TWI849035B - 分斷方法及裂斷方法 - Google Patents
分斷方法及裂斷方法 Download PDFInfo
- Publication number
- TWI849035B TWI849035B TW109101195A TW109101195A TWI849035B TW I849035 B TWI849035 B TW I849035B TW 109101195 A TW109101195 A TW 109101195A TW 109101195 A TW109101195 A TW 109101195A TW I849035 B TWI849035 B TW I849035B
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- TW
- Taiwan
- Prior art keywords
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Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 342
- 239000003566 sealing material Substances 0.000 claims abstract description 40
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 230000035515 penetration Effects 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 9
- 230000035699 permeability Effects 0.000 claims description 8
- 230000011218 segmentation Effects 0.000 claims description 7
- 238000003776 cleavage reaction Methods 0.000 claims description 5
- 230000007017 scission Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005336 cracking Methods 0.000 abstract description 11
- 238000012795 verification Methods 0.000 description 58
- 238000011156 evaluation Methods 0.000 description 15
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 6
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2019-014672 | 2019-01-30 | ||
| JP2019014672A JP7228883B2 (ja) | 2019-01-30 | 2019-01-30 | 分断方法およびブレイク方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202041475A TW202041475A (zh) | 2020-11-16 |
| TWI849035B true TWI849035B (zh) | 2024-07-21 |
Family
ID=71848079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109101195A TWI849035B (zh) | 2019-01-30 | 2020-01-14 | 分斷方法及裂斷方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7228883B2 (ja) |
| KR (1) | KR20200094697A (ja) |
| CN (1) | CN111497034B (ja) |
| TW (1) | TWI849035B (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255362A (ja) * | 2002-03-05 | 2003-09-10 | Citizen Watch Co Ltd | セルとその製造方法およびそのセルを用いた液晶光学素子 |
| JP2011241145A (ja) * | 2005-07-06 | 2011-12-01 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料用スクライビングホイールの製造方法 |
| TW201815538A (zh) * | 2016-07-26 | 2018-05-01 | 日商三星鑽石工業股份有限公司 | 基板分斷裝置、及基板分斷方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100893871B1 (ko) * | 2004-10-13 | 2009-04-20 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템 |
| JP4902155B2 (ja) | 2005-08-31 | 2012-03-21 | オプトレックス株式会社 | 基板分断方法 |
| JP2009083079A (ja) | 2007-10-03 | 2009-04-23 | Seiko Epson Corp | 貼合せ基板の分断装置および貼合せ基板の分断方法 |
| JP2011088382A (ja) * | 2009-10-23 | 2011-05-06 | Mitsuboshi Diamond Industrial Co Ltd | ブレイク装置およびブレイク方法 |
| JP5156085B2 (ja) * | 2010-12-13 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板の分断方法 |
| JP2016060684A (ja) * | 2014-09-22 | 2016-04-25 | 三星ダイヤモンド工業株式会社 | 基板分断方法及びスクライブ装置 |
| JP6405968B2 (ja) * | 2014-12-10 | 2018-10-17 | 三星ダイヤモンド工業株式会社 | 基板分断方法およびスクライブ装置 |
| JP2016121037A (ja) * | 2014-12-25 | 2016-07-07 | 三星ダイヤモンド工業株式会社 | スクライブ装置 |
| JP6540272B2 (ja) | 2015-06-26 | 2019-07-10 | 三星ダイヤモンド工業株式会社 | ブレイク装置及びブレイク方法 |
| JP6638400B2 (ja) * | 2016-01-05 | 2020-01-29 | 三星ダイヤモンド工業株式会社 | 基板分断方法 |
| JP6493512B2 (ja) * | 2017-12-29 | 2019-04-03 | 三星ダイヤモンド工業株式会社 | 分断方法および分断装置 |
-
2019
- 2019-01-30 JP JP2019014672A patent/JP7228883B2/ja active Active
-
2020
- 2020-01-14 TW TW109101195A patent/TWI849035B/zh active
- 2020-01-22 CN CN202010075675.8A patent/CN111497034B/zh active Active
- 2020-01-30 KR KR1020200010802A patent/KR20200094697A/ko active Search and Examination
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255362A (ja) * | 2002-03-05 | 2003-09-10 | Citizen Watch Co Ltd | セルとその製造方法およびそのセルを用いた液晶光学素子 |
| JP2011241145A (ja) * | 2005-07-06 | 2011-12-01 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料用スクライビングホイールの製造方法 |
| TW201815538A (zh) * | 2016-07-26 | 2018-05-01 | 日商三星鑽石工業股份有限公司 | 基板分斷裝置、及基板分斷方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7228883B2 (ja) | 2023-02-27 |
| CN111497034A (zh) | 2020-08-07 |
| CN111497034B (zh) | 2024-03-22 |
| KR20200094697A (ko) | 2020-08-07 |
| JP2020121478A (ja) | 2020-08-13 |
| TW202041475A (zh) | 2020-11-16 |
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