WO2014002842A1 - 有機薄膜形成装置 - Google Patents
有機薄膜形成装置 Download PDFInfo
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- WO2014002842A1 WO2014002842A1 PCT/JP2013/066804 JP2013066804W WO2014002842A1 WO 2014002842 A1 WO2014002842 A1 WO 2014002842A1 JP 2013066804 W JP2013066804 W JP 2013066804W WO 2014002842 A1 WO2014002842 A1 WO 2014002842A1
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- chamber
- vapor
- central roller
- film forming
- thin film
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
- B05D2252/02—Sheets of indefinite length
Definitions
- the present invention relates to an organic thin film forming apparatus, and more particularly to an organic thin film forming apparatus for forming an organic thin film on a film in a vacuum atmosphere.
- Thin film forming devices that form organic thin films on films in a vacuum atmosphere have been used in the past, forming metal thin films and organic thin films on films, and producing films for food packaging and electronic components. Yes.
- the organic thin film forming apparatus 101 includes a vacuum chamber 111, and a raw roll in which a base film 105 to be formed is wound up in the vacuum chamber 111. 102 and a winding device 103 for winding the base film 105 unwound from the original fabric roll 102 are arranged.
- the base film 105 is unwound from the raw roll 102, and the base film is formed on a part of the side surface of the central roller 104 disposed in the center of the vacuum chamber 111. With the back surface of 105 in contact, the tip of the unwound portion is attached to the winding device 103.
- the inside of the vacuum chamber 111 was evacuated, the central roller 104 was rotated so that the base film 105 and the surface of the central roller 104 did not slide, and the base film 105 was unwound from the raw roll 102 and unwound.
- the base film 105 is wound up by the winding device 103.
- a steam generator 106 is disposed at a position facing the portion where the central roller 104 and the base film 105 are in contact with each other.
- the organic material disposed in the steam generator 106 is heated by the heating device 107, Steam of the organic material is generated in the steam generator 106, and the steam of the organic material is discharged from the discharge port of the steam generator 106 toward the central roller 104.
- the base film 105 moves while contacting the central roller 104, and the vapor of the organic material reaches the surface of the moving base film 105 at the position facing the discharge port.
- An organic thin film is formed on the surface of the organic thin film and is wound up by the winding device 103 to obtain a winding roll 108.
- the organic thin film formed on the base film 105 is required to have a technique for preventing the uniformity of the film thickness and the inside of the vacuum chamber 111 from being contaminated by the organic material vapor released into the vacuum chamber 111. It has been.
- the present invention was created to solve the disadvantages of the prior art described above, and its purpose is to form an organic thin film that forms a cured organic thin film at a high film formation rate without being contaminated in the vacuum chamber by steam. Providing equipment.
- the present invention has a vacuum chamber, a vapor discharge device, an energy beam injection device, an unwinding device, a winding device, and a cylindrical central roller.
- the substrate roll of the mounted base film is unwound, and the unwound base film travels in the vacuum chamber while the back surface is in contact with the side surface of the center roller, and is wound by the winding device.
- the vapor of the organic compound discharged into the vacuum chamber from the discharge port of the vapor discharge device reaches the surface of the base film in a portion contacting the side surface of the central roller, and the organic raw material layer is After the formation, a thin film formation in which an organic thin film is formed by irradiating the organic raw material layer with an energy ray emitted from an injection part of the energy ray emitting device and causing a chemical reaction of the organic compound in the organic raw material layer
- a vapor generation device that generates vapor of the organic compound and supplies it to the vapor discharge device is disposed outside the vacuum chamber, and a buffer chamber is disposed inside the vacuum chamber, and is disposed inside the vacuum chamber.
- a curing chamber is disposed outside the buffer chamber, a film forming chamber is disposed inside the buffer chamber, and the buffer chamber, the film forming chamber, and the curing chamber are respectively connected to a vacuum exhaust device.
- the discharge port is disposed inside the film forming chamber, the injection portion is disposed in the curing chamber, and the central roller is disposed so as to rotate around a rotation axis located in the buffer chamber.
- a film forming chamber opening is provided in a portion of the film forming chamber partition forming the film forming chamber located between the rotation axis and the discharge port, and the discharge port and a side surface of the central roller are Face to face and form the curing chamber
- a thin film forming apparatus in which a curing chamber opening is provided in a portion of the curing chamber partition located between the rotation axis and the injection portion, and the injection portion and the side surface of the central roller face each other. It is.
- a cooling device is connected to the central roller, and the cooling device is configured to circulate a cooling medium between the central roller and the cooling device to cool the central roller.
- a thin film forming apparatus is connected to the central roller, and the cooling device is configured to circulate a cooling medium between the central roller and the cooling device to cool the central roller.
- a portion of the side surface of the central roller facing the discharge port is inserted into the film formation chamber through the film formation chamber opening, and a portion of the side surface of the central roller facing the injection portion Is a thin film forming apparatus inserted into the curing chamber through the curing chamber opening.
- the present invention further includes a carrier gas supply device that supplies a carrier gas to the vapor generating device, and a thin film in which a mixed gas in which the carrier gas and the vapor of the organic compound are mixed is discharged from the discharge port. Forming device.
- the pressure of the film formation chamber is higher than the pressure of the buffer chamber, and the pressure of the curing chamber is lower than the buffer chamber by the vacuum exhaust device.
- the vapor generation chamber is arranged outside the vacuum chamber and the film formation chamber opening is arranged inside the buffer chamber, replenishment of the organic compound is easy, and the vapor generated from the organic compound is cured. It does not flow into the chamber or roll chamber.
- the central roller Since the central roller is cooled to a temperature below the condensation temperature of the vapor, the vapor of the organic compound formed by heating can be condensed (including gas solidification in addition to gas liquefaction). Since the organic raw material layer formed by condensation is cured with an energy resin, a tough organic thin film can be obtained.
- the generated vapor is carried by the carrier gas, a large amount of vapor can be supplied from the vapor generation chamber to the film formation chamber, and the film formation rate can be increased. Moreover, since the formation of the organic material layer and the curing of the organic material layer are performed by one central roller, the volume of the vacuum chamber can be reduced.
- the figure for demonstrating the thin film forming apparatus of this invention (a) (b): The figure for demonstrating a discharge port (a): Diagram for explaining film formation chamber opening (b): Diagram for explaining curing chamber opening (a): The figure which shows the state in which the organic raw material layer was formed on the base film (b): The figure which shows the state in which the polymer organic thin film was formed from the organic raw material layer Conventional thin film forming equipment
- FIG. 1 shows a thin film forming apparatus 10 of the present invention.
- the thin film forming apparatus 10 includes a vacuum chamber 11, and the inside of the vacuum chamber 11 is partitioned by a partition plate 51, and a roll chamber 41 is formed on one side of the partition plate 51 inside the vacuum chamber 11. Has been.
- a buffer chamber 42 is formed on the opposite side of the partition plate 51, and a film forming chamber partition wall 52 is disposed inside the buffer chamber 42, and is separated from the internal space of the buffer chamber 42 by the film forming chamber partition wall 52.
- the formed film forming chamber 43 is formed.
- a curing chamber partition wall 53 is disposed at a position separated from the film forming chamber 43 inside the buffer chamber 42, and the inside of the buffer chamber 42 is separated from the internal space of the buffer chamber 42 by the curing chamber partition wall 53.
- a curing chamber 44 is formed. The film forming chamber 43 and the curing chamber 44 are also separated.
- a metal-made cylindrical central roller 17 is disposed in the buffer chamber 42.
- the rotary shaft 18 is horizontally disposed inside the buffer chamber 42, and the central roller 17 is attached to the rotary shaft 18 with the central axis thereof coincident with the central axis of the rotary shaft 18.
- the central roller 18 and the central roller 17 are configured to rotate together around a coincident central axis.
- Reference numeral 14 in FIG. 1 is a rotation axis that is the center of rotation of the rotation shaft 18 and the center roller 17, and is also a center axis of the rotation shaft 18 and the center roller 17.
- the roll chamber 41, the film forming chamber 43, and the curing chamber 44 are disposed around the side surface of the central roller 17.
- a film forming chamber opening 54 is formed in the film forming chamber partition 52, and as shown in FIG. 3B, a curing chamber opening 56 is formed in the curing chamber partition 53. Has been.
- the width of the film forming chamber opening 54, the width of the curing chamber opening 56, and the width of the passage port described below are slightly larger than the width of the side surface (the distance between the bottom surfaces) of the central roller 17.
- the side surface of the central roller 17 is a part in the circumferential direction, and all the parts in the width direction are inserted into the film forming chamber 43. All parts in the direction are inserted into the curing chamber 44, and the side surfaces of the inserted part are exposed inside the film forming chamber 43 and the curing chamber 44.
- the unwinding device 32 and a winding device 33 are disposed inside the roll chamber 41.
- the unwinding device 32 is provided with a raw roll 21 configured by winding a long base film 23 to be formed into a film, and the base film 23 of the original roll 21 is wound up.
- the edge part of the base film 23 located in the outer periphery of the original fabric roll 21 is pulled out.
- a passage opening is formed in the partition plate 51, and the leading end of the drawn-out portion is carried into the buffer chamber 42 through the passage opening, is in contact with the side surface of the central roller 17, and extends in the circumferential direction of the side surface.
- the partition plate 51, the film formation chamber partition wall 52, and the curing chamber partition wall 53 are not in contact with each other.
- the rotary shaft 18 and the winding device 33 are provided with motors 37a and 37b, respectively.
- the unwinding device 32 is configured to be rotatable.
- the rotating shaft 18 and the central roller 17 and the winding device 33 are rotated by the motors 37a and 37b, the base roll 21 is unwound. Pulled by the material film 23 and rotated together with the unwinding device 32, the base film 23 is further unwound from the raw fabric roll 21. The unwound portion is wound up by the winding device 33 so that the base film 23 is not slackened.
- the inside of the vacuum chamber 11 is evacuated by the evacuation device 12.
- the vacuum exhaust device 12 is individually connected to the roll chamber 41, the buffer chamber 42, the film formation chamber 43, and the curing chamber 44, and each chamber 41 to 44 can be individually evacuated. Yes.
- the chambers 41 to 44 are continuously evacuated even after the vacuum atmosphere is formed in the chambers 41 to 44.
- the vacuum atmosphere is generated in the chambers 41 to 44. It is formed and continuously evacuated.
- a vapor release device 19 is disposed inside the film forming chamber 43.
- a steam generator 26 is disposed outside the vacuum chamber 11, and the steam discharge device 19 is connected to the steam generator 26.
- the steam generation device 26 includes a heating device and a container in which a liquid or solid organic compound is disposed, and the organic compound disposed in the container is heated by the heating device little by little to generate steam. It is configured.
- the organic compound is evaporated or sublimated by heating to generate a gas, and in the present invention, the gas generated by sublimation is included in the “vapor”.
- a carrier gas supply device 27 that supplies a carrier gas (a gas that does not react with an organic compound, such as a rare gas or N 2 gas) is disposed in the steam generation device 26. 26 is configured so that a carrier gas heated to a predetermined temperature can be supplied.
- a carrier gas a gas that does not react with an organic compound, such as a rare gas or N 2 gas
- the vapor discharge device 19 has a hollow discharge device main body 19a and an elongated discharge port 19b provided in the discharge device main body 19a, and is a mixed gas of vapor and carrier gas supplied from the vapor discharge device 19 Spreads uniformly in the discharge device main body 19a and is uniformly discharged into the film forming chamber 43 from the discharge port 19b.
- the discharge port 19b is disposed at a position facing the side surface of the central roller 17 so that the longitudinal direction thereof is parallel to the rotation axis 14, and the base film 23 is positioned between the discharge port 19b and the central roller 17. is doing.
- the length of the discharge port 19b in the longitudinal direction is longer than the width of the base film 23, and both ends of the discharge port 19b protrude outside the base film 23 in the width direction.
- the circular openings 19b are arranged in a line or a plurality of lines in a range longer than the width of the base film 23 in parallel with the width direction of the base film 23. May be.
- the back surface of the base film 23 between the central roller 17 and the discharge port 19b is in contact with the side surface of the central roller 17 and is discharged from the discharge port 19b.
- the generated steam reaches the portion of the base film 23 where the back surface is in contact with the central roller 17.
- Each portion of the surface of the base film 23 is in contact with the central roller 17 before being moved to a position where the vapor discharged from the discharge port 19b reaches, and is cooled by the central roller 17 as described later.
- the base film 23 thus made has a temperature at which the partial pressure of the vapor near the surface of the base film 23 where the vapor reaches is higher than the saturated vapor pressure at the internal pressure of the film forming chamber 43.
- FIG. 4A shows a state in which the organic raw material layer 35 is formed on the base film 23.
- the organic raw material layer 35 is a monomer layer composed of the monomer.
- the base film 23 is in contact with the central roller 17 after being unwound from the raw roll 21 and before the organic raw material layer 35 is formed.
- the apparatus 33 rotates and moves the base film 23
- the central roller 17 and the winding apparatus 33 are such that the base film 23 is in contact with the side surface of the central roller 17, and the back surface is Rotate to move without being scraped.
- the base film 23 on which the organic raw material layer 35 is formed is unloaded from the film formation chamber 43 with the back surface in contact with the central roller 17, passes through the buffer chamber 42, and then is loaded into the curing chamber 44. .
- an energy beam injection device 16 is provided in the curing chamber 44.
- the energy beam injection device 16 has an injection unit 13, and the injection unit 13 is arranged inside the curing chamber 44, and is configured so that an energy beam is injected from the injection unit 13 into the curing chamber 44. Yes.
- the injected energy rays are applied to the organic material layer 35 on the surface of the base film 23 that is in contact with the side surface inserted into the curing chamber 44 of the central roller 17.
- the irradiation range of the base film 23 of energy rays is a straight line along the width direction of the base film 23, that is, a straight line extending in a direction perpendicular to the moving direction of the base film 23, Irradiated to a wider range than the width direction.
- the width of the irradiation range is constant, and when the organic raw material layer 35 passes through the irradiation position, all the positions in the width direction are irradiated with the width of the energy beam.
- the polymerization reaction of the monomer occurs due to the energy of the energy rays, the polymerization reaction proceeds and the monomer becomes a polymer, and an organic thin film of the polymer is formed from the organic raw material layer 35. Is done.
- symbol 36 of FIG.4 (b) has shown the organic thin film.
- the energy rays are electrons, but they may emit other elementary particles or charged particles, or may emit electromagnetic waves (including light).
- the energy beam has a charge
- the irradiated base film 23 is charged.
- the central roller 17 is connected to the ground potential, so that charges that are to be accumulated in the organic thin film 36 and the base film 23 by the irradiation of the energy rays flow out from the central roller 17 to the ground potential. , The charge is to be reduced.
- the central roller 17 is provided with a cooling device 30.
- the cooling device 30 circulates the cooling medium between the cooling device 30 and the central roller 17, and the cooled cooling medium flows into the flow path inside the central roller 17.
- the center roller 17 is cooled by pouring.
- the back surface of the base film 23 is in contact with the portion of the side surface of the central roller 17 that is inserted into the film forming chamber 43 inside the film forming chamber 43.
- the back surface of the base film 23 is in contact with the same central roller 17 before the organic raw material layer 35 is formed and after the organic thin film 36 is formed. Yes. Meanwhile, the base film 23 is cooled by the central roller 17 and moves while being cooled.
- the heat reaching the base film 23 or the heat generated by the energy rays applied to the base film 23 and the organic raw material layer 35 raises the temperature of the cooling medium flowing through the flow path of the central roller 17, thereby raising the temperature of the cooling medium. Is returned to the cooling device 30.
- the cooling medium is radiated and cooled, and the cooling medium is circulated by transporting the cooled cooling medium to the central roller 17.
- the base film 23 only needs to be cooled to a temperature at which it is brought into contact with the central roller 17 and condensed before condensing the vapor of the organic compound. 42 may be located inside the film forming chamber 43.
- the base film 23 where the organic thin film 36 is formed passes through the curing chamber opening 56 while the back surface is in contact with the central roller 17, is unloaded from the curing chamber 44, is loaded into the buffer chamber 42, and passes through the buffer chamber 42. Passes through the passage opening formed in the partition plate 51 and is carried into the roll chamber 41.
- the base film 23 When charged particles such as electrons are emitted toward the base film 23, the base film 23 is charged, and when the base film 23 is separated from the central roller 17, the base film 23 is centered by the electrostatic force of charging. In some cases, the substrate film 23 is attracted by the roller 17 and the separation fails and the base film 23 is wound around the central roller 17.
- a static eliminator 28 is provided near the position where the base film 23 is separated from the central roller 17, and the plasma formed by the static eliminator 28 is spread to the separation position to reduce the amount of charge before separation.
- the separation position should be arranged in the chamber in which the static elimination device 28 is arranged, and here is the roll chamber 41.
- the portion of the base film 23 on which the organic thin film 36 is formed is separated from the central roller 17 in the roll chamber 41, and then passed through the plasma formed by the static eliminator 28 to be neutralized. It is wound up by 33. Therefore, since the base film 23 on which the organic thin film 36 is formed is not charged, the winding device 33 that winds the base film 23 is not charged, and there is no adsorption of the base film 23 due to charging.
- the vapor of the monomer released from the vapor release device 19 adheres to the base film 23 by condensation, and the organic raw material layer 35 is formed. Further, the organic raw material layer 35 is irradiated with energy rays to cause a polymerization reaction, and is cured to form the organic thin film 36. Meanwhile, the base film 23 is in contact with the same central roller 17 on the back surface, and the base film 23 on which the organic thin film 36 is formed by the single central roller 17 can be obtained. In that case, once the base film 23 comes into contact with the central roller 17, it is not separated until it is separated after the organic thin film 36 is formed.
- the film forming chamber 43 is arranged inside the buffer chamber 42, and the inside of the buffer chamber 42 and the film forming chamber are formed by the film forming chamber partition wall 52 and the tank wall of the vacuum chamber 11. 43 is separated from the inside.
- the inside of the buffer chamber 42 and the inside of the film forming chamber 43 are connected only by the film forming chamber opening 54, and are shielded at portions other than the film forming chamber opening 54.
- the vacuum atmosphere of the curing chamber 44 is connected to the vacuum atmosphere of the buffer chamber 42 by the curing chamber opening 56, and the vacuum atmosphere of the roll chamber 41 is connected to the vacuum atmosphere of the buffer chamber 42 by the passage opening of the partition plate 51.
- the film formation chamber opening 54 is disposed inside the buffer chamber 42, and the vapor and carrier gas flowing out of the film formation chamber opening 54 are evacuated by the evacuation device 12 that evacuates the buffer chamber 42, and the curing chamber 44. In addition, it does not flow into the roll chamber 41.
- control device 29 is a member that controls all devices provided in the film formation chamber 43 of the present invention
- the control device 29 causes the individual exhaust speeds of the respective chambers 41 to 44 of the vacuum exhaust device 12 to The amount of carrier gas supplied to the generator 26 is controlled.
- the control device 29 and the vacuum evacuation device 12 evacuate the film forming chamber 43 so that the pressure in the film forming chamber 43 is higher than the pressure in the buffer chamber 42 and the pressure in the curing chamber 44 is lower than that in the buffer chamber 42. ing.
- the pressure in the roll chamber 41 is evacuated so as to be higher than the pressure in the buffer chamber 42, and flows into the buffer chamber 42 from the film formation chamber opening 54 of the film formation chamber 43.
- the vapor of the organic compound is evacuated from the buffer chamber 42 so as not to flow into the curing chamber 44 and the roll chamber 41 from the curing chamber opening 56 and the passage opening.
- the roll chamber 41 may be provided with a gas introduction device to introduce an inert gas.
- a temperature sensor is provided inside the central roller 17, and the control device 29 measures the temperature of the central roller 17 using the temperature sensor, and the cooling is performed so that the temperature of the central roller 17 is within a predetermined temperature range.
- the apparatus 30 is controlled to control the temperature of the base film 23 when the organic raw material layer 35 is formed and the temperature of the base film 23 when the organic raw material layer 35 is cured to form the organic thin film 36. Can do.
- control device 29 may control the energy beam injection device 16, the static elimination device 28, the steam generation device 26, and the like.
- the motors 37a and 37b are connected to the rotating shaft 18 and the winding device 33, but a motor is also connected to the unwinding device 32 so that the rotation of the raw roll 21 is assisted by the rotational force of the motor.
- the supply amount of the carrier gas is controlled by a mass flow device that the carrier gas supply device 27 has and the control device 29 controls to control the growth rate of the organic raw material layer 35 on the base film 23. It can be controlled by the device 29.
- the vacuum exhaust device 12 may be provided with a plurality of vacuum pumps, and separate vacuum pumps may be connected to the respective chambers 41 to 44 so that the pressures in the respective chambers 41 to 44 are individually controlled.
- the mask board 55 is provided in the inside of the hardening chamber 44, and it is comprised so that the energy beam which passed the opening of the mask board 55 may irradiate the base film 23, and base films other than an irradiation position 23 is prevented from being exposed to energy rays.
- a pair 31 of electrodes for applying a positive voltage and an electrode for applying a negative voltage are disposed inside the housing, and a magnet 38 for confining plasma is disposed.
- the said monomer is widely contained in the organic compound which can superpose
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Abstract
Description
また、基材フィルム105上に形成される有機薄膜には、膜厚の均一性や、真空槽111の内部が、真空槽111内に放出された有機材料蒸気によって汚染されないようにする技術が求められている。
また、本発明は、前記中央ローラには冷却装置が接続され、前記冷却装置は、前記中央ローラと前記冷却装置との間に冷却媒体を循環させ、前記中央ローラを冷却するように構成された薄膜形成装置である。
また、本発明は、前記中央ローラの側面の前記放出口と対面する部分は、前記成膜室開口から前記成膜室の内部に挿入され、前記中央ローラの側面の前記射出部と対面する部分は、前記硬化室開口から前記硬化室の内部に挿入された薄膜形成装置である。
また、本発明は、前記蒸気生成装置にキャリアガスを供給するキャリアガス供給装置を有し、前記キャリアガスと前記有機化合物の蒸気とが混合された混合ガスが、前記放出口から放出される薄膜形成装置である。
また、本発明は、前記真空排気装置により、前記成膜室の圧力は、前記バッファー室の圧力よりも高くされ、前記硬化室の圧力は、前記バッファー室よりも低くされるように真空排気される薄膜形成装置である。
また、一個の中央ローラで、有機原料層の形成と、有機原料層の硬化を行っているので、真空槽の体積を小さくすることができる。
この薄膜形成装置10は、真空槽11を有しており、真空槽11の内部は、仕切板51によって仕切られて、真空槽11の内部の仕切板51の片側には、ロール室41が形成されている。
図3(a)に示すように、成膜室隔壁52には成膜室開口54が形成されており、同図(b)に示すように、硬化室隔壁53には硬化室開口56が形成されている。
巻出装置32には、成膜対象である長尺の基材フィルム23が巻き取られて構成された原反ロール21が装着されており、原反ロール21の基材フィルム23を巻取装置33によって巻き取るために、先ず、原反ロール21の外周に位置する基材フィルム23の端部が引き出される。
回転軸18と巻取装置33とには、それぞれモータ37a、37bが設けられている。
真空排気装置12は、ロール室41と、バッファー室42と、成膜室43と、硬化室44とにそれぞれ個別に接続されており、各室41~44を個別に真空排気できるようにされている。
真空槽11の外部には、蒸気生成装置26が配置されており、蒸気放出装置19は、蒸気生成装置26に接続されている。
ここでは、加熱により、有機化合物は蒸発又は昇華して気体を発生させており、本発明では、昇華で発生した気体は「蒸気」に含まれるものとする。
蒸気放出装置19は、内部中空の放出装置本体19aと、放出装置本体19aに設けられた細長の放出口19bとを有しており、蒸気放出装置19から供給された蒸気とキャリアガスの混合気体は、放出装置本体19a内で均一に広がり、放出口19bから成膜室43内に均一に放出される。
放出口19bの長手方向の長さは、基材フィルム23の幅よりも長くされており、放出口19bの両端は、基材フィルム23の幅方向の外側にはみ出るようにされている。
蒸気がキャリアガスと共に放出口19bから放出されると、蒸気は、基材フィルム23の幅方向の両端を含む範囲に到達する。
硬化室44には、エネルギー線射出装置16が設けられている。
射出されたエネルギー線は、中央ローラ17の硬化室44の内部に挿入された側面に接触された基材フィルム23の表面の有機原料層35に照射される。
但し、エネルギー線が電荷を有している場合には、照射された基材フィルム23が帯電してしまう。本発明では、中央ローラ17は接地電位に接続されており、従って、エネルギー線の照射によって有機薄膜36や基材フィルム23に蓄積されようとする電荷は、中央ローラ17から、接地電位に流出し、帯電が減少するようにされている。
冷却装置30では冷却媒体は放熱され、冷却されており、中央ローラ17には、冷却された冷却媒体が輸送されることで、冷却媒体は循環される。
分離位置は、除電装置28が配置されている室に配置すべきであり、ここではロール室41である。
各室が真空排気される際、ロール室41の圧力は、バッファー室42の圧力よりも高くなるように真空排気されており、成膜室43の成膜室開口54からバッファー室42内に流入した有機化合物の蒸気は、バッファー室42から真空排気され、硬化室開口56や通過口から硬化室44やロール室41には流入しないようにされている。ロール室41には、ガス導入装置を設け、不活性ガスを導入するようにしても良い。
上記例では、回転軸18と巻取装置33とにモータ37a、37bを接続したが、巻出装置32にもモータを接続して、モータの回転力で原反ロール21の回転を補助するようにしても良い。
なお、上記モノマーは、エネルギー線の照射によって重合し、有機薄膜を形成できる有機化合物が広く含まれる。
12……真空排気装置
14……回転軸線
17……中央ローラ
19b……放出口
21……原反ロール
23……基材フィルム
26……蒸気生成装置
27……キャリアガス供給装置
30……冷却装置
32……巻出装置
33……巻取装置
35……有機原料層
36……有機薄膜
41……ロール室
42……バッファー室
43……成膜室
44……硬化室
54……成膜室開口
56……硬化室開口
Claims (5)
- 真空槽と、
蒸気放出装置と、
エネルギー線射出装置と、
巻出装置と、
巻取装置と、
円筒状の中央ローラとを有し、
前記巻出装置に装着された基材フィルムの原反ロールが巻き出され、巻き出された基材フィルムは、裏面が前記中央ローラの側面と接触しながら前記真空槽内を走行し、前記巻取装置によって巻き取られる間に、前記蒸気放出装置の放出口から前記真空槽内に放出された有機化合物の蒸気が、前記中央ローラの側面に接触する部分の前記基材フィルムの表面に到達し、有機原料層が形成された後、前記エネルギー線射出装置の射出部から射出されたエネルギー線が前記有機原料層に照射され、前記有機原料層中の前記有機化合物が化学反応し、有機薄膜が形成される薄膜形成装置であって、
前記真空槽の外部には、前記有機化合物の蒸気を生成し、前記蒸気放出装置に供給する蒸気生成装置が配置され、
前記真空槽の内部には、バッファー室が配置され、
前記真空槽内部であって前記バッファー室の外部には硬化室が配置され、
前記バッファー室の内部には成膜室が配置され、
前記バッファー室と、前記成膜室と、前記硬化室とは、それぞれ真空排気装置に接続され、
前記放出口は前記成膜室の内部に配置され、
前記射出部は前記硬化室に配置され、
前記中央ローラは、前記バッファー室に位置する回転軸線を中心にして回転するように配置され、
前記成膜室を形成する成膜室隔壁のうち、前記回転軸線と前記放出口との間に位置する部分に成膜室開口が設けられ、前記放出口と前記中央ローラの側面とが対面し、
前記硬化室を形成する硬化室隔壁のうち、前記回転軸線と前記射出部との間に位置する部分に硬化室開口が設けられ、前記射出部と前記中央ローラの側面とが対面するように構成された薄膜形成装置。 - 前記中央ローラには冷却装置が接続され、前記冷却装置は、前記中央ローラと前記冷却装置との間に冷却媒体を循環させ、前記中央ローラを冷却するように構成された請求項1記載の薄膜形成装置。
- 前記中央ローラの側面の前記放出口と対面する部分は、前記成膜室開口から前記成膜室の内部に挿入され、
前記中央ローラの側面の前記射出部と対面する部分は、前記硬化室開口から前記硬化室の内部に挿入された請求項1又は請求項2のいずれか1項記載の薄膜形成装置。 - 前記蒸気生成装置にキャリアガスを供給するキャリアガス供給装置を有し、
前記キャリアガスと前記有機化合物の蒸気とが混合された混合ガスが、前記放出口から放出される請求項1乃至請求項3のいずれか1項記載の薄膜形成装置。 - 前記真空排気装置により、前記成膜室の圧力は、前記バッファー室の圧力よりも高くされ、前記硬化室の圧力は、前記バッファー室よりも低くされるように真空排気される請求項1乃至請求項4のいずれか1項記載の薄膜形成装置。
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US20150114290A1 (en) | 2015-04-30 |
JP5953374B2 (ja) | 2016-07-20 |
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EP2868767A1 (en) | 2015-05-06 |
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