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KR102626801B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

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Publication number
KR102626801B1
KR102626801B1 KR1020207026242A KR20207026242A KR102626801B1 KR 102626801 B1 KR102626801 B1 KR 102626801B1 KR 1020207026242 A KR1020207026242 A KR 1020207026242A KR 20207026242 A KR20207026242 A KR 20207026242A KR 102626801 B1 KR102626801 B1 KR 102626801B1
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KR
South Korea
Prior art keywords
temperature
shift amount
abnormal
hot plate
area
Prior art date
Application number
KR1020207026242A
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English (en)
Korean (ko)
Other versions
KR20200120699A (ko
Inventor
신이치로 미사카
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20200120699A publication Critical patent/KR20200120699A/ko
Application granted granted Critical
Publication of KR102626801B1 publication Critical patent/KR102626801B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Debugging And Monitoring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020207026242A 2018-02-14 2019-01-31 기판 처리 장치, 기판 처리 방법 및 기억 매체 KR102626801B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018024198 2018-02-14
JPJP-P-2018-024198 2018-02-14
PCT/JP2019/003476 WO2019159704A1 (ja) 2018-02-14 2019-01-31 基板処理装置、基板処理方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
KR20200120699A KR20200120699A (ko) 2020-10-21
KR102626801B1 true KR102626801B1 (ko) 2024-01-18

Family

ID=67620177

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207026242A KR102626801B1 (ko) 2018-02-14 2019-01-31 기판 처리 장치, 기판 처리 방법 및 기억 매체

Country Status (5)

Country Link
JP (1) JP6964176B2 (ja)
KR (1) KR102626801B1 (ja)
CN (1) CN111699544B (ja)
TW (1) TWI791752B (ja)
WO (1) WO2019159704A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004072000A (ja) 2002-08-09 2004-03-04 Matsushita Electric Ind Co Ltd 加熱装置
JP2006013445A (ja) 2004-05-26 2006-01-12 Matsushita Electric Ind Co Ltd 温度異常の検知方法及び半導体製造装置
KR100700764B1 (ko) * 1999-09-03 2007-03-27 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
JP2017009848A (ja) * 2015-06-24 2017-01-12 株式会社リコー 定着装置及び画像形成装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001143850A (ja) * 1999-09-03 2001-05-25 Tokyo Electron Ltd 基板の加熱処理装置，基板の加熱処理方法，基板処理装置及び基板処理方法
JP2005253412A (ja) * 2004-03-15 2005-09-22 Masayasu Suzuki マイクロウェルアレイチップ、その製造方法及び被検体の活性検定方法
JP4664233B2 (ja) * 2006-05-22 2011-04-06 東京エレクトロン株式会社 熱処理板の温度設定方法，プログラム，プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置
JP4699283B2 (ja) * 2006-05-23 2011-06-08 東京エレクトロン株式会社 熱処理板の温度制御方法、プログラム及び熱処理板の温度制御装置
JP2012230023A (ja) * 2011-04-27 2012-11-22 Tokyo Electron Ltd 温度測定装置、温度校正装置及び温度校正方法
US10049905B2 (en) * 2014-09-25 2018-08-14 Tokyo Electron Limited Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus
JP6432458B2 (ja) * 2015-07-07 2018-12-05 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
TW201723716A (zh) * 2015-09-30 2017-07-01 Shibaura Mechatronics Corp 加熱器控制裝置、加熱器控制方法、基板處理裝置及基板處理方法
JP6575861B2 (ja) 2015-09-30 2019-09-18 株式会社リコー 加熱装置、乾燥装置、定着装置、画像形成装置及び画像形成システム
JP6391558B2 (ja) * 2015-12-21 2018-09-19 東京エレクトロン株式会社 熱処理装置、基板を熱処理する方法及びコンピュータ読み取り可能な記録媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100700764B1 (ko) * 1999-09-03 2007-03-27 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
JP2004072000A (ja) 2002-08-09 2004-03-04 Matsushita Electric Ind Co Ltd 加熱装置
JP2006013445A (ja) 2004-05-26 2006-01-12 Matsushita Electric Ind Co Ltd 温度異常の検知方法及び半導体製造装置
JP2017009848A (ja) * 2015-06-24 2017-01-12 株式会社リコー 定着装置及び画像形成装置

Also Published As

Publication number Publication date
CN111699544B (zh) 2024-03-22
WO2019159704A1 (ja) 2019-08-22
TWI791752B (zh) 2023-02-11
CN111699544A (zh) 2020-09-22
TW201939639A (zh) 2019-10-01
KR20200120699A (ko) 2020-10-21
JP6964176B2 (ja) 2021-11-10
JPWO2019159704A1 (ja) 2021-02-12

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