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JPWO2021200820A1 - - Google Patents

Info

Publication number
JPWO2021200820A1
JPWO2021200820A1 JP2022512209A JP2022512209A JPWO2021200820A1 JP WO2021200820 A1 JPWO2021200820 A1 JP WO2021200820A1 JP 2022512209 A JP2022512209 A JP 2022512209A JP 2022512209 A JP2022512209 A JP 2022512209A JP WO2021200820 A1 JPWO2021200820 A1 JP WO2021200820A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022512209A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021200820A1 publication Critical patent/JPWO2021200820A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022512209A 2020-03-30 2021-03-29 Pending JPWO2021200820A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020060398 2020-03-30
PCT/JP2021/013285 WO2021200820A1 (ja) 2020-03-30 2021-03-29 印刷配線板およびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2021200820A1 true JPWO2021200820A1 (ja) 2021-10-07

Family

ID=77929030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512209A Pending JPWO2021200820A1 (ja) 2020-03-30 2021-03-29

Country Status (2)

Country Link
JP (1) JPWO2021200820A1 (ja)
WO (1) WO2021200820A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066544A (ja) * 2006-09-08 2008-03-21 Nec Corp 多層プリント配線基板及びその製造方法
US20130025919A1 (en) * 2010-03-31 2013-01-31 Flextronics Ap, Llc Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
JP2013143461A (ja) * 2012-01-11 2013-07-22 Nec Corp 多層プリント基板及びそれに用いる製造方法
JP2016527725A (ja) * 2013-08-02 2016-09-08 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ Ｐｃｂ基板上のバックドリルホールの製造方法及びｐｃｂ基板
JP2017098433A (ja) * 2015-11-25 2017-06-01 京セラ株式会社 印刷配線板の中間体および印刷配線板、印刷配線板の製造方法
JP2017216327A (ja) * 2016-05-31 2017-12-07 三菱電機株式会社 多層プリント配線板およびその製造方法
JP2019071318A (ja) * 2017-10-06 2019-05-09 日立化成株式会社 多層配線板及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066544A (ja) * 2006-09-08 2008-03-21 Nec Corp 多層プリント配線基板及びその製造方法
US20130025919A1 (en) * 2010-03-31 2013-01-31 Flextronics Ap, Llc Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
JP2013143461A (ja) * 2012-01-11 2013-07-22 Nec Corp 多層プリント基板及びそれに用いる製造方法
JP2016527725A (ja) * 2013-08-02 2016-09-08 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ Ｐｃｂ基板上のバックドリルホールの製造方法及びｐｃｂ基板
JP2017098433A (ja) * 2015-11-25 2017-06-01 京セラ株式会社 印刷配線板の中間体および印刷配線板、印刷配線板の製造方法
JP2017216327A (ja) * 2016-05-31 2017-12-07 三菱電機株式会社 多層プリント配線板およびその製造方法
JP2019071318A (ja) * 2017-10-06 2019-05-09 日立化成株式会社 多層配線板及びその製造方法

Also Published As

Publication number Publication date
WO2021200820A1 (ja) 2021-10-07

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