[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2009047886A1 - ケースモールド型コンデンサとその製造方法 - Google Patents

ケースモールド型コンデンサとその製造方法 Download PDF

Info

Publication number
WO2009047886A1
WO2009047886A1 PCT/JP2008/002764 JP2008002764W WO2009047886A1 WO 2009047886 A1 WO2009047886 A1 WO 2009047886A1 JP 2008002764 W JP2008002764 W JP 2008002764W WO 2009047886 A1 WO2009047886 A1 WO 2009047886A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold type
manufacturing
same
type capacitor
case mold
Prior art date
Application number
PCT/JP2008/002764
Other languages
English (en)
French (fr)
Inventor
Takuya Kyouda
Makoto Tomita
Toshiharu Saito
Shigeo Okuno
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009536917A priority Critical patent/JP4973735B2/ja
Priority to US12/678,425 priority patent/US8315031B2/en
Priority to CN2008801112327A priority patent/CN101821823B/zh
Priority to EP08837527.4A priority patent/EP2234130B1/en
Priority to KR1020107006664A priority patent/KR101148419B1/ko
Publication of WO2009047886A1 publication Critical patent/WO2009047886A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　ケースモールド型コンデンサは、コンデンサ素子と一対の端子とモールド樹脂とを有する。一対の端子はコンデンサ素子の第１電極と第２電極にそれぞれ接続されている。モールド樹脂は一対の端子の一端に設けられた端子部の一部がそれぞれ露出するようにしてコンデンサ素子を埋設している。モールド樹脂は、無機フィラーを含むエポキシ樹脂と、エポキシ樹脂に混入された吸湿剤とを含む。
PCT/JP2008/002764 2007-10-12 2008-10-02 ケースモールド型コンデンサとその製造方法 WO2009047886A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009536917A JP4973735B2 (ja) 2007-10-12 2008-10-02 ケースモールド型コンデンサとその製造方法
US12/678,425 US8315031B2 (en) 2007-10-12 2008-10-02 Case mold type capacitor
CN2008801112327A CN101821823B (zh) 2007-10-12 2008-10-02 壳体模制型电容器及其制造方法
EP08837527.4A EP2234130B1 (en) 2007-10-12 2008-10-02 Case mold type capacitor and method for manufacturing the same
KR1020107006664A KR101148419B1 (ko) 2007-10-12 2008-10-02 케이스 몰드형 콘덴서와 그 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007266354 2007-10-12
JP2007-266354 2007-10-12
JP2008032870 2008-02-14
JP2008-032870 2008-02-14

Publications (1)

Publication Number Publication Date
WO2009047886A1 true WO2009047886A1 (ja) 2009-04-16

Family

ID=40549039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002764 WO2009047886A1 (ja) 2007-10-12 2008-10-02 ケースモールド型コンデンサとその製造方法

Country Status (6)

Country Link
US (1) US8315031B2 (ja)
EP (1) EP2234130B1 (ja)
JP (1) JP4973735B2 (ja)
KR (1) KR101148419B1 (ja)
CN (1) CN101821823B (ja)
WO (1) WO2009047886A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101767411A (zh) * 2010-01-18 2010-07-07 漳州市科泰精密科技有限公司 自动顶退电容壳成型装置
JP2018160498A (ja) * 2017-03-22 2018-10-11 ニチコン株式会社 ケースレスフィルムコンデンサ
WO2019087259A1 (ja) * 2017-10-30 2019-05-09 日立化成株式会社 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法
JP2019117038A (ja) * 2017-12-27 2019-07-18 ユニオン昭和株式会社 サブクールコンデンサ
US12077666B2 (en) 2017-10-30 2024-09-03 Resonac Corporation Resin composition, cured product, molding and method for producing same, and film capacitor and method for producing same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2623709A1 (de) * 2011-10-27 2013-08-07 Siemens Aktiengesellschaft Kondensatorvorrichtung für eine Leiterschleife einer Vorrichtung zur "in situ"-Förderung von Schweröl und Bitumen aus Ölsand-Lagerstätten.
KR101545410B1 (ko) * 2013-12-31 2015-08-21 현대모비스 주식회사 커패시터 모듈, 이의 제조 방법 및 이를 적용한 차량용 인버터
JP6352740B2 (ja) * 2014-09-11 2018-07-04 株式会社ケーヒン 電力変換装置
CN105702458B (zh) * 2014-11-28 2018-03-13 比亚迪股份有限公司 三电平用薄膜电容器
US10355611B2 (en) * 2014-12-22 2019-07-16 Flex Power Control, Inc. Multi-functional power management system
WO2017134699A1 (en) * 2016-02-04 2017-08-10 Murata Manufacturing Co., Ltd. Roll-up type capacitor and process for producing the same
JP6920593B2 (ja) * 2016-05-31 2021-08-18 パナソニックＩｐマネジメント株式会社 電解コンデンサおよびその製造方法
EP3736841A4 (en) * 2018-01-25 2021-11-24 Murata Manufacturing Co., Ltd. FILM CAPACITOR, AND OUTER CASE FOR FILM CAPACITOR

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05171041A (ja) * 1991-12-25 1993-07-09 Tosoh Corp ポリフェニレンスルフィド樹脂組成物
JP2002289459A (ja) * 2001-03-28 2002-10-04 Okaya Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2004146724A (ja) * 2002-10-28 2004-05-20 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522842A (en) 1978-08-03 1980-02-18 Sanyo Electric Co Resin sealed electronic part
JPS59117213A (ja) 1982-12-24 1984-07-06 日本電気株式会社 電子部品
JPH0611864B2 (ja) * 1986-01-18 1994-02-16 松下電工株式会社 ポリフエニレンスルフイド樹脂組成物
DE3639791A1 (de) * 1986-02-15 1987-08-27 Licentia Gmbh Elektrischer kondensator mit abreisssicherung
US4760494A (en) * 1987-07-22 1988-07-26 General Electric Company Capacitor containing an adsorbent material
JPH01294476A (ja) 1988-05-07 1989-11-28 Fujitsu Ltd 樹脂封止電子部品の収納容器
US5264393A (en) * 1988-11-25 1993-11-23 Fuji Photo Film Co., Ltd. Solid state image pickup device and method of manufacturing the same
JPH03122114A (ja) * 1989-10-06 1991-05-24 Somar Corp 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物
US5827908A (en) * 1994-01-26 1998-10-27 Shin-Etsu Chemical Co., Ltd. Naphthalene and or biphenyl skeleton containing epoxy resin composition
JPH0995527A (ja) 1995-09-29 1997-04-08 Sumitomo Bakelite Co Ltd 電子部品封止用樹脂組成物
JP3197872B2 (ja) * 1998-09-07 2001-08-13 岡谷電機産業株式会社 ケース外装型電子部品及びその製造方法
JP2000230110A (ja) 1999-02-15 2000-08-22 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2000281876A (ja) 1999-03-30 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2000281869A (ja) 1999-03-30 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2000281872A (ja) 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
DE19918090A1 (de) * 1999-04-21 2000-11-02 Epcos Ag Leistungselektronik-Bauelement mit verbesserten thermischen Eigenschaften
EP1744606A3 (en) * 1999-09-02 2007-04-11 Ibiden Co., Ltd. Printed circuit board and method for producing the printed circuit board
JP4511079B2 (ja) 2001-05-25 2010-07-28 パナソニック株式会社 金属化フィルムコンデンサ
JP3780975B2 (ja) * 2002-05-22 2006-05-31 松下電器産業株式会社 コンデンサの製造方法およびコンデンサ
FR2841254B1 (fr) * 2002-06-24 2004-09-03 Atofina Compositions ignifugees a base de polyamide et de polyolefine
JP2004168974A (ja) 2002-11-22 2004-06-17 Sumitomo Bakelite Co Ltd フェノール樹脂成形材料
JP2004277635A (ja) 2003-03-18 2004-10-07 Sumitomo Bakelite Co Ltd フェノール樹脂成形材料
JP2004303934A (ja) 2003-03-31 2004-10-28 Okaya Electric Ind Co Ltd コンデンサの製造方法
JP2005093515A (ja) 2003-09-12 2005-04-07 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサとその製造方法、および自動車駆動用インバータ回路とそれを用いた自動車
JP2005146157A (ja) 2003-11-18 2005-06-09 Mitsui Chemicals Inc エポキシ樹脂組成物および半導体素子収納用中空パッケージ
JP4747560B2 (ja) * 2004-11-17 2011-08-17 パナソニック株式会社 フィルムコンデンサおよびその製造方法
JP2006265370A (ja) 2005-03-24 2006-10-05 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP4774784B2 (ja) 2005-03-30 2011-09-14 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5288150B2 (ja) 2005-10-24 2013-09-11 株式会社スリーボンド 有機ｅｌ素子封止用熱硬化型組成物
JP4973097B2 (ja) 2005-12-16 2012-07-11 東レ株式会社 ポリフェニレンスルフィド樹脂組成物および成形品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05171041A (ja) * 1991-12-25 1993-07-09 Tosoh Corp ポリフェニレンスルフィド樹脂組成物
JP2002289459A (ja) * 2001-03-28 2002-10-04 Okaya Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2004146724A (ja) * 2002-10-28 2004-05-20 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2234130A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101767411A (zh) * 2010-01-18 2010-07-07 漳州市科泰精密科技有限公司 自动顶退电容壳成型装置
JP2018160498A (ja) * 2017-03-22 2018-10-11 ニチコン株式会社 ケースレスフィルムコンデンサ
WO2019087259A1 (ja) * 2017-10-30 2019-05-09 日立化成株式会社 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法
US11339284B2 (en) 2017-10-30 2022-05-24 Showa Denko Materials Co., Ltd. Resin composition, cured product, formed body and manufacturing method thereof, and film capacitor and manufacturing method thereof
US12077666B2 (en) 2017-10-30 2024-09-03 Resonac Corporation Resin composition, cured product, molding and method for producing same, and film capacitor and method for producing same
JP2019117038A (ja) * 2017-12-27 2019-07-18 ユニオン昭和株式会社 サブクールコンデンサ

Also Published As

Publication number Publication date
EP2234130B1 (en) 2015-12-23
US8315031B2 (en) 2012-11-20
KR101148419B1 (ko) 2012-05-25
CN101821823A (zh) 2010-09-01
EP2234130A4 (en) 2013-01-23
KR20100047336A (ko) 2010-05-07
JP4973735B2 (ja) 2012-07-11
US20100202095A1 (en) 2010-08-12
EP2234130A1 (en) 2010-09-29
CN101821823B (zh) 2013-03-06
JPWO2009047886A1 (ja) 2011-02-17

Similar Documents

Publication Publication Date Title
WO2009047886A1 (ja) ケースモールド型コンデンサとその製造方法
WO2008089415A3 (en) A small form factor molded memory card and method thereof
WO2010039453A3 (en) Inertial sensor with dual cavity package and method of fabrication
WO2007130497A3 (en) Molded elements
WO2009105449A3 (en) Flat leadless packages and stacked leadless package assemblies
WO2009066504A1 (ja) 部品内蔵モジュール
WO2007095468A3 (en) Multi-chip module for battery power control
EP2357876A4 (en) ELECTROCONDUCTIVE CONNECTION MATERIAL, METHOD FOR CONNECTING TERMINALS TO OTHER BY USING THE ELECTROCONDUCTIVE CONNECTION MATERIAL, AND METHOD FOR MANUFACTURING CONNECTION TERMINAL
WO2009057654A1 (ja) 部品内蔵配線板、部品内蔵配線板の製造方法
WO2008081696A1 (ja) 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
TW200620587A (en) Package structure with embedded chip and method for fabricating the same
WO2009076579A3 (en) Overmolded circuit board and method
WO2007143458A3 (en) Method and apparatus for a dummy sram cell
WO2009055365A3 (en) Packaged microchip with spacer for mitigating electrical leakage between components
TW200735480A (en) Casing for electric connections and process for manufacturing such a casing
WO2010078021A3 (en) Removable package underside device attach
WO2012065041A3 (en) Rfid devices and methods for manufacturing
WO2010028009A8 (en) Electrically conductive module
WO2009001170A3 (en) Filter having impedance matching circuits
CN101742852B (zh) 防水塞及应用该防水塞的电子装置
WO2009093822A3 (ko) 파워제어모듈 및 이를 구비한 배터리팩
WO2009072493A1 (ja) 感光性接着剤、半導体装置及び半導体装置の製造方法
WO2010135388A3 (en) Active material circuit protector
ATE514067T1 (de) Kunststoffgehäuse mit integrierter steckerschnittstelle
WO2009041044A1 (ja) 半導体モジュール、半導体モジュールの製造方法および携帯機器

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880111232.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08837527

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009536917

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2008837527

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12678425

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20107006664

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE