the value is within 10%.
  • the thickness t of the plurality of insulating layers 5 (here, the insulating layer 5a, the insulating layer 5b, and the insulating layer 5c) laminated to form the insulating substrate 1 may be the same, but it differs depending on the application. It may be the thickness.
  • the thickness of the first conductor layer 9a to the eighth conductor layer 9h may be the same, but may be different depending on the application.
  • the fact that the thickness of the conductor layer 9 is the same means that the difference ⁇ tM between the maximum thickness and the minimum thickness is 20% or less when the thickness of the conductor layer 9 is measured.
  • the absolute value is within 20%.
  • the distance dL from the end portion 11tL of the first through-hole conductor 11L to the third conductor layer 9c is from the end portion 11tR of the through-hole conductor 11R to the seventh conductor layer 9g. It is shorter than the interval dR. Due to the difference in spacing between the spacing dL and the spacing dR, the capacitance CdL generated in the insulating layer 5b located on the left side with the through hole 7 in the center and the insulating layer 5b located on the right side with the through hole 7 in the center. It is different from the capacitance CdR generated in.
  • the third conductor layer 9c is in a state of entering the recess 7LC provided in the inner wall 7L of the through hole 7.
  • its capacitance goes around the recess 7LC from the end 11tL of the through hole conductor 11L to the third conductor layer 9c.
  • the length from the end 11tR of the through-hole conductor 11R to the recess 7RC and up to the 7th conductor layer 9g is included.
  • the capacitance contributing to the impedance differs between the region AL on the left side and the region AR on the right side of the printed wiring board A.
  • the impedance can be adjusted in each of the left region AL and the right region AR with the through hole 7 in the center.
  • the printed wiring board A may have a difference in inductance between the area AL and the area AR with the through hole 7 in the center.
  • the inductance in the region AL of the printed wiring board A is such that the first conductor layer 9a, the second conductor layer 9b, and the first through-hole conductor 11L arranged so as to sandwich the first insulating layer 5a are electrically connected.
  • the inductance of the printed wiring board A in the region AR is such that the fifth conductor layer 9e, the sixth conductor layer 9f, and the second through-hole conductor 11R arranged so as to sandwich the first insulating layer 5a are electrically connected.
  • the printed wiring board A may have a structure having a difference between the inductance in the region AL and the inductance in the region AR.
  • FIG. 2 is a schematic view showing another aspect of the through-hole conductor in the printed wiring board of the embodiment.
  • the through-hole conductor 12 may have a cylindrical shape.
  • the printed wiring board having the through-hole conductor 12 shown in FIG. 2 is hereinafter referred to as a printed wiring board B.
  • the through-hole conductor 12 has an elliptical cut end at the end 12t. Also in the case of the through-hole conductor 12, the lengths of the opposing portions of the through-hole conductor 12 arranged in the through-hole 7 are different.
  • the end face of the through-hole conductor 12 near the second opening 8b is inclined with respect to the central axis Z of the through-hole 7. In FIG.
  • the length LL of the left side portion of the through-hole conductor 12 is longer than the length LR of the right portion of the through-hole conductor 12. Even in such a structure, the impedance can be adjusted in the same manner as in the case of the printed wiring board A described above.
  • the number of through-hole conductors 11 is the same in the left and right regions AL and AR of the through-hole 7 when the insulating substrate 1 is viewed in a vertical cross section. It is preferable that the conductor layer 9 is electrically connected to the conductor layer 9. If the through-hole conductor 11 has a structure in which the same number of conductor layers 9 are electrically connected in the left and right regions AL and AR of the through hole 7, the shape or size (length) of the through-hole conductor 11 is different. The change in the generated capacitance can be adjusted in the same insulating layer 5 (in the case of FIG. 1, the insulating layer 5c).
  • FIG. 3 is a schematic view showing another aspect of the through-hole conductor in the printed wiring board of the embodiment.
  • the shape of the through-hole conductor 11 is different from that of the printed wiring board A in FIG.
  • the printed wiring board C of FIG. 3 is a through-hole conductor 11 and a conductor layer 9 (first conductor layer 9a, second conductor layer 9b, fifth conductor layer 9e, sixth conductor) of the printed wiring board A shown in FIG.
  • the portion corresponding to the insulating substrate 1 existing in the layer 9f) and its surroundings is drawn.
  • the through-hole conductor 11L located on the left side of the through-hole 7 of the printed wiring board C but the through-hole conductor 11R located on the right side of the through-hole 7 also has a mirror image relationship.
  • the through-hole conductor 11L is longer than the through-hole conductor 11R, as in the printed wiring board A shown in FIG.
  • the surface of the through-hole conductor 11L on the inner wall 7L side of the through hole 7 is the outer surface 11LA
  • the surface opposite to the outer surface 11LA is the inner surface 11LB.
  • the length LLA of the outer surface 11LA of the through-hole conductor 11L is longer than the length LLB of the inner surface 11LB.
  • the first surface (outer surface 11LA) corresponding to the inner wall 7L side of the through hole 7 is located on the opposite side of the first surface (outer surface 11LA). It is located closer to the second opening 8b than 11LB). If the length LLA of the outer surface 11LA of the through-hole conductor 11 is longer than the length LLB of the inner surface 11LB, the inductance of this portion also depends on the difference between the length LLA of the outer surface 11LA and the length LLB of the inner surface 11LB. Can be changed.
  • the end portion 11tL of the through-hole conductor 11L may be inclined so as to be gradually shortened from the outer edge end 11LAt to the inner edge end 11LBt.
  • the end face from the outer edge end 11LAt to the inner edge end 11LBt is preferably an inclined surface.
  • the various printed wiring boards A and C described above have a conductor layer 9 (third conductor layer 9c, seventh conductor layer 9g) that is not electrically connected to the through-hole conductor 11 among the conductor layers 9. Had had.
  • the third conductor layer 9c and the seventh conductor layer 9g will be referred to as a non-connecting conductor layer 9c and 9g.
  • the non-connecting conductor layers 9c and 9g are arranged so as to sandwich the through-hole 7.
  • the length in the direction along the surface of the insulating layer 5 may be different between the two.
  • the capacitance can be changed due to the difference in the covering area with respect to the surface of the insulating layer 5 between the non-connecting conductor layer 9c and the non-connecting conductor layer 9g.
  • This makes it possible to adjust the impedance between the regions AL and the regions AR of the printed wiring boards A and C. Needless to say, the above effect can be obtained for the printed wiring board B as well.
  • At least one of the above-mentioned non-connecting conductors 9c and 9g may be at a position where its ends 9ct and 9gt are recessed from the inner walls 7L and 7R of the through hole 7.
  • the end 9ct of the non-connecting conductor layer 9c is recessed from the inner wall 7L of the through hole 7, for example, the distance between the through-hole conductor 11L and the end 9ct of the non-connecting conductor layer 9c becomes wide. This makes it possible to further improve the insulating property between the through-hole conductor 11L and the end 9ct of the non-connecting conductor layer 9c.
  • FIG. 4 is a cross-sectional view of a multilayer board used in the method for manufacturing the printed wiring board A of the embodiment.
  • the multilayer board 20 is prepared.
  • the multilayer board 20 has an insulating board 21 and a conductor portion 23.
  • the multilayer board 20 has through holes 25 in the thickness direction.
  • the insulating substrate 21 includes a plurality of insulating layers 27.
  • the insulating substrate 21 shown in FIG. 4 is composed of a first insulating layer 27a, a second insulating layer 27b, and a third insulating layer 27c from the upper side in the thickness direction.
  • the conductor portion 23 includes a plurality of conductor layers 29 and a through-hole conductor bulk material 31.
  • the conductor layer 29 includes a first conductor layer 29a, a second conductor layer 29b, a third conductor layer 29c, a fourth conductor layer 29d, a fifth conductor layer 29e, a sixth conductor layer 29f, a seventh conductor layer 29g, and an eighth conductor. It is composed of layers 29h.
  • Each of the above-mentioned conductor layers 29 may be integrated on the same surface of each layer of the insulating layer 27.
  • the pair of conductor layers 29 integrated on the same surface of each layer of the insulating layer 27 is as follows.
  • the first conductor layer 29a and the fifth conductor layer 29e are arranged on the upper surface side of the first insulating layer 27a.
  • a second conductor layer 29b and a sixth conductor layer 29f are arranged between the first insulating layer 27a and the second insulating layer 27b.
  • a third conductor layer 29c and a seventh conductor layer 29g are arranged between the second insulating layer 27b and the third insulating layer 27c.
  • the fourth conductor layer 29d and the eighth conductor layer 29h are arranged on the lower surface side of the third insulating layer 27c.
  • the through-hole conductor bulk material 31 covers the entire inner wall 25L and inner wall 25R of the through-hole 25.
  • the through-hole conductor base 31 includes a first conductor layer 29a, a second conductor layer 29b, a third conductor layer 29c, a fourth conductor layer 29d, a fifth conductor layer 29e, a sixth conductor layer 29f, a seventh conductor layer 29g, and the like. It is in a state of being electrically connected to the eighth conductor layer 29h.
  • the through-hole conductor bulk material 31 that appears to be separated across the through-hole 25 is divided into two parts on the left and right, and is indicated by a reference numeral.
  • the code of the through-hole conductor bulk material 31 located on the left side of the through-hole 25 is 31GL.
  • the code of the through-hole conductor bulk material 31 located on the right side of the through-hole 25 is 31GR.
  • FIG. 5 is a cross-sectional view showing a printed wiring board processed body in which the protective layer 33 is formed on the multilayer substrate 20 shown in FIG.
  • the protective layer 33 is formed on the inner surfaces 31LA and 31RA of the through-hole conductor bulk material 31 (31GL, 31GR) formed on the prepared multilayer substrate 20.
  • the multilayer board 20 on which the protective layer 33 is formed is hereinafter referred to as a printed wiring board processed body 20A.
  • the protective layer 33 is also formed on the surfaces of the first conductor layer 29a, the fourth conductor layer 29d, the fifth conductor layer 29e, and the eighth conductor layer 29h formed on the outermost surface of the insulating substrate 21.
  • the protective layer 33 is in contact with the through-hole conductor bulk material 31 (31GL), the first conductor layer 29a, and the fourth conductor layer 29d.
  • the protective layer 33 is in contact with the surfaces of the through-hole conductor bulk material 31 (31GL), the first conductor layer 29a, and the fourth conductor layer 29d.
  • the protective layer 33 is in contact with the through-hole conductor bulk material 31 (31GR), the fifth conductor layer 29e, and the eighth conductor layer 29h.
  • the protective layer 33 is in contact with the surfaces of the through-hole conductor bulk material 31 (31GR), the fifth conductor layer 29e, and the eighth conductor layer 29h.
  • As the material used for the protective layer 33 for example, tin or an ED film is suitable.
  • the protective layer 33 formed of such a material is preferably formed by an electrolytic plating method for tin and an electrodeposition method for an ED film.
  • FIG. 6 is a cross-sectional view showing a state in which a portion of the through-hole conductor bulk material 31 provided in the printed wiring board processed body 20A shown in FIG. 5 is cut.
  • FIG. 7 is a cross-sectional view showing a state of the printed wiring board processed body 20A after the through-hole conductor original body 31 is partially cut.
  • the through-hole conductor base 31 provided in the printed wiring board processed body 20A is cut to remove a part of the through-hole conductor base 31 and the protective layer 33.
  • a part of the through-hole conductor bulk material 31 and the protective layer 33 is removed by a jig for cutting.
  • a drilling machine can be mentioned.
  • the tip portion of the drill processing machine is hereinafter referred to as a drill 35.
  • a drill 35 having a tip portion 35A having a diameter (diameter or maximum diameter) larger than the inner diameter of the through-hole conductor bulk material 31 is used.
  • the inner diameter of the through-hole conductor bulk material 31 is the portion where the double-headed arrow is designated by the symbol DT in FIG.
  • the diameter of the tip portion 35A of the drill 35 is a portion in which a thick double-headed arrow is designated by a reference numeral DD in FIG.
  • a drill 35 having a slightly tapered tip portion 35A is used as the drill 35. Further, in the process of cutting with the drill 35, the axis 39 of the drill 35 is displaced from the central axis Z of the through-hole conductor original body 31.
  • the through after cutting is performed. Differences in length can be made on both sides of the through hole 25 of the hole conductor original body 31 sandwiched between them.
  • the difference in length in the through-hole conductor bulk material 31 is between the through-hole conductor processed body 31GL and the through-hole conductor processed body 31GR.
  • the length of the through-hole conductor processed body 31GL remaining from the through-hole conductor bulk material 31 is represented by the reference numeral LTL.
  • the length of the through-hole conductor processed body 31GR remaining from the through-hole conductor bulk material 31 is represented by the reference numeral LTR.
  • the portion remaining after the cutting process is the portion of the through-hole conductor processed body 31GL from the first conductor layer 29a to the portion in contact with the tip portion 35A of the drill 35.
  • the range is from the fifth conductor layer 29e to the portion where the tip portion 35A of the drill 35 is in contact.
  • the length LTL of the through-hole conductor processed body 31GL, which is a portion not cut after cutting is longer than the length LTR of the through-hole conductor processed body 31GR, which is also a portion not cut after cutting.
  • FIG. 8 is a cross-sectional view showing a state after etching the printed wiring board processed body 20A shown in FIG. 7.
  • FIG. 9 is a cross-sectional view showing a state after the protective layer 33 is removed from the printed wiring board processed body 20A shown in FIG.
  • the step of FIG. 8 is a step of etching the through-hole conductor processed body 31GL and the through-hole conductor processed body 31GR remaining after the cutting process.
  • the etching solution used in this case dissolves the metal (copper) used in the through-hole conductor bulk material 31, but does not dissolve the protective layer 33.
  • the etching solution include an aqueous solution of cupric chloride or an aqueous solution of ferric chloride.
  • Such an etching process is called a half etching process.
  • the through-hole conductor processed body 31GL and the through-hole conductor processed body 31GR are viewed from the direction in which the drill 35 is inserted. It is further removed by a predetermined length.
  • the length LTL of the through-hole conductor processed body 31GL after etching is shorter than the protective layer 33 in contact with the through-hole conductor processed body 31GL.
  • the length LTR of the through-hole conductor processed body 31GR after etching is also shorter than the protective layer 33 in contact with the through-hole conductor processed body 31GR.
  • the third conductor layer 29c, the fourth conductor layer 29d, the seventh conductor layer 29g, and the eighth conductor layer 29h, which are not covered by the protective layer 33, are also partially removed.
  • the third conductor layer 29c and the seventh conductor layer 29g are partially removed from the inner wall 25L and the inner wall 25R of the through hole 25 toward the back.
  • the end portion 29ct of the third conductor layer 29c and the end portion 29gt of the seventh conductor layer 29g are recessed from the inner wall 25L and the inner wall 25R of the through hole 25.
  • the protective layer 33 is a tin metal film
  • Enstrip manufactured by Meltex Inc.
  • Meckli Mover manufactured by MEC
  • the filler is embedded in the voids where the through-hole 25, the through-hole conductor processed body 31GL, and the through-hole conductor processed body 31GR are present.
  • a circuit pattern is further formed on the surface of the printed wiring board processed body 20A, and then a solder resist is applied, and the surface of the exposed conductor portion 23 is selected from the group of gold, platinum, and nickel.
  • a metal film containing at least one kind of material as a main component is formed.
  • a plating film should be applied to the metal film.
  • the printed wiring board A can be obtained by the above steps.
  • FIG. 10 shows a method of manufacturing a printed wiring board of another aspect, and shows a cross section showing a state in which a portion of the through-hole conductor original body 31 is cut with respect to the printed wiring board processed body on which the protective layer 33 is formed. It is a figure.
  • FIG. 11 is a cross-sectional view showing a state of the printed wiring board processed body after the through-hole conductor original body 31 is partially cut.
  • FIG. 12 is a cross-sectional view showing a state after etching the printed wiring board processed body shown in FIG.
  • FIG. 13 is a cross-sectional view showing a state after the protective layer 33 is removed from the printed wiring board processed body shown in FIG.
  • the axial center 39 of the drill 35 is shifted with respect to the central axis Z of the through hole 25.
  • the difference between the steps shown in FIGS. 10 to 13 and the steps shown in FIGS. 6 to 12 is that the shape of the drill 35 is different.
  • the drill 35 used here has a conical tip 35A.
  • the length LTL of the through-hole conductor processed body 31GL remaining after cutting and etching is longer than the length LTR of the through-hole conductor processed body 31GR.
  • the shapes of the through-hole conductor processed body 31GL and the end portions 31tL and 31tR of the through-hole conductor processed body 31GR can be made into the inclined shape shown in FIG.
  • the multilayer board 20 shown in FIG. 4 was prepared, and specifically, a printed wiring board was produced by using the steps of FIGS. 5 to 9. Further, the multilayer board 20 shown in FIG. 4 was prepared, and specifically, a printed wiring board was produced by using the steps of FIGS. 10 to 13.
  • FR-4 material glass cloth base material epoxy resin
  • the conductor layer a copper foil or a copper foil plated with electrolytic copper was used.
  • the printed wiring board produced by using the steps of FIGS. 5 to 9 is used as sample 1.
  • the printed wiring board produced by using the steps of FIGS. 10 to 13 is used as sample 2.
  • the through-hole conductor L and the through-hole conductor R are arranged so as to be opposed to each other by providing an insulating portion on the inner wall of the through hole.
  • the arrangement of the insulating layer and the first to eighth conductor layers is basically a four-layer structure shown in FIG.
  • the shapes of the first to eighth conductor layers are also strip-shaped as shown in FIG.
  • the area, length and thickness of the conductor layer formed on each insulating layer are the same.
  • the length of the portion corresponding to the through-hole conductor L was made longer than the length of the portion corresponding to the through-hole conductor R.
  • the through-hole conductor of sample 2 has a cylindrical shape and an inclined end portion thereof.
  • the impedance of the manufactured printed wiring board was measured using an impedance analyzer.
  • As the impedance analyzer 4192A manufactured by Yokogawa Hewlett-Packard Co., Ltd. was used.
  • the measurement frequency was in the range of 1 MHz to 10 MHz.
  • For the impedance the average value of the values obtained from the range of 1 MHz to 10 MHz was used.
  • the measurement measured the circuits between the first conductor layer and the third conductor layer, and between the fifth conductor layer and the seventh conductor layer, respectively.
  • the ratio of the impedance of the circuit between the 5th conductor layer and the 7th conductor layer to the average impedance of the circuit between the 1st conductor layer and the 3rd conductor layer was determined, respectively.
  • the same evaluation was performed on a sample in which the through-hole conductor was cylindrical and the difference between the length on the through-hole conductor L side and the length on the through-hole conductor R side was the same (0.01 ⁇ m or less).
  • the ratio of the impedance of the circuit between the 5th conductor layer and the 7th conductor layer to the average impedance of the circuit between the 1st conductor layer and the 3rd conductor layer of the sample of the comparative example is 1, the sample The impedance ratio of sample 1 tended to be larger than that of the sample of Comparative Example, and the impedance ratio of sample 2 tended to be larger than that of sample 1.
  • This disclosure can be used for printed wiring boards and methods for manufacturing them.
  • A, B, C ... Printed wiring board 1, 21 ... Insulation substrate 3, 23 ... Conductor part 5, 27 ... Insulation layer 7, 25 ... Through hole 8a ; 1st opening 8b ........... 2nd opening 9, 29 ; Conductor layer 11, 31 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Through-hole conductor 20 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Multi-layer board 33 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Protective layer Z ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Central axis

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un tableau de connexion imprimé comprenant un substrat isolant (1) et une partie conductrice (3) disposée au moins à l'intérieur du substrat isolant. Le substrat isolant (1) comprend une pluralité de couches isolantes empilées. Le substrat isolant (1) comprend un trou traversant (7) pénétrant à travers celui-ci depuis une première ouverture de celui-ci vers une seconde ouverture de celui-ci dans la direction de l'épaisseur. La partie conductrice (3) comprend une pluralité de couches conductrices (9) et un conducteur traversant (11). La pluralité de couches conductrices est respectivement positionnée le long des couches isolantes (5) dans une direction plane. Le conducteur traversant (11) présente une forme tubulaire s'étendant de la première ouverture vers la seconde ouverture. Le conducteur traversant (11) au niveau d'une position existante est électriquement connecté à certaines couches de la pluralité de couches conductrices (9). La pluralité de couches conductrices (9) comprend au moins une couche d'une couche conductrice non connectée plus proche de la seconde ouverture que du conducteur traversant (11), qui n'est pas en contact avec le conducteur traversant (11). Dans une vue en coupe transversale prise le long de l'axe central du trou traversant (7), le conducteur traversant (11) possède deux parties d'extrémité plus proches de la seconde ouverture, comprenant une première partie d'extrémité et une seconde partie d'extrémité qui ont des positions différentes dans la direction de l'épaisseur.
PCT/JP2021/013285 2020-03-30 2021-03-29 Tableau de connexions imprimé et son procédé de fabrication WO2021200820A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066544A (ja) * 2006-09-08 2008-03-21 Nec Corp 多層プリント配線基板及びその製造方法
US20130025919A1 (en) * 2010-03-31 2013-01-31 Flextronics Ap, Llc Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
JP2013143461A (ja) * 2012-01-11 2013-07-22 Nec Corp 多層プリント基板及びそれに用いる製造方法
JP2016527725A (ja) * 2013-08-02 2016-09-08 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ Ｐｃｂ基板上のバックドリルホールの製造方法及びｐｃｂ基板
JP2017098433A (ja) * 2015-11-25 2017-06-01 京セラ株式会社 印刷配線板の中間体および印刷配線板、印刷配線板の製造方法
JP2017216327A (ja) * 2016-05-31 2017-12-07 三菱電機株式会社 多層プリント配線板およびその製造方法
JP2019071318A (ja) * 2017-10-06 2019-05-09 日立化成株式会社 多層配線板及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066544A (ja) * 2006-09-08 2008-03-21 Nec Corp 多層プリント配線基板及びその製造方法
US20130025919A1 (en) * 2010-03-31 2013-01-31 Flextronics Ap, Llc Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
JP2013143461A (ja) * 2012-01-11 2013-07-22 Nec Corp 多層プリント基板及びそれに用いる製造方法
JP2016527725A (ja) * 2013-08-02 2016-09-08 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ Ｐｃｂ基板上のバックドリルホールの製造方法及びｐｃｂ基板
JP2017098433A (ja) * 2015-11-25 2017-06-01 京セラ株式会社 印刷配線板の中間体および印刷配線板、印刷配線板の製造方法
JP2017216327A (ja) * 2016-05-31 2017-12-07 三菱電機株式会社 多層プリント配線板およびその製造方法
JP2019071318A (ja) * 2017-10-06 2019-05-09 日立化成株式会社 多層配線板及びその製造方法

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