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KR950030323A - 반도체 장치와 반도체 장치의 생산방법 및 반도체 모듈 - Google Patents

반도체 장치와 반도체 장치의 생산방법 및 반도체 모듈 Download PDF

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Publication number
KR950030323A
KR950030323A KR1019950008559A KR19950008559A KR950030323A KR 950030323 A KR950030323 A KR 950030323A KR 1019950008559 A KR1019950008559 A KR 1019950008559A KR 19950008559 A KR19950008559 A KR 19950008559A KR 950030323 A KR950030323 A KR 950030323A
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South Korea
Prior art keywords
semiconductor device
lead
semiconductor
lead frame
substrate
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KR1019950008559A
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English (en)
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KR0153595B1 (ko
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테쓰야 우에다
키사미쓰 오노
코오 시모무라
히데유키 이치야마
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기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR950030323A publication Critical patent/KR950030323A/ko
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Publication of KR0153595B1 publication Critical patent/KR0153595B1/ko

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Abstract

본 발명은 크기가 감소되고 더 높은 방열성을 가진 직립형 표면 실장 패키지의 반도체 장치와, 그런 장치를 생상하는 방법과, 반도체 모듈을 제공하는데 목적이 있다.
제1리드 프레임의 리드선(2)과 제2리드 프레임의 리드선(3)은 서로 평행하고 적어도 그 리드선의 일부는 투영면에서 서로 겹치도록 배치된다.
내부 리드선은 반도체 패키지로 부터 연장되어 빠져나와 있거나, 또는 반도체 패키지의 다이 패드의 동면이 노출되어 있다.
본 발명은 더 많은 외부 리드선을 이용할 수 있고, 반도체 장치의 크기를 감소시킬 수 있으며, 고밀도 실장을 성취할 수 있다.

Description

반도체 장치와 반도체 장치의 생산방법 및 반도체 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 반도체 장치의 일부 파단된 사시도, 제2도는 제1도에 예시된 반도체의 측단면도, 제3도는 본 발명의 제1실시예에 있어서 외부 리드선이 선단에서 굽혀진 반도체 장치의 부분 측단면도, 제4도는 본 발명의 제1실시예에 있어서 매몰된 내부 리드선의 선단을 가진 반도체 장치의 측단면도, 제5도는 제1실시예에 있어서 TAB 리드선을 가진 반도체 장치의 측단면도, 제6도는 본 발명의 제2실시예에 따른 반도체 장치의 일부 파단된 사시도, 제7도는 제6도에 예시된 반도체의 측단면도, 제8도는 본 발명의 제2실시예에 따른 반도체 장치의 부분적인 측단면도.

Claims (15)

  1. 반도체 칩이 수지봉입으로 매몰되고 두개의 리드 프레임을 가진 반도체 장치에 있어서, 제1리드 프레임의 일부를 형성하는 외부 리드선이 제2리드 프레임의 일부를 형성하는 외부 리드선과 평행하면서도 동일 평면에 포함되지 않도록 배치되고, 상기의 두 외부 리드선이 각각 같은 평면으로부터 연장되어 삐져나올때, 제1의 리드 프레임의 외부 리드선이 적어도 제2의 리드 프레임의 외부 리드선의 일부와 겹치도록 배치됨을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 복수개의 외부 리드선이 2개의 행으로 배치되고 반도체 장치의 한 옆면으로 부터 연장되어 빠져나오고, 연장되어 삐져나온 각행의 외부 리드선 각각은 그의 반대편의 외부 리드선에 대해 거의 수직으로 굽혀져서 반도체 장치의 정면에 대해 거의 수직이 됨을 특징으로 하는 반도체 장치.
  3. 제1항에 있어서, 제1리드 프레임의 그 내부 리드선은 반도체 칩의 기능 면에 연장되어 있고 반도체 장치의 외부 리드선이 연장되어 빠져나온 옆면의 반대쪽에 배치되어서 그 반도체 칩의 전극에 전기적으로 연결되어 있으며, 제2리드 프레임의 그 내부 리드선은 상기 반도체 칩의 전극에 전기적으로 연결되어 있고, 그 반도체 장치의 그 외부 리드선은 연장되어 삐져나온 옆면에 배치되어 있음을 특징으로 하는 반도체 장치.
  4. 제1항에 있어서, 상기 리드 프레임의 내부 리드선의 그 선단은 낮은 부분을 형성하도록 아래로 굽혀짐을 특징으로 하는 반도체 장치.
  5. 제1항에 있어서, 반도체 칩의 제2리드 프레임의 내부 리드선과 그 반도체 칩의 전극은 TAB 리드선으로 전기적으로 연결됨을 특징으로 하는 반도체 장치.
  6. 제1항에 있어서, 제1리드 프레임의 그 내부 리드선은 그 반도체 칩의 기능 면측의 봉입 수지로 부터 연장되어 삐져나온 것을 특징으로 하는 반도체 장치.
  7. 제1항에 있어서, 제2리드 프레임의 그 내부 리드선은 다이 패드에 연결되고, 그 봉입 수지에 매몰된 그 다이 패드는, 그 반도체 칩이 실장된 표면에 반대되는, 그의 동면이 부분적으로 노출됨을 특징으로 하는 반도체 장치.
  8. 제1항에 있어서, 제2리드 프레임의 일부가 방열판을 형성하도록 그 반도체 장치로부터 연장되어 삐져나온 것을 특징으로 하는 반도체 장치.
  9. 수지봉입으로 매몰된 반도체 칩과 더불어, 두개의 리드 프레임을 가진 반도체 장치에 있어서, 제1리드 프레임의 리드선이 반도체 장치의 그 정면으로 부터 연장되어 삐져 나오고, 제2리드 프레임의 외부 리드선이 반도체 장치의 한 측면으로 부터 연장되어 삐져나온 것을 특징으로 하는 반도체 장치.
  10. 기판과 복수개의 반도체 장치로 구성된 반도체 모듈에 있어서, 두개의 행으로 배열되고 그 반도체 장치의 한 측면으로부터 서로 거의 평행하게 연장되어 삐져나온 외부 리드선이, 그 기판을 파고 들어서 그 반도체장치가 거의 동일한 평면상으로 기판에 실장됨을 특징으로 하는 반도체 모듈.
  11. 제10항에 있어서, 그 기본 보드와의 전기적 접속을 위한 전극을 가진 그 기판의 일부가 확장된 너비를 가진 것을 특징으로 하는 반도체 모듈.
  12. 기판과 복수개의 반도체 장치로 구성된 반도체 모듈에 있어서, 상기의 반도체 장치는 그 기본 보드에 연결된 상기 기판의 한 옆면과 상기 기판의 적어도 한 면위에 서로 평행하게 배열되어 있음을 특징으로 하는 반도체 모듈.
  13. 기판과 복수개의 반도체의 장치로 구성된 반도체 모듈에 있어서, 상기 반도체장치는 기본 보드에 연결된 상기 기판의 한 옆면과 상기 기판의 적어도 한 면위에 수직이 되도록 실장되어 있음을 특징으로 하는 반도체 모듈.
  14. 다이 패드에 실장된 반도체 칩이 수지로 봉합되어 있고, 두개의 리드 프레임을 가진 반도체 장치를 생산하는 방법에 있어서, 다이는 제1리드 프레임의 외부 리드선과 제2리드 프레임의 외부 리드선 사이에 파여진 홈이 있어서 상층 다이와 하층 다이에 의해서 수지로 봉입됨을 특징으로 하는 반도체 장치의 생산방법.
  15. 다이 패드에 실장된 반도체 칩이 수지로 봉입되어 있고, 두개의 리드 프레임을 가진 반도체 장치를 생산하는 방법에 있어서, 상기의 반도체 칩위에 실장된 그 두개의 리드 프레임과 그 다이 패드는 그 하층 다이에 놓여 있고, 블록 부재는 그 두 리드 프레임의 그 외부 리드선 사이로 삽입되어 있고, 그 상층 다이는 수지봉입을 수행하도록 그 하층 다이위에 조립되는 것을 특징으로 하는 반도체 장치의 생산방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950008559A 1994-04-19 1995-04-12 반도체 장치와 반도체 장치의 생산방법 및 반도체 모듈 KR0153595B1 (ko)

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Families Citing this family (138)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118173A (en) * 1996-11-14 2000-09-12 Nippon Steel Semiconductor Corporation Lead frame and a semiconductor device
US5907769A (en) 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6175161B1 (en) 1998-05-22 2001-01-16 Alpine Microsystems, Inc. System and method for packaging integrated circuits
AU7592198A (en) * 1997-05-23 1998-12-11 Alpine Microsystems, Inc. A system and method for packaging integrated circuits
KR19990000698A (ko) * 1997-06-10 1999-01-15 윤종용 고방열 구조를 갖는 반도체 패키지
US5995378A (en) * 1997-12-31 1999-11-30 Micron Technology, Inc. Semiconductor device socket, assembly and methods
US5940277A (en) * 1997-12-31 1999-08-17 Micron Technology, Inc. Semiconductor device including combed bond pad opening, assemblies and methods
US6342731B1 (en) 1997-12-31 2002-01-29 Micron Technology, Inc. Vertically mountable semiconductor device, assembly, and methods
US6803656B2 (en) * 1997-12-31 2004-10-12 Micron Technology, Inc. Semiconductor device including combed bond pad opening
US6235551B1 (en) * 1997-12-31 2001-05-22 Micron Technology, Inc. Semiconductor device including edge bond pads and methods
US6140696A (en) 1998-01-27 2000-10-31 Micron Technology, Inc. Vertically mountable semiconductor device and methods
US6207474B1 (en) * 1998-03-09 2001-03-27 Micron Technology, Inc. Method of forming a stack of packaged memory die and resulting apparatus
US6087723A (en) * 1998-03-30 2000-07-11 Micron Technology, Inc. Vertical surface mount assembly and methods
US6147411A (en) * 1998-03-31 2000-11-14 Micron Technology, Inc. Vertical surface mount package utilizing a back-to-back semiconductor device module
US6089920A (en) * 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6124150A (en) 1998-08-20 2000-09-26 Micron Technology, Inc. Transverse hybrid LOC package
US6153929A (en) * 1998-08-21 2000-11-28 Micron Technology, Inc. Low profile multi-IC package connector
US6326687B1 (en) * 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
DE19843479A1 (de) * 1998-09-22 2000-03-30 Siemens Ag Halbleiterbauelement
US6261865B1 (en) 1998-10-06 2001-07-17 Micron Technology, Inc. Multi chip semiconductor package and method of construction
US6448633B1 (en) * 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6419517B1 (en) 1999-02-26 2002-07-16 Micron Technology, Inc. Apparatus and method for packaging circuits
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
KR100403142B1 (ko) * 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
KR100421774B1 (ko) * 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
KR100583494B1 (ko) * 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
KR20020058209A (ko) * 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
KR100393448B1 (ko) * 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
KR20030085444A (ko) * 2002-04-30 2003-11-05 세미텍 주식회사 반도체 패키지
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
JP2004079760A (ja) * 2002-08-19 2004-03-11 Nec Electronics Corp 半導体装置及びその組立方法
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US20040084211A1 (en) * 2002-10-30 2004-05-06 Sensonix, Inc. Z-axis packaging for electronic device and method for making same
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
KR100723174B1 (ko) * 2004-08-09 2007-05-30 옵티멈 케어 인터내셔널 테크 인코포레이티드 반도체 칩의 패키징 구조
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
JP2006093238A (ja) * 2004-09-21 2006-04-06 Fuji Xerox Co Ltd 半導体集積回路、半導体集積回路配置装置及び方法
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7808088B2 (en) * 2006-06-07 2010-10-05 Texas Instruments Incorporated Semiconductor device with improved high current performance
US20070290303A1 (en) * 2006-06-07 2007-12-20 Texas Instruments Deutschland Gmbh Dual leadframe semiconductor device package
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
DE102010002945A1 (de) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9484320B2 (en) * 2012-04-27 2016-11-01 Freescale Semiconductor, Inc. Vertically packaged integrated circuit
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board
US20210043466A1 (en) * 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198744A (ja) * 1983-04-25 1984-11-10 Fujitsu Ltd 樹脂封止型半導体装置
JPS60180154A (ja) * 1984-02-27 1985-09-13 Clarion Co Ltd 半導体装置
JPS62266855A (ja) * 1986-05-15 1987-11-19 Matsushita Electronics Corp 半導体パツケ−ジと実装方法
JPS63151057A (ja) * 1986-12-16 1988-06-23 Mitsubishi Electric Corp Ｉｃパツケ−ジ
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH01206660A (ja) * 1988-02-15 1989-08-18 Nec Corp リードフレームおよびこれを用いた半導体装置
JPH02110960A (ja) * 1988-04-08 1990-04-24 Hitachi Ltd 半導体装置
JPH01316250A (ja) * 1988-06-15 1989-12-21 Sekisui Plastics Co Ltd 表皮材付発泡成形品の製造方法
JPH0691174B2 (ja) * 1988-08-15 1994-11-14 株式会社日立製作所 半導体装置
JPH0297049A (ja) * 1988-10-03 1990-04-09 Mitsubishi Electric Corp 集積回路用パッケージ装置
JPH02211643A (ja) * 1989-02-10 1990-08-22 Nec Corp 半導体装置
JP2799408B2 (ja) * 1989-12-22 1998-09-17 株式会社日立製作所 半導体装置及びそれを実装した電子装置
JPH02270361A (ja) * 1989-04-11 1990-11-05 Mitsubishi Electric Corp 半導体記憶装置
JPH02310954A (ja) * 1989-05-26 1990-12-26 Hitachi Ltd リードフレーム及びそれを用いた半導体装置
JPH03129866A (ja) * 1989-10-16 1991-06-03 Nec Kyushu Ltd 半導体装置
JPH03270062A (ja) * 1990-03-19 1991-12-02 Nec Corp 半導体装置
JPH0414859A (ja) * 1990-05-08 1992-01-20 Mitsubishi Electric Corp 電子部品のリード端子構造
JPH0499044A (ja) * 1990-08-07 1992-03-31 Seiko Epson Corp タブ装置
JP2980369B2 (ja) * 1990-11-30 1999-11-22 新日本無線株式会社 半導体装置の製造方法
JPH04237154A (ja) * 1991-01-22 1992-08-25 Sumitomo Electric Ind Ltd 半導体パッケージ
US5172214A (en) * 1991-02-06 1992-12-15 Motorola, Inc. Leadless semiconductor device and method for making the same
JPH0529525A (ja) * 1991-07-23 1993-02-05 Mitsubishi Electric Corp 半導体パツケージ
JPH05152495A (ja) * 1991-11-26 1993-06-18 Hitachi Ltd 半導体装置
EP0987758A3 (en) * 1991-12-27 2000-05-24 Fujitsu Limited Semiconducter device and method of producing the same
JPH0653399A (ja) * 1992-07-30 1994-02-25 Fujitsu Ltd 樹脂封止型半導体装置
JPH0661408A (ja) * 1992-08-10 1994-03-04 Rohm Co Ltd 表面実装型半導体装置
JPH0697358A (ja) * 1992-09-11 1994-04-08 Hitachi Ltd シングルインライン型半導体装置
JP2670408B2 (ja) * 1992-10-27 1997-10-29 株式会社東芝 樹脂封止型半導体装置及びその製造方法

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