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WO2009072493A1 - 感光性接着剤、半導体装置及び半導体装置の製造方法 - Google Patents

感光性接着剤、半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
WO2009072493A1
WO2009072493A1 PCT/JP2008/071883 JP2008071883W WO2009072493A1 WO 2009072493 A1 WO2009072493 A1 WO 2009072493A1 JP 2008071883 W JP2008071883 W JP 2008071883W WO 2009072493 A1 WO2009072493 A1 WO 2009072493A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
photosensitive adhesive
manufacturing
connecting terminal
substrate
Prior art date
Application number
PCT/JP2008/071883
Other languages
English (en)
French (fr)
Inventor
Takashi Masuko
Takashi Kawamori
Kazuyuki Mitsukura
Shigeki Katogi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to US12/745,594 priority Critical patent/US8349700B2/en
Priority to CN2008801171626A priority patent/CN101868852B/zh
Priority to KR1020107011963A priority patent/KR101138742B1/ko
Priority to EP08856848A priority patent/EP2219214A1/en
Priority to JP2009544677A priority patent/JP5526783B2/ja
Publication of WO2009072493A1 publication Critical patent/WO2009072493A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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Abstract

　接続端子を有する基板３上に感光性接着剤（絶縁樹脂層７）を設ける第１の工程と、感光性接着剤を露光及び現像により、接続端子が露出する開口１３が形成されるようにパターニングする第２の工程と、開口１３に導電材を充填して導電層９を形成する第３の工程と、接続用電極部を有する半導体チップ５を感光性接着剤に直接接着すると共に、基板３の接続端子と半導体チップ５の接続用電極部とを導電層９を介して電気的に接続する第４の工程と、を備える、半導体装置１の製造方法。
PCT/JP2008/071883 2007-12-04 2008-12-02 感光性接着剤、半導体装置及び半導体装置の製造方法 WO2009072493A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/745,594 US8349700B2 (en) 2007-12-04 2008-12-02 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
CN2008801171626A CN101868852B (zh) 2007-12-04 2008-12-02 感光性胶粘剂、半导体装置及半导体装置的制造方法
KR1020107011963A KR101138742B1 (ko) 2007-12-04 2008-12-02 감광성 접착제, 반도체 장치 및 반도체 장치의 제조 방법
EP08856848A EP2219214A1 (en) 2007-12-04 2008-12-02 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
JP2009544677A JP5526783B2 (ja) 2007-12-04 2008-12-02 半導体装置及び半導体装置の製造方法

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JP2007-313906 2007-12-04
JP2007313906 2007-12-04

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EP (1) EP2219214A1 (ja)
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CN (2) CN101868852B (ja)
TW (1) TW200941548A (ja)
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JP2011215360A (ja) * 2010-03-31 2011-10-27 Toyobo Co Ltd 感光性樹脂組成物
JP2017201694A (ja) * 2017-05-31 2017-11-09 日立化成株式会社 液状感光性接着剤、接着剤層付き半導体ウェハの製造方法、半導体装置の製造方法及び半導体素子付き半導体ウェハの製造方法

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US8790996B2 (en) 2012-07-16 2014-07-29 Invensas Corporation Method of processing a device substrate
TWI595572B (zh) * 2016-06-29 2017-08-11 摩爾創新科技股份有限公司 具有三維立體結構的電子組件的製造方法
KR102440327B1 (ko) * 2017-03-21 2022-09-05 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 수지 조성물 필름, 절연막 및 전자 부품
JP7045929B2 (ja) * 2018-05-28 2022-04-01 東京エレクトロン株式会社 半導体装置の製造方法および基板処理装置
CN108882552A (zh) * 2018-08-10 2018-11-23 武汉华星光电半导体显示技术有限公司 导电胶及电路板的邦定方法
JPWO2021039565A1 (ja) * 2019-08-26 2021-03-04

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